CN100366444C - Laser internal engraving equipment for transparent material - Google Patents

Laser internal engraving equipment for transparent material Download PDF

Info

Publication number
CN100366444C
CN100366444C CNB2004100134159A CN200410013415A CN100366444C CN 100366444 C CN100366444 C CN 100366444C CN B2004100134159 A CNB2004100134159 A CN B2004100134159A CN 200410013415 A CN200410013415 A CN 200410013415A CN 100366444 C CN100366444 C CN 100366444C
Authority
CN
China
Prior art keywords
mirror
laser
frequency
axle
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100134159A
Other languages
Chinese (zh)
Other versions
CN1593942A (en
Inventor
朱晓
朱长虹
齐丽君
朱广志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huazhong University of Science and Technology
Original Assignee
Huazhong University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huazhong University of Science and Technology filed Critical Huazhong University of Science and Technology
Priority to CNB2004100134159A priority Critical patent/CN100366444C/en
Publication of CN1593942A publication Critical patent/CN1593942A/en
Application granted granted Critical
Publication of CN100366444C publication Critical patent/CN100366444C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Lasers (AREA)

Abstract

The present invention provides laser internal carving equipment of transparent materials, which comprises a laser device, a ray-expanding mirror, two light beam deflection mirrors, a focusing mirror and a computer, wherein the laser device comprises a full-reflecting mirror, a sound and light Q-adjusting device, a semiconductor pumping module, a frequency doubling crystal and an outputting mirror; the full-reflecting mirror is coated with a fundamental frequency full-reflecting membrane layer or is coated with fundamental frequency and multiplier frequency double full-reflecting membrane layer; the outputting mirror is coated with a membrane layer, the transmissivity of the membrane layer to fundamental frequency light is from 4% to 10%, and the transmissivity of the membrane layer to multiplier frequency light is full; the power source of the sound and light Q-adjusting device adjusts the driving frequency of the sound and light Q-adjusting device and produces 1 to 10 kilohertz Q-adjusting multiplier frequency laser pulse to be outputted; the computer controls an XY working bench to realize motion in the X direction and the Y direction of the first light beam deflection mirror, the second light beam deflection mirror and the focusing mirror, and controls a one-dimensional electrical controlling displacement platform to realize the motion in the Z direction of the focusing mirror and the transparent material. The present invention has the advantages of good laser outputting mode, steady and efficient light power and fast carving ratio, and the present invention is suitable for carving the transparent material with big breadth.

Description

The inner engraving equipment of transparent material laser
Technical field
The present invention relates to the inner engraving equipment of a kind of transparent material laser.
Background technology
The inside engraving equipment of simple glass and other transparent materials has become an emerging developing direction of the inner engraving of laser.At present, the inner engraving equipment of laser is mainly used in quartzy quartz glass, and the shortcoming of the inner engraving equipment of this laser is: mainly adopt the pulse laser of flash lamp pumping, beam quality is relatively poor, and it is big to focus on after-explosion point, and carved image is not meticulous; Adopt electric-optically Q-switched, laser pulse repetition frequency low (having only about hundred hertz), speed is slow, is not suitable for carrying out the inside engraving of large format simple glass and other transparent materials; Because adopt flash lamp pumping, the life-span of laser pump source is shorter, make troubles for the maintenance and the use of equipment.Therefore, present body laser inner carving product only limits to a limited number of, small-sized handicraft scope, has limited the use field expansion of laser-light transparent material internal engraving and has extended.
Summary of the invention
The objective of the invention is to overcome the weak point of the inner engraving equipment of above-mentioned laser, provide a kind of transparent material laser inner engraving equipment.This equipment adopts high repetition frequency 1~10 KHz, semiconductor pumped total solidifying laser device light source as the laser-light transparent material, has promoted the performance indications of body laser inner carving equipment comprehensively.
For achieving the above object, the technical solution used in the present invention is: the inner engraving equipment of a kind of transparent material laser comprises laser instrument, beam expanding lens, first beam-deflecting mirror, second beam-deflecting mirror, focus lamp and computer; Laser instrument comprises total reflective mirror, A-O Q-switch device and power supply thereof, semiconductor pumping module, frequency-doubling crystal, outgoing mirror, total reflective mirror, outgoing mirror and semiconductor pumping module constitute laserresonator, power supply and A-O Q-switch device join, A-O Q-switch device places between total reflective mirror and the semiconductor pumping module, frequency-doubling crystal places between semiconductor pumping module and the outgoing mirror, or A-O Q-switch device places between semiconductor pumping module and the outgoing mirror, frequency-doubling crystal places between A-O Q-switch device and the outgoing mirror, total reflective mirror is coated with fundamental frequency light all-trans film, perhaps be coated with fundamental frequency light and the frequency doubled light anti-rete of enjoying a double blessing simultaneously, it is 4%~10% and to the rete of frequency doubled light full impregnated that outgoing mirror is coated with the fundamental frequency light transmission rate simultaneously, the driving frequency of power adjustment A-O Q-switch device produces the output of 1~10 KHz q-multiplier laser pulse at 1~10 KHz; Beam expanding lens enlarges the lasing beam diameter of laser instrument output, and angle of divergence compression is dwindled the spot diameter after laser beam focuses on by focus lamp, obtains little focal beam spot; First beam-deflecting mirror is installed on the x axle of xy workbench, will be deflected into the laser beam that is parallel to the y axle through the laser beam that is parallel to the x axle behind the beam expanding lens; Second beam-deflecting mirror is installed on the y axle of xy workbench, and the laser beam of the above-mentioned y of being parallel to axle is deflected into the laser beam that is parallel to the z axle; The optical axis of focus lamp is parallel to the z axle, and is installed on the y axle of xy workbench with the automatically controlled displacement platform of one dimension, and the laser beam of the above-mentioned z of being parallel to axle is focused in the transparent material; Computer control xy workbench is realized the motion of first beam-deflecting mirror on directions X, the motion on x, y direction of second beam-deflecting mirror and focus lamp; The automatically controlled displacement platform of computer controlled one-dimensional is realized condenser lens or the motion of transparent material on the z direction.
The invention has the advantages that:
(1) adopt the mode of continuous semiconductor pumping, efficient height, life-span are long, and plant maintenance makes things convenient for.
(2) adopt the acousto-optic Q modulation mode, the frequency of output laser pulse can reach 1~10 KHz, and carving speed is fast, can be fit to carry out the inner engraving of large format transparent material greater than 12 meters/minute.
(3) adopt the outgoing mirror that is coated with fundamental frequency light transmission rate 4%~10% and frequency doubled light total transmissivity rete simultaneously, when determining pump power, can obtain the double-frequency laser output of maximum conversion efficiency.
(4) the laser output mode is good, light power stabilising.
(5) compare with existing interior carving equipment, carving speed has improved more than 10 times, therefore, can utilize large format xy workbench, at high speed large tracts of land simple glass, quartzy quartz and other transparent class materials is carried out the inside engraving.
Description of drawings
Fig. 1 is the structural representation of an embodiment of the present invention.
Fig. 2 is the structural representation of a kind of embodiment of laser instrument among Fig. 1.
Fig. 3 is the structural representation of the another kind of embodiment of laser instrument among Fig. 1.
The specific embodiment
As shown in Figure 1, the inner engraving equipment of a kind of transparent material laser comprises laser instrument 1, beam expanding lens 2, first beam-deflecting mirror 3, second beam-deflecting mirror 4, focus lamp 5 and computer 6.
Laser instrument 1 produces the q-multiplier laser pulse of 1~10 KHz, good beam quality;
Beam expanding lens 2 enlarges the lasing beam diameter of laser instrument 1 output, and angle of divergence compression is dwindled the spot diameter after laser beam focuses on by focus lamp 5, obtains little focal beam spot;
First beam-deflecting mirror 3 is installed on the x axle of xy workbench 7, and mirror surface is parallel to the z axle, perpendicular to the xy plane, is 45 degree with the angle of x axle and y axle, will be deflected into the laser beam that is parallel to the y axle through the laser beam that is parallel to the x axle behind the beam expanding lens 2;
Second beam-deflecting mirror 4 is installed on the y axle of xy workbench 7, mirror surface is parallel to the x axle, perpendicular to the yz plane, be 45 degree with the angle of y axle and z axle, will be deflected into the laser beam that is parallel to the z axle through the laser beam that is parallel to the y axle behind first beam-deflecting mirror 3;
The optical axis of focus lamp 5 is parallel to the z axle, and is installed on the y axle of xy workbench 7 with the automatically controlled displacement platform 8 of one dimension, and focus lamp 5 is by the motion on xy and three directions of z, and the laser beam that will be parallel to the z axle focuses in the transparent material on the laser work platform;
Computer 6 control xy workbench 7, realize that first beam-deflecting mirror 3 is in the motion on the x direction, second beam-deflecting mirror 4 and the motion of focus lamp 5 on x, y direction, the automatically controlled displacement platform 8 of control one dimension, realize focus lamp 5 or the motion of transparent material on the z direction, carry out the three-dimensional engraving of transparent material laser inside.
By shown in Figure 2, laser instrument 1 can comprise total reflective mirror 9, A-O Q-switch device 10 and power supply 14 thereof, semiconductor pumping module 11, frequency-doubling crystal 12, outgoing mirror 13.Total reflective mirror 9, outgoing mirror 13 constitute laserresonator with semiconductor pumping module 11, power supply 14 joins with A-O Q-switch device 10, A-O Q-switch device 10 places between total reflective mirror 9 and the semiconductor pumping module 11, frequency-doubling crystal 12 places between semiconductor pumping module 11 and the outgoing mirror 13, total reflective mirror 9 is coated with fundamental frequency light all-trans film, perhaps is coated with fundamental frequency light and the frequency doubled light anti-rete of enjoying a double blessing simultaneously.It is 4%~10% and to the rete of frequency doubled light full impregnated that outgoing mirror 13 is coated with fundamental frequency light transmission rate scope simultaneously.Frequency-doubling crystal 12 can be crystal such as KTP, BBO.Semiconductor pumping module 11 comprises semiconductor pumping sources and laser crystal, it and total reflective mirror 9, outgoing mirror 13 constitute basic laserresonator, the laser output of vibrating between total reflective mirror 9, A-O Q-switch device 10, semiconductor pumping module 11, frequency-doubling crystal 12 and outgoing mirror 13 produces frequency doubled light.The driving frequency that power supply 14 is regulated A-O Q-switch device 10 produces the output of 1~10 KHz q-multiplier laser pulse at 1~10 KHz.
Laserresonator of the present invention does not use the outgoing mirror that is coated with fundamental frequency light total reflection and frequency doubled light total transmissivity film, but according to continuous wave laser under a certain pump power condition, outgoing mirror has the principle of optimum transmission, the shg efficiency of nonlinear crystal in the resonator etc. is all the part of outgoing mirror transmitance, design the transmitance of the outgoing mirror fundamental frequency light when active resonant cavity gain coefficient and power dissipation optimal coupling operating point, operate in maximum light-light conversion efficiency scope to guarantee continuous wave laser.At this moment, the power of frequency doubled light also reaches maximum.
The triggering signal that computer 6 produces according to engraving pattern, the opening and closing of control A-O Q-switch device power supply 14, thus the duty of control A-O Q-switch device 10 can make resonator be in high loss or low-loss state, therefore, can control resonator and have or not laser output.
By shown in Figure 3, laser instrument 1 can comprise total reflective mirror 9, semiconductor pumping module 11, A-O Q-switch device 10 and power supply 14 thereof, frequency-doubling crystal 12, outgoing mirror 13, total reflective mirror 9, outgoing mirror 13 constitutes laserresonator with semiconductor pumping module 11, power supply 14 joins with A-O Q-switch device 10, A-O Q-switch device 10 places between semiconductor pumping module 11 and the outgoing mirror 13, frequency-doubling crystal 12 places between A-O Q-switch device 10 and the outgoing mirror 13, total reflective mirror 9 is coated with fundamental frequency light all-trans film, perhaps be coated with fundamental frequency light and the frequency doubled light anti-rete of enjoying a double blessing simultaneously, it is 4%~10% and to the rete of frequency doubled light full impregnated that outgoing mirror 13 is coated with the fundamental frequency light transmission rate simultaneously, the driving frequency that power supply 14 is regulated A-O Q-switch device 10 produces the output of 1~10 KHz q-multiplier laser pulse.

Claims (1)

1. the inner engraving equipment of transparent material laser comprises laser instrument (1), beam expanding lens (2), first beam-deflecting mirror (3), second beam-deflecting mirror (4), focus lamp (5) and computer (6); Beam expanding lens (2) enlarges the lasing beam diameter of laser instrument (1) output, angle of divergence compression, the spot diameter that laser beam is passed through after focus lamp (5) focuses on dwindles, obtain little focal beam spot: first beam-deflecting mirror (3) is installed on the x axle of xy workbench (7), will be deflected into the laser beam that is parallel to the y axle through the laser beam that is parallel to the x axle behind the beam expanding lens (2); Second beam-deflecting mirror (4) is installed on the y axle of xy workbench (7), and the laser beam of the above-mentioned y of being parallel to axle is deflected into the laser beam that is parallel to the z axle; The optical axis of focus lamp (5) is parallel to the z axle, and is installed on the y axle of xy workbench (7) with the automatically controlled displacement platform of one dimension (8), and the laser beam of the above-mentioned z of being parallel to axle is focused in the transparent material; Computer (6) control xy workbench (7) is realized the motion of first beam-deflecting mirror (3) on the x direction, second beam-deflecting mirror (4) and the motion of focus lamp (5) on x, y direction;
It is characterized in that:
Laser instrument (1) comprises total reflective mirror (9), A-O Q-switch device (10) and power supply (14) thereof, semiconductor pumping module (11), frequency-doubling crystal (12), outgoing mirror (13), total reflective mirror (9), outgoing mirror (13) constitutes laserresonator with semiconductor pumping module (11), power supply (14) joins with A-O Q-switch device (10), A-O Q-switch device (10) places between total reflective mirror (9) and the semiconductor pumping module (11), frequency-doubling crystal (12) places between semiconductor pumping module (11) and the outgoing mirror (13), or A-O Q-switch device (10) places between semiconductor pumping module (11) and the outgoing mirror (13), frequency-doubling crystal (12) places between A-O Q-switch device (10) and the outgoing mirror (13), total reflective mirror (9) is coated with fundamental frequency light all-trans film, perhaps be coated with fundamental frequency light and the frequency doubled light anti-rete of enjoying a double blessing simultaneously, it is 4%~10% and to the rete of frequency doubled light full impregnated that outgoing mirror (13) is coated with the fundamental frequency light transmission rate simultaneously, power supply (14) is regulated the driving frequency of A-O Q-switch device (10), produces the output of 1~10 KHz q-multiplier laser pulse;
Computer (6) the control automatically controlled displacement platform of one dimension (8) is realized condenser lens (5) or the motion of transparent material on the z direction.
CNB2004100134159A 2004-07-04 2004-07-04 Laser internal engraving equipment for transparent material Expired - Fee Related CN100366444C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2004100134159A CN100366444C (en) 2004-07-04 2004-07-04 Laser internal engraving equipment for transparent material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2004100134159A CN100366444C (en) 2004-07-04 2004-07-04 Laser internal engraving equipment for transparent material

Publications (2)

Publication Number Publication Date
CN1593942A CN1593942A (en) 2005-03-16
CN100366444C true CN100366444C (en) 2008-02-06

Family

ID=34662962

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100134159A Expired - Fee Related CN100366444C (en) 2004-07-04 2004-07-04 Laser internal engraving equipment for transparent material

Country Status (1)

Country Link
CN (1) CN100366444C (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101152819B (en) * 2006-09-28 2010-07-21 深圳市大族激光科技股份有限公司 Device with internal laser carving
CN106112271B (en) * 2016-08-22 2017-08-25 首都师范大学 A kind of Multifunctional laser engraving machine system and engraving process
CN107378254A (en) * 2017-06-06 2017-11-24 北京莱泽光电技术有限公司 Multiwavelength laser marking device and multiwavelength laser marking method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278852A (en) * 1990-10-11 1994-01-11 Kigre, Inc. Intra-cavity high order harmonic laser
CN2178642Y (en) * 1993-12-23 1994-10-05 孟广君 Seal carving machine with gas laser
CN1256211A (en) * 1998-12-07 2000-06-14 大连星山电器有限公司 Application equipment and technology for laser carved picture and writing
CN2723224Y (en) * 2004-07-04 2005-09-07 华中科技大学 Laser internal carving device for transparent material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278852A (en) * 1990-10-11 1994-01-11 Kigre, Inc. Intra-cavity high order harmonic laser
CN2178642Y (en) * 1993-12-23 1994-10-05 孟广君 Seal carving machine with gas laser
CN1256211A (en) * 1998-12-07 2000-06-14 大连星山电器有限公司 Application equipment and technology for laser carved picture and writing
CN2723224Y (en) * 2004-07-04 2005-09-07 华中科技大学 Laser internal carving device for transparent material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
二极管侧面泵浦倍频固体激光技术研究. 赵鸿.中国科学院博士学位研究生学位论文. 2001 *

Also Published As

Publication number Publication date
CN1593942A (en) 2005-03-16

Similar Documents

Publication Publication Date Title
CN100352673C (en) Laser internal engraving apparatus for transparent material
US7088749B2 (en) Green welding laser
CN101554683A (en) Laser oscillator and laser processing apparatus
CN1402390A (en) High-efficiency high power third harmonic wave laser generating technique
CN1161866C (en) Optically parametric oscillator
CN104617474A (en) Resonant cavity for pulse and line selection output of airflow hydrogen fluoride laser
JP5657139B2 (en) CO2 laser device and CO2 laser processing device
CN110277726B (en) Acousto-optic Q-switched ultraviolet laser
CN100366444C (en) Laser internal engraving equipment for transparent material
CN1635670A (en) Laser diode pumping full-solid ultraviolet pulse laser
CN2714340Y (en) Laser internal engraving apparatus for transparent material
CN210379761U (en) Laser with high beam quality
CN2723224Y (en) Laser internal carving device for transparent material
KR970005166B1 (en) Equipment and method oscillating raman laser using stimulated raman scattering
US6980574B1 (en) Short pulse separation laser
CN104659648B (en) Neodymium-doped barium silicate is from frequency multiplication ultrashort pulse laser
JPH1152443A (en) Laser beam generating device
CN108767634A (en) A kind of subnanosecond green (light) laser
CN2902760Y (en) Crystal laser internal carving machine
CN101100019A (en) Solar energy silicon wafer double laser beams double-line groove-scribing method and device
CN207442180U (en) A kind of single pump ultraviolet laser
CN101764347B (en) Acousto-optic modulation laser
JP2008010720A (en) Fiber laser device
CN103368052A (en) Wide-frequency-band and high-power single frequency pulse solid-state laser of LD end pump
CN216289477U (en) Double-resonant-cavity laser with freely switchable output wavelength

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080206

Termination date: 20130704