CN100361319C - Manufacturing method of lead frame and optical coupling device using this lead frame - Google Patents

Manufacturing method of lead frame and optical coupling device using this lead frame Download PDF

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Publication number
CN100361319C
CN100361319C CNB2004100900942A CN200410090094A CN100361319C CN 100361319 C CN100361319 C CN 100361319C CN B2004100900942 A CNB2004100900942 A CN B2004100900942A CN 200410090094 A CN200410090094 A CN 200410090094A CN 100361319 C CN100361319 C CN 100361319C
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China
Prior art keywords
lead frame
light
manufacture method
connecting rod
curb girder
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Expired - Fee Related
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CNB2004100900942A
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Chinese (zh)
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CN1612362A (en
Inventor
高仓英也
楠田一夫
小路弘之
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Sharp Corp
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Sharp Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
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    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01038—Strontium [Sr]
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5104—Type of machine
    • Y10T29/5109—Lathe
    • Y10T29/5111—Pulley or wheel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Led Device Packages (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

In a manufacturing method of a lead frame for an optical coupling device, the method includes the steps of preparing an elongated lead frame and placing a plurality of tie bars between a pair of mutually parallel side rails on the lead frame to orthogonally cross the bars, interlacing a plurality of lead terminals in a manner vertically crossing those tie bars, and laterally cutting the elongated lead frame to prepare a plurality of strap-shaped lead frames. Herein, the elongated lead frame is cut in such a manner that the length of protrusion of a cut end of each of the side rails from each of the tie bars is made longer than the length of protrusion of a lead terminal from each of the tie bars.

Description

Lead frame and manufacture method thereof, the Light Coupled Device of using it and manufacture method thereof
Technical field
The present invention relates to the method for the lead frame of the Light Coupled Device (for example photoelectrical coupler) that a kind of manufacturing is applicable to the electronic equipment such as (especially) TV and mobile phone, a kind of lead frame and a kind of manufacture method of making according to the method for using the Light Coupled Device of this lead frame.
Background technology
The structure of the Light Coupled Device that accompanying drawing 1 expression is traditional, accompanying drawing 2 expressions are used for the lead frame of this Light Coupled Device.This Light Coupled Device is by using the manufacturing of this lead frame, and is as described below.
With light-emitting component 1 and light receiving element 2 respectively chips welding (bonding) to lead frame 3 and another lead frame 3 ' on.Lead frame 3 and 3 ' be provided with a head separately, element is installed on this head.Then, carry out wire-bonded respectively in the above and handle, light-emitting component 1 and light receiving element 2 are connected respectively on the outside lead by gold thread 4.Use silicones that light-emitting component 1 is carried out coating processing then, to alleviate the effect of stress.
Then, with two lead frames 3 and 3 ' placement face-to-face, the optical axis of light-emitting component 1 and light receiving element 2 is overlapped each other.Use light penetrating ring epoxy resins 6 that it is carried out preliminary forming processes then, use shade epoxy resins 7 that its whole part of having passed through preliminary forming processes is carried out transfer mo(u)lding afterwards and handle, that is, post forming is handled.
Then resulting product is carried out various processing, such as outside coating handle, lead-in wire form handle that (outside lead processing) is handled, dielectric voltage withstand test (preliminary moulding is tested with the insulation property between the secondary moulding), electrical characteristics test (various different electrical characteristics are measured), mark processing, visual examination and encapsulation process; Like this, prepared a finished product.
With regard to the means of forming processes, except transfer mo(u)lding above-mentioned is handled, also can use the technology such as casting processing and moldings formed therefrom processing.
And, as shown in Figure 3, in the preliminary forming processes of mentioning, can use another kind of method in the above, this method is not used light penetrating ring epoxy resins 6, and is to use transparent silicon resin 8 to form path between light-emitting component 1 and the light receiving element 2.
The example of some prior aries relevant with the lead frame that is used for Light Coupled Device is disclosed in JP-A Hei 06 (1994)-237010, JP-A Hei 06 (1994)-350128 and JP-A Hei06 (1994)-132561.
The work flow and the line frame graph of the Light Coupled Device that accompanying drawing 4 expressions are traditional, comprise that handling stacked processing, preliminary forming processes, secondary forming processes, the processing of outside coating and lead-in wire from the chips welding of light-emitting component and light receiving element forms processing, until encapsulation process, finally make each treatment step of finished product.
And, the processing method of the lead frame that accompanying drawing 5 expressions are traditional.
At first, the metal material (Cu material or Fe material etc.) that preparation is wound in coil uses the stamped metal mould that it is carried out punching press then, to form component mounting head portion.Afterwards, head part and line joint second portion are carried out the coating processing, then that the head part is crooked, and cut into fillet with designated length.
In general, processing technology is with in sequence above-mentioned; But, also can after at first having carried out the coating processing, carry out the technology such as punching press, bending and the cutting process of fillet shape again, perhaps also can be according to handling such as punching press, bending, coating and the such order of fillet shape cutting.
When using the lead frame that obtains as described above, need a lead frame and the lead frame that light receiving element is installed that light-emitting component is installed, and, therefore needing independently transfer system (seeing the line construction schematic diagram of accompanying drawing 4) on the light-emitting component end and on the light receiving element end respectively owing to need respectively these elements to be carried out chips welding and line joint.
For this reason, on production line, need the installing space of broad, cause the cost of facility higher.And, with regard to the lead frame processing technology, owing on light-emitting component end and light receiving element end, need two lead frames, therefore need two moulds (finishing mould) that are used to process lead frame, caused higher while material of lead frame processing cost and die cost higher.
In recent years, the price competition of electronic devices and components is more and more fierce, and corresponding to this situation, except reducing the variable cost such as material cost, must reduce such as the such fixed cost of device service cost.In addition, the countermeasure that is proposed is efficient materials used (reducing every electronic devices and components material cost), reduces equipment cost and reduce equipment cost by the simplified apparatus structure by equipment is improved.
Recently, developed a kind of Plane Installation optical coupling element, wherein light-emitting component and light receiving element are formed integrally as a part and flat being installed on the lead frame.
But, Plane Installation optical coupling element although it is so has the advantage that has reduced lead frame price and the required cost of transfer system equipment, but because the restriction of processing technology, its structure causes lead deformation easily in the cutting lead frame.
Summary of the invention
Therefore an object of the present invention is to provide a kind of lead frame manufacture method, the waste of material when this method can reduce manufacturing cost, is difficult for causing lead-in wire to deform and can prevents the cutting of fillet shape in the cutting lead frame; A kind of lead frame of making according to the method; With a kind of manufacture method of using the Light Coupled Device of this lead frame.
According to one aspect of the present invention, a kind of manufacture method that is used for the lead frame of Light Coupled Device is provided, comprise step: prepare a strip lead frame, on this lead frame, a plurality of connecting rods are arranged between a pair of curb girder, described a pair of curb girder is parallel each other, intersects with described connecting rod quadrature, and a plurality of lead terminals are arranged with staggered form and intersected with described connecting rod quadrature; With the described strip lead frame of transverse cuts, to prepare a plurality of fillet shape lead frames, wherein, described strip lead frame cuts in the following manner: make that the crop of each described curb girder is longer from the length that each described connecting rod protrudes than lead terminal from the length that each described connecting rod protrudes.
According to this manufacture method,, therefore can reduce manufacturing cost because light-emitting component and light receiving element are to be formed integrally as a part and flat being installed on the lead frame.In addition, because the strip lead frame makes that when cutting the crop of each described curb girder is longer from the length that each described connecting rod protrudes than lead terminal from the length that each described connecting rod protrudes, lead deformation when therefore this structure is not easy to cause the lead frame cutting, and the waste of material can prevent the cutting of fillet shape the time.
Description of drawings
Accompanying drawing 1 is the structural representation of traditional Light Coupled Device;
Accompanying drawing 2 is schematic diagrames of lead frame of the Light Coupled Device of accompanying drawing 1;
Accompanying drawing 3 is structural representations of another kind of traditional Light Coupled Device;
Accompanying drawing 4 is the manufacturing flow chart of traditional Light Coupled Device and the block diagram of line construction;
Accompanying drawing 5 is schematic diagrames of the processing technology of conventional wire frame;
Accompanying drawing 6 is the schematic diagrames according to the fillet shape cutting technique of the lead frame that is used for the Plane Installation Light Coupled Device of first embodiment of the invention, and Fig. 6 A is the schematic diagram before the lead frame cutting, and Fig. 6 B is the schematic diagram after the lead frame cutting;
Accompanying drawing 7 is the schematic diagrames according to the fillet shape cutting technique of the lead frame that is used for the Plane Installation optical coupling element of second embodiment of the invention, and Fig. 7 A is the schematic diagram before the lead frame cutting, and Fig. 7 B is the schematic diagram after the lead frame cutting;
Accompanying drawing 8 is the schematic diagrames according to the fillet shape cutting technique of the lead frame that is used for the Plane Installation optical coupling element of third embodiment of the invention, Fig. 8 A is the schematic diagram before the lead frame cutting, Fig. 8 B is the schematic diagram after the lead frame cutting, and Fig. 8 C is the enlarged diagram of connecting rod and curb girder coupling part;
Accompanying drawing 9 is the schematic diagrames according to the beam mode of the lead frame that is used for the Plane Installation optical coupling element of four embodiment of the invention, and Fig. 9 A is the schematic diagram before the lead frame bending, and Fig. 9 B is the schematic diagram after the lead frame bending;
Accompanying drawing 10 is the schematic diagrames according to the beam mode of the lead frame that is used for the Plane Installation optical coupling element of fifth embodiment of the invention, and Figure 10 A is the schematic diagram before the lead frame bending, and Figure 10 B is the schematic diagram after the lead frame bending;
Accompanying drawing 11 is the schematic diagrames according to the beam mode of the lead frame that is used for the Plane Installation optical coupling element of sixth embodiment of the invention, and Figure 11 A is the schematic diagram before the lead frame bending, and Figure 11 B is the schematic diagram after the lead frame bending.
Embodiment
In manufacture method according to one aspect of the present invention, best, also in such a manner the lead frame of strip is cut: make the plan view shape of the curb girder crop that will face with each other after the cutting differ from one another.
Under the situation of by this way lead frame of strip being cut, owing to make the plan view shape of two crops (for example left and right sides crop) of each curb girder differ from one another, therefore can determine fillet shape lead frame towards (for example, right side and left side), thus definite processing of direction is easy to carry out.
In manufacture method according to one aspect of the present invention, best, also in such a manner the lead frame of strip is cut: make that the plan view shape of a crop of one of curb girder is different with the plan view shape of the corresponding crop of another curb girder.
By cut the lead frame of strip according to the top mode of introducing, because the plan view shape of two crops about making in a pair of curb girder of a pair of curb girder or front and back differs from one another, therefore can identify the upper and lower sides or the front and back side of fillet shape lead frame, thereby definite processing of direction is easy to carry out.
In manufacture method according to one aspect of the present invention, best, also in such a manner the lead frame of strip is cut: make that the width of the interlinking lever end that is connected with each curb girder is bigger than the width of these connecting rod other parts.
Under the situation of in this manner lead frame of strip being cut, owing to make at the connecting rod strength at place, curb girder end greatly than the intensity of its other parts, therefore this structure is difficult for taking place rod deformation, thereby and is difficult for the generation lead deformation.
According to another aspect of the present invention, a kind of fillet shape lead frame is provided, this lead frame is to form by the lead frame that cuts a strip according to the manufacture method of described one aspect of the present invention.
According to such strip lead frame,, therefore can reduce manufacturing cost because light-emitting component and light receiving element are formed integrally as a part and flat being installed on the lead frame.In addition, because the lead frame of strip cuts according to a kind of like this mode: make that the crop of each curb girder is longer from the length that connecting rod protrudes than lead terminal from the length that connecting rod protrudes, therefore this structure is difficult for lead deformation takes place, and can prevent the waste that material uses.
According to the 3rd aspect of the present invention, a kind of manufacture method of Light Coupled Device is provided, comprise step: on according to the fillet shape lead frame of another aspect of the present invention, a semiconductor element is installed; With the use resin gained result is sealed.
According to this manufacture method,, therefore can reduce manufacturing cost because light-emitting component and light receiving element are formed integrally as a part and flat being installed on the lead frame.In addition, because the lead frame of strip cuts in such a way: make that the crop of each curb girder is longer from the length that connecting rod protrudes than lead terminal from the length that connecting rod protrudes, therefore this structure is difficult for lead deformation takes place, and can prevent the waste that material uses.
According to the 4th aspect of the present invention, a kind of manufacture method of Light Coupled Device is provided, comprise step: on according to the fillet shape lead frame of another aspect of the present invention, a light-emitting component and a light receiving element are installed; The end that the lead frame of light-emitting component and light receiving element is installed is bent to the obtuse angle from upper surface side towards lower face side; Use resin that light-emitting component and light receiving element are sealed.
According to this manufacture method,, therefore can reduce manufacturing cost because light-emitting component and light receiving element are formed integrally as a part and flat being installed on the lead frame.In addition, because the lead frame of strip cuts in such a way: make that the crop of each curb girder is longer from the length that connecting rod protrudes than lead terminal from the length that connecting rod protrudes, therefore this structure is difficult for lead deformation takes place, and can prevent the waste that material uses.And, because the end of lead frame has been bent to the obtuse angle from upper surface side towards lower face side, therefore when carrying out preliminary forming processes, be easy to make lead-in wire crooked.
In according to the manufacture method aspect the 4th of the present invention, best, will carry out along it forming a groove on crooked part at lead frame in advance, thereby make the thinner thickness of lead frame at this part place.
By being pre-formed such groove, can be in preliminary forming processes bending lead frame more easily.
In according to the manufacture method aspect the 4th of the present invention, best, lead frame and coupled connecting rod are carried out bending together.
By in this manner connecting rod being carried out bending, can engage formation bending evenly on second side in head side and line, thereby can make the element connecting line be difficult for deforming.
In according to the manufacture method aspect the 4th of the present invention, best, resin-sealed processing is carried out in such a way: use silicones that light-emitting component, light receiving element and element connecting line are integrally sealed.
By this encapsulation process,, therefore can alleviate the stress that acts on the line because whole line partly is by as the silicone-coated of resinizing in advance.
According to the present invention, can access a kind of like this lead frame: the waste of material when this lead frame can reduce manufacturing cost, is difficult for that when lead frame is cut lead deformation takes place and can prevents to carry out the cutting of fillet shape; And can access a kind of Light Coupled Device of using such lead frame.
Provide preferred implementation of the present invention now with reference to accompanying drawing.
First execution mode
Accompanying drawing 6 is expression schematic diagrames according to the manufacturing process of the lead frame that is used for the Plane Installation Light Coupled Device of first execution mode of the present invention.Fig. 6 A is the schematic diagram before the lead frame cutting, and Fig. 6 B is the schematic diagram after the lead frame cutting.
Under the situation of the strip lead frame shown in the accompanying drawing 6A being cut apart the fillet shape lead frame shown in (cutting) one-tenth accompanying drawing 6B, this strip lead frame is cutting like this: make each longer from the length that connecting rod protrudes than lead terminal from the length that connecting rod protrudes to the crop of front and back curb girder.By this structure, make that the crop of each curb girder is longer than the length of lead terminal from the length that connecting rod protrudes; Therefore, lead terminal has been subjected to the protection of the curb girder of protrusion, thereby is difficult for deforming.
And, the lead frame of strip has been carried out such cutting: make the plan view shape of left and right sides crop of cutting back curb girder respect to one another differ from one another; Therefore, can distinguish out the left and right sides of fillet shape lead frame, so that travel direction is determined to handle at an easy rate.
In this manner, during the cutting lead frame, the part that is not cut.By changing the shape of each curb girder cutting part, needn't cut away the two row ends (correspondence is 20 in Fig. 6) of each patch bay in two patch bays again.
Second execution mode
Accompanying drawing 7 is expression schematic diagrames according to the manufacturing process of the lead frame that is used for the Plane Installation optical coupling element of second execution mode of the present invention.Fig. 7 A is the schematic diagram before the lead frame cutting, and Fig. 7 B is the schematic diagram after the lead frame cutting.
Except the scheme of first kind of execution mode, in this embodiment, the strip lead frame has been carried out the cutting of this mode: make curb girder one of the plan view shape of corresponding crop of the plan view shape of crop of (front side) and another curb girder (rear side) differ from one another.Therefore, can distinguish out the left and right sides and the both sides, front and back of fillet shape lead frame, determine, and can easily carry out front/rear direction and determine thereby not only can easily carry out a left side/right.
In this manner, during the cutting lead frame, the part that is not cut.By changing the shape of each curb girder cutting part, needn't cut away the two row ends (corresponding 20 in the drawings) of each patch bay in two patch bays again.And, because therefore the cutting profile difference of upper and lower, left and right, is easy to travel direction and determines to handle.
The 3rd execution mode
Accompanying drawing 8 is expression schematic diagrames according to the manufacturing process of the lead frame that is used for the Plane Installation optical coupling element of the 3rd execution mode of the present invention.Fig. 8 A is the schematic diagram before the lead frame cutting, and Fig. 8 B is the schematic diagram after the lead frame cutting, and Fig. 8 C is the enlarged diagram of connecting rod and curb girder coupling part.
In this embodiment, the end width of the connecting rod (master connecting-rod) that will be connected with each curb girder is made widelyer than the width of the other parts of this connecting rod, promptly, as as shown in the accompanying drawing 8C, the strip lead frame is carried out such cutting: make curb girder coupling part (bottom) broad of connecting rod.
By this structure, it is bigger than the intensity of other parts that the intensity of interlinking lever end becomes, thereby can make connecting rod be difficult for deforming, thereby and make lead-in wire be difficult for deforming.
The 4th execution mode
Accompanying drawing 9 is expression detail view according to the manufacturing process of the lead frame that is used for the Plane Installation optical coupling element of the 4th execution mode of the present invention.Fig. 9 A is the schematic diagram before the lead frame bending, and Fig. 9 B is the schematic diagram after the lead frame bending.
In this embodiment, the end of lead frame that light-emitting component and light receiving element be installed on it from upper surface side before lower face side bends to the obtuse angle, to carry out being pre-formed the groove that cross section is V-arrangement or U-shaped on the crooked appropriate section (upper surface or lower surface) at lead frame.By this structure, make the lead frame thinner thickness at appropriate section place, thereby the lead-in wire bending process when making first one-step forming is more prone to carry out.
The 5th execution mode
Accompanying drawing 10 is expression schematic diagrames according to the beam mode of the lead frame that is used for the Plane Installation optical coupling element of the 5th execution mode of the present invention.Figure 10 A is the schematic diagram before the lead frame bending, and Figure 10 B is the schematic diagram after the lead frame bending.
In this embodiment, lead frame is crooked with the connecting rod that connects in the above.Under the crooked by this way situation of lead frame, can head side and line engage evenly form on second side crooked, thereby can make the element connecting line be difficult for deforming.
The 6th execution mode
Accompanying drawing 11 is expression schematic diagrames according to the beam mode of the lead frame that is used for the Plane Installation optical coupling element of the 6th execution mode of the present invention.Figure 11 A is the schematic diagram before the lead frame bending, and Figure 11 B is the schematic diagram after the lead frame bending.
In this embodiment, light-emitting component, light receiving element and element connecting line (gold thread) are to use the silicones integral sealing.By this encapsulation process, because all being used as the silicones of resinizing in advance, whole line part applies, therefore can alleviate the stress that acts on the line.

Claims (10)

1. manufacture method that is used for the lead frame of Light Coupled Device comprises step:
Preparation strip lead frame, on this lead frame, a plurality of connecting rods are arranged between a pair of curb girder, and described a pair of curb girder is parallel each other, intersects with described connecting rod quadrature, and a plurality of lead terminals are arranged with staggered form and are intersected with described connecting rod quadrature; With
The described strip lead frame of transverse cuts, to prepare a plurality of fillet shape lead frames, wherein,
Described strip lead frame cuts in the following manner: make that the crop of each described curb girder is longer from the length that each described connecting rod protrudes than lead terminal from the length that each described connecting rod protrudes.
2. according to the described manufacture method of claim 1, wherein, also in the following manner described strip lead frame is cut: the plan view shape of described curb girder crop respect to one another differs from one another after the feasible cutting.
3. according to the described manufacture method of claim 1, wherein, also in the following manner described strip lead frame is cut: make that the plan view shape of crop of one of described curb girder is different with the plan view shape of the corresponding crop of another curb girder.
4. according to the described manufacture method of claim 1, wherein, also in the following manner described strip lead frame is cut: make that the width of the end that connecting rod links to each other with each curb girder is wideer than the width of the other parts of this connecting rod.
5. fillet shape lead frame, this lead frame forms by according to any one described manufacture method in the claim 1 to 4 the strip lead frame being cut.
6. the manufacture method of a Light Coupled Device comprises step:
On the described fillet shape lead frame semiconductor element is being installed according to claim 5; With
Use resin that resulting structure is sealed.
7. the manufacture method of a Light Coupled Device comprises step:
Light-emitting component and light receiving element are installed on the described fillet shape lead frame according to claim 5;
The end that the described lead frame of light-emitting component and light receiving element is installed on it is bent to the obtuse angle from upper surface side towards lower face side; With
Use resin that described light-emitting component and light receiving element are sealed.
8. according to the described manufacture method of claim 7, wherein, to carry out being pre-formed groove on the crooked part at described lead frame, make the thinner thickness of described lead frame at this part place.
9. according to the described manufacture method of claim 7, wherein, described lead frame is crooked together with the connecting rod that is connected in the above.
10. according to the described manufacture method of claim 7, wherein, described resin-sealed technology is carried out in the following manner: use silicones that described light-emitting component, light receiving element are connected described light-emitting component and light receiving element with one element connecting line is integrally sealed.
CNB2004100900942A 2003-10-30 2004-11-01 Manufacturing method of lead frame and optical coupling device using this lead frame Expired - Fee Related CN100361319C (en)

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TWI320228B (en) 2006-05-04 2010-02-01 A structure of a lead-frame matrix of photoelectron devices
CN101458366B (en) * 2007-12-13 2010-12-01 旭丽电子(广州)有限公司 Optical coupler wire guide frame band
JP2014135473A (en) * 2012-12-11 2014-07-24 Renesas Electronics Corp Optical coupling element

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CN1433074A (en) * 2002-01-15 2003-07-30 夏普公司 Semiconductor lead frame

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CN1612362A (en) 2005-05-04
JP2005136196A (en) 2005-05-26

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