CN100382267C - Recovery processing method of an electrode - Google Patents
Recovery processing method of an electrode Download PDFInfo
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- CN100382267C CN100382267C CNB2005101234089A CN200510123408A CN100382267C CN 100382267 C CN100382267 C CN 100382267C CN B2005101234089 A CNB2005101234089 A CN B2005101234089A CN 200510123408 A CN200510123408 A CN 200510123408A CN 100382267 C CN100382267 C CN 100382267C
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Abstract
While a transfer surface 10 a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44 B on a contact sheet 44 formed on a substrate 44 M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44 M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44 B to a predetermined value.
Description
The application is that application number is dividing an application of 03138409.9 application for a patent for invention, and female case applying date is on May 27th, 2003, and denomination of invention is " the recovery processing method of electrode ".
Technical field
The present invention relates to the recovery processing method of electrode that a kind of electrode part joint face that makes the battery lead plate of the electrode part that terminal with relative semiconductor device is electrically connected recovers to become the surface roughness of regulation.
Background technology
, generally wish to be installed on wiring and be electrically connected reliably with in IC socket or the connector at electronic equipment with the terminal of the semiconductor device of the electrode of substrate.In such device, for example Japanese kokai publication hei 8-96865 communique and Te Kai 2000-294043 communique also illustrate like that, form the ceramic sputtered films of bismuth of the oxide-film that is enough to puncture the terminal that is formed at semiconductor device by spraying plating or form minute protrusions in the electric contact portion of the conductive pattern of the terminal (electrode) that is electrically connected semiconductor device or the end face on conduction road by etching processing.In the end face formation minute protrusions on electric contact portion or conduction road, reduced mutual contact area by like this, and the increase of the contact pressure of unit are, so, the effect that is easy to destroy oxide-film had.
As a result, the terminal of semiconductor device is electrically connected on the electrode of wiring with substrate reliably.
Use in the IC socket at electronic equipment as described above, when using the electric contact portion of conductive pattern repeatedly, owing to have the minute protrusions of resistance to wear as described above and the durability of ceramic sputtered films of bismuth also has certain life-span, so minute protrusions is because wearing and tearing such as contact pressures.Therefore, the end face of this electric contact portion or conducting channel becomes the surface that does not have concavo-convex cardinal principle smooth corresponding to frequency of utilization and irrecoverable, so its contact area increases, and, there is the inadequate danger of contact pressure.As a result, the reliable electrical connection that obtained originally may can not obtain along with use.
Summary of the invention
Consider above problem points, the object of the present invention is to provide a kind of electrode part joint face that makes the battery lead plate of the electrode part that terminal with relative semiconductor device is electrically connected to recover to become the recovery processing method of the electrode of regulation surface roughness, this recover processing method can be easily and also reliably the joint face of the electrode part of the battery lead plate after wearing and tearing form the concavo-convex of regulation.
In order to achieve the above object, the recovery processing method of electrode of the present invention comprises the 1st operation, the 2nd operation, and the 3rd operation, in described the 1st operation, in described the 1st operation, mounting copy board on the joint face of the electrode part of battery lead plate, surface and this joint face of this copy board are in contact with one another, this battery lead plate has the electrode part that is formed on the insulated substrate, and the joint face by this electrode part is electrically connected with the portion of terminal of semiconductor device, this copy board exists the material of difference to make by the linear expansivity of the insulated substrate of linear expansivity and this battery lead plate, and has the irregular surface of formation; In described the 2nd operation, press against in above-mentioned the 1st operation mounting in the copy board of the joint face of above-mentioned electrode part with the pressure of regulation towards the joint face of this electrode part, simultaneously under set point of temperature to this copy board and above-mentioned battery lead plate heating stipulated time; In described the 3rd operation, make copy board leave above-mentioned battery lead plate, on the joint face of above-mentioned electrode part, obtain the concavo-convex of regulation.
In addition, the set point of temperature of the 2nd operation and stipulated time also can be set at more than 80 ℃ less than 150 ℃ temperature range and time below 15 minutes more than 5 minutes.
In addition, the recovery processing method of electrode of the present invention comprises the 1st operation and the 2nd operation, in described the 1st operation, on the joint face of the electrode part of battery lead plate, the portion of terminal of mounting semiconductor device, this battery lead plate is formed with the electrode part that the small crystal than the resistance to wear of the high abrasion resistance of mother metal constitutes that has that contains ormal weight in the mother metal by making on insulated substrate, and is electrically connected with the portion of terminal of semiconductor device by the joint face of this electrode part; In described the 2nd operation, make the portion of terminal of semiconductor device contact the joint face of above-mentioned battery lead plate and make this joint face wearing and tearing, the part of above-mentioned crystal is exposed, obtain the concavo-convex of regulation at this joint face whereby.
Crystal also can be by having the big hardness of hardness that likens to the copper of mother metal, and palladium that conductivity is higher or nickel are made.
In addition, the recovery processing method of electrode of the present invention comprises the 1st operation, the 2nd operation, reaches the 3rd operation, in described the 1st operation, mounting copy board on the joint face of the electrode part of battery lead plate, surface and this joint face of this copy board are in contact with one another, this battery lead plate has the electrode part that is formed on the insulated substrate, and is electrically connected in portion with the end of semiconductor device by the joint face of this electrode part, and this copy board has the irregular surface of formation; In described the 2nd operation, press against in above-mentioned the 1st operation mounting in the copy board of the joint face of above-mentioned electrode part towards the joint face of this electrode part, make on each electrode part applied pressure below the above 100g of 1g, simultaneously, on the parallel substantially either direction of relative this joint face, amount relatively moves the joint face of this copy board or this electrode part at least 1 time in accordance with regulations; In described the 3rd operation, make above-mentioned copy board leave above-mentioned battery lead plate, on the joint face of above-mentioned electrode part, obtain the concavo-convex of regulation.
In addition, in the 2nd operation, also can and make the parallel mobile carriage of joint face cardinal principle of its comparative electrode portion that battery lead plate is moved relative to copy board by the supporting battery lead plate.
Pushing force to each electrode part in the 2nd operation also can be below the above 100g of 1g, and in addition, the ormal weight that relatively moves of the 2nd operation also can be below the above 1mm of 1 μ m.
By above explanation as can be known, recovery processing method according to electrode of the present invention, since in the 1st operation with the pressure of regulation towards the joint face of electrode part pushing mounting in the copy board of the joint face of electrode part, simultaneously, heat copy board and battery lead plate in specified time limit with set point of temperature, so, by relatively sliding by the effect of its differential expansion, the joint face of electrode can be formed the roughness of regulation, so, can be easily and form the concavo-convex of regulation at the joint face of the electrode part of worn out battery lead plate reliably.
Description of drawings
Figure 1A and 1B are respectively the figure of each operation of the 1st embodiment of the recovery processing method that electrode of the present invention schematically is shown.
Fig. 2 A part illustrates the leading section of the prominent point in the operation shown in Figure 1A enlargedly, is the schematic partial sectional view of the explanation that is used for each operation, and Fig. 2 B part illustrates the leading section of the prominent point of operation shown in Figure 1B enlargedly, is the schematic partial sectional view of the explanation that is used for each operation.
Fig. 3 A, 3B, 3C, and the leading section of the prominent point of each operation of local respectively the 1st embodiment that amplifies the recovery processing method that electrode of the present invention is shown of 3D are the schematic partial sectional view of the explanation that is used for each operation.
Fig. 4 A, Fig. 4 B, and the leading section of the prominent point of local respectively each operation that comparative example is shown enlargedly of Fig. 4 C are the schematic partial sectional view of the explanation of each operation of being used for comparative example.
Fig. 5 A, Fig. 5 B, and the figure of Fig. 5 C each operation that to be the front end that is respectively applied for the prominent point of explanation wear and tear because of use.
The figure of each operation that Fig. 6 A, Fig. 6 B, and the local respectively front end that prominent point is shown enlargedly of Fig. 6 C, the front end that is respectively applied for prominent point shown in key diagram 5A, Fig. 5 B, Fig. 5 C wear and tear because of use.
Fig. 7 is the schematic partial sectional view of an example of semiconductor device by using socket that the contact chip of the 1st embodiment with the recovery processing method that is suitable for electrode of the present invention and the 2nd embodiment is shown.
Fig. 8 is the schematic partial sectional view of the formation of bracket system that example shown in Figure 7 schematically is shown.
Fig. 9 is the plane graph of example shown in Figure 8.
Figure 10 A, Figure 10 B, Figure 10 C are the used schematic partial sectional view of wanting portion of explanation of each operation of the 2nd embodiment of recovery processing method that electrode of the present invention is shown respectively enlargedly.
Figure 11 A, Figure 11 B, and Figure 11 C for amplifying the schematic partial sectional view of the part that Figure 10 A, Figure 10 B, Figure 10 C institute diagrammatic sketch are shown respectively.
Figure 12 A is the pie graph of the formation of an example of another bracket shell that decomposes the 1st embodiment that the recovery processing method that is used for electrode of the present invention is shown and substructure member, and Figure 12 B is the pie graph of formation that the bracket system of the bracket shell that comprises Figure 12 A is shown.
Figure 13 A is the pie graph of the formation of an example of another bracket shell again that decomposes the 1st embodiment that the recovery processing method that is used for electrode of the present invention is shown and substructure member, and Figure 13 B is the pie graph of formation that the bracket system of the bracket shell that comprises Figure 13 A is shown.
Figure 14 A is the pie graph of the formation of an example of another bracket shell again that decomposes the 1st embodiment that the recovery processing method that is used for electrode of the present invention is shown and substructure member, and Figure 14 B is the pie graph of formation that the bracket system of the bracket shell that comprises Figure 14 A is shown.
Figure 15 fixes first sectional drawing that illustrates for formation and the copy board of the bracket system platform of the 3rd embodiment of the recovery processing method that will be used for electrode of the present invention.
Figure 16 is the plane graph that is shown in the example of Figure 15.
Figure 17 is for decomposing the pie graph of the formation that bracket shell shown in Figure 15 and bracket system platform are shown.
Figure 18 A and 18B are the pie graph of all formations of carriage of the 3rd embodiment that the recovery processing method of electrode of the present invention is shown.
Embodiment
The 1st execution mode
Fig. 7 illustrate the 1st embodiment with the recovery processing method that is suitable for electrode of the present invention, the 2nd embodiment that the back will illustrate, and the connection of the 3rd embodiment with the semiconductor device by using socket of battery lead plate.
In semiconductor device by using socket shown in Figure 7, for example be used for the electrical characteristics test of semiconductor device, specifically be used in ageing test etc.The semiconductor device by using socket is included in inside and accommodates as the bracket system 40 of the bare chip of semiconductor device with dismantledly at the IC socket 30 of resettlement section receptacle bracket device 40.
IC socket 30 mainly comprises body 32, contact member group 34, cover member 36, wherein, described body 32 is configured on the inspection signal that is sent to this bare chip and the printed circuit board 38 from the input and output of detection output signal of bare chip etc., has the resettlement section of receptacle bracket device 40; Described contact member group 34 is located at body 32, comprises that conduct that the back that is electrically connected on the inscape that becomes bracket system 40 respectively will illustrate connects a plurality of contact members with each pad of the contact chip of battery lead plate; Described cover member 36 body 32 relatively disposes up and down, and selectively each contact portion of contact member group 34 is electrically connected on each pad of this contact chip.
The body 32 that is formed by resin material is configured to assigned position corresponding to the electrode part of printed circuit board 38.Body 32 has the resettlement section 32A of receptacle bracket device 40 as shown in Figure 7.Resettlement section 32A surrounds by the interior perimembranous of the bottom abutment portion 32a of the bottom of the pedestal part that is engaged in the bracket system 40 that the back will illustrate with the interior perimembranous of top abutment portion 32b that bottom abutment portion 32a conjointly is engaged in the top of this pedestal part.Bottom abutment portion 32a supporting contact member group 34.Be formed for inserting the slit SL of each the contact member 34ai (i=1～n, n are positive integer) that constitutes contact member group 34 at bottom abutment portion 32a and top abutment portion 32b.
The 34f of fixed side contact portion, the rubber-like that comprises the portion of terminal 34T that is pressed into bottom abutment portion 32a, links to each other and be electrically connected on the pad of contact chip by each contact member 34ai (i=1～n, n are positive integer) of thin-sheet metal material from lower side with portion of terminal 34T link to each other with portion of terminal 34T and be electrically connected on from upper side the pad of contact chip the movable side contact 34m of portion, and selectively be engaged in the inclined plane part of the cover member 36 that the back will illustrate and the rotating joint 34e of direction that the movable side contact 34m of portion is left towards the relative fixed side contact 34f of portion.This joint 34e extends setting from the cardinal extremity branch of the movable side contact 34m of portion towards cover member 36.
Each contact member 34ai in Fig. 7 corresponding to each pad of contact chip 44 along paper is vertical substantially relatively direction being spaced in accordance with regulations.In Fig. 7, contact member group 34 among 4 the contact member groups 34 all around that surround resettlement section 32A and corresponding position only is shown on one side.
The cover member 36 that is formed by resin material has the peristome 36a that bracket system 40 is passed through.The frame shape part that forms the periphery of peristome 36a is liftably supported by the foot's (not shown) that is led at the groove (not shown) of being located at body 32 peripheral parts.Cover member 36 applies elastic force by having omitted illustrated elastic component towards the direction that relative body 32 leaves.Lower end on this frame shape each limit partly is formed with inclined plane part 36s like that respectively shown in the double dot dash line of Fig. 7, when making cover member 36 drop to the position of regulation, this inclined plane part 36s is engaged in the front end of the joint 34e of above-mentioned each contact member 34ai, makes the movable side contact 34m of portion overcome its elastic force and the direction revolution left towards the relative fixed side contact 34f of portion.
The bracket system 40 that will illustrate in the back is installed on the occasion of resettlement section 32A of the body 32 of IC socket 30, by piezometric in accordance with regulations down and keep cover member 36, after each movable side contact relative resettlement section 32A of the 34m of portion of contact member group 34 retreats, become holding state, bracket system 40 is positioned to carry out in the 32A of resettlement section mounting from the top via peristome 36a.At this moment, the 34f of fixed side contact portion is contacted with the following side of pad of the contact chip 44 of bracket system 40.
Then, when release is in the cover member 36 of maintained state, cover member 36 risings of making a concerted effort to make of the elastic force of above-mentioned elastomeric restoring force and the joint 34e of each contact member 34ai.At this moment, the movable side of each of the contact member group 34 contact 34m of portion returns to original position from above-mentioned position of readiness, makes the upper face side of the pad of its contact chip that is contacted with bracket system 40 44.Like this, as shown in Figure 7, each pad and the contact member group 34 of contact chip 44 are electrically connected.
Pushing comprises with cover 52 as shown in Figure 8: have the pushing face 56a that is contacted with bare chip 60 upper surfaces pushing body 56, accommodate pushing body 56 base portion lid body 64 and be disposed at pushing body 56 base portion each recess and and the darker recess of this recess lid body 64 in opposite directions between the space push the spring 54 that body 56 applies elastic force towards 60 pairs of bare chips.
Substantially foursquare bare chip 60 is at the electrode group that for example has regulation with the prominent some 44B lower surface in opposite directions of contact chip 44.In Fig. 8, representative ground illustrates 2 among a plurality of prominent some 44B of contact chip 44 more turgidly.
The base portion of pushing body 56 is inserted in the more shallow and wide recess that covers body 64 movably.Form opposite to each other in the end of the base portion of this pushing body 56 a plurality of be located at the claw 56n that the claw that covers body 64 lower ends engages.Like this, pushing body 56 remains under the state by the resilient force of spring 54 and covers body 64.
Locking mechanism 50 comprises hook component 48A and 48B, torsion spring 66, reaches bolster 68, and wherein, described hook component 48A and 48B are supported on the two ends of bracket shell 46 respectively pivotally, and keeps covering body 64; Described torsion spring 66 is direction shown in the arrow in Fig. 7 respectively, and promptly the direction that engages with the lug boss 64p of lid body 64 applies elastic force to hook component 48A and 48B; Described bolster 68 supporting hook member 48A, 48B and torsion spring 66.
Form at the both ends of bracket shell 46 when pushing guide part 46g to the peripheral part channeling conduct of the bottom of covering body 64 when covering 52 is installed.The both ends of bolster 68 be bearing in guide part 46g around.
Contact chip 44 as Fig. 8 and as shown in Figure 9, in base material 44M, to have a plurality of prominent some 44B with the electrode group of the bare chip 60 that is electrically connected with arranging accordingly.In Fig. 9, a plurality of among a plurality of prominent some 44B of contact chip 44 are illustrated typically more turgidly.
Each prominent some 44B is by for example nickel plating and gold processing being carried out in its surface that becomes the copper of mother metal and forming.The front end of each prominent some 44B protrudes the height of regulation from the surface of this base material 44M.Base material 44M is for example by polyimide resin material (coefficient of linear expansion: 35 * 10
-6/ ℃) make with lamellar, have the thickness about about 40 μ m.
Each prominent some 44B is connected on the pad 44p via the conductor layer 44c that is made by Copper Foil as shown in Figure 9.Pad 44p is formed at the both ends of protruding towards the outside from the both ends of substructure member 42 respectively at base material 44M as shown in Figure 7.
The surface that the part of a plurality of prominent some 44B of the formation of contact chip 44 can be in substantially parallel relationship to substructure member 42 is supported with relatively moving prescribed limit.
In this constituted, when bracket system 40 in bare chip 60 being installed, at first, connect each prominent some 44B of contact 44 of the electrode group of bare chip 60 was positioned, and the electrode group of bare chip 60 is contacted with each prominent some 44B ground and disposes.Then, pushing is inserted in the resettlement section 46A of bracket shell 46 with lid 52.At this moment, pushing makes the hook component 48A of locking mechanism 50 and the front end of 48B turn round towards the direction of leaving mutually with the elastic force that the inclined plane part 64ps of the lid body 64 of lid 52 overcomes torsion spring 66.In addition, the outer peripheral face of lid body 64 is by the guiding of the inner face of guide part 46g, and the elastic force that the pushing face 56a of pushing body 56 overcomes spring 54 is pressed to the upper surface of bare chip 60.
Then,, the front end of hook component 48A and 48B is turned round towards approaching mutually direction, and engage with the lug boss 64p of lid body 64 by applying elastic force from torsion spring 66.Like this, pushing remains in bracket shell 46 with lid 52.
Then, under the state that this bracket system 40 is installed on as described above resettlement section 32A bare chip 60 is being tested in the gas medium of regulation.
In such test, bracket system 40 as described above and contact chip 44 are recycled stipulated number with respect to the new bare chip of being installed 60.
Before being used for such test, the initial as Fig. 5 A of untapped each prominent some 44B amplifies and has the cone shape shape of cardinal principle illustrating.In addition, amplify as Fig. 6 A in the portion foremost of prominent some 44B and illustrate like that at the small concavo-convex 44a of all formation in its surface.
When contact chip 44 was used to test, as being illustrated by Fig. 5 B and Fig. 6 B amplification, the flattening amount in accordance with regulations of portion foremost of prominent some 44B was contacted with the electrode surface of bare chip 60 with the pressure of regulation.
Then, by 1 contact chip 44 is recycled stipulated number with respect to bare chip 60, illustrate like that thereby amplify as Fig. 5 C and Fig. 6 C, the prominent portion foremost of putting 44B ' of each after the use is crushed, and becomes the cardinal principle truncated cone shape with tabular surface.The level and smooth tabular surface 44fs of the prominent point of like this each 44B ' does not have shown in Fig. 6 A such small concavo-convex.
Therefore, use the occasion more than the stipulated number on contact chip 44 ground of not changing 1, have the mutual insecure danger of electrical connection of contact chip 44 and bare chip 60.
For this reason, in the 1st embodiment of the recovery processing method of electrode of the present invention, prepare the copy board with specific thickness 10 such shown in Figure 1A in advance.This copy board 10 is by for example having carried out chromium plating (coefficient of linear expansion: about 6.2 * 10 as surface treatment
-6/ ℃) cold working tool steel (JIS trade mark SKS, the SKD) (coefficient of linear expansion: about 11.5 * 10 handled
-6/ ℃) make, amplify the concavo-convex 10a that has the regulation roughness illustrating at the duplicate surface 10s of side's side as Fig. 2 A at least.
At first, shown in Figure 1A, like that, will dispose the contact chip 44 of worn out prominent some 44B ' and replace bare chip 60 and above-mentioned bracket system 40 that copy board 10 has been installed is configured to temperature maintenance in the groove in the thermostat 12 of setting.Thermostat 12 has the temperature regulator that can adjust temperature in the groove changeably.
At this moment, copy board 10 with the worn out tabular surface 44fs of each prominent some 44B ' in its duplicate surface 10s and the thermostat 12 contiguously mounting on the universal plane that forms by a plurality of tabular surface 44fs.Therefore, copy board 10 is by the tabular surface 44fs supporting of a plurality of prominent some 44B '.At this moment, along the pressure of direction shown in the F of arrow shown in Figure 1A duplicate surface 10s is pressurizeed by a plurality of relatively prominent some 44B ' of the elastic force of spring 54 via above-mentioned pushing body 56 with regulation.This plus-pressure is set at for example per 1 following scope of the prominent above 100g of the point about 1g of 44B '.Check according to the present inventor, this plus-pressure is to the occasion of per 1 prominent some 44B ' less than about 1g, basically recover the effect of processing, in addition, plus-pressure is in the occasion that per 1 prominent some 44B ' is surpassed 100g, the protrusion height of prominent some 44B ' is lower too much than benchmark, and, the flattening degree of the front end of prominent some 44B ' is bigger, thereby the electrode that checked property takes place is subjected to the problem of bigger damage, so this plus-pressure is set in for example per 1 following scope of the prominent above 100g of the point about 1g of 44B '.
Fig. 3 B amplifies the state that duplicate surface 10s just has been contacted with the leading section of prominent some 44B ' after tabular surface 44fs is pressurizeed that illustrates.Like this, as can be seen from Figure 3B, the leading section of prominent some 44B ' forms thicker concavo-convex 44ps by the concavo-convex 10a pushing of copy board 10.
Then, make the temperature in the thermostat 12 for example rise to 80 ℃～150 ℃ scope, and keep more than 5 minutes from standard state.Temperature in the thermostat 12 and keep during preferably be set at about 150 ℃, 15 minutes of groove temperature.
Therefore, copy board 10 and contact chip 44 are in the occasion that expands towards direction shown in the arrow E of for example Figure 1A along with the temperature rising of groove temperature respectively, because the thermal coefficient of expansion of base material 44M is set greatlyyer than the coefficient of linear expansion of copy board 10 as described above, so contact chip 44 overcomes the mutual frictional force of concavo-convex 44ps shown in Fig. 3 B and duplicate surface 10s and extends relative to the earth than the extension of copy board 10.The result, the face that forms concavo-convex 44ps about by tens of microns of the small concavo-convex 10a of contact chip 44 and the relative duplicate surface 10s of prominent some 44B ' slide relative and and then be cut, its such surface roughness shown in formation Fig. 3 C is the concavo-convex 44ms of thinner roughness.
Then, will have prominent some 44B having carried out recovering handling " contact chip 44 " takes out from bracket system 40 shown in Figure 1B like that.
Therefore, amplify as Fig. 2 B and Fig. 3 D and to illustrate like that, not at a prominent some 44B " face 44es foremost apply bigger pushing force and promptly form pushing and the corresponding trickleer concavo-convex 44ms of slip with the small concavo-convex 10a of the duplicate surface 10s of copy board 10.
In addition, as described above, by heating, the prominent some 44B easy deformation that becomes, so, above-mentioned concavo-convex easier formation.
Fig. 4 A, Fig. 4 B, Fig. 4 C illustrate the state of each operation of prominent some 44B ' of the comparative example of having been verified by the present inventor respectively.
In this comparative example, when the recovery of carrying out electrode is handled, do not carry out the heating as in the above-mentioned example, configuration is similarly amplified the worn out contact chip 44 of such, prominent some 44B ' that is shown in Fig. 4 A with above-mentioned example in above-mentioned bracket system 40, and, only replace bare chip 60 as described above and same copy board 10 is installed.
In this comparative example, via pushing body 56 by the elastic force of spring 54 along direction shown in the F of arrow shown in Figure 1A by with the same authorized pressure of above-mentioned example by 10 couples of prominent some 44B ' of copy board pressurizations.Fig. 4 B amplifies the state that duplicate surface 10s rigidly connects the leading section of prominent some 44BC after touching tabular surface 44fs and being pressurizeed that illustrates.Like this, by Fig. 4 B as can be known, the leading section of prominent some 44BC forms thicker concavo-convex 44ps by the pushing of the concavo-convex 10a of copy board 10.
Then, from bracket system 40, take out contact chip with the prominent some 44BC that handles through over recovery.
Like this, amplify as Fig. 4 C and to illustrate like that, the corresponding thicker concavo-convex 44ps of pushing of formation and the small concavo-convex 10a of the duplicate surface 10s of copy board 10 on the face foremost of prominent some 44BC.
As a result, in the method for comparative example, can confirm to be formed on the such trickleer concavo-convex 44ms that obtains among the application's the embodiment 1.
In addition, in the present invention, by duplicate surface 10s as described above and the relative slip of dashing forward between the some 44B, can obtain just like file such effect in processing back on the joint face of prominent some 44B, and, compare with the occasion of only being duplicated by pushing, this concavo-convex interval becomes littler, and can positively form concavo-convex.
The 2nd execution mode
Figure 10 A, Figure 10 B, Figure 10 C schematically illustrate the 2nd embodiment of the recovery processing method of electrode of the present invention.
The contact chip 80 that is used for the employing of example shown in Figure 10 A～Figure 10 C is such shown in Figure 10 A, by having a plurality of prominent some 84B with the electrode group of the bare chip 60 that is electrically connected in base material 84M with arranging accordingly.The front end of this each prominent some 84B protrudes the height of regulation from the surface of this base material 84M.Form small concavo-convex 84a all as Figure 11 A amplification illustrates on the surface of its front end.
Each prominent some 84B is electrically connected on the pad (not shown) by the conductor layer 84C that is made by Copper Foil.This pad is formed at from the both ends of substructure member 42 as described above respectively the both ends that portion outwardly protrudes at base material 84M.Each prominent some 84B by for example the crystal 86 of regulation is mixed into substantially equably the gold that becomes mother metal (Ku Shi hardness: 80～200) or copper (Ku Shi hardness: the material that obtains 250～320) is with coniform formation substantially.
In addition, crystal 86 is that the occasion of copper is by nickel (Ni) (the Ku Shi hardness: 300～490) make, mix by the containing ratio about about 15～20%/vol with particle diameter about 2～3 μ ms more higher than the big hardness of the hardness of copper and conductance at mother metal.
The recovery that the prominent some 84B as electrode of this contact chip 80 carries out is handled, because 1 contact chip 80 is configured in the above-mentioned bracket system 40 as described above, so, relative bare chip 60 contacts of front end by prominent some 84B are also recycled, and can be automatically the joint face of the front end of prominent some 84B are recovered to handle.Therefore, the pushing operation and the heating process of the copy board 10 that need in above-mentioned the 1st embodiment, not use.
That is, when the contact chip in the bracket system 40 80 was used to test, as Figure 10 B and Figure 11 B illustrated enlargedly, the flattening amount in accordance with regulations of portion foremost of prominent some 84B was contacted with the electrode surface of bare chip 60 with the pressure of regulation.
Then, by 1 contact chip 80 is recycled stipulated number with respect to bare chip 60, amplify as Figure 10 C and Figure 11 C and to illustrate like that, each prominent portion foremost of putting 84B ' is crushed, and becomes the cardinal principle truncated cone shape with tabular surface.Front end face 84fs at the prominent point of such each 84B ' is exposed the part of a plurality of crystals 86 that contain like that by the wearing and tearing of mother metal shown in Figure 11 C, thereby form small concavo-convex.
Therefore, along with the wearing and tearing of the mother metal of the portion foremost of each prominent some 84B ', new have a portion foremost that small concavo-convex face automatically is formed at each prominent some 84B '.
At the bracket system 40 of the 1st embodiment of the recovery processing method of the electrode that is used for the invention described above, the surface that the part that is formed with a plurality of prominent some 44B of contact chip 44 can be in substantially parallel relationship to substructure member 42 is supported with relatively moving prescribed limit.
Yet the structure of bracket system 40 needn't necessarily form like this, also can use for example bracket system shown in Figure 12 A and Figure 12 B～Figure 14 A and Figure 14 B.
In Figure 12 A, bracket system and above-mentioned example similarly comprise: have the resettlement section 47A that accommodates bare chip 60 or copy board 10 bracket shell 47, form bracket shell 47 resettlement section 47A the bottom substructure member 43, across flexure strip 41 be configured to contact chip 45 on the substructure member 43, the pushing of pushing body 56 that comprises the electrode group of prominent some 45B pushing bare chip 60 of the contact 45 that connects or copy board 10 with lid 52 (with reference to Fig. 8), and optionally will push with covering 52 locking mechanisms 49 that remain in the bracket shell 47.Pushing with cover 52 with the structure of locking mechanism 49 because identical with the structure that covers with locking mechanism, so the repetitive description thereof will be omitted with the pushing of above-mentioned the 1st embodiment.
Each prominent some 44B is connected on the pad 45p via the conductor layer of being made by Copper Foil.A plurality of pad 45p are formed at the both ends of protruding from substructure member 43 both ends towards the outside respectively at base material 45M.
Be disposed at contact chip 45 a plurality of prominent 44B of selecting under one of flexure strip 41 roles be the deviation homogenizing that similarly makes the contact force of the prominent some 45B that the protrusion height by each prominent some 45B produces with above-mentioned example.
Shown in Figure 12 B, like that, accompany contact chip 45 ground with bracket shell 47 and substructure member 43 interconnective connecting elementss 51, be preferably for example rivet or Screw and nut as the centre.
When using such bracket system, the recovery of prominent point is handled, same with above-mentioned the 1st embodiment, at first will dispose the contact chip 45 of worn out prominent point and replace bare chip 60 and above-mentioned bracket system that copy board 10 has been installed is configured to temperature maintenance in the groove in the thermostat 12 of the value of regulation.
The condition of pushing force and above-mentioned the 1st embodiment similarly set.
Then, make the temperature in the thermostat 12 for example rise to 80 ℃～150 ℃ scope, and keep more than 5 minutes from standard state.Temperature in the thermostat 12 and keep during preferably be set at about 150 ℃, 15 minutes of groove temperature.
Like this, rise along with the temperature of groove temperature respectively and the occasion that expands at copy board 10 and substructure member 43, bracket shell 47, contact chip 45, because the thermal coefficient of expansion of bracket shell 47 grades is set greatlyyer than the coefficient of linear expansion of copy board 10 as described above, so contact chip 45 overcomes with the extension the earth of the mutual frictional force of duplicate surface 10s than copy board 10 and extends.As a result, same with above-mentioned the 1st embodiment, each prominent some 45B moves with contact chip 45, so, form its surface roughness concavo-convex for thinner roughness at the front end of prominent some 45B.
Figure 13 A and Figure 13 B illustrate another bracket system of an example of the recovery processing method that is used for electrode of the present invention respectively.
In bracket system shown in Figure 12 A and Figure 12 B, accompany contact chip 45 ground by connecting elements 51 and interconnect bracket shell 47 and substructure member 43, but in Figure 13 A and B, as its alternative structure, by binding agent or accompany contact chip 45 ground by welding and interconnect bracket shell 47 and substructure member 43.In Figure 13 A and Figure 13 B,, omit its repeat specification with inscape employing same-sign identical among Figure 12 A and Figure 12 B.
Bracket shell 47 ' by the material with linear expansivity bigger than the linear expansivity of above-mentioned copy board 10, for example resin material forms.As resin material, be preferably for example Polyetherimide (coefficient of linear expansion: 56 * 10
-6/ ℃).Bracket shell 47 ' the interior perimembranous of resettlement section 47 ' A shown in Figure 13 B, when pushing is installed with lid 52, form like that pushing with covering 52 peripheral part channeling conduct and being located in assigned position ground.Form bracket shell 47 ' the bottom surface sections of bottom of resettlement section 47 ' A peristome 47 ' b is formed at central authorities.
Substructure member 43 ' by with bracket shell 47 ' the material identical materials form, the hole 45a that corresponds respectively to contact chip 45 has alignment pin 43 ' P at 4 positions.The face that alignment pin 43 ' P disposes flexure strip 41 relatively protrudes the length of stipulating, for example length of the thickness degree of contact chip 45.Alignment pin 43 ' P since to contact chip 45 relative substructure members 43 ' the position position, simultaneously, also be used for corresponding to substructure member 43 ' thermal expansion or the displacement of contraction contact chip 45 is moved.The bracket shell 47 of substructure member 43 ' relatively ' the position of resettlement section 47 ' A when welding, locate.
In this embodiment, copy board 10, substructure member 43 ', bracket shell 47 ', and contact chip 45 rise along with the temperature of groove temperature respectively and the occasion that expands, also because bracket shell 47 ' coefficient of linear expansion that waits is set greatlyyer than the coefficient of linear expansion of copy board 10 as described above, so contact chip 45 overcomes with the mutual frictional force of the duplicate surface 10s extension the earth than copy board 10 and extends.As a result, same with above-mentioned the 1st embodiment, because each prominent some 45B moves with contact chip 45, so, form its surface roughness concavo-convex for thinner roughness at the front end of each prominent some 45B.
Figure 14 A and Figure 14 B illustrate another bracket system again of an example of the recovery processing method that is used for electrode of the present invention respectively.
In bracket system shown in Figure 13 A and Figure 13 B, bracket shell 47 ' with the substructure member 43 with alignment pin 43 ' P ' accompany contact chip 45 ground to interconnect, but in Figure 14 A and Figure 14 B, as its alternative structure, have alignment pin 47 " bracket shell 47 of P " and substructure member 43 " by binding agent or accompany contact chip 45 ground by welding and interconnect.In Figure 14 A and Figure 14 B, to Figure 12 A and Figure 12 B in identical inscape adopt same-sign, omit its repeat specification.
" by the material with linear expansivity bigger than the linear expansivity of above-mentioned copy board 10, for example resin material forms bracket shell 47.As resin material, be preferably for example Polyetherimide (coefficient of linear expansion: 56 * 10
-6/ ℃).The interior perimembranous of bracket shell 47 " resettlement section 47 " A as shown in Figure 14B like that when pushing is installed with lid 52 (with reference to Fig. 8) pushing is formed with covering 52 peripheral part channeling conduct and being located in assigned position ground." b is formed at central authorities with peristome 47 in the bottom surface sections of bracket shell 47 " resettlement section 47 " A." outside of the periphery of b, the hole 45a that corresponds respectively to contact chip 45 is protruding with alignment pin 47 " P at 4 positions at peristome 47." P this bottom surface relatively protrudes the length of stipulating, for example length of the thickness degree of contact chip 45 to alignment pin 47.The position of alignment pin 47 " P is used for contact chip 45 relative bracket shells 47 " positions, and simultaneously, also is used for corresponding to bracket shell 47 " thermal expansion or the displacement of contraction contact chip 45 is moved.Locate when welding the position of bracket shell 47 " the relative substructure member 43 of resettlement section 47 ' A ".
In this embodiment, copy board 10, substructure member 43 ", bracket shell 47 ", and contact chip 45 rise along with the temperature of groove temperature respectively and the occasion that expands, " coefficient of linear expansion that waits is set greatlyyer than the coefficient of linear expansion of copy board 10 as described above; so contact chip 45 overcomes with the mutual frictional force of the duplicate surface 10s extension the earth than copy board 10 and extends also because bracket shell 47.As a result, same with above-mentioned the 1st embodiment, because each prominent some 45B moves with contact chip 45, so, form its surface roughness concavo-convex for thinner roughness at the front end of each prominent some 45B.
The 3rd execution mode
The formation of bracket system platform and fixing first of the copy board of the 3rd embodiment that Figure 15 and Figure 16 will be used for the recovery processing method of electrode of the present invention respectively schematically illustrates.
In Figure 15 and Figure 16, inscape identical in the bracket system of Fig. 7 and example shown in Figure 8 is adopted same-sign, omit its repeat specification.In addition, in Figure 15 Figure 16, show and to have removed the state that the inscape of pushing with the part of the bracket system of the state that covers remains in the bracket system platform.
The part of bracket system such as Figure 15 and as shown in Figure 17 comprise: have the bracket shell 116 of the resettlement section 116A that accommodates bare chip 60, on the substructure member 108 of the bottom of the resettlement section 116A that forms bracket shell 116 across the contact chip 44 of flexure strip 110 ground configuration, comprise the contact 44 that connects the pushing of pushing body of prominent some 44B pushing bare chip 60 with lid (not illustrating in the drawings) and will push the locking mechanism 116F that optionally remains in the bracket shell 116 with covering.
Not shown above-mentioned pushing with the lid have with example shown in Figure 8 in the same formation of formation.
The two ends that locking mechanism 116F is included in bracket shell 116 are supported by as shown in Figure 7 bolster respectively and hook component that pushing is kept with the end of lid and towards hook component being applied the helical spring of elastic force with the direction of the engaged at end of covering with pushing pivotally.
At the circumference of resettlement section 106A, as Figure 16 and as shown in Figure 17, be arranged on the pair of locking mechanism of the bracket shell 116 that keeps bracket system in the 106A of resettlement section dismantledly opposite to each other.This locking mechanism comprise the resettlement section 116A that keeps bracket shell 116 circumference an ancient unit of weight member 112 and towards the direction that engages with the circumference of resettlement section 116A hook component 112 is applied the helical spring 114 of elastic force respectively.Hook component 112 is supported on the wall portion of the resettlement section 106A that forms bracket system platform 106 respectively pivotally by bolster 118.
The fixing head of copy board is such as will be described, when the contact chip 44 to the prominent point that worn and torn recovers to handle, as shown in Figure 15, is configured in the resettlement section 116A of bracket shell 116 of bracket system.
The fixing head of copy board comprises as shown in Figure 15: have the fixing stationary plane 102a of copy board 104 pushing body 102, have the recess of the base portion of accommodating pushing body 102 lid body 100, and copy board 104 is applied a plurality of springs 103 of elastic force towards prominent some 44B of contact chip 44.Each spring 103 is configured in respectively in each space between recess and the darker recess that covers body 100 of base portion of pushing body 102.
The base portion of pushing body 102 is inserted in the more shallow and wide recess that covers body 100 movably.Be formed with opposite to each other in the end of the insertion portion of this pushing body 102 a plurality of be located at the claw 102n that the claw that covers body 100 lower ends engages.Like this, pushing body 102 is held under the state by the resilient force of a plurality of springs 103 and covers body 100.
The one side relative fixed face 102a of the copy board of being made by metal material or ceramic material etc. 104 is fixed by bonding or connector.Be formed with surface roughness concavo-convex of flatness with regulation and regulation at the another side of copy board 104.Copy board 104 is not limited to this example, also can be integrally formed with pushing body 102.In addition, pushing body 102 also can not press from both sides establishes a plurality of springs 103, for example forms with lid body 100.
On the other hand, when the bare chip of installing 60 was tested, 116F held it on the bracket shell 116 by its locking mechanism with the lid (not shown) in the pushing of bracket system.
Be provided with the internal thread part 100s that the external thread part of the load transducer that will illustrate with the back cooperates at the cardinal principle central portion on top of lid body 100.
Figure 18 A and 18B are schematically illustrated among the 3rd embodiment of recovery processing method of electrode of the present invention, and the operation of recovering to handle by prominent some 44B to contact chip 44 makes the integral body formation of the carriage that contact chip 44 moves relative to the fixing head of copy board.
Carriage comprises portion of platform mechanism and pressing mechanism portion, and wherein, described portion of mechanism is disposed on the substructure member 120, maintenance is accommodated the bracket system platform 106 of the bracket shell 116 of contact chip 44 and fixes, and its direction towards regulation is moved; Described pressing mechanism portion keeps fixedly head of above-mentioned copy board, the pressure of regulation is affacted prominent some 44B of copy board 104 and contact chip 44.
Portion of platform mechanism comprises: the base station 122, X axis platform member 126, Y-axis that is disposed at substructure member 120 is to platform member 130, and panoramic table 136.X axis platform member 126 is moved by the ball screw member 124 that is supported on base station 122.In addition, Y-axis is moved by the ball screw member 132 that is supported on X axis platform member 126 by the vertical substantially direction of the edge and the axis direction of ball screw member 124 to platform member 130.In addition, panoramic table 136 is bearing in pivotally and is disposed at the platform support 134 of Y-axis to platform member 130, and keeps bracket system.
X axis platform member 126 is guided by guide rail 168, and is supported movably by ball screw member 124 via nut.The both ends of ball screw member 124 respectively by the par of base station 122 along the overhang bracket of direction shown in the arrow X among Figure 18 A and the 18B.In a side's of ball screw member 124 end, be connected with output shaft to the CD-ROM drive motor 160 that is fixed in base station 122 via reducing gear 160GH such as planetary gears.CD-ROM drive motor 160 also can be used for example linear motor, stepper motor, servo motor etc.Control device 150 controls that each CD-ROM drive motor that CD-ROM drive motor 160 and back will illustrate will be illustrated by the back.
Y-axis can be supported along the direction vertical with paper with 128B by 1 couple of guide rail 128A that disposes in opposite directions movably to the interior perimembranous of platform member 130 at X axis platform member 126.In addition, Y-axis is supported by ball screw member 132 via nut movably to platform member 130.The both ends of ball screw member 132 are respectively by the overhang bracket of the edge of X axis platform member 126 direction vertical with the paper of Figure 18 A and 18B.Be connected with the output shaft of the CD-ROM drive motor 162 that is fixed in X axis platform member 126 via reducing gears such as planetary gears in a side's of ball screw member 132 end.CD-ROM drive motor 162 also can be used for example linear motor, stepper motor, servo motor etc.
CD-ROM drive motor 164 is fixed on and is fixed in the central portion of Y-axis to the platform support 134 of the end face of platform member 130.Platform support 134 is fixed in the end face of Y-axis to platform member 130 via the otch of X axis platform member 126.The output shaft of CD-ROM drive motor 164 is connected to the endoporus of central authorities of the plectane portion of panoramic table 136 via reducing gear 164GH.The sidewall of panoramic table 136 is supported on the top of platform support 134 pivotally via bearing 137.CD-ROM drive motor 164 also can be used for example linear motor, stepper motor, servo motor etc.
Like this, when CD-ROM drive motor 164 was in running order, panoramic table 136 was around the central axis revolution of Y-axis to the central axis and the platform support 134 of platform member 130.
Pressing mechanism portion comprises: detect via the fixing head of copy board to the load transducer 138 of the pushing force of prominent some 44B, keep load transducer 138 and pushing force be delivered to the axial platform member 140 of Z of the fixing head of copy board, cooperate with the axial platform member 140 of Z and movably with the ball screw member 142 of its supporting and make ball screw member 142 rotating CD-ROM drive motor 166.
The both ends of ball screw member 142 are bearing in pivotally respectively and are located at the facial a pair of bracket part of standing upside down with separating predetermined distance.One side's of ball screw member 142 end is connected to the output shaft that is fixed in the facial CD-ROM drive motor 166 of standing upside down via reducing gear 166GH.CD-ROM drive motor 166 also can be used for example linear motor, stepper motor, servo motor etc.
The axial platform member 140 of Z vertically cooperates ball screw member 142 relative its axis with it via nut substantially, and not rotation ground is by guide rail 144 guiding.
The internal thread part 100s that load transducer 138 is screwed into the fixing head of copy board by the external thread part 138s that will be connected in inner transducer is connected to and covers body 100.Load transducer 138 detects the pushing force of the fixing head of the axial platform member 140 relative copy boards of Z, and will represent that the detection signal Sp of pushing force sends to control device 150.
Supply with to control device 150: from omitted illustrated production management with master computer be used to represent position with each member turn back to regulation the reference position order reset instruction signal Sr, represent the direction that should move of bracket shell 116 moving direction command signal Sd, recover to handle sign on signal Ss, reach detection signal Sp from above-mentioned load transducer 138.
In addition, control device 150 has storage part 150M in inside, this storage part 150M storage representation corresponding to contact chip 44 set to the data of the set point of the amount of movement of the set point of the pushing force of the fixing head of copy board or bracket shell 116 (bracket system platform 106) and be used to implement the routine data that recovers to handle etc.
The value of this pushing force is set corresponding to the size of prominent some 44B, for example, is made as the following scope of per 1 above 100g of electrode 1g.Example as the scope of the lower limit of the value of pushing force is made as the following scope of per 1 above 40g of electrode 1g.
The amount of movement of a direction of bracket shell 116 (bracket system platform 106) is set the play of each mechanism and the deflection of contact chip 44 etc. with taking in, for example makes the relative amount of movement of prominent some 44B become the following scope ground setting of the above 1mm of 1 μ m.One example of the scope of the lower limit of the relative amount of movement of putting 44B as dashing forward can be the following scopes of the above 100 μ m of 1 μ m.
In the recovery of the 3rd embodiment of the recovery processing method of electrode of the present invention is handled, at first, the bracket system platform 106 that the bracket shell 116 of the contact chip 44 that has disposed worn out prominent point will be installed shown in Figure 18 A and 18B like that remains in the plectane portion of the panoramic table 136 of the reference position that is in regulation.
Then, control device 150 makes the amount of movement of bracket shell 116 and bracket system platform 106 become the amount of movement of each member of value ground setting of regulation according to the data of recovering to handle sign on signal Ss, moving direction command signal Sd, reach in the storage device 150M.
At this moment, control device 150 is according to the amount of movement of the axial platform member 140 of data setting Z of the set point of the pushing force in detection signal Sp and the storage part 150M.
Control device 150 forms pulse control signal Cz corresponding to the amount of movement of setting, and it is supplied to motor drive circuit 158.Motor drive circuit 158 is supplied with drive signal according to pulse control signal Cz.
Then, control device 150 forms corresponding to the amount of movement of setting and should make bracket shell 116 and bracket system platform 106 move 1 time pulse control signal Cx, Cy, Cr at least, and with its supply motor drive circuit 152,154, and 156 respectively.Motor drive circuit 152,154, and 156 respectively according to pulse control signal Cx, Cy, Cr to CD-ROM drive motor 160,162, and 164 supply with drive signals.
Like this, the relative copy board 104 of prominent some 44B of the contact chip 44 in the bracket shell 116 is measured in accordance with regulations towards prescribed direction and is relatively moved 1 time.
Therefore, same with the occasion of above-mentioned the 1st embodiment, do not apply bigger pushing force and promptly form corresponding with the small concavo-convex pushing of the duplicate surface of copy board 104 and slip finer concavo-convex in the worn out end of prominent point.This is concavo-convex, and for example the interval about following forms with the height below the 5 μ m more than about 0.001 μ m by the above 50 μ m of 0.1 μ m.As the scope of this concavo-convex lower limit, be made as the scope of the following height of interval, the about 0.002 μ m above 3 μ ms of the above 50 μ m of 0.1 μ m for example about following.
In addition, in the present embodiment, owing to do not need as the occasion of the 1st embodiment, to heat, so, recover the control of the slippage of processing and carry out easily, and, can between than short-term, handle, the result is more suitable for producing in enormous quantities.
In addition, control device 150 forms pulse control signal Cz in order to remove pushing force, and it is supplied to motor drive circuit 158.
The bracket shell 116 of accommodating the contact chip that has carried out the recovery processing is pulled down from bracket system platform 106.At this moment, control device 150 supplies to motor drive circuit 152,154,156,158 in order to form the reference position pulse control signal Cx that the position of each member should be turned back to regulation, Cy, Cr, and Cz according to the control signal Sr that supplies with respectively with it.
The bracket shell of pulling down 116 is bare chip 60 and pushing being installed with after covering, and is same with above-mentioned example, is installed to the resettlement section of IC socket 30 as bracket system.
Claims (2)
1. the recovery processing method of an electrode comprises the 1st operation and the 2nd operation,
In described the 1st operation, on the joint face of the electrode part of battery lead plate, the portion of terminal of mounting semiconductor device, this battery lead plate is formed with the electrode part that the small crystal than the resistance to wear of the high abrasion resistance of mother metal constitutes that has that contains ormal weight in the mother metal by making on insulated substrate, and is electrically connected with the portion of terminal of semiconductor device by the joint face of this electrode part;
In described the 2nd operation, make the portion of terminal of semiconductor device contact the joint face of above-mentioned battery lead plate and make this joint face wearing and tearing, the part of above-mentioned crystal is exposed, obtain the concavo-convex of regulation at this joint face whereby.
2. the recovery processing method of electrode according to claim 1 is characterized in that: above-mentioned crystal is by having the big hardness of hardness that likens to the copper of above-mentioned mother metal, and palladium that conductivity is higher or nickel are made.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP153062/2002 | 2002-05-27 | ||
| JP2002153062 | 2002-05-27 | ||
| JP003508/2003 | 2003-01-09 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN031384099A Division CN1467832B (en) | 2002-05-27 | 2003-05-27 | Recovery processing method of an electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1794436A CN1794436A (en) | 2006-06-28 |
| CN100382267C true CN100382267C (en) | 2008-04-16 |
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ID=36805797
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101234089A Expired - Fee Related CN100382267C (en) | 2002-05-27 | 2003-05-27 | Recovery processing method of an electrode |
| CNA2008100960852A Pending CN101271849A (en) | 2002-05-27 | 2003-05-27 | Recovery processing method of an electrode |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100960852A Pending CN101271849A (en) | 2002-05-27 | 2003-05-27 | Recovery processing method of an electrode |
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| Country | Link |
|---|---|
| CN (2) | CN100382267C (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1048732A (en) * | 1989-07-14 | 1991-01-23 | 帕马斯坎德公司 | Electrode |
| CN1143685A (en) * | 1995-02-17 | 1997-02-26 | 丰田自动车株式会社 | Wear-resisting copper base alloy |
| JP2000294043A (en) * | 1999-04-06 | 2000-10-20 | Nitto Denko Corp | Anisotropic conductive connector |
| JP2001004700A (en) * | 1999-06-24 | 2001-01-12 | Yamaichi Electronics Co Ltd | Interposer board |
| CN1318865A (en) * | 2000-03-31 | 2001-10-24 | Tdk株式会社 | Terminal electrode forming method of chip electronic element and apparatus therefor |
-
2003
- 2003-05-27 CN CNB2005101234089A patent/CN100382267C/en not_active Expired - Fee Related
- 2003-05-27 CN CNA2008100960852A patent/CN101271849A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1048732A (en) * | 1989-07-14 | 1991-01-23 | 帕马斯坎德公司 | Electrode |
| CN1143685A (en) * | 1995-02-17 | 1997-02-26 | 丰田自动车株式会社 | Wear-resisting copper base alloy |
| JP2000294043A (en) * | 1999-04-06 | 2000-10-20 | Nitto Denko Corp | Anisotropic conductive connector |
| JP2001004700A (en) * | 1999-06-24 | 2001-01-12 | Yamaichi Electronics Co Ltd | Interposer board |
| CN1318865A (en) * | 2000-03-31 | 2001-10-24 | Tdk株式会社 | Terminal electrode forming method of chip electronic element and apparatus therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1794436A (en) | 2006-06-28 |
| CN101271849A (en) | 2008-09-24 |
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