CN100365882C - Negative high-voltage electronic striking sparks balling apparatus - Google Patents
Negative high-voltage electronic striking sparks balling apparatus Download PDFInfo
- Publication number
- CN100365882C CN100365882C CNB2005102006412A CN200510200641A CN100365882C CN 100365882 C CN100365882 C CN 100365882C CN B2005102006412 A CNB2005102006412 A CN B2005102006412A CN 200510200641 A CN200510200641 A CN 200510200641A CN 100365882 C CN100365882 C CN 100365882C
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- Prior art keywords
- control circuit
- circuit
- voltage
- current
- signal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005102006412A CN100365882C (en) | 2005-10-24 | 2005-10-24 | Negative high-voltage electronic striking sparks balling apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005102006412A CN100365882C (en) | 2005-10-24 | 2005-10-24 | Negative high-voltage electronic striking sparks balling apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1773786A CN1773786A (en) | 2006-05-17 |
CN100365882C true CN100365882C (en) | 2008-01-30 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2005102006412A Expired - Fee Related CN100365882C (en) | 2005-10-24 | 2005-10-24 | Negative high-voltage electronic striking sparks balling apparatus |
Country Status (1)
Country | Link |
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CN (1) | CN100365882C (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI562252B (en) * | 2014-02-17 | 2016-12-11 | Shinkawa Kk | Detecting discharging device, wire bonding device and detecting discharging method |
CN108614484A (en) * | 2018-05-11 | 2018-10-02 | 大族激光科技产业集团股份有限公司 | A kind of electric current burns the control method and its burning ball control system of ball |
CN111715976B (en) * | 2019-03-18 | 2024-04-26 | 深圳市德沃先进自动化有限公司 | LED wire bonding machine |
CN114643394A (en) * | 2022-05-19 | 2022-06-21 | 深圳市大族封测科技股份有限公司 | Ball welding current control method, controller and EFO system |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5773780A (en) * | 1993-11-16 | 1998-06-30 | Formfactor, Inc. | Method of severing bond wires and forming balls at their ends |
US6065667A (en) * | 1997-01-15 | 2000-05-23 | National Semiconductor Corporation | Method and apparatus for fine pitch wire bonding |
US6898849B2 (en) * | 2000-09-27 | 2005-05-31 | Texas Instruments Incorporated | Method for controlling wire balls in electronic bonding |
CN1667892A (en) * | 2004-03-09 | 2005-09-14 | 库力索法投资公司 | Wire bonding apparatus having actuated flame-off wand |
-
2005
- 2005-10-24 CN CNB2005102006412A patent/CN100365882C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5773780A (en) * | 1993-11-16 | 1998-06-30 | Formfactor, Inc. | Method of severing bond wires and forming balls at their ends |
US6065667A (en) * | 1997-01-15 | 2000-05-23 | National Semiconductor Corporation | Method and apparatus for fine pitch wire bonding |
US6898849B2 (en) * | 2000-09-27 | 2005-05-31 | Texas Instruments Incorporated | Method for controlling wire balls in electronic bonding |
CN1667892A (en) * | 2004-03-09 | 2005-09-14 | 库力索法投资公司 | Wire bonding apparatus having actuated flame-off wand |
US20050199677A1 (en) * | 2004-03-09 | 2005-09-15 | Kulicke And Soffa Industries Inc. | Wire bonding apparatus having actuated flame-off wand |
Non-Patent Citations (3)
Title |
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A New Approach Air Ball Formation Process ParametersAnalysis. Jau-Liang Chen,Yeh-Chao Lin.IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,Vol.23 No.2. 2000 * |
Moldelling of Free Air Ball for Copper Wire Bonding. Jonathan Tan,Boon Hoe Toh and Hong Meng Ho.Electronics Packaging Technology Conference. 2004 * |
引线键合技术的现状和发展趋势. 何田.电子工业专用设备,第117期. 2004 * |
Also Published As
Publication number | Publication date |
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CN1773786A (en) | 2006-05-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: CETC Beijing Electronic Equipment Co., Ltd. Assignor: No.45 Inst., China Electronic science and Technology Group Corp. Contract fulfillment period: 2007.3.1 to 2014.12.29 contract change Contract record no.: 2009990000523 Denomination of invention: Negative high-voltage electronic striking sparks balling apparatus Granted publication date: 20080130 License type: Exclusive license Record date: 2009.5.18 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.3.1 TO 2014.12.29; CHANGE OF CONTRACT Name of requester: BEIJING ZHONGDIAN SCIENCE ELECTRONIC EQUIPMENT CO. Effective date: 20090518 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080130 Termination date: 20141024 |
|
EXPY | Termination of patent right or utility model |