CN100375349C - Semiconductor laser device and method of manufacturing the same - Google Patents

Semiconductor laser device and method of manufacturing the same Download PDF

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CN100375349C
CN100375349C CNB2005101202196A CN200510120219A CN100375349C CN 100375349 C CN100375349 C CN 100375349C CN B2005101202196 A CNB2005101202196 A CN B2005101202196A CN 200510120219 A CN200510120219 A CN 200510120219A CN 100375349 C CN100375349 C CN 100375349C
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layer
waveguide area
ridge
waveguide
type
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CN1783606A (en
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松村拓明
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Nichia Corp
Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Abstract

A laser device capable of oscillating in a stable transverse mode and outputting a laser beam excellent in the F.F.P. A first semiconductor laser device comprises a multilayer structure in which a semiconductor layer of a first conductivity type, an active layer and a semiconductor layer of a second conductivity type different from the first one are formed in this order; and a waveguide region formed in and near the active layer for guiding the light beam in a direction perpendicular to the direction of the width by limiting the divergence of the beam in the direction of the width. The waveguide region includes a first waveguide region and a second waveguide region. In the first waveguide region, the beam is confined within the active layer because of the difference in the refractive indices between the active layer and the regions on both sides by limiting the width of the active layer; and in the second one, the beam is confined by providing an effective refractive index difference in the active layer.

Description

Semiconductor Laser device and manufacture method thereof
The application is applying date 2001.4.25, application number 018108644, the dividing an application of denomination of invention " semiconductor Laser device and manufacture method thereof ".
Technical field
The present invention relates to a kind of semiconductor Laser device that is provided with bar shaped ridge (protuberance), particularly relating to a kind of GaN, AIN or InN or their mix-crystal of having used is III-V group-III nitride semiconductor (In bAl dGa 1-b-dN, 0≤b, 0≤d, b+d＜1) semiconductor Laser device.
Background technology
Now, the semiconductor Laser device that has used nitride-based semiconductor increases day by day being applied to all if can record with the demand of reappearing in the jumbo optical disk system of high density such as DVD.Therefore, studying just energetically aspect the semiconductor Laser device that has used nitride-based semiconductor.Used the semiconductor Laser device of nitride-based semiconductor can vibrate and emit visible light from ultraviolet ray to red wide spectral region, expect that its range of application not only is confined to the light source of described optical disk system, light source that also will relate generally to laser printer and optics networking etc. etc. is multi-field.
Particularly, in the existing various researchs of the configuration aspects of laser diode and for can have the structure of preferable control also to propose many suggestions to transverse mode.Wherein there is the ridge waveguide line structure to be regarded as rising and has been applied to beginning first in the world the nitride semiconductor Laser device that goes on the market.
The ridge waveguide line structure of semiconductor Laser device is easy to generate the deviation on the characteristic but then because of its easy driving laser that makes simple in structure vibrates when producing in a large number.This is because the variation of the rectangular size of ridge waveguide line structure camber can make characteristic changing, and the deviation of convex elongate in shape depends on etched precision, and the precision of the rectangular size of convex can't be higher than its etched precision.In addition, if with regard to the semiconductor Laser device that the semi-conducting material that can cause damage when may suffer to have great etch damage in the active layer or being exposed to the active layer surface in the etching environment is made, when the semiconductor Laser device of complete refractive index waveguide road type is when forming ridge and make by the also dark etching of specific activity floor, by in the active layer and the damage that etching caused on surface laser characteristics is degenerated.Therefore, this semiconductor Laser device is necessary for the waveguide line structure of effective refractive index type, and the rectangular degree of depth that wherein is provided with can not arrive active layer.But with regard to the waveguide line structure of effective refractive index type,, cause the quite big variation of element characteristic when producing in batches owing to the variation of above-mentioned rectangular form causes element characteristic to be changed significantly.
For the semiconductor Laser device that has used nitride-based semiconductor being applied to above-described field, a kind of can production in a large number and the element of stay in grade must be set.
But, known laser diode runs into obstacle in the formation on ridge waveguide road at present, this is because the formation on ridge waveguide road is the nitride-based semiconductor of composed component of at first growing usually, its upper strata of etching is removed the part of its nitride-based semiconductor and is formed for constituting the ridge (protuberance) on waveguide road again, as previously discussed, etched precision has a significant impact the element characteristic of made laser diode.Also promptly because transverse mode is to be controlled by the form (particularly height and the width) of the ridge that constitutes the ridge waveguide road (protuberance), and the F.F.P of the laser that obtains (far-field pattern) also thereby decision, and the departure of etch depth produces the principal element of deviation for directly causing element characteristic when utilizing etching to form the ridge waveguide road.
In addition, in the known engraving method that can be used for nitride-based semiconductor of the dry etching technology of RIE (reactive ion etching) etc., can solve the precision that element characteristic changes (deviation) fully but be difficult to etch depth controlled to this kind engraving method.
And circuit elements design trend was to form a plurality of layers with the control of several atomic layer units in component structure in the last few years, such as superlattice structure etc.This also can be changed by the element characteristic that described etching precision is caused in furtherance.That is, when forming each layer of composed component structure high precision will be arranged, the engraving method that so is difficult to use its precision to be lower than film formation precision numerical digit reaches the somewhat complex design component structure that forms ridge and other structures, thereby causes the obstruction of improvement element characteristic.
For example form a refractive index waveguide type structure and need not the etch activity floor and the ridge waveguide road is set on active layer and have high-output power use during the semiconductor Laser device of nitride-based semiconductor, the precision of etch depth must be controlled at and remain on one of percentage with being positioned at the active layer of part under the ridge and the heterodyne that has of the refractive index between other part active layers.For reaching this precision, if when the layer directly over active layer be p type covering, the formation of ridge must the mat etching and the precision of etch depth should be controlled at 0.01 μ m with interior till only being left the p type covering of minimum part.On the other hand, the width on ridge waveguide road can have lower precision, but must carry out etching with the precision of 0.1 μ m.
In addition, when using RIE method (reactive ion etching method) when coming the nitride etching semiconductor, etched layer and surface thereof are impaired easily and cause the deterioration of element characteristic and reliability.In engraving method, available wet etch method and dry ecthing method carry out etching, but the still untapped wet etching solution that goes out can be applicable to nitride-based semiconductor.
As previously discussed, the high performance semiconductor Laser device that has used nitride-based semiconductor whether can produce in a large number and the variation of its characteristic less, the precision that forms the ridge waveguide road in etching work procedure has very big influence to this, how to form the ridge waveguide road with high accuracy and become very important problem.
Summary of the invention
The existence of problem in view of the above, the objective of the invention is to: a kind of semiconductor Laser device or end face light-emitting component and manufacture method thereof are set, make the semiconductor Laser device of strip form, it is semiconductor Laser device with resonator of its vibration and the equal excellence of waveguide road characteristic, be again to obtain stable transverse mode control, and can penetrate the semiconductor Laser device of laser beam with excellent far-field pattern (F.F.P), even and when a large amount of production the characteristic of this element also seldom change.
Purpose of the present invention can be realized by the semiconductor Laser device with the following stated structure.
The layered structure of first kind of semiconductor Laser device of the present invention comprised lamination successively first conductive-type semiconductor layer, active layer and second conductive-type semiconductor layer different with described first conductivity type, described active layer and near be formed with restriction light in diffusion on the Width and light is directed to waveguide area on the direction vertical with this Width, it is characterized in that:
Described waveguide area has first waveguide area and second waveguide area;
Described first waveguide area is compared with described second waveguide area, constitutes by comprising the narrower active layer of width, and it is by the refringence between the zone of this active layer and these active layer both sides light to be closed in zone in its active layer that limits;
Described second waveguide area is an effective refractive index type waveguide area.
Like this, in first kind of semiconductor Laser device of the present invention of above-mentioned structure, described waveguide area has first waveguide area, in this first waveguide area, light is limited in this active layer by refringence being set effectively between the zone of active layer and these active layer both sides, so in this first waveguide area, can suppress the generation of transverse mode more reliably, and can carry out Beam Control reliably, can send the laser of excellent far-field pattern (far field pattern).
In addition, has second waveguide area in described first kind of semiconductor Laser device, its formation is to form the zone with high index of refraction in active layer effectively, in described second waveguide area, can make the active layer of bringing into play function as the waveguide road directly be exposed to the outside, can prolong the useful life of element and can improve reliability.Therefore, first kind of semiconductor Laser device of the present invention is that each feature with first waveguide area and second waveguide area lumps together formed laser diode.
In addition, in first kind of semiconductor Laser device of the present invention, active layer in first waveguide area can comprise that first ridge of described active layer constitutes by formation, and thereby limit the width of this active layer, and can constitute described zone by in second conductive layer, forming second ridge with effective high index of refraction.
In addition, in first kind of semiconductor Laser device of the present invention, the formation of first ridge also can be by etching first ridge both sides till described first conductive layer exposes, and both sides that the formation of second ridge can be by described second ridge of etching and described second conductive layer still is retained on the described active layer.
In addition, in first kind of semiconductor Laser device of the present invention, the thickness that is positioned at second conductive layer on the second ridge both sides active layer is preferably below the 0.1 μ m, so can control transverse mode more reliably.
Moreover second ridge is preferably long than first ridge in first kind of semiconductor Laser device of the present invention, so better reliability can be arranged.
And first waveguide area preferably has a laser resonator resonator face in first kind of semiconductor Laser device of the present invention, so can obtain the laser of best far-field pattern.
In addition, in first kind of semiconductor Laser device of the present invention, the resonator face that also preferably uses a side so can obtain the laser with better far-field pattern as the surface of emission.
And in first kind of semiconductor Laser device of the present invention, the length of first waveguide area is preferably more than the 1 μ m.
And in first kind of semiconductor Laser device of the present invention, first conductive-type semiconductor layer, active layer and described second conductive-type semiconductor layer all can be made by nitride-based semiconductor.
And in described semiconductor Laser device, described active layer can constitute with the nitride semiconductor layer that contains In, and so laser can vibrate in short visible region of wavelength and ultraviolet range.
In addition, be preferably in the two sides of first ridge and the two sides of second ridge and form dielectric film respectively in first kind of semiconductor Laser device of the present invention, this dielectric film is preferably by at least aly constituting of choosing from each oxide of thallium (Ti), vanadium (V), zirconium (Zr), niobium (Nb), hafnium (Hf), tantalum (Ta) and silicon nitride (SiN), boron nitride (BN), carborundum (SiC), the formed group of aluminium nitride (AlN).
In addition, second kind of semiconductor Laser device of the present invention at lamination successively have the waveguide area of bar shaped on the layered structure of first conductive layer, active layer and second conductive layer different with the conductivity type of this first conductive layer, it is characterized in that:
The waveguide area of described bar shaped has at least:
In the resonator direction, in the part of second conductive layer, active layer and first conductive layer of bar shaped, be provided with first waveguide area on slab waveguide road; And second waveguide area that the ridge waveguide road type of ridge is set on second conductive layer.
In this structure, comprise the second waveguide area C because of laser diode of the present invention with component reliability excellence 2And has first a waveguide area C of excellent swaying control ability and excellent beam characteristics 1, become the laser diode of having brought into play its two aspect characteristic, can various laser diodes be set and needn't change the somewhat complex design of element according to purposes.In effective refractive index type waveguide road, bar shaped ridged is formed in second conductive layer on active layer, make active layer remain in the growth conditions, and waveguide Lu Buhui worsens when driving element, thereby excellent component reliability is arranged.Also because be to be deeper than being etched in of active layer is provided with the index guide structure type in the waveguide road the first waveguide area C 1Thereby cause the refringence of both sides, waveguide road, can be easy to control transverse mode.The waveguide road that laser diode so is set can be easy to change the transverse mode on waveguide road.In this manual, the waveguide road with first waveguide area will be called the waveguide road of complete refractive index type or fully refractive index type waveguide road obscure mutually with effective refractive index type waveguide road avoiding.
In addition, in second kind of semiconductor Laser device of the present invention, the described first waveguide area C 1Complete refractive index to reach by the bar shaped ridge be first conductive layer, active layer and second conductive layer to be included interior design, and the described second waveguide area C 2Reaching of effective refractive index then be the bar shaped ridge that is provided with by at second conductive layer.Utilize this structure, because of the first waveguide area C 1With the second waveguide area C 2Be easy in laser diode, form, so available simple designs produces the laser diode of various characteristics.
In addition, the third semiconductor Laser device of the present invention at lamination successively have the waveguide area of bar shaped on the layered structure of first conductive layer, active layer and second conductive layer different with the conductivity type of this first conductive layer, it is characterized in that:
The waveguide area of described bar shaped has at least: in the resonator direction, be provided with second waveguide area of the protuberance of bar shaped on described second conductive layer; And
On the part of described second conductive layer, described active layer and described first conductive layer, be provided with first waveguide area of the protuberance of bar shaped.
Utilize this structure, because of the waveguide area of bar shaped is zone (the first waveguide area C that is removed by the part that active layer is wherein arranged 1) and zone (the second waveguide area C that is not removed of wherein active layer 2) constitute, the damage that when removing active layer is caused can be limited in the part of waveguide road, thereby has improved the reliability of element.Just be easy to impaired and when removing the part active layer, cause with regard to the semi-conducting material of component reliability and characteristic degradation, can be by the design first waveguide area C 1Proportion obtains to have the laser diode of required reliability and element characteristic, and this is because a part of first waveguide area C only is set 1Change the first waveguide area C 1With the second waveguide area C 2The length ratio of road (constitute waveguide) and position also can make the laser diode of various characteristics, particularly obtain to have the laser diode of required beam characteristics easily.
In addition, described second with the third semiconductor Laser device in, a part that can be by removing layered structure and form a ridge waveguide road that comprises the bar shaped ridge and also can constitute the described first waveguide area C 1With the second waveguide area C 2By this structure, in the laser diode of the ridge waveguide line structure that constitutes by bar shaped ridge (protuberance of strip), can obtain the laser diode of multifrequency nature.
In addition, described second with the third semiconductor Laser device in, preferably make the described second waveguide area C 2The length of bar than the first waveguide area C 1Be length.Just can use because of forming the first waveguide area C by this structure 1And the semi-conducting material that element is greatly worsened, impaired semi-conducting material when the part of active layer is removed or exposes is for example made the laser diode of excellent reliability.
In addition, described second with the third semiconductor Laser device in preferably this element have a resonator face at least and be formed at the first waveguide area C 1The end.Be provided with the first waveguide area C of excellent transverse mode reliability with resonator face of this kind structure 1The first waveguide area C can be set in other positions 1Guiding that can more effective control light, thereby can obtain laser diode with various characteristics.
In addition, described second with the third semiconductor Laser device in, at the described first waveguide area C 1The resonator face that forms on the end is preferably penetrates optical plane.With this kind structure by being arranged on the first waveguide area C that has excellent transverse mode controlled on the laser beam plane of departure 1, directly the characteristic of control beam and obtain has the laser diode of the asperratio of desired far-field pattern and desired laser.
In addition, described second with the third semiconductor Laser device in, the first waveguide area C of resonator face is arranged in its end 1Rectangular length is preferably more than the 1 μ m.Can reach far-field pattern and more reliable control of laser beam asperratio and the less laser diode of acquired character variation by this structure.
In addition, described second with the third semiconductor Laser device also can in first conductive layer, active layer and second conductive layer, use nitride-based semiconductor to constitute.This kind structure can be used and be difficult in the laser diode that wherein forms according to ion injects, the nitride-based semiconductor of imbedding structure of growth layer is made various characteristics again.Because when the part of active layer is when removing with engraving method in nitride-based semiconductor, can shorten dramatically the useful life of element, is difficult to make comprise the waveguide road of complete refractive index type and the laser diode commercialization that has the part active layer to be removed.But because of the part on waveguide road becomes the first waveguide area C 1, can make has excellent controlled laser diode and still the holding element life-span can not shorten to transverse mode.
In addition, described second with the third semiconductor Laser device in also can constitute active layer with the semi-conductive laser of indium containing nitride.Can make the laser diode that has from ultraviolet ray to visible wavelength range by this structure.
In addition, described second with the third semiconductor Laser device in, the described first waveguide area C 1Can comprise n type nitride-based semiconductor and the described second waveguide area C 2Can comprise p type nitride-based semiconductor.
In addition, described second with the third semiconductor Laser device in the second waveguide area C 2The one p type covering that comprises p type nitride-based semiconductor is preferably arranged, and the bar shaped ridge of described second waveguide area is to form under the thickness with this p type covering remains on situation less than 0.1 μ m.Can make the laser diode of low critical current and excellent transverse mode control by this structure.Said herein p type cladding thickness is meant in not forming the zone of ridge the distance between the adjoining course interface below the exposing surface of p type covering and p type covering and what is called " above active layer " is meant in active layer and the position above the interface between adjoining course thereon.Also to be active layer and p type covering when forming be when contacting with each other, and described exposing surface is to be formed at that its degree of depth remains on the locating less than 0.1 μ m greater than 0 in the p type covering.If as below, when having a guide layer to be formed between active layer and p type covering described in the embodiment 1, described exposing surface be formed at active layer and the position thereon between adjoining course the top of interface and in p type covering thickness remain on 0.1 μ m depths below or between active layer and p type covering layer in.
In addition, described second also can expose at the described first waveguide area C for nitride-based semiconductor with the structure of the third semiconductor Laser device 1The side and the second waveguide area C of bar shaped ridge 2The side of bar shaped ridge is provided with dielectric film in the side of this bar shaped ridge, and the material of this dielectric film can be selected oxide and the compounds such as silicon nitride, boron nitride, carborundum and aluminium nitride that comprise at least a thallium, vanadium, zirconium, niobium, hafnium and tantalum for use.Can have good refringence in the bar shaped keel setting of the semiconductor Laser device that has used nitride-based semiconductor and can make the laser diode of waveguide area of bar shaped of the controlled excellence of transverse mode by this structure.
In addition, described second with the third semiconductor Laser device in the width of bar shaped ridge be preferably in 1 μ m to 3 mu m range.Can be by this structure at the described first waveguide area C 1With the second waveguide area C 2Waveguide road floor in form the waveguide area of bar shaped of the controlled excellence of transverse mode, thereby the laser diode of no kinking in electric current optics output characteristic can be arranged.
The manufacture method of semiconductor Laser device of the present invention can be by the structure of the following stated, reaches to be purpose of the present invention.
The manufacture method of semiconductor Laser device of the present invention is characterized in that: comprising: use nitride-based semiconductor, the lamination procedure of layered structure of first conductive layer, active layer and second conductive layer that formed lamination successively; After forming layered structure, form the operation of first diaphragm of bar shaped again; The layer structure body portion that does not form described first diaphragm is carried out etching, on second conductive layer, form first etching work procedure of bar shaped ridge; On the part on the surface of in this first etching work procedure, exposing, form the 3rd diaphragm, and the layer structure body portion that does not form the 3rd diaphragm is carried out etching, on first conductive layer, form second etching work procedure of bar shaped ridge by first diaphragm; The lip-deep operation of nitride-based semiconductor that second diaphragm that will the material different with first diaphragm promptly has an insulating properties is formed on the side of described bar shaped ridge and exposes owing to etching; After forming second diaphragm, the operation that first diaphragm is removed.
Description of drawings
Below, the brief description accompanying drawing.
Figure 1A is the stereogram of medelling ground expression according to the laser diode structure of the embodiment of the invention.
Figure 1B is the cutaway view of second waveguide area of the laser diode of this embodiment.
Fig. 1 C is the cutaway view of first waveguide area of the laser diode of embodiment.
Fig. 2 A is the pattern cutaway view of technology laser diode before not forming ridge in the past.
Fig. 2 B is the cutaway view of technology laser diode after forming ridge in the past.
Fig. 2 C is the enlarged drawing that indicates the part of " a " among Fig. 2 B.
Fig. 2 D is the enlarged drawing that indicates the part of " b " among Fig. 2 B.
Fig. 3 A is the stereogram of each layer structure of the laser diode of expression embodiments of the invention, and Fig. 3 B is the end view of Fig. 3 A.
Fig. 4 A is the end view of the laser diode of the present invention's one variation.
Fig. 4 B is the end view of the laser diode of other variation of the present invention.
Fig. 5 A to Fig. 5 D is the stereogram of the operation of the expression ridge that forms laser diode of the present invention.
Fig. 5 E is the cutaway view that forms the part of second waveguide area among Fig. 5 C.
Fig. 5 F is the cutaway view that forms the part of second waveguide area among Fig. 5 D.
Fig. 6 A to Fig. 6 C represents the stereogram with the formation operation of the ridge of the laser diode of the present invention that forms with diverse ways shown in Fig. 5 A to 5D.
Fig. 7 A to Fig. 7 D is illustrated in the stereogram that forms the operation of electrode in the laser diode of the present invention.
Fig. 8 is the pattern cutaway view of second waveguide area of the laser diode of embodiments of the invention 1.
Fig. 9 is the cutaway view of first waveguide area of the laser diode of embodiments of the invention 1.
Figure 10 is the curve chart that is illustrated in the relation of etch depth in the laser diode of effective refractive index type and qualification rate.
Figure 11 is the curve chart that is illustrated in the relation of etch depth in the laser diode of effective refractive index type and drive current.
Figure 12 is the curve chart that is illustrated in the relation of etch depth in the laser diode of effective refractive index type and component life.
Figure 13 A is the stereogram of the laser diode of embodiments of the invention 6.
Figure 13 B is the transverse sectional view of the laser diode of embodiments of the invention 6.
Figure 14 A is the stereogram of the laser diode of embodiments of the invention 7.
Figure 14 B is the cutaway view of second waveguide area of the laser diode of embodiments of the invention 7.
Figure 14 C is the cutaway view of first waveguide area of the laser diode of embodiments of the invention 7.
Figure 15 A is the stereogram of the laser diode of embodiments of the invention 8.
Figure 15 B is the transverse sectional view of the laser diode of embodiments of the invention 8.
Figure 16 A to Figure 16 D is that expression uses the element that is formed on the wafer to make the stereogram of the manufacture method of laser diode of the present invention.
Figure 17 A, Figure 17 B are illustrated in the manufacture method of laser diode of the present invention, are used to illustrate the pattern cutaway view of cutting position.
Figure 18 is illustrated in the manufacture method of laser diode of the present invention, is used to illustrate the ideograph of the operation that forms reflectance coating.
Embodiment
Below, with preferred embodiment semiconductor Laser device of the present invention is described with reference to the accompanying drawings.
Semiconductor Laser device has the first waveguide area C according to an embodiment of the invention 1With the second waveguide area C 2As the waveguide area of bar shaped, shown in Figure 1A.
At this, the first waveguide area C 1Be that waveguide area that this place is formed with a ridge (first ridge 201) comprises an active layer 3 and at active layer 3 and be positioned between the zone (being atmosphere herein) of its both sides and cause a refringence, shown in Fig. 1 C, thereby light be limited in the active layer 3.The waveguide area that by an actual refractive index difference is set light is limited to this place in this manual between active layer and its two side areas will be called the waveguide road of complete refractive index type.
In addition, the second waveguide area C 2To be a waveguide area at this place have a ridge (second ridge 202) to be formed to make in the semiconductor layer on active layer is positioned at the effective refractive index of active layer 3 below second ridge 202 and is higher than effective refractive index at its both sides active layer, shown in Figure 1B, thereby light is limited in the active layer 3 of higher effective refractive index.The waveguide area that by an effective refractive index difference is set light is limited in this place in this manual between active layer and its two side areas will be called effective refractive index type waveguide road.
Like this, the waveguide road that is characterized as the complete refractive index type that in the waveguide road, is provided with and the effective refractive index type waveguide road of semiconductor laser of the present invention.
As concrete structure, the second waveguide area C 2Structure be to form a layered structure of forming by first conductive layer, active layer and second conductive layer different of lamination successively and on second conductive layer 2, form second bar shaped ridge 202 and its degree of depth does not reach active layer and the first waveguide area C with first conductivity type 1Structure then be a part, active layer 3 and first conductive layer 1 that forms first bar shaped ridge 201 and comprise second conductive layer 2.
Make like this, as mentioned above the first waveguide area C is arranged in the waveguide road 1With the second waveguide area C 2Can obtain to have the semiconductor Laser device of various characteristics.The first waveguide area C is arranged in semiconductor Laser device of the present invention 1With the second waveguide area C 2The waveguide road can form various forms, shown in Fig. 3 and 4.Fig. 3 A is the stereogram of this laser diode part, and its structure is for forming the bar shaped ridge by a part of removing layered structure.Fig. 3 B is the cutaway view of Fig. 3 A direction of arrow.Fig. 4 A is expression and different waveguide line structure shown in Figure 3 with 4B.
According to the present invention, shown in Fig. 3 and 4, available various structures are with the first waveguide area C 1With the second waveguide area C 2Place direction towards resonator (bar shaped ridge vertically) with various arrangements.Semiconductor laser of the present invention in fact also can have the first waveguide area C of removing 1With the second waveguide area C 2Outer waveguide area.For example with the first waveguide area C 1With the second waveguide area C 2Different waveguide area 203 can place the first waveguide area C 1With the second waveguide area C 2Between, shown in Fig. 4 A.The structure that Fig. 3 represents is for being provided with the first waveguide area C 1And comprise each resonator face of resonator one and the second waveguide area C is set 2And comprise other resonator faces.The structure of semiconductor Laser device shown in Fig. 4 A is for constituting the first waveguide area C 1First ridge 201 with constitute the second waveguide area C 2Second bar shaped ridge 202 be via being connected towards the formed waveguide area 203 of vertical direction (vertical) with resonator.Therefore, the first waveguide area C 1With the second waveguide area C 2Can continue as shown in Figure 3 to form or shown in Fig. 4 A, form jointly with another zone that is clipped in therebetween towards the resonator direction.
In addition, also unnecessary identical according to first ridge 201 of the present invention with the width of second ridge 202.When for example the side of each ridge all is skewed as shown in Fig. 1 and 3, constitute the first waveguide area C 1First ridge 201 bottom width with constitute the second waveguide area C 2The bottom width of second ridge 202 inevitably can be mutually different.The side of the side of first ridge and second ridge preferably can be in same plane.Though Fig. 1 and bar shaped ridge shown in Figure 3 reduce to the top from the bottom for normal convex form and its laterally inclined its width that makes, but ridge also can be for its width of convex form of turning one's coat then be to increase to the top from the bottom, and the two sides of convex can be the same manner and tilts also can tilt for relative mode.
In addition, first ridge 201 can be different with the top surface width of second ridge 202.And behind the width of first ridge 201 and second ridge 202 level it seems can be different thereby intermittently change in the joint of first ridge 201 and second ridge 202.
(structure of resonator)
Be the part by removing layered structure in the semiconductor Laser device of present embodiment and form ridge and constitute the slab waveguide road.Identical with the bar shaped ridge as Fig. 1 with the structure of resonator as shown in 3, its formation is that the layered structure be made up of first conductive layer 1, active layer 3 and second conductive layer 2 is removed the both sides of the part that will become ridge with etching or other modes, and this is applicable to so-called ridge waveguide road laser diode.According to the present invention because at least the first waveguide area C 1With the second waveguide area C 2Be mat bar shaped ridge and being provided with, the characteristic of light beam can be improved, and particularly far-field pattern can be controlled as the shape of desiring to have, and becomes real circle from oval, thereby can be provided with the various laser diodes of different qualities.The bar shaped ridge is not limited to the normal convex form shown in Fig. 1 and 3 and can be turn one's coat the convex form or the strip of vertical side is arranged as mentioned above.The shape that also is ridge can change according to required laser characteristics.
In addition, in semiconductor Laser device of the present invention, when constituting the first waveguide area C 1With the second waveguide area C 2The time form can be by burying ridge at the both sides of ridge regeneration crystal behind bar shaped ridge 201 and 202.
As previously discussed, because of the present invention adopts the ridge waveguide line structure with bar shaped ridge, not only can reduce production costs but also can make the first waveguide area C 1With the second waveguide area C 2In the waveguide road, various combinations are arranged and make the laser diode of various characteristics.For example needn't use bundle correcting lens or like that satisfied far-field pattern can be arranged because of the characteristic of energy control beam.
In laser diode of the present invention, place the first waveguide area C 1With the second waveguide area C 2In the form of first and second bar shaped ridge 201,202 as shown in Figure 1B and 1C.
In addition, the present invention also is applicable to the element except that laser oscillation element, for example end face light-emitting component such as light-emitting diode etc.At this moment, as shown in Figure 1 the element of structure as long as this element can be used as a light-emitting diode and make the waveguide road favour the vertical direction of end face but not make the vertical element that can obtain to need not laser generation and send light from end face in waveguide road with end face at the critical following driving element of vibration.
(structure of layered structure)
Below, with the layered structure of forming by first conductive layer, active layer and second conductive layer in the explanation present embodiment.
At first, covering 5,7 and active layer 3 is clipped in the direction that light can be limited in thickness in the covering 5,7 is set respectively in first conductive layer 1 and second conductive layer 2 in the semiconductor element of present embodiment shown in Figure 1.So, zone, an optical waveguide road is set in layered structure, light is limited to Width (vertical with thickness direction and resonance directions) and by covering 5,7 light is limited to thickness direction by ridge at this place.In semiconductor Laser device of the present invention, can use various semi-conducting materials known in the technology in the past, such as GaAlAs system, the material of InGaAsP system and GaAlInN system.
In semiconductor Laser device of the present invention, the waveguide area of bar shaped be according between first conductive layer and second conductive layer and near active layer in ridge and form, rectangular vertically identical with the direction of propagation essence of light.Also promptly when the waveguide area of bar shaped mainly be to be limited in wherein active layer when being constituted by light, the part light of diffusion in its vicinity is carried out guiding thereby can forms a guide layer between active layer and covering and the feasible zone that includes guide layer is used as optical waveguide road floor.
(the second waveguide area C 2)
The second waveguide area C of the present invention 2Be an effective refractive index type zone in the semiconductor Laser device medium wave guide passage.Particularly bar shaped ridge 201 is formed in second conductive layer 2 that is positioned on the layered structure active layer 3 and the formation of the waveguide area of bar shaped is by the in-plane (Width) at active layer effective refringence to be set.
Waveguide road in effective refractive index type laser diode in the past only comprises the second waveguide area C 2, and bar shaped ridge 202 is to cover with one more as shown in Figure 2 to cover 20 etchings and form after forming semiconductor layer.Because of the formation of bar shaped ridge 202 is to be etched to the degree of depth that does not arrive active layer in active layer (waveguide road floor) effective refringence to be set, the characteristic of element entirely on rectangular width S w, the height of ridge (the rectangular degree of depth) Sh1 and etching institute's exposing surface and shown in Fig. 2 B deciding between the active layer top plan apart from Sh2, so can change.These factors can be caused the serious variation of element characteristic when producing.Also promptly directly can cause the variation of element characteristic as the error Wd of the error Hd of Fig. 2 C and ridge height (the rectangular degree of depth) relevant shown in Fig. 2 D and rectangular width with the etching precision.This is because the waveguide area that forms in active layer (waveguide road floor) is to use to be provided with corresponding to the effective refractive index difference of ridge 202 bar shaped ridge 202 in the active layer (waveguide road floor), so the form of ridge has significant impact to the effective refractive index difference.The error Hd of ridge height also is the error of distance between etching surface of exposing and active layer top plan.When excessive apart from Sh2 between active layer top plan and etching institute exposing surface, effective refractive index missionary society diminishes and causes significant impact to element characteristic, such as the restriction deficiency to light.As mentioned above because of effective refractive index entirely on deciding between active layer top plan and etching institute exposing surface apart from Sh2, the variation of this distance can cause the variation of effective refractive index.
Figure 10, the inspection of product etch depth, drive current and the ratio in useful life that 11 and 12 expressions technology effective refractive index type laser diode in the past passes through.The characteristic of laser diode is very responsive to etch depth as we know from the figure.
In laser diode of the present invention, do not arrive the second waveguide area C that active layer forms because of etch depth 2Be the part on waveguide road, active layer can be because of the etching second waveguide area C 2And cause damage, so the reliability of element thereby improvement.If when active layer exposes out, element characteristic there is the material of significant relationship, the second waveguide area C is set 2The reliability of element can not worsened.
(the first waveguide area C 1)
Remove the foregoing second waveguide area C according to the present invention 2Outer and form the first waveguide area C 1Can be easy to make the laser diode of various characteristics as the waveguide area of bar shaped.This is owing to a part that comprises active layer in the layered structure that has by formation bar shaped ridge 201 and the first waveguide area C of first conductive layer 1 1Effect to the excellent controllability of transverse mode.
That is, at the described first waveguide area C 1In,, can more effectively limit by the interregional actual refractive index difference with the first ridge restricted activity layer width is carried out limitation in active layer and its both sides because of only light.
Therefore, can effectively suppress the unnecessary transverse mode that vibrates and more effectively control transverse mode.
According to the present invention, the first waveguide area C to the controlled excellence of transverse mode is set in zone, part of waveguide road as previously discussed 1Can suppress the first waveguide area C 1In unnecessary vibration transverse mode and improve whole element to the controllability of transverse mode and obtain to have the laser diode of various beam characteristicses easily.
Laser diode of the present invention can at one end form the first waveguide area C 1And comprise the resonator face of laser resonator, so be easy to reach the laser beam of desiring to have form.Change speech, what can form preferably that laser resonator face 4 makes meets the B as Fig. 3, the first waveguide area C shown in 4A and the 4B 1End face.This is because become the first waveguide area C when near the zone the resonator face 1The time, the transverse mode of light reflects on the resonator face preceding with after can control and make that being controlled in the waveguide road of transverse mode function is more effective in other zones.
In addition, use the first waveguide area C according to the present invention 1As the laser resonator face and use the laser resonator face can obtain to have excellent beam characteristics as the surface of emission, such as far-field pattern, and the laser diode of excellent laser beam asperratio.Also because with this kind structure with the first waveguide area C 1Place and be easy to control the first waveguide area C on the laser beam plane of departure 1In transverse mode and make the characteristic be easy to control beam.If the first waveguide area C 1Be when being made of the first bar shaped ridge 201 shown in Fig. 3 and 4, the rectangular width of adjusting first ridge 201 with high accuracy can be easy to control transverse mode and obtain the beam characteristics desiring to have.
At this moment, place the first waveguide area C on the surface of emission 1Length to be a wavelength of light that laser sends at least, but consider control transverse mode function, can have the length of several times wavelength better, can reach the beam characteristics of desiring to have like this.
Specifically, the first waveguide area C 1Length be preferably more than the 1 μ m, to transverse mode Satisfactory Control can be arranged like this.When considering manufacturing process, the first waveguide area C 1Length be preferably more than the 5 μ m because this length can have preferable precision to form bar shaped ridge (protuberance) 201.
In addition, the width of active layer (perpendicular to the length of resonator direction) can be 10 μ m, more than the 50 μ m, preferably more than the 100 μ m.Have pair of positive and negative to see through a matrix and relative structure with a kind of like this, the width of active layer becomes with the wafer width and equates.The structure of pair of positive and negative is set on same one side of a matrix, has the surface of exposing to form the electrode of first conductive layer on it, its length is removed the width that forms the exposing surface part for the wafer width deducts.
(formation on waveguide road)
Laser diode of the present invention is characterized as has the first waveguide area C at least 1With the second waveguide area C 2Waveguide area and make the arrangement needn't revise whole element design and only to change waveguide area can revise the characteristic of this laser diode easily.Particularly as mentioned above with the first waveguide area c 1The characteristic that places on the resonator face characteristic of control beam and acquisition easily to desire to have.Also can set the first waveguide area C 1The ratio on shared waveguide road and make the side of wherein exposing active layer than the second waveguide area C 2Middle person is the little laser diode that can obtain higher reliability.This is because the bigger second waveguide area C is set in the waveguide road 2Can make active layer not increased by the ratio of etching damage.Therefore, can prolong the useful life of element and the variation in element useful life can be lowered.
When laser diode of the present invention has the first waveguide area C at least 1With the second waveguide area C 2During as the waveguide road, the first waveguide area C of removing can be arranged also 1With the second waveguide area C 2Outer waveguide area form.For example available be shown in as Fig. 4 A as described in the first waveguide area C 1With the second waveguide area C 2Between form a plane inclined surface 203.One and the first waveguide area C so can be arranged 1With the second waveguide area C 2Different waveguide roads.Moreover, one first waveguide area C can respectively be set in the waveguide road 1With the second waveguide area C 2Or shown in Fig. 4 B, be provided with a plurality of.The first waveguide area C as described in also can being shown in as Fig. 3 and Fig. 4 B 1With the second waveguide area C 2Between decline anything or have and make the first waveguide area C with inclination opposite shown in Fig. 4 A 1With the second waveguide area C 2Some is overlapped.
The structure of laser diode of the present invention also can be for removing the first waveguide area C 1With the second waveguide area C 2Outer form one the 3rd waveguide area C3 again and make the side (floor side, waveguide road) 204 of active layer tilt towards the resonator direction.Figure 13 A is near the cutaway view of part top covering 7 and active layer 3 joints for stereogram Figure 13 B of this component structure.The 3rd waveguide area C3 and the second waveguide area C in this structure 2Bar shaped ridge 202 on the shared top covering 7,204 of the end faces (side) of active layer (waveguide road floor) are the inclination form.The light of being guided by side 204 in the laser diode of said structure can be reflected fully by the angle [alpha] of adjusting between resonator direction AA and active layer direction BB, shown in Figure 13 B, and can import light into the first waveguide area C 1Especially the time when angle [alpha] be 70 ° or more hour, the incidence angle of resonator AA direction light can be set in more than 20 ° and entire emission can be arranged and do not have loss on the end face 204.Therefore, angle [alpha] can be according to application settings in 0 to 70 ° scope.For example when angle [alpha] be below 20 ° the time, the incidence angle of resonator AA direction light can be set at more than 70 ° on the end face 204, can obtain break-even entire emission in this case.At the described second waveguide area C 2In, when in active layer (waveguide road floor), using the effective refractive index difference to form the waveguide area of bar shaped, there is light outside waveguide area to be guided and this a part of light is reflected in the described second waveguide area C 2End face on.
In this case, when the loss of light increased, power output can reduce and cause the deterioration of electric current optics output inclined-plane efficient.As the second waveguide area C 2Than the first waveguide area C 1When wide, at the described second waveguide area C 2With the first waveguide area C 1Between the 3rd waveguide area C3 is set can reduces the loss of light and can guide satisfactorily and the first waveguide area C 1The light of joint, as shown in figure 13.
In laser diode of the present invention, constitute the first waveguide area C 1With the second waveguide area C 2Bar shaped ridge 201,202 different in width can be arranged.Changing rectangular width can make bundle that different asperratios is arranged.Therefore, first and second ridge can be made into and be suitable for the width used in laser diode of the present invention.Width hour will have accurate control to width, so also can reach to make far-field pattern near the characteristic of proper circle or according to the expansion of width change bundle.Particularly as shown in figure 15 as the second waveguide area C 2In the width of 205 parts when reducing gradually, can make and the first waveguide area C 1The rectangular width of joint equals rectangular width S w2, therefore, and can be according to the first waveguide area C 1Width extract the laser beam of various patterns out.At the second waveguide area C shown in Figure 15 2The part that width reduces gradually is the 3rd waveguide area C3.
In Figure 15, be the formation second waveguide area C 2And first ridge 202 is set, its width S w1 is greater than constituting the first waveguide area C 1The rectangular width S w2 of first ridge, thereby form a less waveguide road of characteristic variations when changing effective refractive index.In the 3rd waveguide area C3, there is its rectangular width the waveguide area of different in width to be coupled together smoothly, thereby the loss at contact place is reduced to minimum in the zone 205 of waveguide road ripple medium dip.The ridge that constitutes the 3rd waveguide area C3 can be placed on the active layer top or as shown in FIG. with to the first waveguide area C 1Similarly etching and arrive degree of depth place of first conductive layer or between the two.
Like this, the bar shaped ridge that the present invention constitutes first waveguide area and second waveguide area can form various forms, the pointed form that for example rectangular width changes towards rectangular direction (rectangular is vertical).Particularly as described in the embodiment 1 or shown in Figure 15 with the first waveguide area C 1When placing the waveguide line structure of luminous end, the second waveguide area C of big width is arranged 2Form can be rectangular width towards the first narrower waveguide area C 1Decrescence reduce the light of waveguide road to two parts joint.The pointed rectangular a plurality of pointed rectangular form that the rectangular part of each waveguide area or rectangular whole length are pointed form or reduce towards two ends for its width that forms of this kind.
(nitride-based semiconductor rectangular)
Below, will the semiconductor Laser device of the present invention that be made of first conductivity type and second conductive-type semiconductor and nitride-based semiconductor active layer be described.
The nitride-based semiconductor that is used for laser diode of the present invention can be the III-V group-III nitride semiconductor (In of gallium nitride, aluminium nitride or indium nitride or these compound crystal bAI dGa 1-b-dN, 0≤b, 0≤d, b+d≤1).Also can use with boron as III family element or replace the made mixed crystal of a part of nitrogen of V family with arsenic or phosphorus.Nitride-based semiconductor can add the impurity of suitable conduction type and become the conduction type of desiring to have.The n type impurity that is used for nitride-based semiconductor can use IV or VI family element, such as silicon, germanium, tin, sulphur, oxygen, titanium and zirconium and silicon, germanium or tin are relatively good, is best with silicon especially.P type impurity also can use such as beryllium, zinc, manganese, chromium, magnesium, calcium etc., is good to use magnesium.Below, will illustrate with a nitride semiconductor laser giving an example as laser diode of the present invention.Alleged herein use the semiconductor Laser device of nitride-based semiconductor be meant in first conductive layer, active layer and second conductive layer that constitute layered structure, preferably in whole each layers, the laser diode of use nitride-based semiconductor.For example the made covering of nitride-based semiconductor is that to be formed in first conductive layer and second conductive layer active layer then be to be formed between two coverings and to form the waveguide road.Particularly first conductive layer comprises n type nitride semiconductor layer, and second conductive layer comprises p type nitride-based semiconductor and active layer comprises the nitride semiconductor laser that contains In.
(active layer)
According to the present invention, when semiconductor Laser device of the present invention is when constituting with nitride-based semiconductor, the nitride semiconductor layer that contains In is set in active layer can sends the laser beam from blue light to the red light wavelength scope in ultraviolet ray and the visibility region.When may making the nitride semiconductor laser that contains In when active layer is exposed to atmosphere, laser diode suffers grievous injury, can reduce to minimum according to this kind of the present invention to the infringement of element, because this element includes the second waveguide area C that first ridge 202 by the no show active layer degree of depth constitutes 2This is to predispose to damage when etching with evaporation and exposing and be difficult to keep crystallinity in the operation behind the active layer and cause the element shortening in useful life because the LMP of indium makes the nitride-based semiconductor that contains indium be easy to decompose.
Relation when Figure 12 represents to form the bar shaped ridge between etch depth and component life.As can be seen from Figure, when etching arrival contained the nitride-based semiconductor active layer of In, component life can greatly lower and expose the severe exacerbation that active layer can cause the laser diode reliability.
Because of laser diode of the present invention has the first waveguide area C 1With the second waveguide area C 2As the waveguide road, even when active layer is exposed to atmosphere, can suffer characteristic degradation use the semiconductor Laser device of nitride-based semiconductor excellent reliability also can be arranged.This is because be used to constitute the first waveguide area C 1First ridge 201 only constitute the part on waveguide road and can prevent the deterioration of component reliability.For example in the present invention has used the semiconductor Laser device of nitride-based semiconductor, resonator length is set at about 650 μ m and is used to constitute the first waveguide area C 1The length setting of first ridge 201 when being 10 μ m, confirmed that element can not suffer the deterioration of reliability and can be arranged when guaranteeing to operate with the 5mW power output thousands of hours useful life because of exposing of the first chi chung active layer.
Used in the present invention and to have constituted the first waveguide area C in the semiconductor Laser device of nitride-based semiconductor 1Or the second waveguide area C 2The rectangular width of ridge preferably be set in 0.5 to 4 mu m range or at 1 to 3 mu m range Nei Gengjia, so can in stable transverse mode and basic (single) pattern, vibrate.When the rectangular width of ridge then is difficult to form ridge during less than 1 μ m, width is 3 μ m or then can causes calmly that on laser oscillation wavelength multimode oscillation in the transverse mode, width are 4 μ m or then can't reach stable transverse mode when bigger when bigger.According to the present invention, width is controlled at the effective stabilisation of transverse mode (effectively suppressing unnecessary transverse mode vibration) that can further make in 1.2 to the 2 μ m models in the high optics power output.According to the present invention with the first waveguide area C 1Or the second waveguide area C 2The rectangular width setup of ridge is good in above-mentioned scope, if the first waveguide area C 1When being arranged on the resonator plane luminous edge, the first waveguide area C 1Bar shaped ridge 201 preferably be set in the above-mentioned scope.The present invention is not limited to described long narrow structure and also can be applicable to width is 5 μ m or bigger rectangular.At the described first waveguide area C 1Be the structure that places in the waveguide terminal portion, the second waveguide area C 2The relatively free but main mat first waveguide area C of the setting of rectangular width 1Control the characteristic of laser beam.
In the semiconductor Laser device that uses nitride-based semiconductor of the present invention, as the first waveguide area C 1End face when being used as the resonator face (surface of emission), the laser diode that can obtain to have excellent transverse mode controllability, far-field pattern, asperratio and component reliability.This is because be deeper than active layer and the first waveguide area C is set on the resonator plane luminous edge by being etched to as previously discussed 1Thereby, can obtain different shape and luminous point size laser beam and can will send from the light of laser diode before promptly control.
At this, active layer can have quantum well structures and can be single quantum well or a plurality of quantum well.Use quantum well structures to can be made into the high power laser light element and the end face light-emitting component of excellent luminous efficiency.Be used to constitute the second waveguide area C 2The formation of second bar shaped ridge 202 be to carry out in the mode that etch depth does not reach active layer.Alleged second bar shaped ridge 202 is to mean with the etch depth that does not reach active layer above being positioned at active layer to form in this specification.Also promptly constitute the second waveguide area C 2Second bar shaped ridge 202 are the tops that are positioned at active layer and the interlayer interface that is in contact with it above it.
As the active layer of nitride-based semiconductor, be preferably the above-mentioned nitride-based semiconductor that contains indium, particularly preferably use with Al xIn yGa 1-x-yThe nitride-based semiconductor of N (0≤x≤1,0＜y≤1, x+y≤1) expression.In this case, nitride-based semiconductor described herein is preferably as the well layer in the quantum well structures active layer.(380nm to 550nm) preferably uses In in from approaching ultraviolet ray to the visible green wavelength region may yGa 1-yN (0＜y≤1).(redness) also available In in longer wavelength region may yGa 1-yN (0＜y≤0), at this moment, the mixing ratio y that changes indium can send the laser beam of desired wavelength.In the zone of wavelength less than 380nm, because of the wide wavelength in the forbidden band that is equivalent to gallium nitride GaN is 365nm, but the crack energy will the person begins near being equal to or greater than the gallium nitride, so will use Al xIn yGa 1-x-yN (0＜x≤1,0＜y≤1, x+y≤1).
If when active layer formed quantum well structures, the thickness of well layer was preferably 20  to 200  in 10  to 300  scopes, so can reduce Vf and critical current density.When crystal is taken into account, when thickness is 20  or can obtains quality when bigger comparatively evenly and do not have the layer of too many varied in thickness, with thickness limits in 200 , crystal can grow and flaw minimum.The quantity of well layer and unrestricted can be one or more in the active layer.When four or more active layers that is constituted with the bigger layer of thickness, the gross thickness of active layer will be too big and Vf can increase.Therefore, preferably with the thickness limits of well layer in 100  and come the thickness of restricted activity layer.If when the light stimulus device of high-output power or light-emitting diode, the number of well layer is set in obtains the high-luminous-efficiency element desiring to have in 1 to 3 scope.
Well layer also can mix or undope p type or n type impurity (acceptor or execute body).When using the indium containing nitride semiconductor as the well layer, the concentration that increases n type impurity can reduce crystallinity, and the well layer of well-crystallized can be arranged so preferably the concentration of n type impurity is limited.In particular for having asked best crystallinity, the well layer had better not mix and surpass 5 * 10 16/ cm 3The n type impurity of concentration generates.N type impurity concentration is remained on 5 * 10 16/ cm 3In mean low-down n type impurity concentration and the well layer can be considered and there is no n type impurity in fact.When the well layer is mixed with n type impurity, n type impurity concentration is controlled at 1 * 10 18/ cm 3To 5 * 10 16/ cm 3Can suppress crystalline deterioration in the scope and increase carrier concentration.
To the composition on barrier layer and unrestricted and can use and the used similar nitride semiconductor layer of well layer.Particularly available is indium containing nitride semiconductors such as low InGaN or such as aluminiferous nitride semiconductors such as gallium nitride, AlGaN such as having indium ratio than the well layer.The band-gap energy on barrier layer must be higher than well layer person.Special component is In βGa 1-βN (0≤β＜1, α＞β), GaN, Al γGa 1-γN (0＜γ≤1) etc., and be preferably In βGa 1-β(GaN so can form the barrier layer of well-crystallized to N for 0≤β＜1, α＞β).This is the impedance function that causes the well layer at last because directly generate on the aluminiferous nitride semiconductor such as AlGaN etc. that the made well layer of nitride-based semiconductor that contains indium can cause low-crystalline.In the barrier layer, use Al γGa 1-γDuring N (0＜γ≤1), by containing the aluminium barrier layer in setting on the well layer and below the well layer, being provided with by In βGa 1-β(0≤β＜1, α＞β), the problems referred to above can be avoided in a plurality of barrier layers that GaN forms to N.Therefore, in a plurality of quantum well structuress, be clipped in barrier layer between active layer and be not limited to the single layer (well layer/barrier layer/well layer) and the barrier layer of two or more heterogeneities and impurity concentration and can stack, such as well layer/barrier layer (1)/barrier layer (2)/... / well layer.At this, alphabetical a represents the ratio of indium in the well layer, preferably makes the ratio of indium β in the barrier layer be lower than person in the well layer, i.e. α＞β.
The barrier layer n type impurity that also can undope that can mix, but Doped n-type impurity preferably.When mixing, the concentration of n type impurity is preferably 5 * 10 in the barrier layer 16/ cm 3Or it is higher and be lower than 1 * 10 20/ cm 3Specifically, if when not needing the LED of high-output power, n type impurity concentration is preferably in 5 * 101 6/ cm 3To 2 * 10 18/ cm 3In the scope.With regard to higher output power light-emitting diode and light stimulus device, mix and be preferably in 5 * 10 17/ cm 3To 1 * 10 20/ cm 3In the scope, be more preferably 1 * 10 18/ cm 3To 5 * 10 19/ cm 3In the scope.When high-dopant concentration like this was arranged, the growth of well layer had better not be mixed or be there is no n type impurity in fact interior.The different reason of n type impurity concentration and normal light-emitting diode, High Power LED LED and high power light exciter LD (output power range be 5 to 100mW) be the high-output power element have relatively high expectations carrier concentration can be with big current drives higher output power.Aforesaid doping scope can make charge carrier that the high concentration of well-crystallized is arranged.
In contrast, during such as the nitride semiconductor device of the light stimulus device of lower-wattage, light-emitting diode etc., but a part of barrier layer Doped n-type impurity of active layer or whole barrier layer can not contain n type impurity in fact.When Doped n-type impurity, can mix to the whole barrier layers or the part barrier layer of active layer.When the Doped n-type impurity of a part of barrier layer, preferably be opposite in the active layer barrier layer on the n type layer limit and mix.Particularly when barrier layer Bn (n=1,2,3 ...) for from the n layer on n type layer limit the time, electronics effectively can be injected active layer and make the element of excellent luminous efficiency and quantum efficiency.This also is applicable to well layer and barrier layer.When barrier layer and active layer all are doped, to barrier layer Bn (n=1,2,3 from n type layer limit n layer ...) and well layer Wm (m=1,2,3 of m layer ...) mix, also promptly earlier the layer near n type layer is mixed, can reach above-mentioned effect.
Thickness to the barrier layer is also unrestricted, and its thickness had better not surpass 500 , particularly is similar to 10  to 300  of active layer.
Used the layered structure in the semiconductor Laser device of nitride-based semiconductor to preferably include first conductive layer of n type nitride-based semiconductor and second conductive layer of p type nitride-based semiconductor in the present invention.Particularly n type covering and p type covering are set respectively in these type layer and form the waveguide road.Can form a guide layer and electronics limiting layer this moment between covering and active layer.
(p type covering)
Used in the semiconductor Laser device of nitride-based semiconductor preferably with the p type covering that comprises p type nitride-based semiconductor (a p type nitride-based semiconductor) as second or first conductive layer in the present invention.Like this then mat with the floor of the different conduction type of floor that p type covering is wherein arranged in be provided with and comprise the n-covering of n type nitride-based semiconductor and the waveguide road is formed in the layered structure.Used nitride-based semiconductor only needs its size to be enough to limit the refringence of light in p type covering, preferably uses the nitride semiconductor layer that contains aluminium.This layer can be the film of simple layer or multilayer.Particularly have the superlattice structure that AlGaN and gallium nitride stack and to reach preferable crystallinity, so preferably this structure.This layer p type impurity that can mix or undope.For the laser diode of vibration at 430 to 550nm scope longer wavelengths, covering is preferably made with the gallium nitride that is mixed with p type impurity.Thickness to film is also unrestricted, and thickness can be preferably 500  to 1 μ m in 100  to 2 mu m ranges, so can make this film that satisfied limit photosphere function is arranged.
In addition, below can between active layer and p type covering, being provided with according to the present invention, described electronics limiting layer and optical navigation layer.Being preferably disposed on when the optical navigation layer is set between n type covering and active layer, also is that active layer is sandwiched in the middle structure of optical navigation layer.So cause the SCH structure, make that the ratio of aluminium component is higher than person in the guide layer and has a refringence light can be limited in this structure in the covering.If when covering and guide layer were sandwich construction, the ratio of aluminium component decided with the average proportions of aluminium.
(p type electronics limiting layer)
P type electronics limiting layer places between active layer and p type covering or preferably places active layer and p type photoconduction to draw interlayer and bring into play the function of restricted activity layer charge carrier thereby reduce critical current and be easy to vibration, and this layer is made for AlGaN.P type covering and p type electronics limiting layer particularly are set in second conductive layer can reach more effective electronics restriction.When using AlGaN, mix p type impurity and can reach above-mentioned functions reliably, also can reach the function of limiting carrier even undope as p type electronics limiting layer.The minimum thickness of film is 10 , is preferably 20 .The thickness that makes film at 500  with interior and with formula Al xGa 1-xThe value of x is set at more than 0 among the N, preferably more than 0.2, can reach above-mentioned functions satisfactorily.N type carrier confining layer also can be arranged on the m-type layer limit and electric hole is limited in the active layer.Biasing (from the difference in band gap of active layer) when the restriction in electricity hole does not need to be made in the electronics restriction can be finished.Particularly available and p type electronics limiting layer similarly makes up.For reaching good crystallinity, the available nitride-based semiconductor that does not contain aluminium of this layer forms and can use with the barrier layer of active layer and similarly make up.Preferably will limit in this case n type charge carrier near n type barrier layer charge carrier be placed in the active layer or the n type layer that contacts with active layer in.So, can effectively charge carrier be injected active layer or well layer by the p type and the n type carrier confining layer that contact with active layer are set.In another form, the layer that contacts with p type or n type layer in the available active layer is as carrier confining layer.
(p type guide layer)
Active layer is clipped in the covering floor that a position forms the optical waveguide road is that available nitride-based semiconductor forms good waveguide road by being provided with one according to the present invention.Waveguide road thickness (active layer reaches the guide layer in both sides) is set in 6000  with interior unexpected increase in order to inhibition vibration critical current in this case.But thickness is had than the long life in 4500  on continuous oscillation and the critical current that limits in fundamental mode.Two guide layer thickness are good with 100  to the 1 μ m that coexist in fact, and the best can form good optical waveguide road in 500  to 2000  scopes.Guide layer is to become and have the band-gap energy on the waveguide road that the covering that is enough to form and will be provided with in its outside compares and can be monofilm or multilayer film with nitride system semiconductor.The optical navigation floor is had be equal to or greater than all band-gap energies of active layer and can form good waveguide road.If during quantum well structures, band-gap energy is greater than well layer person and more preferably greater than the barrier layer person.Moreover, be provided with about 10nm or greater than active layer in the optical navigation floor the band-gap energy of luminous wavelength can make good optical waveguide road.
With regard to p type light guide layer, preferably use the undoped gallium nitride in 370 to 470nm oscillation wavelength scopes and use the InGaN/gallium nitride sandwich construction of in the longer wavelength scope (more than the 450 μ m).So can increase by active layer and optical navigation floor and be constituted the refractive index on waveguide road thereby the refringence of increase covering.370nm with interior shorter wavelength scope in, preferably use the aluminiferous nitride semiconductor because of its absorption edge at 365nm.Particularly best Al xGa 1-xN (0＜x＜1) forms the made multilayer film of AlGaN/ gallium nitride, also is multilayer film or every layer of superlattice multilayer film that superlattice structure is all arranged of the mutual lamination of they.The structure and the p type guide layer of n type guide layer are similar.Consider the band gap of active layer and use gallium nitride, InGaN and form and comprise the multilayer film of InGaN and the mutual lamination of gallium nitride and make and promptly can be made into satisfied waveguide road towards the indium composition minimizing of active layer.
(n type covering)
Used the nitride-based semiconductor that is used in the n type covering in the semiconductor Laser device of nitride-based semiconductor only to need similarly to be enough to limit the refringence of light and preferably to use the nitride-based semiconductor that contains aluminium in the present invention with p type covering.This layer can be simple layer or multilayer film, and the AlGaN and the gallium nitride superlattice structure of mutual lamination particularly arranged.The function of n type covering can be used as carrier confining layer and light limiting layer.If when using sandwich construction, preferably generate and contain aluminium, AlGaN especially as mentioned above, nitride semiconductor layer.Moreover this layer can mix or undope n type impurity and also can mix to a formation layer.For the laser diode of vibration longer wavelength in 430 to 550nm scopes, covering is preferably made with the gallium nitride that is mixed with n type impurity.Thickness to film is also unrestricted, and similar with p type covering, thickness is in 100  to 2 mu m ranges, and preferably 500  to 1 μ m so can make film become good limit photosphere.
At this, in the semiconductor Laser device that has used nitride-based semiconductor, be placed on the bar shaped ridge in the nitride-based semiconductor that contains aluminium and the side of the nitride-based semiconductor that is exposing surface and ridge on a dielectric film is set good insulation performance can be arranged.Electrode is set on dielectric film also can makes the laser diode of leakproof.This forms the good insulation that dielectric film and electrode can have leakproof on semiconductor surface because almost there is not material can reach good resistance contact at present in the aluminiferous nitride semiconductor layer.That compares is following when on the nitride semiconductor layer that does not contain aluminium electrode being set, and then has been easy to resistance and contacts between electrode and nitride-based semiconductor.When electrode was formed on the nitride semiconductor layer that does not contain aluminium through dielectric film, the aperture in the dielectric film then can cause electric leakage calmly on dielectric film and electrode quality.Need its thickness be enough to be provided with for solving this problem that shape and the position of the dielectric film of the insulation degree that requires or design electrode make is not overlapping but this design that laser diode is constructed can add sizable restriction with semiconductor surface.The position of ridge is very important, because the area that the nitride-based semiconductor surface is exposed in the ridge both sides when forming ridge has satisfied insulation much larger than the side of ridge in this surface assurance.So the design of laser diode has the electrodes of big freedom and available various forms and the position of freely deciding electrode greatly can be arranged, this formation to ridge is very favourable.The superlattice sandwich construction of the most handy described AlGaN of aluminiferous nitride semiconductor layer or AlGaN/ gallium nitride.
At this, as the first waveguide area C 1With the second waveguide area C 2Bar shaped form first ridge 201 and second ridge 202 be to remove the both sides of each ridge and form, shown in Figure 1B and 1C.Ridge 202 is arranged on the top covering 7 and top covering 7 can determine etched depth removing the surface that ridge exposed in exterior domain.
(electrode)
Laser diode of the present invention is not limited to be provided with the form of electrode on the bar shaped ridge and second ridge.As Fig. 1 and shown in Figure 7, electrode can be arranged at almost as the first waveguide area C 1With the second waveguide area C 2First bar shaped ridge 201 and all surfaces of second bar shaped ridge 202 on.Electrode also can only be arranged on the described second waveguide area C 2On, so can preferentially charge carrier be injected the second waveguide area C 2On the contrary, electrode also can only be arranged at the first waveguide area C 1Going up the waveguide road then separately works in the resonator direction.
(dielectric film)
In laser diode of the present invention,, preferably dielectric film is formed on the plane of rectangular side and ridge both sides (on the surface at place, ridge place) if the part of layered structure is removed and is provided with a bar shaped ridge when forming resonator.After bar shaped ridge for example shown in Figure 1 was set up, the set-up mode of dielectric film then was the surface that extends to the ridge both sides from the side of ridge.
If when using nitride-based semiconductor in the laser diode of the present invention, second diaphragm 162 preferably is set shown in Fig. 7,8,9 as dielectric film.
With regard to second diaphragm; except that earth silicon material, preferably use and be selected from oxide or at least a compound of silicon nitride, boron nitride, carborundum and aluminium nitride that comprises at least a element in titanium, vanadium, zirconium, niobium, hafnium and the tantalum family, particularly preferably use zirconium or hafnium or boron nitride or carborundum.Though some dissolves in hydrofluoric acid in these materials, as the insulating barrier of laser diode the reliability higher than the silicon dioxide embedding layer can be arranged with these materials.If during the sull that forms with physical vapor or chemical vapor deposition, difficult usually because of making element and oxygen have chemical quantitative response to form oxide, its reliability as the sull insulation is also lower.The selected element of following the present invention of comparing all has higher insulating reliability than silica with oxide and boron nitride, carborundum or the aluminium nitride etc. of physical vapor or chemical vapor deposition.Moreover, when selecting its refractive index for use, (for example remove carborundum) with epigenesist less than the oxide person of nitride-based semiconductor, can advantageously generate the embedding layer of laser diode.In addition; when first diaphragm 161 is when forming with silica; because of silica available hydrogen fluoric acid is removed, shown in Fig. 7 B only the top surface of ridge form first diaphragm 161 and continue on the side of first diaphragm 161 and ridge and its both side surface, to form second protective layer 162 (etch stopper) and optionally remove first protective layer 161 can be as the surface of Fig. 7 C be shown in except that crestal culmination portion surface on second diaphragm 162 of the same thickness of formation.
In addition, the thickness of second diaphragm is preferably in 1000  to the 5000  scopes in 500  to 1 mu m ranges.When thickness during, when forming electrode enough insulation can't be arranged less than 500 .When thickness during, the uniformity and the good insulation performance film of diaphragm can't be arranged greater than 1 μ m.When thickness is in above-mentioned preferred range, can on the side of ridge, form the unified film that refringence is arranged with ridge.
In addition, second protective layer also can be to form by the nitride-based semiconductor embedding layer.If when semi-insulating, i type nitride-based semiconductor, also promptly relative type, for example second waveguide area C in embodiment 1 with the conduction type of waveguide area median ridge 2In the person, the made embedding layer of available n type nitride-based semiconductor is as second diaphragm.Be provided with the refringence of ridge or the function that reaches impermeable barrier and light can be limited in laterally as being exemplified as especially of embedding layer, the good optical characteristic that absorption coefficient of light difference can have laser diode is set by the nitride semiconductor laser that contains indium by aluminiferous nitride semiconductor such as AlGaN.When using i type layer except that semi-insulating layer as embedding layer, second waveguide area can be first a conductivity type embedding layer different with second conductivity type.On the other hand, at first chi chung that constitutes first waveguide area, because of first and second conductive layer of bar shaped form is formed at the both sides of active layer, in first conductive layer or in first conductive layer and the active layer two side areas, form the second conductivity type embedding layer different and the formation first conductivity type embedding layer different in second conductive layer or in second conductive layer and the active layer two side areas with second conductivity type with first conductivity type.As previously discussed, in described first waveguide area and second waveguide area, can form heteroid embedding layer.Embedding layer is to be formed on the part of rectangular side or to be preferably on the whole surface, and is also promptly similar with second diaphragm.In addition, when embedding layer is formed at the side of ridge and ridge both sides nitride-based semiconductor surperficial, can obtain preferable limit luminous effect and throttle effect.This kind structure is forming embedding layer and also can use after the rectangular and ridge of embedding layer formation mononitride semiconductor layer and formation waveguide area has all been inserted in the element.
The present invention has used the length of the semiconductor Laser device resonator of nitride-based semiconductor can be in 400 to 900 mu m ranges, and in this case, the refraction of controlling two end mirrors can reduce drive current.
(manufacture method)
As previously discussed, the semiconductor Laser device of nitride-based semiconductor that used of the present invention can have good characteristic.Moreover, form the first waveguide area C with following operation manufacturing 1And the second waveguide area C 2Ridge can be made into the waveguide area of bar shaped of the laser diode of the present invention of high accuracy and high yield.This manufacture method also can be made laser diode highly reliably.Below, this manufacture method is elaborated.
In addition, shown in Fig. 8 and 9, when make one have different matrix with form on one side one align with negative electrode element the time, for exposing the n type contact layer that will form negative electrode as shown in Figure 7 thereon, the waveguide area of etching formation bar shaped again after being etched to this degree of depth.
(forming the method 1 of bar shaped ridge (protuberance))
Fig. 5 is that the stereogram of representing to form a part of wafer of nitride semiconductor device structure thereon is used to illustrate the operation that forms electrode according to the present invention.Fig. 6 is a similar figure explanation another embodiment of the present invention.Fig. 7 is the operation after expression forms second diaphragm, and Fig. 7 B is the second waveguide area C among the presentation graphs 7A 2Cutaway view and Fig. 7 C is the second waveguide area C among the presentation graphs 7D 2Cutaway view.According to manufacture method of the present invention, be shown in first diaphragm 161 that on top layer, forms a bar shaped form behind each semiconductor layer of lamination composed component structure on the contact layer in second conductive layer 8 as Fig. 5 A.
Whether first diaphragm 161 can be any material, as long as the rate of etch different with nitride-based semiconductor arranged, and no matter be insulation.For example available silica (comprising silicon dioxide) or photoresistance etc., the most handy material that more can be dissolved in acid than second diaphragm can go out the solubility of second diaphragm that will form subsequently respectively.Acid the most handy hydrofluoric acid and silica is handy to be the material compatible with hydrofluoric acid.The rectangular width (W) of first diaphragm will be controlled in 1 μ m to 3 mu m range.The rectangular width of first diaphragm 161 roughly is equivalent to constitute the rectangular width of waveguide area ridge.
Fig. 5 A is that expression is formed at lip-deep first diaphragm 161 of layered structure.Also promptly after forming second diaphragm, the whole surface of layered structure forms first diaphragm 161 desiring the covering cover of shape arranged and on the surface of contact layer 8, form bar shaped form shown in Fig. 5 A on first diaphragm surface with the stone plate photolithography.
In addition, also can be with erasing first diaphragm 161 that method forms bar shaped form shown in Fig. 5 A.Also promptly after forming a photoresistance that bar shaped form slit arranged, first diaphragm is formed at and removes removing photoresistance with dissolving again on the whole surface of photoresistance and only stay and contact layer 8 contacted first diaphragms 161.It is rectangular that first diaphragm that the method for need not erasing with aforesaid etching forms the bar shaped form can obtain to have the excellent in shape of the perpendicular end surface of being roughly.
Then, shown in Fig. 5 B first diaphragm 161 as covering that cover comes not form on the etching contact layer 8 part of first diaphragm 161 and according to being located immediately at below first diaphragm 161, the shape of diaphragm forms the bar shaped ridge.The structure of laser diode and characteristic can be ended etched position and change to some extent by fixation pause during etching.
Come the nitride etching semiconductor layer such as dry ecthing with reactive ion etching.First diaphragm of etching oxidation silicon then preferably uses the fluorine compounds such as CF4.In second operation, then use during the nitride etching semiconductor and be generally used for the semi-conductive Cl of other III-V family chemical combination 2, CCl4 and SiCl 4, the most handy to silica selectivity the higher person.
Then, shown in Fig. 5 C, form the part that the 3rd diaphragm 163 covers the bar shaped ridge again.The 3rd diaphragm 163 can be used to the resistant known resistance film of dry ecthing, such as light-hardening resin.The bar shaped ridge that covered by the 3rd diaphragm 163 this moment becomes the formation second waveguide area C 2Second ridge 202 and constitute the first waveguide area C 1201 on first ridge be to be formed at not in the zone that is covered by the 3rd diaphragm.Described the 3rd diaphragm 163 and first diaphragm 161 are to be used for forming on the etching layered structure covering locating of cover, and etched depth is then for reaching the bar shaped ridge (first ridge) that covering forms different depth.
In addition, Fig. 7 A side that to be expression be formed at the bar shaped ridge with second diaphragm 162 of first diaphragm, 161 different insulative materials with since etching expose on the surface of layer (covering 5,7 among Fig. 7).So first diaphragm 161 is to make first diaphragm 161 and second diaphragm 162 is optionally carried out etching with the material different with second diaphragm 162.The result is when only having first diaphragm 161 to be removed with hydrofluoric acid, and second diaphragm 162 can continue to form on the side of covering 5,7 surperficial upward (etched nitride-based semiconductor surface of exposing) and ridge, and the top surface of ridge is opened shown in Fig. 7 B.Aforesaid continuation forms second diaphragm 162 can keep high insulation characterisitic.In addition, when second diaphragm 162 continued to form on first diaphragm 161, film was at covering 5, so the electric current that can have unified thickness that the uneven gauge because of film can not take place on 7 to have concentrates.Stop because of being etched in the covering 5,7, second diaphragm 162 is to be formed at below, covering 5,7 surfaces (top surface that exposes).But in fact when etching when stopping at the below of covering 5,7, second diaphragm then is formed on the layer that etching stops to locate.
In next step operation shown in Fig. 7 B first diaphragm 161 removed to erase method, then, on second diaphragm 162 and contact layer 8, form electrode and have with contact layer 8 and to electrically contact.On ridge, form earlier because of second diaphragm that strip gab is arranged according to the present invention, unnecessary only on the contact layer of more long narrow width, form electrode and can form broad-area electrode can be from seeing through contact layer that opening exposes until second dielectric film.So can select for use to form and to be used for the electrode that the resistance electrodes in contact is incorporated into the electrode that is used to overlap in conjunction with the electrode material that resistance contacts function.
To use dry ecthing because the wet etching process difficulty when in the semiconductor Laser device that has used nitride-based semiconductor, forming the waveguide area of bar shaped.Because it is very important in the dry ecthing operation in the selectivity between first diaphragm and nitride-based semiconductor.Silicon dioxide is used for first diaphragm but then can't reaches when also using silicon dioxide in second diaphragm that the top surface etching of this layer stops to locate to form filling part insulation and because of its material identical and very difficult this diaphragm that only removes of material with first diaphragm.Therefore, second diaphragm will be with the material beyond the silicon dioxide to guarantee the selectivity of first diaphragm of the present invention.Because nitride-based semiconductor is not etched after forming second diaphragm, the difference of rate of etch can't throw into question between second diaphragm and nitride-based semiconductor simultaneously.
(forming the method 2 of bar shaped ridge)
Figure 16 represents to form the stereogram of a wafer part of nitride semiconductor device structure thereon in order to explain the operation that forms semiconductor laser according to the present invention.Processing in this method in fact with method 1 in processing similar, though in the method when humorous device end face forms, n type contact layer is also exposed out and is formed negative electrode with etching.The order that also promptly forms each several part is different with person in the method 1.In method 2, at first n type contact layer is exposed out (Figure 16 A).This moment, the end face of resonator also formed simultaneously.Then then form bar shaped ridge, first waveguide area and second waveguide area and electrode (Figure 16 B) as method 1.Aforesaid elder generation also is applicable to the situation that can't obtain good resonator end face with disintegrating method with the end face that etching forms resonator.
In laser diode of the present invention, can effectively form the formation first waveguide area C as mentioned above 1With the second waveguide area C 2Bar shaped ridge 202 and electrode also can be formed on the surface of layered structure ridge.
(engraving method)
According to manufacture method of the present invention, when using such as the dry ecthing of reactive ion etching, preferably use first diaphragm that comes etching oxidation silicon to make such as the CF4 fluorine gas compound that is generally used for first step operation as the method for nitride etching semiconductor layer.In the second step operation, use during the nitride etching semiconductor be generally used for other III-V compound semiconductors such as Cl 2, CCl 4With SiCl 4So there Deng the chlorine compound silica is had to be very suitable than high selectivity.
(chipization)
Figure 17 is the cutaway view of cutting position when representing that the layered structure from wafer is as previously mentioned made wafer.Figure 17 A only represents matrix, and Figure 17 B then represents to cut apart the situation of matrix and n type layer.Each zone that forms pair of electrodes therein is regarded as a unit and is numbered I, II, III and IV as shown in the figure from left to right.Ia among Figure 17 A, the arrangement of IIa and IVa is that first waveguide area then is in the other direction towards right-hand IIIa.Ib among Figure 17 B, the arrangement of IIb and IIIb is that first waveguide area then is in the other direction towards right-hand IVb.Can optionally select cutting apart the arrangement of up till now planting the unit.
When the A-A line is cut apart, the resonator end face can stay because of etching.In unit I and II, the end face on the reflective limit of resonator is for cutting apart the division facet of back when the B-B line is cut apart along the A-A line.End face in unit II on the resonator luminous edge also is the division facet when the D-D line is cut apart.When the C-C line is cut apart, the end face among IIIa and the IVa on the reflective limit of resonator forms the division facet simultaneously.Similarly when when the E-E line is cut apart, the end face among IIIb and the IVb on the resonator luminous edge forms the division facet simultaneously.Therefore, the end face of element and resonator end face can form etched surfaces or division surface calmly on cutting position.
At this, shown in Figure 17 A, make matrix exist only in arrangement between the resonator end face of the resonator end face of Ia between Ia and IIa and IIb for reaching, shown in Figure 16 B with etching form the work of resonator end face will be again etching master matrix downwards.The reason that is etched down to matrix is to prevent that semiconductor layer from rupturing when cutting apart.When exposing matrix if remove the step shown in Figure 16 A from single etching work procedure, the surface of the approaching active layer that has exposed in than etching early can become coarse because of long-time etching, thereby the good resonator end face of very difficult acquisition.When etching is divided into two steps, at first shown in Figure 16 A, be etched to n type layer then, be etched to matrix again, can form good resonator end face and cut apart also easier.Figure 16 D is that the work shown in the presentation graphs 16C is cut in arrow indication position.Use the protuberance D of described two step etchings in can formation figure.When being etched to matrix, need reduce the length of protuberance D towards radiative direction.This is because too wide D (outstanding length) can be difficult to that from the outgoing plane issued light good far-field pattern is arranged by the resistance shelves.D hour in the luminous edge upper end surface hour, does not promptly have problem at least.
(reflectance coating)
Figure 18 is illustrated in the ideograph that forms a reflectance coating on the resonator end face.Dispose and to be divided into the semiconductor of clavate and to make relatively with reflectance coating at end face on the reflective limit or the end face on the luminous edge as shown in figure 18, reflectance coating is with sputter or similar fashion formation.When being divided into clavate and making cut surface relative,, film also can form the high-quality reflectance coating that consistency of thickness not too can worsen even being sandwich construction with reflectance coating with sputter formation reflectance coating and with semiconductor.To be used for the requirement high-output power particularly more effective during the element of sandwich construction when this kind reflectance coating, so can make the reflectance coating of ability high-output power.This reflectance coating even can extend to the resonator end face of side from the sputter of electrode top.But as then can eliminate the advantage that forms clavate and end face is made progress this moment, also unified film can't be arranged, if particularly during multilayer film, so because film be formed up to the quality of film on the end face from the side can be relatively poor.This kind reflectance coating can be formed on reflective end face and the light emitting end surface or only on an end face and available different material.
In addition, according to the present invention to such as other component structures of active layer and covering and unrestricted and can use various layer structures.For example, described component structure promptly is available as specific component structure in the embodiment.Also unrestricted to electrode, the electrode of various structures all can use.The nitride-based semiconductor composition that is used for each layer of laser diode is also unrestricted, can use In bAl cGa 1-b-cThe nitride-based semiconductor of N (0≤b, 0≤d, b+d＜1) formula representative.
According to the present invention, the method that can be suitable for known generation nitride-based semiconductor has such as MOVPE, MOCVD (organometallic chemistry vapour phase flop-in method), HVPE (halogen vapour phase flop-in method) and MBE (molecular line vapour phase flop-in method) etc.
Embodiment.
Below, embodiment be about having used the semiconductor Laser device of nitride-based semiconductor, but laser diode of the present invention is not limited to this structure and technology of the present invention also is applicable to various semiconductors.
Embodiment 1
Below, the embodiment 1 with the explanation laser diode particularly has the structure second waveguide area C shown in Figure 8 2With the first waveguide area C shown in Figure 9 1Laser diode.
Matrix in embodiment 1 is that sapphire is made, also promptly different with nitride-based semiconductor materials.Also can use nitride-based semiconductor such as gallium nitride as matrix.A kind of insulating body is such as sapphire and spinelle (MgAl with main plane such as C plane, R plane or A plane 2O 4), carborundum (comprising 6H, 4H and 3C), zinc sulphide, zinc oxide, GaAs, silicon or can all can be used as the matrix of different materials with the oxide of nitride-based semiconductor lattice match, as long as can on matrix, generate nitride-based semiconductor.Preferably with sapphire and spinelle matrix as different materials.The matrix of different materials can have from low exponential ramp plane (drift angle) commonly used, uses the matrix of drift angle form progressively can generate the basic layer of gallium nitride of well-crystallized in this case.
And, when using the different materials matrix, after generating the basic layer of nitride-based semiconductor on the matrix, promptly remove the matrix of different materials and only stay this basic layer before forming component structure with polishing or other modes, then, available basic layer also can be removed the matrix of different materials as single nitride-based semiconductor matrix or after forming component structure.
If as shown in Figure 8 when using the different materials matrix, form resilient coating thereon and form a component structure with basic layer back the made component structure of good nitride can be arranged.Fig. 8 is the expression second waveguide area C 2The cutaway view of interior component structure, Fig. 9 are the expression first waveguide area C 1The cutaway view of middle component structure.
(resilient coating 102)
The made different materials matrix 101 of sapphire that at first will have two cun main planes in the C plane of diameter in embodiment 1 is inserted in the MOVPE container, and temperature fixes on 500 ℃, with TMG (TMG) and ammonia (NH 3) to form thickness be the gallium nitride resilient coating of 200 .
(basic layer 103)
Generate behind the resilient coating 102 and temperature to be fixed on 1050 ℃ and be the unadulterated gallium nitride nitride semiconductor layers 103 of 4 μ m with ammonia generation thickness with TMG.This layer is as the basic layer (matrix that is used for produced film) of component structure.Basic layer also can spread growth pattern (ELOG) with epitaxial lateral and form with nitride-based semiconductor, so can generate the nitride-based semiconductor of well-crystallized.ELOG means the growing method that is attended by cross growth; just behind growth mononitride semiconductor layer on the different materials matrix; its surface is covered by a diaphragm and is difficult to the nitride-based semiconductor that growth has bar shaped form and fixed intervals thereon, and nitride-based semiconductor then is newly to grow out from the nitride-based semiconductor surface of exposing through the diaphragm slit and cover whole substrate.Also promptly form one and covered zone that cover covers when exposing not covered zone that cover covers and nitride-based semiconductor and see through the nitride-based semiconductor surface regeneration length of not covered to be exposed in the zone of nitride-based semiconductor with one when mutual, covered zone that cover covers so this layer elder generation finally also covers towards cross growth towards the thickness direction growth but with the carrying out that work is grown, covered whole substrate.
As ELOG growth, also comprise the nitride semiconductor layer that forms an opening and matrix surface is exposed on the different materials matrix, generated at first and nitride-based semiconductor from the nitride-based semiconductor that is positioned at open side to the limit growth and form a film.
According to the present invention, can use this ELOG growth method that various variations are arranged.When using the ELOG growth method to generate nitride-based semiconductor, so the nitride-based semiconductor that cross growth forms has well-crystallized can obtain to have the nitride semiconductor layer of whole well-crystallized.
Then, with follow-up each layer laminate of composed component structure on the made basic layer of nitride-based semiconductor.
(n type contact layer 104)
At first, form with 1050 ℃ temperature going up of nitride-based semiconductor matrix (basic layer) 103 as foreign gas with TMG, ammonia and silane that 4.5 μ m are thick to be mixed with 1 * 10 18/ cm 3The made n contact layer 3 of the gallium nitride of concentration silicon.
(anti-parting 105)
Then, form the thick In of 0.15 μ m with TMG, TMI (front three indium) and ammonia with 800 ℃ temperature 0.06Ga 0.94The anti-parting 105 that N is made.And anti-parting can be removed from.
(n type covering 106)
After generating thickness with trimethylaluminum, TMG and ammonia as unstrpped gas and with 1050 ℃ temperature and being the unadulterated AlGaN grown layer of 25  A, the supply of trimethylaluminum stops and forming thickness with silane gas as foreign gas is that 25  are mixed with 5 * 10 18/ cm 3The gallium nitride layer B of concentration silicon.This operation repeats 160 lamination A layers and B layer and forms gross thickness is 8000  multiple field (superlattice structure) n type coverings 106.At this moment, when the ratio of aluminium among the unadulterated AlGaN under 0.05 to 0.3 situation, the refringence that is enough to make covering work is set.
(n type light guide layer 107)
Then, with similar temperature and use TMG and ammonia to form thickness as unstrpped gas be the unadulterated gallium nitride n of 0.1 μ m type light guide layer 107.But this layer Doped n-type impurity.
(active layer 108)
Then, temperature is fixed on 800 ℃ and form as foreign gas as unstrpped gas and silane gas with front three indium, TMG and ammonia and to be mixed with 5 * 10 18/ cm 3The In of concentration silicon 0.05Ga 0.95The barrier layer of N, its thickness are 100 .So stop supplies silane gas also forms the unadulterated In that thickness is 50  0.1Ga 0.9N well layer.This operation triplicate forms the active layer 108 of multiple quantum trap structure (MQW), and its gross thickness is 550  and last one deck is the barrier layer.
(p type electronics limiting layer 109)
Then, use TMA, TMG and ammonia as unstrpped gas and Cp with similar temperature 2It is that to be mixed with concentration be 1 * 10 to 100  that Mg forms thickness as foreign gas 19/ cm 3The AlGaNp type electronics limiting layer 109 of magnesium.Can not be provided with this layer when though this electronics limiting layer is arranged its function help to reduce critical.
(p type light guide layer 110)
Then, temperature being fixed on 1050 ℃, to form thickness with TMG and ammonia as unstrpped gas be the made p type of the unadulterated gallium nitride of 750  light guide layer 110.
When generating p light guide layer 110, the concentration of magnesium is increased to 5 * 10 from the magnesium of p type electronics limiting layer 109 diffusions as undoped layer 16/ cm 3And change p type layer into.Also can when generating, deliberately mix magnesium on the other hand to this layer.
(p type covering 111)
Then, forming thickness with 1050 ℃ temperature is the unadulterated Al of 25  0.16Ga 0.84The N layer, so, stop supplies trimethylaluminum and with Cp 2It is the magnesium-doped gallium nitride layer of 25  that Mg forms thickness.This operation is carried out repetition and is formed the p type covering 111 that gross thickness is 0.6 μ m superlattice structure.With lamination by different band-gap energies and wherein have superlattice structure p type covering that a nitride-based semiconductor that comprises aluminium forms at least when forming, mix with so-called adjusting, also promptly wherein the doping level of one deck overweight the doping level of another layer, can improve crystallinity.But the two-layer in the present invention doping that similarity degree is arranged.Covering is that superlattice structure comprises the nitride semiconductor layer that contains aluminium, with Al xGa 1-xN (0＜X＜1) is preferable, preferably the gallium nitride of lamination and AlGaN superlattice structure.Because of the p type covering of superlattice structure increases the ratio of aluminium in the whole covering, the refractive index of covering can reduce.Also because can increase band-gap energy, so reduce critical very effectively.More can reduce the pitting that produces in the covering because of the more non-superlattice structure of superlattice structure simultaneously, also can reduce the generation of short circuit.
(p type contact layer 112)
At last, form on p type covering 111 with 1050 ℃ temperature and be mixed with 1 * 10 20/ cm 3The made p type of the p type gallium nitride contact layer 112 of concentration magnesium, its thickness is 150 .P type contact layer can be used p type In xAl yGa 1-x-yN (0≤X, 0≤Y, X+Y≤1) forms and the most handy magnesium-doped gallium nitride, so, can have best resistance to contact with p type electrode 20.Because of contact layer 112 is the layers that will form the electrode place, can have 1 * 10 17/ cm 3Or higher carrier concentration is preferable.If concentration is lower than 1 * 10 17/ cm 3The time then be difficult to have good resistance to contact with electrode.Form contact layer with the gallium nitride composition and can be easy to have good resistance to contact with electrode.After reaction finishes, in reaction vessel, wafer annealed in nitrogen environment and can further reduce the resistance of p type layer with 700 ℃.
After forming each nitride semiconductor layer with stacked system recited above, wafer is taken out from reaction vessel.Then, form silicon dioxide protective film, and the surface of the n type contact layer 104 that n type electrode will be formed thereon carried out etching and exposes out with four calorize silicon gases and with the reactive ion etching method, as shown in Figure 8 in the uppermost surface of p type contact layer.For reaching the purpose to the nitride-based semiconductor deep etching, silicon dioxide is suitable for use as diaphragm most.When n type contact layer 104 exposed, the active layer end face that will become the resonator face was also exposed and makes etched facet become the resonator face.
Below, with the first waveguide area C that describes in detail as the waveguide area of bar shaped 1With the second waveguide area C 2The formation method.At first forming thickness with the data processor that stylizes on the whole surface of the top p type contact layer (going up contact layer) 8 is silica (being mainly silicon dioxide) first diaphragm of 0.5 μ m.First diaphragm 161 is to form (seeing Fig. 5 A) with the pattern method.The design producing of first diaphragm 161 is to carry out with photolithography and reactive ion etching utensil and with silicon tetrafluoride gas.Then, remove a part of p type contact layer 112 and p type covering 111 and make and stay very thin p type covering 111 and on active layer 3, form bar shaped ridge (seeing Fig. 5 B) covering the cover both sides as covering cover with first diaphragm 161.The result forms and constitutes the second waveguide area C 2Second ridge 202.The formation of this second ridge is etching part p type contact layer 112 and p type covering 111, is 0.01 μ m to the etch depth of covering 111.
Then, form behind bar shaped second ridge at the formation one photoresistance film that except that the part of second ridge, (constitutes the part of first waveguide area) as the 3rd diaphragm 163 (seeing Fig. 5 C).First diaphragm 161 still is retained in the top surface that will form the second and first waveguide area place ridge.
Use the 3rd diaphragm 163 and first diaphragm 161 behind the reactive ion etching utensil instead and come etching will form the both sides of first diaphragm 161 in first waveguide area part as covering cover with silicon tetrafluoride gas, etched depth will be exposed n type covering 106 and form and constitute the first waveguide area C 1Bar shaped form first ridge.The formation of bar shaped first ridge is that the n type covering 106 with the first ridge both sides is etched to its thickness and becomes 0.2 μ m.
Then, remove the 3rd diaphragm.
Then, the first waveguide area C will be formed with on it 1With the second waveguide area C 2Wafer go to the physical vapor deposition utensil, thickness is that zirconia (being mainly zirconium dioxide) second diaphragm 162 of 0.5 μ m continues on first diaphragm, 161 surfaces, first and second ridge side, the p type covering 111 that exposes owing to etching and n type covering 106 (seeing Fig. 7 A).
After forming second diaphragm 162, wafer is carried out 600 ℃ heat treatment.When second diaphragm is when forming with the material beyond the silicon dioxide; heat treated temperature is not lower than 300 ℃; be preferably 400 ℃ or higher but will be lower than and form the temperature (1200 ℃) that nitride-based semiconductor decomposes behind second diaphragm, the material (hydrofluoric acid) that second diaphragm more can be dissolved in be used to dissolve first diaphragm.
Then, wafer is immersed remove first diaphragm 161 (erasing operation) in the hydrofluoric acid.So first diaphragm 161 on p type contact layer 112 is removed and exposes p type contact membranes 112.Second diaphragm 162 is to be formed at the first waveguide area C with described processing 1With the second waveguide area C 2On the last side that forms bar shaped first ridge 201 and second ridge 202 and extend on the surface of these ridge both sides, place (be positioned at the surface of the second ridge both sides p type covering 111 and be positioned at the surface of the first ridge both sides n type covering) shown in Fig. 7 C.
After first diaphragm 161 on the P type contact layer 112 is removed, on the p type contact layer surface of exposing, form nickel/golden made p type electrode 120 and with contact as resistance.P type electrode 120 is formed at second diaphragm, 162 tops as shown in Figure 8, and its rectangular width is 100 μ m.P type electrode 120 only is formed at the first waveguide area C in embodiment 1 1With the second waveguide area C 2In towards rectangular direction, the length of p type electrode 120 does not arrive the second waveguide area C 2Two ends.After forming second diaphragm 162, forming the made n type electrode 21 of titanium/aluminium with the rectangular parallel direction of exposing on the n type contact layer 104.
Then, the zone that will be used for forming p type and n type electrode extraction electrode place adds and covers cover and form silicon dioxide and the made multilayer dielectric film 164 of titanium dioxide.Remove and cover the cover back is formed for exposing p type and n type electrode in multilayer dielectric film 164 aperture.See through these apertures and on p type and n type electrode, form the made extraction electrode 122,123 of Ni-Ti-Jin (1000 -1000 -8000 ).The second waveguide area C in embodiment 1 2Middle active layer 108 width that form are 200 μ m (with the width of resonator direction vertical direction).Guide layer also forms similar width.
Form behind p type and the n type electrode by further being etched to and expose matrix and at the described first waveguide area C 1With the second waveguide area C 2The end form the resonator face.
The total length of resonator is 650 μ m and the first waveguide area C in the laser diode in embodiment 1 1Total length be 5 μ m, comprise an end face of resonator.So, the second waveguide area C 2Total length be 645 μ m, comprise the other end.On the end face that forms with etching, form silicon dioxide and the made multilayer dielectric film of titanium dioxide.Then, with the sapphire substrates of wafer be polished into thickness be 70 μ m and from the matrix limit will be divided into bar-shapedly, more bar-shaped wafer further is divided into each element and obtains laser diode.
And, be on etched surface, to form multilayer dielectric film and form the resonator face in embodiment 1, wafer can be M face and be divided into bar-shapedly along gallium nitride division surface (11-00), uses this surface to be the resonator face.
The continuous oscillation that confirms to have at wavelength 405nm the 30mW power output of the laser diode of the embodiment 1 of Zhi Zuoing in the above described manner, at room temperature critical then is 2.0kA/cm 2Also obtain to have the bundle of good far-field pattern and 1.5 asperratio simultaneously, this expression is used for the ideal beam characteristic of optical disk system light source.Reaching of this excellent specific property is to see through characteristics of the present invention only by adjusting the first waveguide area C on the luminous edge 1The width of ridge and do not remove to manage the second waveguide area C that its function is mainly a gain region 2Rectangular width can be launched the laser beam of desiring to have optical characteristics.The laser diode of embodiment 1 does not have the transverse shift in 5 to the 30mW optics output areas yet, so the advantageous feature of the optical disk system of being applicable to read-write light source is arranged.Superperformance is arranged when this laser diode drives with the 30mW that can compare with traditional type index guide structure laser diode simultaneously.
In addition, in embodiment 1, n type electrode can be arranged on and cover the first waveguide area C shown in Fig. 7 C 1Length on.This structure can be made into excellent beam characteristics with than the laser diode of long life.
(embodiment 2)
In the present embodiment, the manufacturing of laser diode removes the first waveguide area C 1Length be outside the 1 μ m, all the other all with embodiment 1 in the person similar.For forming the first waveguide area C of this little length 1, make the final lengths longer (for example tens of μ ms to about 100 μ ms) of the first bar shaped ridge than resonator, then, at the described first waveguide area C 1Desiring has locating etching or cutting apart matrix of length.The result makes with stable shaped formation second ridge 201 than person's difficulty in embodiment 1, though still can good control be arranged to transverse mode with this length.The short length of first waveguide area also can be improved element a little than embodiment 1 life-span.
(embodiment 3)
Laser diode among the embodiment 3 is except that respectively forming first waveguide area that length is 5 μ m (with reference to figure 4B) at its two ends, the person is similar among all the other structures and the embodiment 1.The laser diode that also is embodiment 3 is with the second waveguide area C 2Place middle and the first waveguide area C 1Then be positioned at its both sides, the first waveguide area C 1Comprise the resonator end face.Among the embodiment 3 laser diode be configured with embodiment 1 in similar far-field pattern of person and asperratio.
(embodiment 4)
Laser diode removes and constitutes the second waveguide area C in the present embodiment 2The formation of second ridge 202 are mat etchings and outside the second ridge both sides stay the thick p type guide layer of 500 , the person is similar among all the other structures and the embodiment 1.The laser diode that is so obtained than person among the embodiment 1 have lower critical also can have with embodiment 1 in similar beam characteristics.
(embodiment 5)
The structure of the laser diode of embodiment 5 removes at the described first waveguide area C 1With the second waveguide area C 2Between person's similar (seeing Fig. 4 A) among all the other and the embodiment 1 is set outside the inclined surface.
That is, in embodiment 5, at the described first waveguide area C 1With the second waveguide area C 2Between have a common boundary and inherently to be positioned at the first ridge both sides n type covering, 106 surfaces and to be positioned at etching between p type covering 111 surfaces, the second ridge both sides and to form the surperficial angle that becomes 90 ° of cross section and n type covering 106.
Though in the above described manner the laser diode of Zhi Zaoing on element characteristic among the embodiment 1 person understand some and change, can obtain the effect of the good far-field pattern of the present invention and reach the improvement of reliability.
(embodiment 6)
The structure of the laser diode of embodiment 6 removes as shown in figure 13 at the described first waveguide area C 1With the second waveguide area C 2Between be provided with outside one the 3rd waveguide area C3, the person is similar among all the other and the embodiment 1.Particularly in the laser diode of embodiment 6 after second ridge, 202 etched depth arrive second conductive layer (p type covering 111), also form the 3rd waveguide area C3 that one 20 ° of angle [alpha] sides 204 are arranged from resonator AA direction when forming first ridge when being etched down to first conductive layer (n type covering 106).Therefore, make except that the first waveguide area C is arranged 1With the second waveguide area C 2The laser diode of the outer embodiment 6 that the 3rd waveguide area C3 more arranged.In the laser diode of the embodiment 6 of above-mentioned structure, be diffused in the described second waveguide area C 2In the active layer plane and the light that has been guided be reflected on the end face 204 of the 3rd waveguide area C3 and be directed to the first waveguide area C 1So this light can successfully be guided.Also promptly at light that the resonator direction is guided so that (when 90 °-α) incidence angle dropped on the side 204, this light can have total reflection and can be imported into the waveguide area and the free of losses of bar shaped on side 204.At the described second waveguide area C 2With the waveguide area that effective refringence and formation bar shaped are set in the active layer plane by second ridge 202 on second conductive layer (p type covering 111) among the 3rd waveguide area C3.Come out and the light that is guided can import the first waveguide area C ideally in the zone under second ridge in the 3rd waveguide area C3 1
As previously discussed, in embodiment 6, favour the first waveguide area C because of side 204 as mentioned above 1In the side of first ridge 201, light can be guided smoothly.The side 204 and the second waveguide area C 2Between intersection also can there is no bending as shown in figure 13 and be connected directly to the second waveguide area C 2
Like this, in the laser diode of embodiment 6, as mentioned above because of in the waveguide area that imports bar shaped in the active layer plane or at the described second waveguide area C 2In effectively import the first waveguide area C from the luminous energy at this place 1, element characteristic can give improvement.In the laser diode of embodiment 6, can reduce the critical of current concentration especially and improve inclined-plane efficient.
(embodiment 7)
The structure of laser diode constitutes the first waveguide area C divided by two steps among the embodiment 7 1And form outside the side with two steps, the person is similar among all the other and the embodiment 1.
That is, in embodiment 7, form behind the bar shaped ridge ridge that forms two stepwises forming that the ridge wideer than the rectangular width of ridge in the first waveguide area place is etched down to n type covering 106 with the etch depth that does not arrive active layer.
At this, Figure 14 A is the structural perspective of the laser diode of expression embodiment 7, and Figure 14 C is the first waveguide area C 1Cutaway view Figure 14 B then be the second waveguide area C 2Cutaway view.In the laser diode of the embodiment shown in Figure 14 A 7, the first waveguide area C 1Be to form to comprise that width is that Sw1 goes up ridge and width is two stepwise ridges of ridge under the Sw2.At the described first waveguide area C 1In, the width that is positioned at following keel and active layer 3 because of active layer is decide according to the width S w2 of ridge down, to can be considered be to be formed by ridge down on the waveguide road in fact.Be easier to control down the width S w2 of ridge when forming first ridge among the structure of embodiment 7 embodiment 1, therefore, can accurately form the width of the first waveguide area active layer.This is because constitute the first waveguide area C when forming with method shown in Figure 5 1First ridge 201 time be to cover the rapid in two steps etching of cover and carry out with single, step be and in the past the established second ridge common sparing and form in the boundary between part below it etch depth for the second time then arrive first conductive layer and make can't accurately control below the width of part.
But, according to embodiment 7 with the common etching work procedure of second ridge in the etching behind the ridge, the formation of following ridge is to use the covers that covers different when forming ridge to carry out etching.Therefore, following ridge can have accurate width and be positioned at the active layer 3 of keel that width is accurately also arranged.
Therefore, according to present embodiment can be made into embodiment 1 in the laser diode of same characteristic is arranged and changes less during fabrication.That is, the laser diode of embodiment 7 helps making.
(embodiment 8)
The structure of the laser diode of embodiment 8 the 3rd waveguide area between described first waveguide area and second waveguide area is arranged and among the formation of the 3rd waveguide area and the embodiment 6 person different.
Specifically, the 3rd waveguide area C3 in the structure of the laser diode of embodiment 8 is by constituting at p type covering 111 and the 3rd ridge on the p type contact layer 112, and shown in Figure 15 A, the 3rd ridge reduces its width towards first waveguide area.
That is,, form first waveguide area that the 3rd waveguide area can be different with width and be connected with second waveguide area and needn't change waveguide degree of having a lot of social connections respectively according to embodiment 8.
At this, Figure 15 A is the cutaway view of active layer for stereogram Figure 15 B of the structure of the laser diode of embodiment 8.The width of second ridge bottom is Sw1 and the width of first ridge active layer part is S in Figure 15 B W2
At this, the imaginary line among Figure 15 B (chain-dotted line) is second ridge and the projection of the 3rd ridge on the active layer cross-table.Because of the waveguide road of second waveguide area and the 3rd waveguide area is to constitute by in the active layer corresponding to second ridge and the 3rd ridge effective refringence being set, this imaginary line (chain-dotted line) can be considered the waveguide road of expression second waveguide area and the 3rd waveguide area in fact.
The structure of the laser diode of the embodiment 8 of above-mentioned manufacturing has excellent specific property similar to Example 1.
(embodiment 9)
Embodiment 9 is to be similar to giving an example of embodiment 1 structure laser diode with embodiment 1 diverse ways manufacturing.
That is, second ridge is just to form after forming first ridge in embodiment 9.
Specifically, behind each layer that forms lamination, be shown in formation bar shaped first diaphragm 161 on the layered structure surface as Fig. 5 A.Then, except that the part of first diaphragm 161, (will form the first waveguide area place) and form the 3rd diaphragm 163 and the both sides of first diaphragm 161 are etched to the degree of depth of exposing below covering 5 (n type covering 106) and form first ridge 201 shown in Fig. 6 B as shown in Figure 6A.Then; after temporarily removing the 3rd diaphragm 163; form the 3rd diaphragm 163 and cover first ridge 201 shown in Fig. 6 C, the part that will form second waveguide area in this case except that first diaphragm, 161 two side portions is covered by one in first diaphragm and the 3rd diaphragm 163 institute at least.Cause behind this state again the zone that will be not be covered by first diaphragm 161 and the 3rd diaphragm 163 to be etched to the degree of depth of no show active layer.
At this moment, will constitute the first waveguide area C 1With the second waveguide area C 2Ridge width with highly fix on value similar to Example 1.Then, with the first waveguide area C 1On the 3rd diaphragm 163 remove and only stay and become first diaphragm 161 that cover is covered in bar shaped, then be similar to embodiment 1 subsequent treatment and on rectangular side and from nitride semiconductor layer surface formation second diaphragm (embedding layer) of this continuation.So, promptly obtain laser diode similar to Example 1.According to the method for the foregoing description 9,, can make laser diode similar to Example 1 though the treatment process number of times increases to some extent than the method for embodiment 1.
(embodiment 10)
Embodiment 10 gives an example the second waveguide area C that constitutes structure shown in Figure 8 that it is put substantially for use nitride-based semiconductor matrix manufacturing laser diode 2And the first waveguide area C of structure shown in Figure 9 1
(matrix 101)
Using the thickness of making in the following manner in embodiment 10 is the gallium nitride nitride-based semiconductor matrix of 80 μ m.
At this, at first, prepare one 425 thick diameter of μ m and be 2 cun and main plane on the C plane, be orientated flat surface at the sapphire substrates on A plane as the different materials matrix of on nitride-based semiconductor, growing.Put into Organometallic chemical vapor deposition (MOCVD) reaction vessel behind the wafer.Then, temperature is fixed on 510 ℃ and use hydrogen to form the thick low-temperature epitaxy gallium nitride resilient coating of 200  as carrier gases and ammonia and TMG as unstrpped gas on sapphire substrates, then use TMG and ammonia to generate basic layer of the thick unadulterated gallium nitride of 2.5 μ m to 1050 ℃ with temperature is fixed as unstrpped gas.From and the direction of sapphire substrates orientation flat surface (A plane) vertical direction θ=0.3 ° to form that the wide strip silicon dioxide that is parallel to each other of several each 6 μ m covers cover and make between covering between cover be 14 μ m every (covering the cover aperture).Then, matrix is put back to the MOCVD utensil and generate the thick unadulterated gallium nitride of 15 μ m.In this operation, optionally see through and cover gallium nitride that the cover aperture generates and mainly give birth to vertical (thickness direction) in covering the cover aperture and cover laterally forming on the cover and cover and cover cover and basic layer that covers the cover aperture.Can reduce the generation of break-through dislocation in the horizontal generation nitride semiconductor layer in the basic layer that generates in the above described manner.Particularly the situation that takes place of break-through dislocation is for increasing to about 10 covering on the cover aperture with covering around the cover center from covering the growing dislocation density of the anterior joint of nitride-based semiconductor of the cover horizontal arrival in both sides 10/ cm 2The time dislocation density that except that its core, covers on the cover reduce to about 10 8/ cm 2
Then, wafer is put into halogen vapour phase brilliant (HVPE) utensil of heap of stone and on basic layer, generated the thick unadulterated gallium nitride of about 100 μ m (grow to the thick layer of about 100 μ m and promptly be called thick film layers).Then, the resilient coating of the matrix of different materials, low-temperature epitaxy, basic layer and a part of thick film layers are removed only stay thick film layers (unification) and obtain the thick gallium nitride matrix layer of 80 μ m.Though the thick film layers that forms with HVPE also can become with the nitride system semiconductor beyond the gallium nitride, preferably uses gallium nitride or aluminium nitride, so easy generation has the thick nitride semiconductor layer of well-crystallized according to the present invention.The matrix of different materials can be removed behind the said formation component structure or after forming waveguide road or electrode below.When the matrix of different materials is removed before wafer is divided into clavate or wafer, the cleave plane of nitride-based semiconductor ({ the 11-00}M plane of approximate hexagonal system, the 112-0}A plane, and the 0001}C plane) when cutting or splitting into wafer, can use.
(basic layer 102)
On the nitride-based semiconductor matrix, form the thick basic layer 102 of about 15 μ m and make also can cross growth.Can use during formation that the used bar shaped silicon dioxide that is similar to basic layer covers cover when making the nitride-based semiconductor matrix.
(resilient coating 103)
Then, on basic layer 102, form the made resilient coating 103 of unadulterated AlGaN (ratio of aluminium is 0.01).Though if the matrix that uses cross growth is made or use cross growth can remove resilient coating 103 as gallium nitride from when made for formed basic layer as gallium nitride, but had better form resilient coating 103 because use the thermal coefficient of expansion nitride-based semiconductor low than gallium nitride, also be Al aGa 1-aN (0＜a≤1) or the made resilient coating 103 of this type of material can reduce the generation that pitting is arranged.Also promptly just pitting may occur when a kind of nitride-based semiconductor is created on the another kind of type nitride-based semiconductor that is attended by cross growth as the situation of basic layer 102, resilient coating 103 has the effect that prevents pitting.
And the ratio of resilient coating 103 contained aluminium also is preferably 0＜a＜0.3, so can be formed with the resilient coating of well-crystallized.Can form the n type contact layer that its constituent class is similar to resilient coating after forming resilient coating 103, so also can give n type contact layer 104 buffering effects.Also promptly when have at least a resilient coating be formed between the horizontal nitride semiconductor layer that generates layer (gallium nitride matrix) and composed component structure or in component structure active layer with laterally between the generation layer (gallium nitride matrix) time, the characteristic that resilient coating 103 can go out and when young cheat and improve element, resilient coating are preferably in component structure endobasal-body limit below covering and laterally generate between the layer (gallium nitride matrix).
When resilient coating was also carried out the function of n type contact layer, the ratio that wherein contains aluminium was preferably in 0.1 with interior and can have with the good resistance of electrode and contact.Be formed at resilient coating on the basic layer 102 and can be similar to the above-mentioned resilient coating that is formed on the different materials matrix and generate with the low temperature in 300 to 900 ℃ of scopes, the single crystal growth of temperature in 800 to 1200 ℃ of scopes can improve the effect that reduces pitting.Moreover, but resilient coating 103 Doped n-type or p type impurity also can undope, but preferably undope and grow good crystallinity can be arranged.When if two or more resilient coatings are set, the ratio of variable n type or p type impurity concentration and aluminium forms these layers.
(n type contact layer 104)
Form on resilient coating 103 that 4 μ m are thick to be doped with 3 * 10 18/ cm 3The Al of concentration silicon 0.01Ga 0. 99The n type contact layer 104 that N is made.
(anti-parting 105)
On n type contact layer 104, form the thick In of 0.15 μ m 0.06Ga 0.94The anti-parting 105 that N is made.
(n type covering 106)
Forming gross thickness on anti-parting 105 is the n type covering 106 of 1.2 μ m superlattice structures.
Specifically, n type covering 106 is the not doped with Al with mutual lamination thickness 25  0.05Ga 0.95N layer and thickness 25 , be mixed with 1 * 10 19/ cm 3The mode of the gallium nitride GaN layer of concentration silicon forms.
(n type light guide layer 107)
On n type covering 106, form the thick unadulterated gallium nitride n type light guide layer 107 of 0.15 μ m.
(active layer 108)
Forming gross thickness on n type light guide layer 107 is the multiple quantum trap structure-activity layer 108 of 550 .
Active layer 108 is to be mixed with 5 * 10 so that 140  are thick 18/ cm 3The In of concentration silicon 0.05Ga 0.95Barrier layer (B) and the thick unadulterated In of 50  that N is made 0.13Ga 0.87The made well layer of N (W) and forming with the order of (B)-(W)-(B)-(W)-(B).
(p type electronics limiting layer 109)
What form 100  thickness on active layer 108 is mixed with 1 * 10 20/ cm 3The p type Al of concentration magnesium 0.3Ga 0.7The made p type of N electronics limiting layer 109.
(p type light guide layer 110)
What form 0.15 μ m thickness on p type electronics limiting layer 109 is mixed with 1 * 10 18/ cm 3The made p type of the p type gallium nitride light guide layer 110 of concentration magnesium.
(p type covering 111)
On light guide layer 110, form the superlattice structure p type covering 111 of gross thickness 0.45 a μ m.
The formation of p type covering 111 is unadulterated Al of lamination 25  thickness 0.05Ga 0.95N be mixed with 1 * 10 20/ cm 3The gallium nitride layer of concentration magnesium.
(p contact layer 112)
On p type covering 111, form and be mixed with 2 * 10 20/ cm 3The made p type of the n-gallium nitride contact layer 112 of concentration magnesium 150  thickness.
As previously discussed, form behind the component structure of n type contact layer 104 to p type contact layers 112, n type contact layer 104 is exposed out and carries out etching and form this 31 and second waveguide area C 2And in first ridge and the second ridge side and extend and form second diaphragm 162 (embedding layer) on the nitride semiconductor layer surface at its place, its situation is similar to Example 1.Be etched to the p type light guide layer 110 of the second ridge both sides and make film become the thick degree of depth of 0.1 μ m and form and constitute the second waveguide area C this moment 2Second ridge.
Below, will the method for the resonator face of the laser diode that forms embodiment 10 be described.
In embodiment 10 by place a pair of laser diode and make with the symmetry arrangement on a symmetrical plane in can effectively form the resonator face relatively.
Particularly at the first long waveguide area C of 10 μ m 1It is the second long waveguide area C of 645 μ m that the both sides of (first waveguide area of a pair of laser diode that is coupled) (IIIb and IVb part among Figure 17 B) respectively form each 2
The second waveguide area C 2Outer face on the both sides also forms when etching is exposed n type contact layer simultaneously.
Then, similar to embodiment 1 at the surface formation n type electrode 121 and p type electrode 120 of n type contact layer 104 with p type contact layer 112.
Then, comprise the side of end face and each ridge of formation waveguide area of second waveguide area, form the made dielectric film (reflectance coating) 164 of dielectric multilayer-film on the whole surface of having exposed.
So the dielectric film 164 that forms is at the described second waveguide area C 2End face have the function of reflectance coating dielectric film function (particularly preventing the function of pn inter-electrode short-circuit) then to be arranged in other parts.P type electrode 120 is formed on the part of p type contact layer in embodiment 10, and its width width rectangular than p type contact layer 112 is little and not like person shown in Fig. 8 and 9.P type electrode 120 only be formed on described second waveguide area towards the top of rectangular direction and with the second waveguide area C 2The end a bit of distance is arranged.
Though n type and a part of dielectric film 164 on the p type electrode removed electrode to be exposed and be formed on the pad capacitor 122,123 that is electrically connected on the electrode surface.
The first waveguide area C that follows at 10 μ m 1(Figure 17 B E-E line indication person) splits into clavate along the M surface with nitride-based semiconductor around the center, towards the direction parallel with resonator these rod divisions obtained wafer along dividing vertical A plane, M plane with interelement again.
The above-mentioned laser wafer that obtains has the first long waveguide area C of about 5 μ m 1The second waveguide area C long with 645 μ m 2, the first waveguide area C 1End face as luminous edge, similar with person among the embodiment 1.
The above-mentioned laser diode that obtains has 2.5kA/cm 2Critical current density and the critical voltage of room temperature 4.5V together with 405nm oscillation wavelength that is used for emitted laser beam and 1.5 asperratio.When 30mW continuous oscillation, this laser diode can be operated on high-output power 1000 hours or longer.This laser diode can and have the beam characteristics that is applicable to optical disk system light source in this output area in the continuous oscillation of 5mW to 80mW output area.
(embodiment 11)
In embodiment 11, the structure of laser diode be with 80 μ m thick mix silicon n-gallium nitride as matrix 101 rather than with the thick gallium nitride of 80 μ m that do not mix among the embodiment 10.Mix making of silicon n type gallium nitride and be on the different materials matrix, form a low temperature-grown buffer layer and form a basic layer that is attended by cross growth and with halogen vapour phase brilliant art of heap of stone form one 100 μ m thick mix silicon n type gallium nitride thick film, then, remove the different materials matrix.
In embodiment 11 to mix silicon Al 0.01Ga 0.99The made resilient coating 103 of N is to be formed on the n type gallium nitride matrix 101 and each layer from n type contact layer 104 to p type contact layers 112 that has formed lamination similar to Example 1 on it.
Then, form a separation trough and expose the surface of p type contact layer 112 with etching so that define the element waveguide area position that will form.Form n type electrode on the n type contact layer surface that in embodiment 11, does not need the space to be used for exposing as different from Example 1 so that the matrix both sides are made the structure of comparative electrode and needn't aligned and negative electrode with forming one on one side.So the element of adjacency embodiment 9 more can be close.
And, in embodiment 11, expose n type contact layer with etching and define zones of different, but the relative arrangement that also can reach structure without etching in the following manner.Layer between n type contact layer and matrix is exposed or form separation trough and expose matrix.Moreover, if when mat exposes matrix and forms separation trough, matrix can be etched to and expose matrix midway.
Do not need to be one of each element defining when regional, a zone is common to constitute two elements or three elements (for example III shown in Figure 17 A and the 17B and IV promptly are common formers partly) as forming as described in the embodiment 9.
Can form several regions continuously and needn't form separation trough in the direction vertical equally at interelement with light conducting direction.
Be deeper than that the active layer mode forms separation trough and cut apart with etching and can avoid active layer to split in flakes because of cutting apart along groove (the A-A part shown in Figure 17 A and 17B).
In embodiment 11, the zone of each element all separately forms individual elements.Then, formation similar to Example 10 constitutes the bar shaped ridge of waveguide area and forms the first waveguide area C in each district corresponding to each element 1With the second waveguide area C 2The rectangular length of first waveguide area is 10 μ m.
Then, similar to Example 10 only at the described second waveguide area C 2Form the bar shaped p type electrode of its width on the interior p type contact layer surface less than p type contact layer width.The length of bar shaped p type electrode does not arrive and constitutes the second waveguide area C 2Second ridge end face and will with separate a little.
Then, (form the matrix surface of component structure relatively thereon) at the matrix back side and form a n type electrode.Follow and similar to Example 10ly form a pad capacitor and relative p type electrode electrical connection under the situation forming the dielectric film (reflectance coating) 164 that forms a dielectric multilayer-film on the whole surface on matrix limit, component structure place and expose at some p type electrode.
At last, be positioned at the first waveguide area C 1The D-D cutting position of center is divided into clavate perpendicular to the direction of resonator and along dividing and obtain the laser diode of wafer form at interelement perpendicular to the A plane of cleave plane along the matrix M plane division of interelement A-A cutting position.
The laser diode of above-mentioned acquisition has at the described first waveguide area C 1The division surface at place, end reaches at the described second waveguide area C 2The etched facet that the end has reflectance coating on it is as the resonator face and laser generation can be arranged.Described laser diode have with embodiment 10 in similar excellent laser characteristics.
(embodiment 12)
Making of the laser diode of embodiment 12 is the matrix between the resonator face to be separated with the AA cutting among the II is surperficial along I shown in Figure 17 A after forming the resonator end face and be etched to matrix when being etched to n type contact layer in embodiment 10.This moment, the size from resonator end face ledge was decided to be 3 μ m.The above-mentioned laser diode that obtains has the excellent laser characteristics of element characteristic similar to Example 10 and optical characteristics.
(comparative example 1)
Comparative example 1 made laser diode has the second waveguide area C that is formed on its whole length 2But do not form the first waveguide area C 1
In comparative example 1, each of composed component layer is similar to the mutual lamination of embodiment 1.Then, shown in Fig. 5 B, form second bar shaped ridge as covering cover and extend the other end from an end face of element with first diaphragm 161.
Then, at the diaphragm that is formed at the first ridge side formation zirconium dioxide on the whole length of first ridge and on the etched both side surface of exposing.Then, wafer is immersed in the hydrofluoric acid and remove first diaphragm 161 to erase method.So, formation resonator face similar to Example 1 and electrode and obtain only to have and constitute the second waveguide area C 2The laser diode of the comparative example 1 of second ridge.
In the laser diode of the comparative example of making as mentioned above 1, be difficult to effectively suppress unnecessary transverse mode and reduce the stability of transverse mode and can often occur in kinking in electric current-optics output characteristic.
Particularly in the high output area of big optics power output, for example write the required 30mW power output of data in the optical disk system, the displacement of transverse mode may take place.Also because of the sensitiveness of element characteristic to first bar shaped ridge dimensional accuracy, interelement can great changes have taken place and be difficult to improve output, as shown in figure 10.The asperratio major part of laser beam spots is in 2.5 to 3.0 scopes, and the quite low output of this meaning work is unless but the acceptance criteria of asperratio can be 2.0 or lower.
Below, will be illustrated as the result that laser diode of the present invention structure effect (controllability of laser diode useful life, drive current and transverse mode) is investigated.
In investigation, use the component construction (semiconductor laminated structure) be similar to embodiment 1 to make the laser diode of different ridge height and change etch depth and useful life, drive current and the transverse mode controllability of this laser diode are determined.
Figure 12 is the useful life (the optics power output during test is 30mW) of the different etch depth laser diodes of expression.
As shown in figure 12, when etch depth during near the border of p type covering and p type light guide layer, the longest-lived of element but when etch depth reduces the life-span also shorten.When etching during near the border of p type covering and p type light guide layer, laser diode descends suddenly, this expression when the waveguide area of bar shaped be to be etched to the degree of depth of arrival active layer and great harmful effect to be taken place component life when forming.Institute is shown in when considering component life, and it serves as better not arriving p type electronics limiting layer with etch depth.Also can understand when ridge be above p type covering and p type photoconduction draw the interlayer intersection with below be etched to the degree of depth in 0.1 mu m range and can be arranged when forming very long useful life.When considering that at thickness direction etched depth does not preferably arrive p type guide layer during to the restriction of light.At this on the one hand, etch depth preferably arrives p type covering and p type light guide layer interface top 0.1 μ m.
Figure 10 is the curve chart of the different etch depth qualification rates of expression.Can there be height to accept ratio when etch depth is deeper than the point of p type covering and p type light guide layer interface top 0.1 μ m as can be seen from Figure 10.Qualification rate shown in Figure 10 be expression element that the vibration ability arranged with 5mW vibrate in basic single transverse mode ratio and this moment waveguide area rectangular width be 1.8 μ m.
Can suddenly kinking take place when the p type covering of staying the ridge both sides is etched to the 0.1 μ m or the bigger degree of depth and cause declining to a great extent of qualification rate.
Figure 11 is the driving voltage (optics be output as 30mW) of expression as the etch depth function, and the waveguide area width fixes on 1.8 μ m during investigation.Can know from Figure 11 and to find out why drive current all remains constant 50mA regardless of etched depth when etching is deeper than the mid point of active layer limit p type light guide layer (mid point of thickness direction).When etch depth when p type light guide layer mid point reduces, the electric current of p type covering and p type light guide layer intersection top increases to 0.1 μ m gradually and (makes the both sides of ridge keep the etch depth of 0.1 μ m thickness or thicker p type covering) when the etch depth of p type covering and p type light guide layer intersection top is shallower than 0.1 μ m, and electric current can unexpected increase.When being etched to remaining 0.25 μ m thickness or thicker p type covering, can't reach the optics output of 30mW.
(comparative example 2)
The laser diode of manufacturing has and is formed at first waveguide area on its whole length and does not have second waveguide area among the embodiment 1 in the comparative example 2.
In comparative example 2, each layer of composed component structure is similar to Example 1 also to be lamination.Then shown in Fig. 5 A, constitute the first waveguide area C 1The formation of bar shaped ridge be to form first diaphragm 161 of bar shaped earlier again the zone of the first diaphragm both sides to be etched to the degree of depth that arrives under-clad layer 5.Then, on the top surface of ridge and side and the etched both side surface of exposing thereof, form the diaphragm of zirconium dioxide.Then wafer is immersed in the hydrofluoric acid and remove first diaphragm 161 to erase method.Then, to embodiment 1 similar formation resonator face and electrode and obtain only to have the first waveguide area C 1And the laser diode of section structure shown in Figure 9.The first waveguide area C of the formation of bar shaped ridge and comparative example 1 in comparative example 2 1Similar is that the p type covering that will stay the ridge both sides is etched to that to make its thickness be the degree of depth of 0.2 μ m.
Short because rectangular formation is to be etched to be deeper than active layer and can't to produce actual useful laser diode and because of it only arranged short useful life shown in Figure 12 to the laser diode that is so obtained than person useful life among the embodiment 1.
The possibility of using on the industry
Laser diode of the present invention has first wave guide passage zone C1With the second waveguide area C2Be used as humorous The waveguide road of the device direction of shaking is so it is controlled that excellent component reliability and transverse mode can be set. This The laser diode that simple Change In Design also can be provided with various element characteristics is carried out in invention.
In addition, in the past, in transverse mode, there was element reliable in some afoul projects such as the while The actual reality of property and stable oscillation stationary vibration is difficult to reach under the situation of excellent element characteristic, laser of the present invention unit Part has excellent productivity ratio, reliability and element characteristic. Moreover, luminous at a part of resonator face First wave guide passage zone C is set on the limit1Can obtain to have various light spot forms and various asperratio Laser beam. Therefore, the present invention can reach various beam characteristicses and expanded laser light element application model is arranged The great effect of enclosing.
In the past, in the semiconductor Laser device that has used nitride-based semiconductor, the regeneration of crystal and, The isoionic injection of proton is very difficult, so only there is the bar shaped laser diode can reach good output With productivity ratio, and, be exposed in the air if having the active layer of the nitride-based semiconductor that contains In,, Have sizable infringement, element meeting in service life decrease is so only can select effective refraction The laser diode of rate type. But in contrast to this, laser diode of the present invention has first wave guide passage zone C1With the second waveguide area C2So, can reach the control of transverse mode and excellent beam characteristics is arranged And the reliability of assurance element. In addition, even the structure of its element also allow a large amount of productions also can with Excellent product percent of pass is made, and makes the semiconductor Laser device that has utilized nitride-based semiconductor Application and popularize rapidly and become possibility. And, can provide when recording the disc density system as height Light source the time, when being used for data reading (5mW) and data write fashionable (30mW) two aspect light In the output power range, there is no transverse mode displacement, even and drive with 30mW and also can surpass 1000 hours excellent laser diode, as light source, asperratio is 1.0～1.5 scope.

Claims (8)

1. the manufacture method of a semiconductor Laser device is characterized in that, comprising:
On n type GaN substrate to major general's first conductive layer, active layer and second conductive layer operation of lamination successively;
On by described operation stacked chip, the separation trough of the length of prescribed waveguide area is formed the darker operation of bottom surface specific activity layer of groove;
On described second conductive layer, the bar shaped protuberance is set, forms the operation that bars up the second waveguide road of light by effective refractive index;
The bar shaped protuberance that comprises active layer is set under described bar shaped protuberance, forms the operation that bars up the first waveguide road of light by complete refractive index;
Described wafer is become the division operation of the mode of resonator face in described separation trough division with splitting plane,
Wherein, described first conductive layer, active layer and second conductive layer are made of nitride-based semiconductor.
2. the manufacture method of semiconductor Laser device as claimed in claim 1 is characterized in that,
Described separation trough and waveguide road form by etching.
3. the manufacture method of semiconductor Laser device as claimed in claim 1 or 2 is characterized in that,
The bottom surface of described separation trough is formed described n type GaN substrate is exposed.
4. the manufacture method of semiconductor Laser device as claimed in claim 1 is characterized in that,
Described splitting plane is { 11-00}M a face.
5. the manufacture method of semiconductor Laser device as claimed in claim 4 is characterized in that,
Be included in the described division operation described wafer is formed bar-shaped back in the operation of sectionization perpendicular to the A face division of described M face.
6. the manufacture method of semiconductor Laser device as claimed in claim 1 is characterized in that,
Comprise that the mode that makes electrode contraposition to clamp described n type GaN substrate forms the operation of electrode.
7. the manufacture method of semiconductor Laser device as claimed in claim 1 is characterized in that,
Described n type GaN substrate forms by HVPE.
8. semiconductor Laser device, it utilizes the manufacture method manufacturing of each described semiconductor Laser device in the claim 1～7.
CNB2005101202196A 2000-06-08 2001-04-25 Semiconductor laser device and method of manufacturing the same Expired - Fee Related CN100375349C (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06260727A (en) * 1993-01-07 1994-09-16 Nec Corp Optical semiconductor device and manufacture thereof
JPH07174931A (en) * 1993-12-20 1995-07-14 Nec Corp Semiconductor optical waveguide and its production
EP0729042A1 (en) * 1995-02-22 1996-08-28 Alcatel N.V. Segmented optical guide, its use in particular in a semiconductor device
JPH08307009A (en) * 1987-08-04 1996-11-22 Sharp Corp Semiconductor laser element
JP2000031599A (en) * 1998-07-14 2000-01-28 Sony Corp Nitride based iii-v compound semiconductor laser
JP3031415B1 (en) * 1998-10-06 2000-04-10 日亜化学工業株式会社 Nitride semiconductor laser device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08307009A (en) * 1987-08-04 1996-11-22 Sharp Corp Semiconductor laser element
JPH06260727A (en) * 1993-01-07 1994-09-16 Nec Corp Optical semiconductor device and manufacture thereof
JPH07174931A (en) * 1993-12-20 1995-07-14 Nec Corp Semiconductor optical waveguide and its production
EP0729042A1 (en) * 1995-02-22 1996-08-28 Alcatel N.V. Segmented optical guide, its use in particular in a semiconductor device
JP2000031599A (en) * 1998-07-14 2000-01-28 Sony Corp Nitride based iii-v compound semiconductor laser
JP3031415B1 (en) * 1998-10-06 2000-04-10 日亜化学工業株式会社 Nitride semiconductor laser device

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