CN100391714C - Compression moulding machines - Google Patents
Compression moulding machines Download PDFInfo
- Publication number
- CN100391714C CN100391714C CNB021515913A CN02151591A CN100391714C CN 100391714 C CN100391714 C CN 100391714C CN B021515913 A CNB021515913 A CN B021515913A CN 02151591 A CN02151591 A CN 02151591A CN 100391714 C CN100391714 C CN 100391714C
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- Prior art keywords
- mould
- resin
- liquid resin
- plasticator
- patrix
- Prior art date
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- 238000000748 compression moulding Methods 0.000 title abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims description 182
- 229920005989 resin Polymers 0.000 claims description 182
- 239000007788 liquid Substances 0.000 claims description 87
- 238000000465 moulding Methods 0.000 claims description 17
- 230000009471 action Effects 0.000 claims description 10
- 230000033228 biological regulation Effects 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 4
- 238000003490 calendering Methods 0.000 claims 2
- 238000001125 extrusion Methods 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 45
- 238000004512 die casting Methods 0.000 description 31
- 230000008859 change Effects 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000003825 pressing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 210000002683 foot Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
- B29C37/0075—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other using release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5891—Measuring, controlling or regulating using imaging devices, e.g. cameras
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/20—Opening, closing or clamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The compression molding machine is capable of maintaining dies parallel, precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine of the present invention comprises: a fixed platen 28; a movable platen 38; a fixed die being held by the fixed platen 28; a movable die being held by the movable platen 38; an open-close mechanism including a screw shaft connected to the movable platen, the open-close mechanism 41 turning the screw shaft 43 so as to move the movable die to and away from the fixed die, whereby the dies can be opened and closed. The fixed die can be taken out from the fixed platen 28 in the direction crossing the open-close direction of the movable die.
Description
Technical field
The present invention relates to a kind of plasticator, wherein, in order to make work piece and together resin moulded, work piece is clamped and be squeezed between mould together with resin.
Background of invention
The device of existing various types of manufacturing semiconductor equipments.Especially use die casting machine to come molding semiconductor chip and resin.In this die casting machine,, resin is supplied to the chamber that is formed on patrix and/or the counterdie through runner and cast gate from hopper for molding is fixed on work piece in the chamber.
In die casting machine, for example, a plurality of pot plunger devices are installed in respectively in the hopper of counterdie.Pot plunger be support by pressure-equalizing device and drive by die casting machine.Supply to after hopper and work piece be fixed in the chamber of counterdie at resin sheet, opening and closing device is clamped in work piece between mould.Afterwards, die casting machine drives pot plunger makes it exert pressure to the molten resin in the hopper, resin is supplied to (referring to Japanese patent gazette No.5-285977 and No.9-155910) in the chamber.
For work piece is fixed in the chamber and with the product of molding from wherein taking out, the movably mould in the resin molding machine should have enough opening strokes.Mould should produce required mold clamping force.For obtaining appropriate production efficiency, movably mould should move under required closing speed.
Opening and closing device has a pair of toggle link, the deceleration device that this toggle link plays a part to reduce motor speed and transmits moment of torsion.In each toggle link, the connector with different length is pivotally connected.Toggle link is sentenced relative to high speed and lower speed reducing ratio at die sinking position and is moved; In the mold closing position to move (referring to Japanese patent gazette No.5-285977 and No.9-155910) relative to low speed and higher speed reducing ratio.
In the opening and closing device of another kind of type, ball bearing screw is connected with displacable platen.Rotation ball bearing screw rod is to open and close mould (referring to Japanese patent gazette No.5-84766).
Plasticator also can be used to molded work piece.In plasticator,, clamp and push work piece and resin at fixed die and removable intermode afterwards to the resin of work piece supply aequum.By extruding work piece and resin, work piece just and resin molded together.Owing in mould, do not form the passage of resin, runner for example, cast gate is so the maintenance of plasticator is easily.In addition, plasticator preferably is used for molding and for example has the thick thin work piece of about 0.8mm.Lead frame (Lead frame) type packing, QFN (four line flat no-leads (Quad Flat Non-leaded)) for example, SON (low profile does not have lead-in wire (SmallOutline Non-leaded)) and CSP (chip size packing (Chip Size Package)) are preferably molded and shaped by plasticator, in lead frame type packing, semiconductor chip is placed on the one side of substrate or circuit board by matrix.It should be noted that preferred belt sticks on the side of lead frame in QFN or SON packing.
In plasticator, clamped and when unclamping when work piece, removable mould is to move with lower speed, and at other state and in die casting machine, removable mould is (referring to the Japanese patent gazette No.4-14419) to move relative to high speed.
With the thin work piece of die casting machine molding, QFN for example, SON exists some defective during CSP.
The die casting machine that links to each other with pot plunger is positioned at the bottom of counterdie, so the through hole that pot plunger can move up and down therein is formed on the lower platen, and this lower platen is supporting counterdie.Adopt this structure, when mold closure, can make with the corresponding lower platen part of through hole and pressure can not imposed on mould.The pressure that promptly is applied on the mould is local different, so that slight distortion can take place mould.Because this slight distortion of mould can make in molded product and form overlap.
If use toggle link in opening and closing device, then departing from slightly takes place in the position of the length of connector and hinge point sometimes in the scope of manufacturing licence, thereby makes lower platen to move under the situation of slight inclination.Reduced the depth of parallelism between movable plate and the fixed head thus, so that the pressure that is applied on the mould is different in the part, and slight distortion can take place in mould.This slight distortion of mould can make the quality that forms overlap and can reduce mechanograph in molded product.
Advancing by ball bearing screw under the situation of removable mould, displacable platen can keep and switching mould when fixed die is parallel.But this needs powerful motor to control closing speed and produce fastening torque, also needs toggle link in addition, thereby makes the mould machine must be very huge.Displacable platen will be moved a common stroke, for example 200-300mm needs the cost long time, has so just reduced productivity ratio.
If work piece fixed and the confined space between the mould of opening in take out mechanograph, the efficient of work will reduce.And the distributor that is used to supply liquid resin can not be installed because the space is too narrow.
When having the work piece of thin packaged unit with the die casting machine molding, the consumption of resin is very little and the fed distance of resin is very long, and therefore resin may solidify when carrying.Be difficult to so resin will be supplied with equably the packaged unit of work piece, thereby must shorten the fed distance of resin.
On the other hand, with plasticator molding work piece the time, if removable mould moves with constant speed, the resin flows speed of moment before the resin flows speed that begins to clamp action back moment can not equal to clamp action and stops.If semiconductor chip is that wire is connected with substrate, in order not damage the wire of connection, resin flow speed must be very low; And closing speed must be minimum, will spend the closed mould of long time like this, and this will inevitably cause the reduction of productivity ratio.For example, the closing speed of removable mould should be reduced to 1/10~1/100 of conventional equipment.Therefore, not to product under the hurtful situation in order to keep quality and productivity ratio, compression molding should carry out under the situation of considering the relation between closing speed and resin flows speed.
Summary of the invention
First purpose of the present invention provides a kind of plasticator, and it can make the mould keeping parallelism, the quality and the productivity ratio that accurately clamp work piece and improve mechanograph.
Second purpose of the present invention provides a kind of plasticator opening and closing device, and it can be at the compression moulding work piece and can improve the quality and the productivity ratio of product under the hurtful situation to product not.
The 3rd purpose of the present invention provides a kind of method that opens and closes mould, and it can be at the compression moulding work piece and can improve the quality and the productivity ratio of product under the hurtful situation to product not.
For achieving the above object, the present invention has following structure.
Plasticator of the present invention comprises:
One fixation clip;
One displacable platen;
Fixed die by the fixation clip support;
Removable mould by the displacable platen support;
One opening and closing device, it comprises a screw shaft that is connected with displacable platen, opening and closing device rotating screw bolt axle so that removable mould near or away from fixed die, open and close mould thus,
Wherein, take fixed die away from fixation clip on the direction that can intersect in switching direction with removable mould.
In plasticator, opening and closing device also comprises the servomotor that is used for the rotating screw bolt axle, and
When the mold clamping force of mould reached the value of regulation, opening and closing device can be closed servomotor.
In plasticator, but the fixed die counterdie, and
Counterdie can move between matched moulds position and die casting position, and wherein in the matched moulds position, work piece is clamped between the mould, and in the die casting position, work piece is passed to counterdie and mechanograph is removed from counterdie.
In plasticator, removable mould can be a patrix, and
The film feeding mechanism is installed on displacable platen, and this mechanism supplies with stripping film on the die joint of the patrix that contains the chamber.
Opening and closing device can open and close a fixed die and a removable mould, when work piece is clamped together with liquid resin, in order to be adjusted in the flow velocity of the liquid resin that extends on the work piece, control the closing speed of removable mould, till liquid resin is finished extension.
In opening and closing device, control can comprise the steps:
Liquid resin is flow to the distance of finishing extension be divided into many branches, these branches change with geometric progression;
Common ratio to the geometric progression of branch is selected; And
In order to be adjusted in the flow velocity at the liquid resin edge that extends in each branch, control the closing speed of removable mould.
In opening and closing device, when liquid resin arrives chamber terminal,, can reduce the closing speed of removable mould in order to reduce the flow velocity of liquid resin.
Closing device also comprises:
The screw shaft that is connected with displacable platen, removable mould is supported by this pressing plate; And
The servomotor that screw shaft is rotated, and
The closing speed of mobile mould can be controlled by the revolution that changes servomotor.
Open and close the fixed die of plasticator and the method for removable mould and comprise the steps: to control the closing speed of removable mould to regulate the flow velocity of liquid resin, thereby when work piece was clamped together with liquid resin, liquid resin can extend on work piece finished extension until liquid resin.
In the method, control can comprise the steps:
Liquid resin is flow to the distance of finishing extension be divided into many branches, these branches change with geometric progression;
Common ratio to the geometric progression of branch is selected; And
In order to be adjusted in the flow velocity at the liquid resin edge that extends in each branch, control the closing speed of removable mould.
In the method, when liquid resin arrives chamber terminal,, can reduce the closing speed of removable mould in order to reduce the flow velocity of liquid resin.
In plasticator of the present invention, screw shaft links to each other with moving press plate, and moving of removable mould can open and close mould.Adopt this structure, just can make removable mould when mobile, keep parallel with fixed die.Since on the fixation clip of support fixation mould, do not drill through the hole, thus in closed mould, can apply enough big pressure, and in mechanograph, do not have resin burr formation, and the quality of product is improved.
In order to place work piece and to take out product, fixed die can move between matched moulds position and die casting position, so that shorten the stroke of mobile mould.By shortening the stroke of mobile mould, mobile mould just can drive under lower closing speed, thereby does not just need large-scale ROTATING SOURCE, the size of mould machine can become littler, but also can improve its productivity ratio.
Be used for the use that the rotating screw bolt axle opens and closes the servomotor of mould, simplified the control of mobile mould, can accurately control the thickness of molding part simultaneously.
By use opening and closing device and this method, work piece is clamped by mould together with liquid resin, and can control the closing speed of mobile mould so that liquid resin begins to extend until its end next mobile with the flow velocity that requires from resin.Therefore, compression moulding can be carried out under certain resin flow velocity, is damaged so that prevent product, improves the quality of product and the productivity ratio of mould machine simultaneously.
For example, liquid resin flows can be divided into a plurality of branches until the distance of finishing extension, these branches change with geometric progression, select the common ratio of the geometric progression of these branches afterwards, and the closing speed of controlling mobile mould is to be adjusted in the flow velocity at the liquid resin edge that extends in each branch.In addition, when liquid resin arrives chamber terminal,, reduce the closing speed of mobile mould for reducing the flow velocity of liquid resin.Adopt this control, can be controlled at the flow velocity at liquid resin edge in each branch exactly, so that the quality steady and the improvement product that flows of liquid resin.In addition, by selecting best closing speed to boost productivity.
Brief description of drawings
With embodiment embodiment of the present invention are described referring now to accompanying drawing, wherein:
Fig. 1 is the rearview of plasticator of the present invention;
Fig. 2 is the right view of plasticator shown in Figure 1;
Fig. 3 is the plane of counterdie;
Fig. 4 is the plane of patrix;
Fig. 5 is the plane of plasticator;
Fig. 6 is the front view of plasticator;
Fig. 7 A and 7B are the key diagrams of work piece;
Fig. 8 is the block diagram of opening and closing device control system;
Fig. 9 is the key diagram of used liquid resin;
What Figure 10 showed is the tables of data that concerns between height, width and liquid resin flow velocity;
Figure 11 is the curve map corresponding with data shown in Figure 10;
Figure 12 is the key diagram that applies liquid resin by another kind of mode;
What Figure 13 showed is the tables of data that concerns between liquid resin height and radius and closing speed;
Figure 14 is the curve map corresponding with data shown in Figure 13;
What Figure 15 showed is the tables of data that concerns between common ratio " r ", pressing plate speed and height that is applied to the liquid resin edge on the rectangle work piece and extension speed;
Figure 16 is the curve map corresponding with data shown in Figure 15;
What Figure 17 showed is the tables of data that concerns between common ratio " r ", pressing plate speed and height that is applied to the liquid resin edge on the circular work piece and extension speed;
Figure 18 is the curve map corresponding with data shown in Figure 17; And
What Figure 19 showed is the flow chart of the action example of closed mould.
The detailed description of embodiment
Describe the preferred embodiments of the invention in detail now with reference to accompanying drawing.
5-7B illustrates the profile of plasticator in the present embodiment at first, with reference to the accompanying drawings.
In Fig. 5 and 6, many work pieces are placed in the work piece feeding part 1, and in each work piece, the one side will be molded together with resin.In the present embodiment, work piece is substrate 2 (seeing Fig. 7 B), and for example film substrate, lead frame, plastic-substrates are being settled many semiconductor chips by matrix in this substrate.A plurality of substrates 2 are contained in each material-storing box 3.It should be noted that under the situation of molding lead frame band preferably sticks on the bottom surface of each lead frame, in order that low viscous liquid resin is dripped from lead frame.
On all sides of material-storing box 3, be formed with slit, outwards promote the substrates 2 of foots by the pusher 5 of driver 4 drivings.As shown in Figure 6, many material-storing boxs 3 are stacked on the lift 6 and by it and are supporting.When a slice substrate 2 was released from material-storing box 3, lift 6 moved down a pitch to release next substrate 2.Thereby repeat This move and constantly supply with substrate 2.It should be noted that except substrate 2 the also available plasticator of other work piece carries out molded.Another example of work piece is presented among Fig. 7 A.What Fig. 7 A showed is silicon wafer 7, is settling semiconductor chip by matrix on this silicon wafer.In Fig. 7 A and 7B, the rectangle part of being cut apart by horizontal and vertical lines is molded into packaged unit.It should be noted that semiconductor chip is not installed in 2a and the 7a part.
The liquid resinous volume that meausring apparatus 14 is measured the weight of substrate 2 and/or supplied with in substrate 2.Meausring apparatus 14 has a device body 14a and measures plate 14b.Measure on the plate 14b by substrate 2 is placed on, device body 14a can measure the weight of substrate 2.Meausring apparatus 14 is installed in the following of supporting rail 9 and corresponding with distribution locations " P ".Measuring plate 14b is rectangular slab, and it is along supporting rail 9 and arrange between supporting rail.Device body 14a is installed on the brace table 15 and brace table 15 links to each other with vertical cylinder 16.Adopt this structure, brace table 15 just can move in vertical direction.
The feeding roller 22a that stripping film 21 is wrapped in film drawing-in device 22 goes up and it is infeeded in the patrix 19; The use of stripping film 21 partly is wrapped on the collecting drum 22b.Stripping film 21 is stood the temperature of mould and is easy to and peels off from patrix 19.Stripping film 21 is by soft making with extensile material, PTFE for example, and ETFE, PET, FEP comprises the glass cloth of fluorine, polypropylene, polyvinylidene chloride.By the suction hole (not shown) that is opened on the die joint air is siphoned away and stripping film 21 is fixed on the die joint of patrix 19.
After compression moulding is finished, open mould 18 and 19.Because stripping film 21 is easy to peel off from the resin that solidifies, thus the stripping film 21 that sucks and support by patrix 19 separate with molded substrate (mechanograph) 2, thereby mechanograph 2 has been stayed in the counterdie 18.Mechanograph 2 and counterdie 18 are transported to die casting position " Q " from matched moulds position " R " together, and take out at this place.Take out mechanograph 2 and be transported to product and hold part by unloader 23.
Product apparatus for placing 24 comprises: the travelling carriage 25 that receives mechanograph 2; The extension die cavity 26 that sucks and mechanograph 2 is advanced along correct direction; And the material-storing box 27 that holds, in this material-storing box, mechanograph 2 piles up by hanging die cavity 26.
Below, with reference to accompanying drawing 1-4 plasticator 17 is described.In Fig. 1 and 2, counterdie 18 supports by fixation clip 28.Be not formed for the through hole of a plurality of pot plunger devices in fixation clip 28, therefore when mould 18 and 19 closures, fixation clip 28 can apply enough pressure and give counterdie 18.Fixation clip 28 is to support by fixing pull bar 30, and described pull bar vertically extends from base plate 29.
In Fig. 3, counterdie 18 moves between matched moulds position " R " and die casting position " Q ", and it is in the outside of mould.Guide plate 31 is installed on the fixation clip 28.Guide plate 31 has guide rail 31a and guide channel 31b, and they extend between position " Q " and " R ".Slide plate 32 is slidingly matched with guide rail 31a and guide channel 31b.Counterdie 18 supports by slide plate 32.Nut portion 32a and slide plate 32 are become one.Screw shaft 33 is spun on nut portion 32a.Screw shaft 33 is supported on the fixation clip 28, and parallel with guide channel 31b with guide rail 31a.Pulley 34 is fixed on an end of screw shaft 33.Pulley 36 is fixed on the motor shaft of motor 35.Annular speed belt 37 cooperates with pulley 34 and 36.When drive motors 35, screw shaft 33 rotates by speed belt 37, and its nut portion 32a moves with counterdie 18 between position " Q " and " R " with the slide plate 32 that screw shaft 33 spins together.
In Fig. 1, patrix 19 is supported by last moving press plate 38, and it can towards with away from the direction of counterdie 18 on move.Last moving press plate 38 is supported by four removable pull bars 40, and these pull bars are from vertically extending on the moving press plate 39 down.By moving moving press plate 39 down in vertical direction, the last moving press plate 38 that is supported by mobile pull bar 40 moves together in vertical direction with moving press plate 39 down, so that opening and closing mould 18 and 19.
In Fig. 1 and 2, opening and closing device 41 opens and closes mould 18 and 19.Following moving press plate 39 has nut portion 42, and screw shaft 43 spins together with nut portion 42.Adopt this structure, following moving press plate 39 just can move in vertical direction by the rotation of screw shaft 43, thereby opens and closes mould 18 and 19.Screw shaft 43 vertically extends from support component 44, and described support component is installed on the base plate 29.Protrude downwards from base plate 29 bottom of screw shaft 43, and pulley 45 is fixed on the bottom.Servomotor 46 is installed on the base plate 29.Pulley 47 is fixed on the motor shaft of servomotor 46.Annular speed belt 48 cooperates with pulley 45 and 47.Pulley 45 and 47 s' speed reducing ratio is very big, so that obtain very big mold clamping force under the situation of not using heavy-duty motor.When driving servomotor 46, come rotating screw bolt axle 43 by speed belt 48, so that moving press plate 39 moves together in vertical direction with nut portion 42 down.
By coming rotating screw bolt axle 43 by motor 46, mold clamping force just can be applied on the mould.When pressure sensor 53 (see figure 1)s on being assemblied in mobile pull bar 40 detected mold clamping force and reach the value of regulation, motor-drive circuit just stopped the rotation of motor 46.In the present embodiment, loading machine 20 and unloader 23 can not enter the mould 18 opened and 19 space, so that shorten the shift motion of patrix 19, and make the maximum translational speed of patrix reach 10mm/sec.Therefore, just no longer needed large-scale motor.
In Fig. 4, substrate 2 is transferred to by loading machine 20 and is waited the counterdie of locating at die casting position " Q " 18; Mechanograph 2 is located to take out at identical position " Q " by unloader 23.The arm portion 20a of loading machine 20 can slide on guide rail 49.Arm portion 20a moves back and forth between the die casting position " Q " of the distribution locations " P " of resin feedway 8 and counterdie 18.The arm portion 23a of unloader 23 can slide on guide rail 50.Arm portion 23a moves back and forth between the receiving position " U " of die casting position of counterdie 18 " Q " and travelling carriage 25.
In Fig. 1, the chamber (not shown) is formed in the patrix 19.The chamber can hold many semiconductor chips in substrate 2, and therefore, semiconductor chip can be simultaneously molded with resin.For the die joint that makes the patrix 19 that comprises the chamber covers stripping film 21, film feedway 22 is installed on the moving press plate 38.Feeding roller 22a is positioned at a side of moving press plate 38; Collecting drum 22b is positioned at opposite side.As mentioned above, stripping film 21 is supplied with by feeding roller 22a, and the use of stripping film 21 partly is wrapped on the collecting drum 22b.
Feeding roller 22c supplies with stripping film 21; Collecting drum 22d collects the use part of stripping film 21.Guiding roller 22e is installed in feeding roller 22c side; Guiding roller 22f is installed in collecting drum 22d side.Guiding roller 22e vertically moves by vertical cylinder 51; Guiding roller 22f vertically moves by vertical cylinder 52.Move by the vertical of guiding roller 22e and 22f, stripping film 21 just is engaged on the die joint of patrix 19 and also can separates with die joint.Promptly when molding substrate 2, guiding roller 22e and 22f move up so that stripping film 21 is engaged on the die joint of patrix 19; Again supply with when the specific length of stripping film 21 and to be used for nextly when molded, guiding roller 22e moves down with 22f so that stripping film 21 separates with die joint.Make feeding roller 22a motor rotating 22g and make collecting drum 22b motor rotating 22h by the stripping film 21 (referring to Fig. 4) of driven in synchronism with supply and collection specific length.
The control of opening and closing device 41 is described referring now to the block diagram of Fig. 8.Control device 69 comprises that the signal based on input flows to command signal each partial C PU60 of device 41, formerly store the ROM61 of the control program be used to open and close mould 18 and 19, measure the timer 63 of the operating time of motor 46 closed moulds, or the like.
Input-output (I/O) part 64 inputs to CPU60 with signal and from this received signal.Mold clamping force probe portion 65 comprises the pressure sensor 53 that is assemblied on the mobile pull bar 40.Motor pulses measure portion 66 comprises the rotation sensor of servomotor 46.The operator is by the control instruction and the control data of operation part 67 input units 41.Motor-driven part 68 comprises the drive circuit that drives servomotor 46 opening and closing moulds.
When the operator imported the mould starting commands by operation part 67, motor-driven part 68 drive motors 46 of control device 69 rotated, so that screw shaft 43 rotates and make mould 18 and 19 to clamp substrates 2.When mold clamping force probe portion 65 detected mold clamping force and reaches the value of regulation, motor-driven part 68 just stopped motor 46 and rotates.The distance that patrix 19 moves is that the data of measuring with motor pulses measure portion 66 are that the basis is controlled.The closing speed of patrix 19 is to control by the rotating speed that changes servomotor 46, and described rotating speed is measured by motor pulses measure portion 66.As mentioned above, the shift motion of patrix 19 has shortened, and the maximum translational speed of patrix can be 10mm/sec.Therefore, do not need to use large-size machine as motor 46.
5 and 6 actions that plasticator 17 is described with reference to the accompanying drawings.Patrix 19 is in open mode.Counterdie 18 waits at die casting position " Q " and locates.Because counterdie 18 can move back and forth between position " Q " and " R ",, thereby be 20-30mm by the shift motion of the vertical mobile patrixes 19 of screw shaft 43 so loading machine 20 and unloader 23 are operated in the outside of mould 18 and 19.
Substrate 2 (liquid resin is coated in this substrate by resin feedway 8) is being supported by loading machine 20 and is being transported to die casting position " Q " from distribution locations " P ".When substrate 2 when loading machine 20 is transported to counterdie 18, drive motors 35 so that screw shaft 33 rotate.By the rotation of screw shaft 33, slide plate 32 moves to matched moulds position " R " from die casting position " Q ".When transport substrate 2, loading machine 20 is got back to wait position " S " and wait from die casting position " Q " and is supplied to (referring to Fig. 4) until next substrate 2 there.At that time, guiding roller 22e and 22f move up so that stripping film 21 is engaged on the die joint of patrix 19.Actuating motor 46 is so that screw shaft 43 rotations afterwards.By the rotation of screw shaft 43, moving press plate 38 and 39 moves down, so that patrix 19 moves down, mould 18 and 19 is closed.Substrate 2 is compression molded into type in the mould 18 and 19 of closure.When patrix 19 during near counterdie 18, patrix 19 moves with low speed (for example 0.1mm/sec or lower); Under another state, patrix 19 can higher speed move.By this speed control, just can improve the quality of mechanograph.
After finishing compression molding, once more actuating motor 46 so that screw shaft 43 rotate in the opposite direction.By screw shaft 43 rotation in the opposite direction, moving press plate 38 and 39 just moves up, so patrix 19 also moves up, mould 18 and 19 is opened.In addition, drive motors 35 so that screw shaft 33 rotate in the opposite direction.Screw shaft 33 makes slide plate 32 move to die casting position " Q " from matched moulds position " R " in reciprocal rotation.Mechanograph 2 is supporting by waiting the unloader of locating at die casting position " Q " 23, and is transported to and waits on the travelling carriage 25 that receiving position " U " is located.When transfer moulding product 2, unloader 23 is got back to from receiving position " U " and is waited position " T ", and waits there and be supplied to (referring to Fig. 4) until next product 2.
The following describes the control of closing speed, this speed is based on the flow velocity of liquid resin.
Prerequisite is that liquid resin is transversely flowing in substrate 2.The closing speed of patrix 19 is to control according to the flow velocity of liquid resin.
At first, as shown in Figure 9, applying liquid resin 80 is to form rectangle, and control is along the flow velocity of the resin 80 that laterally applies.Its parameter is restricted to: " t " is for clamping the used time (second) of substrate 2 fully; " a " is after the elapsed time " t ", half (mm) of resin 80 width; " B " is half (mm) of resin 80 length and is constant; " h " is the height (mm) of elapsed time " t " back resin 80; " H " be before substrate 2 clamps moment resin 80 height (mm); " M " is the volume (mm of resin 80
3) and be constant; " V " is the closing speed (mm/sec) of patrix 19 and is constant.
The volume " M " of the resin 80 that is applied is M=2B * 2a * h (formula 1)
Height " h " after the elapsed time " t " is
H=H-Vt (formula 2)
According to formula 1 and 2,
M=4aB(H-Vt)
So,
a=M/4B(H-Vt)
" t " makes differential with the time
Da/dt=M/4B * V/ (H-Vt)
2(formula 3)
According to formula 1 and 2,
M/4B=ah and H-Vt=h
So,
Da/dt=V * a/h (formula 4)
Volume " M " that it should be noted that liquid resin 80 is very little, and therefore, formula 4 can be limited as differential with the time " t " by formula " dh * 2a * 2B=2da * 2B * h ".
In formula 4, closing speed " V " is constant, so the flow velocity of resin 80 " da/dt " depends on height " h " and width " a ".In the case, the flow velocity " da/dt " along horizontal liquid resin 80 is directly proportional with the width " a " of resin 80; And the height " h " of flow velocity and resin 80 is inversely proportional to.The closing speed " V " of preferred patrix 19 is by using the accurately control of these relations.
The data of experiment are presented among Figure 10.Figure 11 has shown the curve map corresponding with these data.Experiment is to carry out under below the condition: closing speed " V " is 0.1mm/sec; The height of resin 80 " Hb " is 2mm before matched moulds; The height of resin 80 " He " is 0.8mm behind matched moulds; The volume of resin 80 " M " is 8000mm
3Length " B " is 94mm (constant).Data are height " h ", the flow velocity " da/dt " of width " a " and resin 80.
According to the data shown in Figure 10 and 11, under situation, when liquid resin 80 arrives chambeies terminal, quicken the flow velocity of liquid resin 80 with constant speed matched moulds.Peak Flow Rate is 3.3mm/sec.Under the situation that the height of resin 80 " Hb " is very low before matched moulds, although the very little required closing time of closing speed " t " has shortened.Data show, if closing speed " V " is 0.2mm/sec, and the height of resin 80 " Hb " is 2mm, and then required time " t " is 12 seconds; If height " Hb " is 5mm, then required time is 42 seconds.
When resin 80 arrives the terminal in chamber, quicken the flow velocity of liquid resin 80.If resin 80 bumps with end under high speed, resin 80 will rebound, so that the quality of mechanograph will be lowered.Therefore, the closing speed of patrix 19 " V " is preferably 0.1mm/s ec or littler, thereby the moment before matched moulds reduces the flow velocity " da/dt " of resin 80.
12-14 illustrates another embodiment with reference to the accompanying drawings.
Its prerequisite is, work piece is silicon wafer 7 (referring to Fig. 7 A), makes the liquid resin 80 that applies rounded, and at the flow velocity of controlling used resin 80 in the radial direction.The closing speed of patrix 19 is to control according to the flow velocity of liquid resin 80.
As shown in figure 12, the liquid resin 80 that is applied is rounded, and the closing speed of control patrix 19 so that liquid resin 80 in the radial direction with constant flow rate.Its parameter is restricted to: " t " clamps the required time (second) for realizing substrate 2; " r " is the radius (mm) of elapsed time " t " back resin 80; " h " is the height (mm) of elapsed time " t " back resin 80; " K " for resin 80 diametrically flow velocity (mm/sec) and be constant; " R " clamps resin 80 the radius (mm) of moment before the substrate 2; " H " is the height (mm) of resin 80; " M " is the volume (mm of resin 80
3) and be constant.
The volume of used resin 80 " M " is
M=π r
2* h (formula 5)
Radius " r " after the time " t " is
R=R+Kt (formula 6)
According to formula 5 and 6
M=π×(R+Kt)
2×h
Therefore,
h=M/(π×(R+Kt)
2)
" t " makes differential with the time
Dh/dt=-2MK/ π * { (R+Kt)
-3(formula 7)
According to formula 5 and 7
Dh/dt=-2Kh/r (formula 8)
Volume " M " that it should be noted that liquid resin 80 is very little, so formula 8 can be by formula " dh * π r
2=dr * 2 π r * h " time " t " is limited as differential.
In formula 8, the flow velocity of resin 80 " K " is constant, so the closing speed of patrix 19 depends on radius " r " and height " h ".In the case, the closing speed of patrix 19 is directly proportional with the height " h " of resin 80; And the radius " r " of closing speed and resin 80 is inversely proportional to.The closing speed of patrix 19 is preferably by using these relations accurately to control.
The data of experiment are presented among Figure 13; Figure 14 has provided the curve map of corresponding data.Experiment is carried out under the following conditions: the flow velocity of resin 80 " K " is 1.0mm/sec (constant); The height of resin 80 " Hb " is 2mm before matched moulds; The height of resin 80 " He " is 0.8mm behind matched moulds; The volume of resin 80 " M " is 8000mm
3Data are closing speeds " dh/dt " of height " h ", radius " r " and patrix 19.
According to the data shown in Figure 13 and 14, with constant speed (for example 0.1mm/sec) matched moulds the time, required time " t " is 12 seconds; Being set at 0.39mm/sec and minimal closure speed is set under the situation of 0.1mm/sec in maximum close speed, is the flow velocity maximum that keeps resin 80, and the needed time is 5.9 seconds.
According to these data, by the closing speed " dh/dt " of control maintenance resin 80 flow velocitys, compression molding just can carry out under the situation that does not reduce manufacturing efficient.Determine the preferable flow rate of resin 80,1.0mm/sec for example is to keep the quality of mechanograph.When arriving chambeies terminal, resin 80 quickens the flow velocity of liquid resin 80.If resin 80 bumps with high speed and end, then resin 80 will rebound so that reduced the quality of mechanograph.Therefore, closing speed must be precisely controlled.
For being adjusted in the flow velocity of the liquid resin 80 that extends on the work piece, until the extension of finishing liquid resin, opening and closing device 41 will be controlled the closing speed of patrix 19.When work piece by mould 18 and 19 with liquid resin 80 when clamped together, liquid resin 80 extends (or broadening) on work piece.For example, the control of closing speed comprises the steps: liquid resin 80 flowed and is divided into a plurality of branches until the distance of finishing extension, and these branches change with geometric progression; And the common ratio that changes geometric progression is to change the closing speed of patrix 19.Adopt this control, just can be controlled at the flow velocity at liquid resin 80 edges that extend in each branch exactly.For making flowing of liquid resin stable, when liquid resin arrived chamber terminal, the closing speed that reduce patrix 19 was to reduce the flow velocity of liquid resin 80.
The details of this control once is described below.In this explanation, total distance that " Δ H " moves when liquid resin 80 extends for moving press plate; " Δ T " extends the required time for finishing resin 80; " N " be the number of times of closing speed for a change; " n " is the designated value of speed change point, is (" n=1 " locates at point, finishes the extension of resin) that changes in this some place closing speed; " Hn " is the displacement of (perhaps in branch) moving press plate between point " n " and " n-1 "; " Vn " is the translational speed of moving press plate between point " n " and " n-1 "; " r " is common ratio.
Distance " Δ H " is divided by " N " of branch.
ΔH=∑Hn=H1×(1-r
N)/(1-r)
Therefore,
H1=ΔH×(r-1)/(r
N-1)
Hn=ΔH×(r-1)/(r
N-1)×r
(n-1)
In each branch " Hn ", spend the mobile displacable platen of time of " Δ T/N ".
Therefore,
Vn=N×(ΔH/ΔT)×(r-1)/(r
N-1)×r
(n-1)
Traveling time in each branch is identical; Displacement changes with geometric progression.Therefore, can control the translational speed of moving press plate 38,39 by changing common ratio " r ".
If after resin begins to extend moment liquid resin viscosity very low, can select bigger common ratio " r " to quicken the flow velocity of resin edge.By accelerating flow velocity, can widen the area of molding.On the other hand, the moment before finishing extension will be reduced the flow velocity at liquid resin 80 edges.
Figure 15 illustrates the data of relation between the flow velocity that relates to the common ratio " r " that is used for molding rectangle work piece, pressing plate speed, liquid resin 80 edges etc.Figure 16 is the curve map corresponding with data shown in Figure 15.In addition, figure 17 illustrates the data that concern between the height that relates to the common ratio " r ", pressing plate speed and the liquid resin 80 that are used for the circular work piece of molding.Figure 18 is the curve map corresponding with data shown in Figure 17.In both cases, the elemental height of resin is 2mm; The height of finishing the resin of extension is 0.8mm; It is 16 seconds that resin is finished the used time of extension.
Be the edge with constant flow velocity moving liquid resin, preferred common ratio " r " is 1.2 or 1.3.Because near the flow velocity of the liquid resin the end of chamber that viscosity etc. cause, preferred common ratio " r " is 1.5 or bigger in order to reduce.Can distinguish for speed change point " 1 → N " and preferentially to select its common ratio " r ", so that can control the flow velocity of pressing plate speed (closing speed of mobile mould 19) and resin edge exactly.
Explain the control of closed action below with reference to the flow chart of Figure 19.
Under the situation of opened mould 18 and 19 closures, patrix 19 is to move till patrix 19 begins to make liquid resin to extend towards counterdie 18 at a high speed.When patrix 19 arrives moulds 10 and begins to make the position that resin extends, the rotating speed of motor 46 is reduced to speed change point " 2 " from speed change point " N-1 " according to selected common ratio " r ".By reducing the rotating speed of motor 46, the closing speed of mould 19 also can be lowered to closing speed " N ".It should be noted that common ratio " r " selects under the situation such as resin flow velocity in advance having considered, and it is stored in the control device 69 with control program.Locate at speed change point " N → 2 ", mold clamping force (pressure) is measured by pressure sensor 53.There are caused unusual power of foreign substance or pressure between mould by measuring mold clamping force, just may detect.
When patrix 19 arrives the first speed change points and mold clamping force and reaches the value of regulation, by the detectable stop position that goes out patrix 19 or moving press plate of rotation sensor.If stop position is higher than object height, illustrate that then the amount of having blocked foreign substance or resin is too much.On the other hand, if stop position is lower than object height, the quantity not sufficient of resin is described then.When the extension of resin is finished, keep-up pressure with cured resin.By the curing of resin, the packaged unit of mechanograph has just formed.The complete closing position of patrix 19 detects by pressure sensor; Its matched moulds position is detected by rotation sensor.
The die sinking action is what to be undertaken by the reverse procedure of mould assembling action.Patrix 19 is along with release pressure moves to the first speed change point with low speed.Patrix 19 moves to speed change point " N " with different or constant low speed from speed change point " 2 ".Patrix 19 from mould 10 beginning to position that initial open position extends with high-speed mobile.
It should be noted that in the present embodiment counterdie 18 moves between matched moulds position " R " and die casting position " Q ", therefore, loading machine 20 and unloader 23 can be in the operations of the outside of mould 18 and 19.So the stroke of the patrix 19 that is driven by screw shaft 43 can be shortened, and for example is 20-30mm.
In the plasticator 17 of the present embodiment, the screw shaft 43 that clamps work piece directly links to each other with following moving press plate 39, and last moving press plate 38 links to each other with patrix 19, and moves the mobile together patrix 19 of the same moving press plate 38 so that open and close mould.Adopt this structure, patrix 19 just can keep mobile under the situation parallel with counterdie 18.Owing to do not drill through the hole in the fixation clip 28 that supports counterdie 18, so can apply enough big pressure at the closed mold period of the day from 11 p.m. to 1 a.m, the quality that does not have resin burr formation and product in mechanograph also is improved.
For placing work piece and taking out product, counterdie 18 moves between matched moulds position " R " and die casting position " Q ", so that shorten the stroke of patrix 19.By shortening the stroke of patrix 19, patrix 19 just can drive under lower closing speed, thereby no longer needs powerful drive source, the size decreases of mould machine and improved the productivity ratio of mould machine.
By using the method for opening and closing device and switching mould, work piece is by mould 18,19 is clamped together with liquid resin 80, and the closing speed of patrix 19 can be controlled, flows until its end thereby can make liquid resin 80 begin to extend from resin with required flow velocity.Therefore, compression molding carries out under the resin flow rate conditions having considered, thereby has prevented the damage of product, the productivity ratio of having improved the quality of product and having improved mould machine.
For example, in opening and closing device 41, liquid resin 80 flows and can be divided into a plurality of branches until the distance of finishing extension, these branches change with geometric progression, select the common ratio of the geometric progression of these branches afterwards, and the closing speed of control patrix 19 is to be adjusted in the flow velocity at liquid resin 80 edges that extend in each branch.In addition, when liquid resin 80 arrives chambeies terminal,, reduce the closing speed of patrix 19 for reducing the flow velocity of liquid resin 80.Liquid resin 80 adopts this control, can be controlled at the flow velocity at liquid resin 80 edges in each branch exactly, so that can flow reposefully and can improve the quality of product.In addition, by selecting best closing speed to boost productivity and making efficient.
The invention is not restricted to above-described embodiment.Resin is supplied with the plasticator 17 of partly can getting along well and is combined into one, but locates to have bigger working space at die casting position " Q ", so that locate and liquid resin can be imposed on work piece at die casting position " Q ".In addition, counterdie 18 can be located to clean at die casting position " Q ".At random select moving of distributor 13 according to the shape of the nozzle 13a of the shape of work piece, distributor 13 etc.In addition, except distributor, also can apply resin by other mode.
In the above in the embodiment of Miao Shuing, work piece molding in a die cavity, but the number of work piece and die cavity can be not limited to one.
Promptly the number of die cavity can be two or more in mould.In the case, can the many work pieces of while compression molding.
In the embodiment of Miao Shuing, patrix 19 is removable moulds in the above, but counterdie 18 also can be used as removable mould.
The present invention can be realized that they all do not break away from its spirit or main feature by other concrete form.Therefore the present embodiment all is considered to a kind of explanation rather than a kind of restriction in every respect, scope of the present invention is that the description by the appended claims rather than front limits, with the meaning of claim equivalence and scope in the various changes made all comprise in the present invention.
Claims (7)
1. a plasticator carries out extrusion molding after the part that is formed that it has envelope to end resin by the stamped metal mould to supply clamps, and comprising:
Fixed die is arranged to be supported by fixation clip, can take out to the direction that intersects with clamping direction;
But dynamic model is arranged to be supported by displacable platen, can be toward or away from fixed die; And
Mould open and close controlling mechanism by driving the screw shaft rotation that is connected with displacable platen, makes removable mould carry out on-off action for fixed die,
Fixed die is arranged to, and the on-off action of removable mould moves between the extracting position of mold cramping position and be formed part or drip molding handing-over accordingly.
2. plasticator as claimed in claim 1 is characterized in that, described mould open and close controlling mechanism when the stamped metal mould reaches the mold clamping force of regulation, stops the driving to described servomotor by the rotation of driven by servomotor screw shaft.
3. plasticator as claimed in claim 1 is characterized in that, is used for covering is comprised that the stripping film carrying mechanism that the stripping film on metal pattern surface of the die cavity recess of described patrix is laid is configured to become one with displacable platen.
4. plasticator as claimed in claim 1, it is characterized in that, mould open and close controlling mechanism utilizes metal pattern to clamp and supplies with the part that is formed that liquid resin is arranged, clamp speeds to removable mould is carried out variable control, so that reach desirable flow velocity from this liquid resin calendering beginning until the flow velocity that rolls the liquid resin between tailend.
5. plasticator as claimed in claim 1, it is characterized in that, mould open and close controlling mechanism is divided into a plurality of intervals until the displacement of rolling removable mould between tailend by the geometric progression variation with liquid resin calendering beginning, determine the common ratio of this geometric ratio ordered series of numbers, at each interval clamp speeds that changes removable mould, thereby the front end speed of liquid resin is carried out variable control.
6. plasticator as claimed in claim 1 is characterized in that, mould open and close controlling mechanism is to the control of slowing down of the clamp speeds of removable mould, so that liquid resin suppresses the flow velocity of liquid resin near the die cavity terminal part.
7. plasticator as claimed in claim 1, it is characterized in that, mould open and close controlling mechanism utilizes the rotation of driven by servomotor screw shaft, make removable mould carry out mould assembling action by the displacable platen that links to each other with this screw shaft, the clamp speeds of removable mould is carried out variable control by the revolution that changes described servomotor.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP2001366446A JP2003165130A (en) | 2001-11-30 | 2001-11-30 | Mold opening/closing control mechanism for compression molding machine and method for controlling mold opening/closing |
JP2001366474A JP4204221B2 (en) | 2001-11-30 | 2001-11-30 | Compression molding equipment |
JP2001366474 | 2001-11-30 | ||
JP2001366446 | 2001-11-30 |
Publications (2)
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CN1424191A CN1424191A (en) | 2003-06-18 |
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CNB021515913A Expired - Fee Related CN100391714C (en) | 2001-11-30 | 2002-11-29 | Compression moulding machines |
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US (1) | US7175405B2 (en) |
KR (1) | KR100868836B1 (en) |
CN (1) | CN100391714C (en) |
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JPH0622822B2 (en) * | 1986-06-19 | 1994-03-30 | 東芝機械株式会社 | Injection molding machine |
JPH0622829B2 (en) * | 1986-06-30 | 1994-03-30 | フアナツク株式会社 | Direct pressure type mold clamping mechanism |
JPS6335325A (en) * | 1986-07-31 | 1988-02-16 | Toyoda Gosei Co Ltd | Vertical molding machine |
JPS63125321A (en) * | 1986-11-14 | 1988-05-28 | Toshiba Mach Co Ltd | Controlling process of injection and compression molding |
JPH0414419A (en) | 1990-05-08 | 1992-01-20 | Yamada Seisakusho Co Ltd | Transfer mold apparatus |
JP3160326B2 (en) | 1991-09-27 | 2001-04-25 | 芝浦メカトロニクス株式会社 | Molding equipment |
GB2273175B (en) * | 1992-12-04 | 1996-05-15 | Advanced Systems Automation Pt | Direct drive electro-mechanical press for encapsulating semiconductor devices |
US5770128A (en) | 1992-04-13 | 1998-06-23 | Apic Yamada Corporation | Method of transfer molding and a transfer molding machine |
JP3200151B2 (en) | 1992-04-13 | 2001-08-20 | アピックヤマダ株式会社 | Transfer molding method and transfer molding apparatus |
JP2812606B2 (en) * | 1992-05-15 | 1998-10-22 | 三菱電機株式会社 | Press processing device, lead molding method and resin sealing method |
DE4239775A1 (en) * | 1992-11-26 | 1994-06-01 | Polygram Record Service Gmbh | Injection molding or injection stamping machine |
KR970002128B1 (en) * | 1994-08-31 | 1997-02-24 | 대우자동차 주식회사 | Head lamp luminosity control circuit |
JPH09155910A (en) | 1995-12-05 | 1997-06-17 | Apic Yamada Kk | Resin molding machine using motor driven press mechanism |
JP3850934B2 (en) * | 1995-12-15 | 2006-11-29 | アマダ・エムエフジー・アメリカ・インコーポレイティド | Ram lifting drive device and press machine |
TW410194B (en) * | 1996-08-20 | 2000-11-01 | Apic Yamada Kk | Resin molding machine |
JP3494586B2 (en) | 1999-03-26 | 2004-02-09 | アピックヤマダ株式会社 | Resin sealing device and resin sealing method |
JP2000299334A (en) * | 1999-04-14 | 2000-10-24 | Apic Yamada Corp | Resin-sealing apparatus |
KR100423140B1 (en) * | 2001-04-18 | 2004-03-18 | (주)에이치디세미테크 | semi-conductor molding manufacturing device |
-
2002
- 2002-11-19 TW TW091133670A patent/TWI293599B/en not_active IP Right Cessation
- 2002-11-20 SG SG200207022A patent/SG120898A1/en unknown
- 2002-11-27 US US10/305,241 patent/US7175405B2/en not_active Expired - Fee Related
- 2002-11-29 CN CNB021515913A patent/CN100391714C/en not_active Expired - Fee Related
- 2002-11-29 KR KR1020020075196A patent/KR100868836B1/en not_active IP Right Cessation
- 2002-12-02 NL NL1022046A patent/NL1022046C2/en not_active IP Right Cessation
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CN1424191A (en) | 2003-06-18 |
SG120898A1 (en) | 2006-04-26 |
US7175405B2 (en) | 2007-02-13 |
KR20030044857A (en) | 2003-06-09 |
NL1022046C2 (en) | 2003-11-21 |
US20030102587A1 (en) | 2003-06-05 |
TWI293599B (en) | 2008-02-21 |
NL1022046A1 (en) | 2003-06-03 |
KR100868836B1 (en) | 2008-11-14 |
TW200300387A (en) | 2003-06-01 |
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