CN100390975C - Fixing structure for heat-conducting block - Google Patents
Fixing structure for heat-conducting block Download PDFInfo
- Publication number
- CN100390975C CN100390975C CNB2005100767052A CN200510076705A CN100390975C CN 100390975 C CN100390975 C CN 100390975C CN B2005100767052 A CNB2005100767052 A CN B2005100767052A CN 200510076705 A CN200510076705 A CN 200510076705A CN 100390975 C CN100390975 C CN 100390975C
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- heat
- fixed
- conducting block
- gusset piece
- fixed area
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Abstract
The present invention relates to a fixing structure of a heat conducting block, which comprises a connecting plate and a fixing plate, wherein the connecting plate is provided with a plurality of buckle pieces which are parallel to the connecting plate; the fixing plate is provided with a plurality of buckle holes which correspond to the buckle pieces. The buckle pieces can pass through the buckle holes so as to combine the connecting plate and the fixing plate. The fixing plate is used for combining a fixing seat, the center of which is provided with a heat source. The connecting plate is fixed to a heat conducting block. Through the combination of the fixing plate and the connecting plate, the heat conducting block contacts and presses the heat source, and absorbs heat produced by the heat source.
Description
Technical field
The present invention relates to heat abstractor, particularly a kind of fixed structure that heat-conducting block is fixed on the heat-conducting block on the thermal source.
Background technology
Heat pipe (heat pipe) carries out heat transmission with two-phase (liquid phase, the gas phase) variation of fluid, makes heat pipe possess the good coefficient of heat conduction.Main frame now is miniaturization Design gradually, make the inner space dwindle, be unfavorable for airflow, influence the running of traditional air cooled heat sinks, therefore heat pipe just is applied to the chip cooling of computer-internal, and the heat that produces when directly chip being operated conducts to the ventilation, the ventilating opening of offering as the main case of computer body side surface, be dissipated to the external world so that heat is overflow, cool off this chip.
The heat abstractor of using heat pipe includes three parts usually, comprises a heat-conducting block, a heat-sink unit and a plurality of heat pipe.Wherein, this heat-conducting block supports and to be affixed on the chip, and this heat-sink unit then is arranged at the ventilation, utilizes the heat pipe conduction, and heat transferred that this heat-conducting block absorbed to this heat-sink unit, is loose in external environment and overflow.As traditional air cooled heat sinks, this heat-conducting block also needs and holder coupling, grips with this fixed mount, is affixed on the chip of holder central authorities so that this heat-conducting block firmly supports, and forms excellent contact heat and passes relation.Along with different chip designs and heat radiation specification requirements, the form of holder also has different metamorphosis with method of clamping, makes the form of heat-conducting block must mate the holder form and method of clamping is made change.The scope of application of heat-conducting block is limited to certain chip and holder form, makes the heat abstractor of using heat pipe must cooperate the assembling of holder form to produce, and causes the puzzlement of production firm.And mistake also takes place to select in user easily when using this class heat abstractor, and the heat abstractor of being held can't be installed on the chip of desire cooling.
In addition, be to improve the coefficient of heat conduction of heat-conducting block, heat-conducting block is many, and with copper to be that material cuts made, in order to mate holder, can make the heat-conducting block geometric shape become complicated, make the heat-conducting block course of processing must pass through multiple tracks cut program, expend time in, increase processing cost.Though the aluminium extruded moulding can reduce cost, but if heat-conducting block will be applied to different holders the time, different moulds and production line must be set simultaneously, its cost consumption is also very surprising, and the aluminium extruded shaped article still needs further to carry out cut, just can finish complicated structural design.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of fixed structure of heat-conducting block, so that this fixed structure is independent of outside the heat-conducting block, make chip and the heat abstractor holder of heat-conducting block applicable to different shape, simplify the mode of appearance of this heat-conducting block, to reduce the spent cost of numerous and diverse procedure.
Therefore, to achieve these goals, the invention provides a kind of fixed structure of heat-conducting block, interosculate with a holder, in order to a heat-conducting block is pressed on the thermal source, the fixed structure of this heat-conducting block includes a gusset piece and a fixed head.This gusset piece is fixed on this heat-conducting block, has one first fixed area, offers a plurality of cramps that are parallel to this gusset piece on this first fixed area, and the front end of these a plurality of cramps has been bent to form a location division.The downside formation one of this fixed head is second fixed area of indent upwards, offer a plurality of button holes on this second fixed area, these a plurality of button holes are corresponding to these a plurality of cramps, these a plurality of cramps can be worn and buckle into this a plurality of button holes, make this first fixed area connect this second fixed area, with in conjunction with this gusset piece and this fixed head, make this heat-conducting block be fixed in the below, blanketed zone of this fixed head, combine with this holder by this fixed head, so that this heat-conducting block is pressed on this thermal source, absorb the heat that this thermal source produces.
Aforesaid heat-conducting block is connected with a heat-sink unit with a plurality of heat pipes, form a heat abstractor, carry out heat transmission by these a plurality of heat pipes, so that the heat that this thermal source was produced is passed to this heat-sink unit by this heat-conducting block, by this heat-sink unit heat being overflow is dissipated in the external environment, so that this thermal source is carried out cooling heat dissipation.
Effect of the present invention is, fixed structure is independent of outside this heat-conducting block, to simplify the form design of this heat-conducting block, to reduce procedure.In addition, after this fixed head is adjusted variation, can make this heat-conducting block be applied to different holders and thermal source form, needn't be individual other holder and the different heat-conducting block of thermal source form design, increase the applicability of this heat-conducting block.And this heat-conducting block can separate with this fixed head easily, with different fixed head combinations, can make this heat-conducting block be passed to the cooling operations of dispelling the heat on the thermal source of different shape at any time.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the exploded perspective view of the present invention's first preferred embodiment;
Fig. 2 and Fig. 3 are the stereogram of the present invention's first preferred embodiment;
Fig. 4 is the vertical view of the present invention's first preferred embodiment partial component;
Fig. 5 and Fig. 6 are the exploded view and the stereogram of the local member of preferred embodiment of the present invention;
Fig. 7 is the application schematic diagram of the present invention's first preferred embodiment;
Fig. 8 is the application schematic diagram of the present invention's second preferred embodiment; And
Fig. 9 is the application schematic diagram of the present invention's the 3rd another form of preferred embodiment.
Wherein, Reference numeral is as follows:
The fixed structure of 100-heat-conducting block
The 110-gusset piece
111-first fixed area
112-horizontal-extending portion
The 112a-screw
The 112b-screw
The 113-protuberance
The 114-plate washer
The 115-cramp
The 115a-location division
The 116-banking stop
The 116a-pivoted hole
The 120-fixed head
121-second fixed area
The 122-button hole
The 123-location hole
The 124-spacing hole
The 125-fin
126-installs sheet
The 126a-recess
The 200-heat abstractor
The 210-heat-conducting block
The 211-holding part
The 212-perforation
The 220-heat pipe
The 230-heat-sink unit
The 231-radiating fin
231a-places the hole
The 310-thermal source
The 320-holder
The 321-framework
The 322-fastener
The 330-holder
The 331-framework
331a-buckle piece
The 331b-cylinder
The 332-fastener
The 332a-clamping part
The 332b-button hole
The 340-holder
The 341-chip carrier socket
341a-buckle piece
The 342-fastener
The 342a-driving rod
Embodiment
The present invention is arranged heat abstractor and fixed structure branch, to simplify the structural change of heat abstractor, and but one size fits all does not need only need be changed at fixed structure in the design at chip and holder form change heat abstractor in the thermal source and the holder of different shape.
See also Fig. 1 to shown in Figure 3, the fixed structure 100 of a kind of heat-conducting block that is provided for the present invention's first preferred embodiment is applied on the heat abstractor 200, and this heat abstractor 200 includes:
One heat-conducting block 210, it is a metal rectangle block, it is that material is made via cutting forming that this heat-conducting block 210 adopts copper, also can utilize aluminium to cast the shape making to squeeze for material, be formed with a plurality of holding parts parallel to each other 211 on this heat-conducting block 210, this each holding part 211 is arranged with in the upper surface of this heat-conducting block 210.
A plurality of heat pipes (heat pipe) 220, inside have working fluid and carry out heat conduction with the two-phase variation, and an end of this each heat pipe 220 is placed in respectively in this each holding part 211, and form the heat biography relation that contacts with this heat-conducting block 210.
One heat-sink unit 230, constituted by a plurality of radiating fin 231, this each radiating fin 231 has and a plurality ofly places hole 231a corresponding to this each heat pipe 220, this each heat pipe 220 is placed through this and respectively places among the 231a of hole, this each radiating fin 231 is serially connected with the other end of this heat pipe 220, this heat-sink unit 230 and these heat pipes 220 is formed contact heat to pass and concern.Connect this heat-conducting block 210 and this heat-sink unit 230 by this each heat pipe 220, for carrying out heat exchange between this heat-conducting block 210 and this heat-sink unit 230.
This heat-conducting block 210 is affixed on the thermal source 310 in order to support, and is passed to this heat-sink unit 230 with the heat that this thermal source 310 is produced by this heat-conducting block 210, overflow again be dissipated to around in the environment to cool off this thermal source 310.This thermal source 310 can be the central processing unit (CPU) of a chip, particularly high frequency and the running of high electrical power, and this thermal source 310 is positioned at a holder 320 central authorities, for fixing of this heat-conducting block 210.In addition, this each heat pipe 220 can be via the bending distortion, so that this heat-sink unit 230 is disposed at the ventilation, in order to the cooling operations of this thermal source 310.
Please be simultaneously with reference to Fig. 4 to Fig. 6, be the heat-conducting block 210 of effectively fixing this heat abstractor 200, the present invention's first preferred embodiment combines with holder 320 by fixed structure 100, to suppress this heat-conducting block 210 effectively, makes this heat-conducting block 210 and this thermal source 310 reach excellent contact heat and passes.
Wherein, this fixed structure 100 includes a gusset piece 110, is fixed on this heat-conducting block 210, and a fixed head 120, interosculating with this gusset piece 110, this fixed head 210 can be fixed on this holder 320, to suppress this heat-conducting block 210, it is resisted against on this thermal source 310.Thus, the form of this heat-conducting block 210 just need not cooperate the fixed form of this holder 320 to do variation, keeps simple bulk forms, and one size fits all is simplified and made flow process in the chip and the holder of different shape.
The central authorities of these gusset piece 110 upper sides form first fixed area 111 that upwards swells, the both sides of this first fixed area 111 form a horizontal-extending portion 112 respectively, be positioned at two sides of this gusset piece 110, this two horizontal-extendings portion 112 offers a screw 112a respectively, also offer perforation 212 in correspondence with each other on this heat-conducting block 210, for two-screw 112b with these gusset piece 110 sealed being fixed on this heat-conducting block 210.The cephalolateral margin of this first fixed area 111 forms a horizontally extending forward protuberance 113, and the front end of this protuberance 113 forms a plate washer 114 that extends downwards.Because the tip end projects of this each heat pipe 220 is in the place ahead of this heat-conducting block 210, be collided easily and break, make these heat pipes 220 ineffective, this protuberance 113 and this plate washer 114 can be by the ends of top and this each heat pipe 220 of leading flank shield, and be impaired to avoid being collided.
Have four cramps 115 that are parallel to this gusset piece 110 on this first fixed area 111, this each cramp 115 is a punch forming, and is integrally formed on this gusset piece 110, and the front end of this each cramp 115 is bent to form a location division 115a who protrudes downwards.The central authorities of this first fixed area 111 have two upwardly extending banking stops 116, and this two banking stop 116 is a punch forming also, and is integrally formed on this gusset piece 110.
The downside formation one of this fixed head 120 is second fixed area 121 of indent upwards, and first fixed area 111 of its profile and this gusset piece 110 matches each other.This second fixed area 121 has four button holes 122, and this each button hole 122 corresponds respectively to this each cramp 115.One side of this each button hole 122 offers a location hole 123, with this each location division 115a in correspondence with each other.Second fixed area, 121 central authorities of this fixed head 120 have a spacing hole 124, in order to banking stop 116 that should gusset piece 110.The forward and backward lateral margin of this second fixed area 121 has a upwardly extending fin 125 respectively.This two banking stop 116 is aimed at this spacing hole 124, and make this first fixed area 111 be resisted against this second fixed area 121, move forward and backward this gusset piece 110 slightly, this each cramp 115 is worn be buckled in this each button hole 122, make this first fixed area 111 be connected in this second fixed area 121.This two banking stop 116 and this spacing hole 124 can limit the distance of these gusset piece 110 front and back slippages, and the reference data during as assembling, wear button mutually in order to this each cramp 115 and this each button hole 122.This each cramp 115 and this each button hole 122 are in order in conjunction with this gusset piece 110 and this fixed head 120.In addition, the location division 115a of these each cramp 115 front ends can be pressed in this each location hole 123, causes to avoid this gusset piece 110 to slide with respect to this fixed head 120 to come off.So that this heat-conducting block 210 is fixed in this fixed head 120 belows, this fixed head 120 is incorporated on this holder 320, this heat-conducting block 210 can firmly press on this thermal source 310.
For this fixed head 120 is interosculated with this holder 320, the edge of this fixed head 120 has more two outward extending installing sheets 126, the form and the size of this installing sheet 126 can be adjusted variation according to the change of holder 320 forms, to mate the form that grips of this holder 320.This respectively installs the stage casing of the outer side edges of sheet 126, is formed with a recess 126a more respectively.
See also shown in Figure 7ly, the schematic diagram that combines with this holder 320 for this fixed head 120 is to press on this heat-conducting block 210 on this thermal source 310.This holder 320 is the combination of a framework 321 and a fastener 322, and this thermal source 310 is positioned at the central authorities of this holder 320.This fixed head 120 is inserted among this framework 321, utilize fastener 322 will install sheet 126, this fixed head 120 is combined with this holder 320, and this heat-conducting block 210 is supported be affixed on the cooling of dispelling the heat on this thermal source 310 to lower compression.
Please consult shown in Figure 8 again, for the another kind that second preferred embodiment of the present invention is provided is used form, the fixed structure 100 of heat-conducting block provided by the present invention is applied on the holder 330 of another kind of form, wherein this holder 330 combination that is a rectangular frame 331 and a fastener 332, this framework 331 has a hollow region, and its relative dual side-edge has a plurality of outwards outstanding buckle piece 331a and a upwardly extending cylinder 331b respectively.This fastener 332 presents microscler sheet, and its front and back end has a clamping part 332a respectively, is formed with a plurality of button hole 332b on this clamping part 332a respectively.One thermal source (figure do not show) is positioned at the central authorities of this holder 330.
This gusset piece 110 is combined with this fixed head 120, make this heat-conducting block 210 be fixed in this fixed head 120 belows, this heat-conducting block 210 is supported be affixed on this thermal source, this fixed head 120 is placed in this framework 331, adjust this fixed head 120 positions, make the recess 126a of outer side edges of this two installings sheet 126 corresponding with this two cylinder 331b respectively, this fixed head 120 is formed the limit effect of horizontal directions.The clamping part 332a of this fastener 332 can utilize this each button hole 332b, with the buckle piece 331a of these framework 331 sides hook of interosculating, make this fastener 332 be fixed in this framework 331 tops, and to the elastic force of these heat-conducting block 210 generations to lower compression, to fix this heat-conducting block 210 and to make this heat-conducting block 210 closely fit in this thermal source, form excellent contact heat and pass, so that heat is conducted to radiating fin 231 via heat pipe 220.
Please consult shown in Figure 9 again, for the another kind that the present invention's the 3rd preferred embodiment is provided is used form, the holder 340 of this heat-conducting block 120 with another kind of form is fixed on the thermal source (figure does not show), this holder 340 is the combination of a chip carrier socket 341 and a fastener 342, be provided with a plurality of buckle piece 341a corresponding to this fastener 342 around this chip carrier socket 341, the kenel of this fastener 342 is roughly identical with second preferred embodiment.In the 3rd embodiment, fixed head 120 is removable, directly this heat-conducting block 210 is supported and be affixed on the thermal source, utilize fastener 342 by gusset piece 110 tops to lower compression, and interosculate with this each buckle piece 341a, to lower compression, fix this heat-conducting block 210 with elastic force, it is firmly supported be affixed on this thermal source.In addition, more be formed with two pivoted hole 116a on this two banking stop 116, the position, stage casing of this fastener forms two respectively along the driving rod 342a that extends laterally, and this two driving rod 342a is placed through this two pivoted hole 116a, makes this fastener 342 be articulated in the top of gusset piece 110.This two banking stop 116 is subjected to the constraint of this fastener 342, can bring into play the position-limiting action of horizontal direction, avoids this heat-conducting block 210 to slide with respect to this thermal source and comes off.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (29)
1. heat abstractor and fixed structure thereof, in order to a thermal source is cooled off, described thermal source is arranged at holder central authorities, described holder is in order to fixing described heat abstractor, with cooling that described thermal source is dispelled the heat, it is characterized in that described heat abstractor and fixture thereof include:
One heat-conducting block is affixed on the described thermal source in order to support;
One heat-sink unit;
A plurality of heat pipes, inside have working fluid and carry out heat conduction with the two-phase variation, and described a plurality of heat pipes connect described heat-conducting block and described heat-sink unit respectively, use for described heat-conducting block and described heat-sink unit and carry out heat exchange;
One gusset piece is fixed on the described heat-conducting block, and described gusset piece has one first fixed area; And
One fixed head, has one second fixed area, second fixed area of described fixed head and first fixed area of described gusset piece are connected and fixed, with in conjunction with described gusset piece and described fixed head, make described heat-conducting block be fixed in described second fixed area below, combine with described holder by described fixed head, so that described heat-conducting block is pressed on the described thermal source.
2. heat abstractor according to claim 1 and fixed structure thereof, it is characterized in that, first fixed area of described gusset piece has a plurality of cramps, and second fixed area of described fixed head has the button hole that corresponds to the described first fixed area cramp, with by the cramp of described first fixed area and the button hole of described second fixed area, described gusset piece and described fixed head are connected and fixed.
3. heat abstractor according to claim 2 and fixed structure thereof is characterized in that, described gusset piece has four cramps, and described fixed head has four button holes corresponding to described four cramps.
4. heat abstractor according to claim 2 and fixed structure thereof, it is characterized in that, the front end of described each cramp is bent to form a location division of protruding downwards, described gusset piece is provided with a plurality of location holes corresponding to described location division, described each location division can be pressed in described each location hole, slides with respect to described fixed head to avoid described gusset piece.
5. heat abstractor according to claim 1 and fixed structure thereof is characterized in that, described heat-conducting block is a metal rectangle block.
6. heat abstractor according to claim 1 and fixed structure thereof is characterized in that described heat-conducting block has a plurality of holding parts, in order to hold described a plurality of heat pipe.
7. heat abstractor according to claim 6 and fixed structure thereof is characterized in that, described each holding part is arranged with the upper surface in described heat-conducting block.
8. heat abstractor according to claim 1 and fixed structure thereof is characterized in that described heat-sink unit is made of a plurality of radiating fin.
9. heat abstractor according to claim 8 and fixed structure thereof, it is characterized in that, described radiating fin has a plurality of holes that place corresponding to described each heat pipe, and described a plurality of heat pipes are placed through described respectively placing in the hole, described each radiating fin are serially connected with an end of described heat pipe.
10. heat abstractor according to claim 1 and fixed structure thereof is characterized in that, first fixed area of the profile of described second fixed area and described gusset piece matches each other.
11. heat abstractor according to claim 1 and fixed structure thereof is characterized in that, the both sides of described first fixed area form a horizontal-extending portion respectively, are fixed on the described heat-conducting block.
12. heat abstractor according to claim 1 and fixed structure thereof is characterized in that, the cephalolateral margin of described first fixed area has a horizontally extending forward protuberance, and the front end of described protuberance forms a plate washer that extends downwards.
13. heat abstractor according to claim 1 and fixed structure thereof is characterized in that, described first fixed area has two upwardly extending banking stops, and described second fixed area has a spacing hole, in order to the described banking stop of correspondence.
14. heat abstractor according to claim 13 and fixed structure thereof is characterized in that, have a pivoted hole on the described banking stop.
15. heat abstractor according to claim 1 and fixed structure thereof is characterized in that, two lateral edges of described fixed head have more two outward extending installing sheets.
16. heat abstractor according to claim 15 and fixed structure thereof is characterized in that, the stage casing of the outer side edges of described installing sheet is formed with a recess more respectively.
17. the fixed structure of a heat-conducting block is incorporated on the holder, it is characterized in that, includes:
One heat-conducting block;
One gusset piece is fixed on the described heat-conducting block, and described gusset piece has one first fixed area; And
One fixed head, tool one second fixed area, described second fixed area connects with described first fixed area, with in conjunction with described gusset piece and described fixed head, makes described heat-conducting block be fixed in described second fixed area below.
18. the fixed structure of heat-conducting block according to claim 17, it is characterized in that, first fixed area of described gusset piece has a plurality of cramps, and second fixed area of described fixed head has the button hole that corresponds to the described first fixed area cramp, with by the cramp of described first fixed area and the button hole of described second fixed area, described gusset piece and described fixed head are connected and fixed.
19. the fixed structure of heat-conducting block according to claim 18 is characterized in that, described gusset piece has four cramps, and described fixed head has four button holes corresponding to described four cramps.
20. the fixed structure of heat-conducting block according to claim 18, it is characterized in that, the front end of described each cramp is bent to form a location division of protruding downwards, described gusset piece is provided with a plurality of location holes corresponding to described location division, described location division can be pressed in the described location hole, slides with respect to described fixed head to avoid described gusset piece.
21. the fixed structure of heat-conducting block according to claim 17 is characterized in that, first fixed area of the profile of described second fixed area and described gusset piece matches each other.
22. the fixed structure of heat-conducting block according to claim 17 is characterized in that, the central authorities of described first fixed area have two upwardly extending banking stops, and the central authorities of described second fixed area have a spacing hole, in order to the described banking stop of correspondence.
23. the fixed structure of heat-conducting block according to claim 22 is characterized in that, has a pivoted hole on the described banking stop.
24. the fixed structure of heat-conducting block according to claim 17 is characterized in that, two lateral edges of described fixed head have more two outward extending installing sheets.
25. the fixed structure of heat-conducting block according to claim 24 is characterized in that, the stage casing of the outer side edges of described installing sheet is formed with a recess more respectively.
26. the fixed structure of heat-conducting block according to claim 17 is characterized in that, the both sides of described first fixed area form a horizontal-extending portion respectively.
27. the fixed structure of heat-conducting block according to claim 17 is characterized in that, the cephalolateral margin of described first fixed area has a horizontally extending forward protuberance, and the front end of described protuberance forms a plate washer that extends downwards.
28. the fixed structure of heat-conducting block according to claim 17 is characterized in that, more includes a plurality of heat pipes, described a plurality of heat pipes connect described heat-conducting block with the one end.
29. the fixed structure of heat-conducting block according to claim 28 is characterized in that, more includes a plurality of radiating fins, is arranged at the other end of described heat pipe, described heat pipe passes relation in order to connect described heat-conducting block and described radiating fin to constitute heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100767052A CN100390975C (en) | 2005-06-10 | 2005-06-10 | Fixing structure for heat-conducting block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100767052A CN100390975C (en) | 2005-06-10 | 2005-06-10 | Fixing structure for heat-conducting block |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1877826A CN1877826A (en) | 2006-12-13 |
| CN100390975C true CN100390975C (en) | 2008-05-28 |
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ID=37510203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100767052A Expired - Fee Related CN100390975C (en) | 2005-06-10 | 2005-06-10 | Fixing structure for heat-conducting block |
Country Status (1)
| Country | Link |
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| CN (1) | CN100390975C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106895724A (en) * | 2017-02-24 | 2017-06-27 | 江阴市亚龙换热设备有限公司 | Plate type heat exchanger |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6094348A (en) * | 1996-10-31 | 2000-07-25 | Fujitsu Limited | Microchip module mounting structure |
| JP2001203485A (en) * | 1999-08-06 | 2001-07-27 | Showa Alum Corp | Radiator of cpu for personal computer |
| CN2476055Y (en) * | 2001-02-28 | 2002-02-06 | 陈欣怡 | Easy-to-assemble fixed structure for integrated circuit radiator |
| CN2572732Y (en) * | 2002-09-26 | 2003-09-10 | 纬创资通股份有限公司 | Heat sink for heat-producing component on circuit board |
| US20040125566A1 (en) * | 2002-12-31 | 2004-07-01 | Lee Hsieh Kun | Heat sink assembly with fixing mechanism |
-
2005
- 2005-06-10 CN CNB2005100767052A patent/CN100390975C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6094348A (en) * | 1996-10-31 | 2000-07-25 | Fujitsu Limited | Microchip module mounting structure |
| JP2001203485A (en) * | 1999-08-06 | 2001-07-27 | Showa Alum Corp | Radiator of cpu for personal computer |
| CN2476055Y (en) * | 2001-02-28 | 2002-02-06 | 陈欣怡 | Easy-to-assemble fixed structure for integrated circuit radiator |
| CN2572732Y (en) * | 2002-09-26 | 2003-09-10 | 纬创资通股份有限公司 | Heat sink for heat-producing component on circuit board |
| US20040125566A1 (en) * | 2002-12-31 | 2004-07-01 | Lee Hsieh Kun | Heat sink assembly with fixing mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1877826A (en) | 2006-12-13 |
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