CN100389497C - Structure for packaging image sensor - Google Patents
Structure for packaging image sensor Download PDFInfo
- Publication number
- CN100389497C CN100389497C CNB03139731XA CN03139731A CN100389497C CN 100389497 C CN100389497 C CN 100389497C CN B03139731X A CNB03139731X A CN B03139731XA CN 03139731 A CN03139731 A CN 03139731A CN 100389497 C CN100389497 C CN 100389497C
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- China
- Prior art keywords
- lens
- package
- sensing chip
- image sensing
- main body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The present invention discloses a package structure for an image sensor, which comprises an image sensing chip, a main package body and a package lens, wherein the main package body contains and fixedly holds the image sensing chip inside; the package lens seals the main package body so that a closed space is formed, wherein the package lens has a condensation function. The present invention uses the lens which has the condensation function on the image signal light for packing the image sensing chip, can effectively shorten the imaging focal length, can reduce the height of the whole package structure of the image sensor, and is beneficial to the miniaturization application for the package structure of the image sensor.
Description
[technical field]
The invention relates to a kind of encapsulation structure for image sensor.
[background technology]
But image sensing is because of detected image and can be converted into electric signal, is widely used in various photovoltaic, as medicine equipment, digital camera, digital camera etc., is one of vital part of these class audio and video products.Compact requirement improves to digital product along with the consumer, and the size of effectively dwindling encapsulation structure for image sensor becomes the emphasis that industry is made great efforts.
Referring to Fig. 1, it is existing encapsulation structure for image sensor 10, image sensing chip 14 utilizes the metal welding connection to be pasted on the substrate 12, have enclosing of certain altitude in image sensing chip 14 setting on every side and hinder 16, and enclose barrier 16 with a cover glass 18 sealing and form confined spaces (indicating), wherein glass cover 18 keeps at a certain distance away with image sensing chip 14, is convenient to capture track P and images in image sensing chip 14 after cover glass 18.Pin leads 13 is that the internal circuit with image sensing chip 14 is connected with external circuit, exports picture signal to printed circuit board (PCB) (figure does not show).It is bigger that the substrate 12 of the encapsulating structure of existing image sensor and glass cover 18 occupy volume, make that the height of whole encapsulation structure for image sensor 10 is higher, this is difficult at therapeutic medical endoscope encapsulation structure for image sensor 10, and microminiature occasions such as camera cell phone obtain extensive use.
A kind of existing modified model encapsulation structure for image sensor 20 was that on May 1st, 2002, publication number are disclosed by the Chinese patent of CN1347151 by open day, the encapsulation structure for image sensor 20 that this patent disclosed, referring to Fig. 2, adopt upside-down mounting chip encapsulation technology, bottom surface in glass plate 22 directly makes circuit 221, and does upside-down mounting chip encapsulation with image sensing chip 14 and combine.This modified model encapsulation structure for image sensor 20 can reduce the height of whole encapsulation structure for image sensor 20.In addition, this method for packing is made the sealing lid with substrate, but conservation.
See also the imaging optical path schematic diagram of Fig. 3 for existing encapsulation structure for image sensor, image sensing chip 14 is sealed in by cover glass 18, encapsulation and encloses barrier 16 and substrate 12 formed confined spaces, and signal of video signal light (not indicating) is received by image sensing chip 14 by cover glass 18 after an imaging len 48 is assembled.Wherein cover glass 18 only seals, and prevents that contamination particle from entering the reception of image sensing chip 14 influences to flashlight.Because 18 pairs of signal of video signal light of this cover glass do not have converging action, thereby whole imaging focal length is longer, thereby cause the size of whole image-forming module bigger.
In addition, the image sensor module that makes of above-mentioned modified model packaged type is unfavorable for reducing system height matching with an imaging lens group when using.
[summary of the invention]
The object of the present invention is to provide a kind of encapsulation structure for image sensor, this encapsulating structure can effectively reduce the package thickness of image sensor.
For achieving the above object, encapsulation structure for image sensor provided by the invention, it comprises an image sensing chip, this image sensing chip tool one light receiving surface and a bottom surface, this light receiving surface is in order to receive signal of video signal light; One package main body, this package main body are accommodated this image sensing chip of fixing in its inside, and the bottom surface of this image sensing chip contacts with this package main body; And a package lens, this package lens seals this package main body and forms an airtight space, and this package lens is the optically focused meniscus lens, and the concave surface of this meniscus lens is towards the light receiving surface of described image sensing chip.
The present invention's one improved encapsulation structure for image sensor comprises that one has the image sensing chip of a light receiving surface and a bottom surface, in order to receive signal of video signal light, one package main body, being used for that described image sensing chip is accommodated the bottom surface that is immobilizated in inside and this image sensing chip contacts with this package main body, an and imaging lens group, in order to the picked-up image and finish output to signal of video signal light, this imaging lens group comprises a taking lens and a package lens, wherein this image sensing chip is via this package lens encapsulation, this package lens is the optically focused meniscus lens, this meniscus lens seals described package main body and forms a confined space, and the concave surface of this meniscus lens is towards the light receiving surface of described image sensing chip, and the convex surface of this meniscus lens is towards described taking lens.
Compare with existing encapsulation structure for image sensor, the invention provides image sensing chip packaging structure and replace the simple glass sheet with the optically focused meniscus lens, can play further converging action to signal of video signal light, effectively shorten imaging focal length, reduce the height of whole module, in addition, this improved encapsulation structure for image sensor and can save the encapsulation raw material.
[description of drawings]
Fig. 1 is existing encapsulation structure for image sensor schematic diagram.
Fig. 2 is existing image sensor one modified model encapsulating structure schematic diagram.
Fig. 3 is the imaging optical path schematic diagram of existing encapsulation structure for image sensor.
Fig. 4 is an encapsulation structure for image sensor schematic diagram of the present invention.
Fig. 5 is the present invention's one improved encapsulation structure for image sensor and imaging optical path schematic diagram thereof.
[embodiment]
See also Fig. 4, encapsulation structure for image sensor of the present invention comprises an image sensing chip 14, and this image sensing chip 14 comprises a light receiving surface 141 and one and light receiving surface 141 corresponding bottom surfaces 142; One package main body 34, this package main body 34 is provided with an inner chamber (not indicating), the degree of depth of this inner chamber is greater than the thickness of image sensing chip 14, and this image sensing chip 14 is accommodated the inside that is immobilizated in this package main body 34, and its bottom surface 142 is mutually bonding with the bottom surface of this package main body 34; And a package lens 36, this this package main body 34 of package lens 36 sealings forms a confined space; This package lens 36 is the optically focused meniscus lens, the concave surface of this meniscus lens is towards the light receiving surface 141 of described image sensing chip 14, thereby this meniscus lens can play converging action to the signal of video signal light of image sensing chip 14 to transmission, thereby effectively shorten imaging focal length, reduce the package dimension of encapsulation structure for image sensor.
See also Fig. 5, for one of encapsulation structure for image sensor of the present invention improves, this encapsulation structure for image sensor comprises an image sensing chip 14, in order to receive signal of video signal light, one package main body 34, being used for that described image sensing chip 14 is accommodated the bottom surface that is immobilizated in inside and this image sensing chip 14 contacts with this package main body 34, an and imaging lens group 30, in order to the picked-up image and finish signal of video signal light exported to image sensing chip 14, this imaging lens group 30 comprises a package lens 36 and a taking lens 38, wherein this image sensing chip 14 is by these package lens 36 encapsulation, this package lens 36 is the optically focused meniscus lens, and this image sensing chip 14 is positioned at concave surface one side of meniscus lens and seals described package main body 34 and forms a confined space, this taking lens 38 is positioned at convex surface one side of meniscus lens, because of signal of video signal light is further assembled through package lens 36 again after a taking lens 38 first convergences, can effectively shorten imaging focal length, so use package lens 36 encapsulation image sensing chips 14 to signal of video signal light tool convergence function, can make the thickness of whole module effectively reduce, in addition, last lens 36 encapsulation image sensing chips 14 by imaging lens group 30 make image sensing chip 14 and imaging lens group 30 integrated, make package lens 36 have the function of imaging and encapsulation concurrently, remove the height that can further reduce whole imaging system and also can save encapsulating material.
Claims (2)
1. encapsulation structure for image sensor, it comprises an image sensing chip, tool one light receiving surface and a bottom surface, this light receiving surface is in order to receive signal of video signal light; One package main body, this package main body are accommodated this image sensing chip of fixing in inside, and the bottom surface of this image sensing chip contacts with this package main body; And a package lens, this package lens seals this package main body and forms an airtight space, it is characterized in that this package lens is an optically focused meniscus lens, and the concave surface of this meniscus lens is towards the light receiving surface of described image sensing chip.
2. encapsulation structure for image sensor, it comprises that one has the image sensing chip of a light receiving surface and a bottom surface, in order to receive signal of video signal light, one package main body, being used for that described image sensing chip is accommodated the bottom surface that is immobilizated in inside and this image sensing chip contacts with this package main body, an and imaging lens group, in order to the picked-up image and finish output to signal of video signal light, this imaging lens group comprises a taking lens and a package lens, it is characterized in that this image sensing chip is by this package lens encapsulation, this package lens is the optically focused meniscus lens, this meniscus lens seals described package main body and forms a confined space, and the concave surface of this meniscus lens is towards the light receiving surface of described image sensing chip, and the convex surface of this meniscus lens is towards described taking lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03139731XA CN100389497C (en) | 2003-07-03 | 2003-07-03 | Structure for packaging image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB03139731XA CN100389497C (en) | 2003-07-03 | 2003-07-03 | Structure for packaging image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1567592A CN1567592A (en) | 2005-01-19 |
| CN100389497C true CN100389497C (en) | 2008-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03139731XA Expired - Fee Related CN100389497C (en) | 2003-07-03 | 2003-07-03 | Structure for packaging image sensor |
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| CN (1) | CN100389497C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286520A (en) | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Image sensing wafer packaging structure and encapsulation method thereof |
| CN107146800A (en) * | 2017-05-22 | 2017-09-08 | 武汉新芯集成电路制造有限公司 | A kind of encapsulation design of imaging sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607767A (en) * | 1983-06-27 | 1985-01-16 | Nec Corp | Semiconductor device |
| US6384397B1 (en) * | 2000-05-10 | 2002-05-07 | National Semiconductor Corporation | Low cost die sized module for imaging application having a lens housing assembly |
-
2003
- 2003-07-03 CN CNB03139731XA patent/CN100389497C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS607767A (en) * | 1983-06-27 | 1985-01-16 | Nec Corp | Semiconductor device |
| US6384397B1 (en) * | 2000-05-10 | 2002-05-07 | National Semiconductor Corporation | Low cost die sized module for imaging application having a lens housing assembly |
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| Publication number | Publication date |
|---|---|
| CN1567592A (en) | 2005-01-19 |
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