CN100346331C - Chip bridging device for multiple chip socket type circuit board - Google Patents
Chip bridging device for multiple chip socket type circuit board Download PDFInfo
- Publication number
- CN100346331C CN100346331C CNB2004100965468A CN200410096546A CN100346331C CN 100346331 C CN100346331 C CN 100346331C CN B2004100965468 A CNB2004100965468 A CN B2004100965468A CN 200410096546 A CN200410096546 A CN 200410096546A CN 100346331 C CN100346331 C CN 100346331C
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- chip
- socket
- chip carrier
- circuit board
- electrical contact
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Abstract
The present invention relates to a chip bridging device for a multiple chip socket type circuit board, which at least comprises a frame, an electrical contact of a first combination, an electrical contact of a second contact and an electrical connection circuit of the combination. The present invention can be matched with a multiple chip socket type circuit board to be inserted on one of or a plurality of chip sockets, and a chip device inserted on the other chip socket is electrically connected with the chip device inserted on the other chip socket in a bridge connection mode. The chip bridging device for a multiple chip socket type circuit board makes the designer adopt the same kind of circuit board, and a multiprocessor type hardware platform which has processors with an arbitrary number can be designed and manufactured arbitrarily; users can make the multiprocessor type hardware platform which has the processors with the arbitrary number according to the users' own requirements, and the users do not need to respectively design and manufacture various circuit boards in view of the requirements of the processors with different numbers. Therefore, the manufacture cost can be helped to be lowered.
Description
Technical field
The invention relates to a kind of computer hardware technology, particularly about a kind of chip crossover assembly of multicore sheet socket type circuit board, can be applicable on the multicore sheet socket circuit plate, and the connection line between its chip carrier socket adopts specific bus structure, HT (Hyper Transport) type bus structure for example, this device is planted on wherein one or more chip carrier sockets, whereby with the chip of planting on the another one chip carrier socket, the processor chips of AMD (Advanced Micro Devices) for example, be electrically connected to the chip apparatus of planting on the other chip carrier socket in the cross-over connection mode, for example connectivity port (I/O Port) module chip is gone in another AMD processor chips or output again.
Background technology
In computer application, in order to strengthen data processing usefulness, there are many computer motherboards to adopt parallel processing technique at present, be provided with two or more processor chips.The computer motherboard of this multiprocessing type is owing to have a plurality of processor chips, and with the parallel mode deal with data, so data processing speed is far above traditional single-processor computers mainboard.
In the manufacturing of multiprocessor computer mainboard, because often there is different demands in market to the number of processor, therefore manufacturer just needs design and produces various multiprocessing type computer motherboard, for example comprises dual processor type, three processing types, four-processor type etc.; Just manufacturer needs to design a kind of circuit board at the dual processor type, handles type at three and designs another kind of circuit board, designs another kind of circuit board at the four-processor type again; The rest may be inferred.This practice obviously can increase the manufacturing cost of manufacturer.
Therefore allowing the user utilize with a kind of circuit board can arbitrarily design and produce the multiprocessing type hardware platform that can use the arbitrary number processor, become present problem demanding prompt solution.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, fundamental purpose of the present invention is to provide a kind of chip crossover assembly of multicore sheet socket type circuit board, can allow the user utilize with a kind of circuit board and can arbitrarily design and produce the multiprocessing type hardware platform with arbitrary number processor.
Another object of the present invention is to provide a kind of chip crossover assembly of multicore sheet socket type circuit board, can reduce the manufacturing cost of multiprocessor computer mainboard.
The chip crossover assembly of multicore sheet socket type circuit board of the present invention designs and is applied in the circuit board of chip carrier socket type at the most of arranging in pairs or groups, and the connection line between its chip carrier socket adopts specific bus structure, the bus structure of HT (Hyper Transport) type for example, be used for planting to wherein one or more chip carrier sockets, whereby with the chip apparatus of being planted on the another one chip carrier socket, for example be the processor chips of AMD (Advanced Micro Devices), being electrically connected to the chip apparatus of being planted on the other chip carrier socket in the cross-over connection mode, for example is that connectivity port (I/O Port) module chip is gone in another AMD processor chips or output again.
The chip crossover assembly of multicore sheet socket type circuit board of the present invention comprises at least: framework; The electrical contact of first combination, it is placed on this framework, and wherein each electrical contact corresponds to each the bar bus line between the 3rd chip carrier socket and this first chip carrier socket, is used to plug together to the 3rd chip carrier socket and has electrical contact to bus line between the 3rd chip carrier socket and this first chip carrier socket; The electrical contact of second combination, it is placed on this framework, and wherein each electrical contact corresponds to each the bar bus line between the 3rd chip carrier socket and this second chip carrier socket, is used to plug together to the 3rd chip carrier socket and has electrical contact to bus line between the 3rd chip carrier socket and this second chip carrier socket; And the electric connection circuit of a combination, it is placed on this framework, and it is that the electrical contact that is used for this first combination is electrically connected to this second electrical contact that makes up respectively.
The advantage of the chip crossover assembly of multicore sheet socket type circuit board of the present invention is to allow the user utilize the multiprocessing type hardware platform that can arbitrarily design and produce the processor with arbitrary number with a kind of circuit board, and do not need to design and make various different circuit board respectively at the demand of the processor of different numbers, therefore can assist to reduce manufacturing cost.
Description of drawings
Figure 1A is the application structure synoptic diagram, the chip crossover assembly that the shows multicore sheet socket type circuit board of the present invention structural form of chip carrier socket type circuit board at the most of arranging in pairs or groups;
Figure 1B is the application structure synoptic diagram, shows that the multicore sheet socket type circuit board shown in Figure 1A is used to realize the structural form of dual processor circuit board;
Fig. 2 A is a structural representation, shows the embodiment 1 of the chip crossover assembly of multicore sheet socket type circuit board of the present invention;
Fig. 2 B is a structural representation, shows the embodiment 2 of the chip crossover assembly of multicore sheet socket type circuit board of the present invention;
Fig. 3 is the application example synoptic diagram, shows that the chip crossover assembly of multicore sheet socket type circuit board of the present invention is applied in an application example making a four-processor type computer motherboard;
Fig. 4 is the application structure synoptic diagram, shows the dual processor hardware configuration of the chip crossover assembly realization of multicore sheet socket type circuit board of the present invention.
Embodiment
Embodiment
Below be conjunction with figs., describe the embodiment of the chip crossover assembly of multicore sheet socket type circuit board of the present invention in detail.
Figure 1A promptly shows the chip crossover assembly 100 of the multicore sheet socket type circuit board of the present invention basic application structure of chip carrier socket type circuit board 10 at the most of arranging in pairs or groups.As shown in the figure, must be provided with a plurality of chip carrier sockets on the multicore sheet socket type circuit board 10 that the present invention is suitable for, comprise that first chip carrier socket 11, second chip carrier socket 12, the 3rd chip carrier socket 13 and four-core sheet socket 14 (are the example explanation with 4 chip carrier sockets only in the embodiment shown in fig. 1; But on concrete the enforcement, the number of chip carrier socket is also unrestricted), the bus line 31,32,33 between these chip carrier sockets 11,12,13,14 must be to adopt a kind of specific bus structure, for example is HT (Hyper Transport) type bus structure.
In the practical application, being plugged with first chip apparatus 21 on first chip carrier socket 11 on the circuit board 10 of above-mentioned multicore sheet socket-type, for example is the processor chips that adopt the bus-structured AMD of HT type (Advanced Micro Devices); 13 of the 3rd chip carrier sockets are plugged with the outer chip apparatus of taking 23; 14 of four-core sheet sockets are plugged with another outer chip apparatus of taking 24.The chip crossover assembly 100 of multicore sheet socket type circuit board of the present invention can for example be used for planting on second chip carrier socket 12 of circuit board 10 of above-mentioned multicore sheet socket-type, with first chip apparatus of planting on this first chip carrier socket 11 21, be electrically connected to the chip apparatus of planting on the 3rd chip carrier socket 13 23 via this second chip carrier socket 12 in the cross-over connection mode.
In the application implementation shown in Figure 1A, if the chip crossover assembly 100 of first chip carrier socket, 11 plant processor chips, second chip carrier socket, 12 plants multicore sheet socket type circuit board of the present invention then can constitute uniprocessor type computer motherboard.Otherwise, shown in Figure 1B,, again processor chips 22 are planted to second chip carrier socket 12 if the chip crossover assembly 100 of the multicore sheet socket type circuit board of the present invention of plant on second chip carrier socket 12 is pulled out, then can constitute dual processor type computer motherboard.On concrete the enforcement, the chip of planting on the chip carrier socket 11,12,13,14 21,22,23,24 all must be supported HT (Hyper Transport) type bus structure.
In addition, if connectivity port (I/O Port) module chip 23,24 is gone in two outputs be plugged on the 3rd chip carrier socket 13 and four-core sheet socket 14 respectively, can be used for then realizing that dual processor as shown in Figure 4 answers hardware configuration.
Fig. 2 A promptly shows the structural form of embodiment of the chip crossover assembly 100 of multicore sheet socket type circuit board of the present invention, and which comprises at least: (a) framework 110; (b) electrical contact 121 of first combination; (c) electrical contact 122 of second combination; And the electric connection circuit 130 that (d) makes up.Fig. 2 B then shows another embodiment 100 ' of the chip crossover assembly of multicore sheet socket type circuit board of the present invention.
Framework 110 for example is the printed circuit board (PCB) of tetragonal body, roughly corresponding its 3rd chip carrier socket 13 that will plant of its geomery.On concrete the enforcement, the shape of this framework 110 can for example make that roughly the shape with the processor chips packaging body is identical.
The electrical contact 121 of first combination is to be placed on the bottom of said frame 110 1 sides, and its embodiment for example is to make needle-like pin or soldered ball (promptly identical with common needle-like pin or soldered ball on the general chip); Wherein each electrical contact 121 corresponds to each the bar bus line 31 between the 3rd chip carrier socket 13 and first chip carrier socket 11, be used to plug together the 3rd chip carrier socket 13, electrically touch bus line 31 between the 3rd chip carrier socket 13 and this first chip carrier socket 11 (in the embodiment shown in Fig. 2 A, be the explanation of presenting a demonstration property of example only with 5 electrical contacts, on concrete enforcement, the number of these electrical contacts may be up to a hundred).
The electrical contact 122 of second combination is placed on the bottom of said frame 110 another sides (it can be that the side at electrical contact 121 places with first combination is adjacent or be relative with the side at the electrical contact 121 ' place of first combination shown in Fig. 2 B shown in Fig. 2 A), and its embodiment is for example for making needle-like pin or soldered ball; Wherein each electrical contact 122 corresponds to each the bar circuit in these bus structure 30, is used to plug together the 3rd chip carrier socket 13, has electrical contact to the bus line 32 between the 3rd chip carrier socket 13 and this second chip carrier socket 12.
Electrically connect circuit 130 and be placed in the said frame 110, its embodiment for example is the conducting wire of printing-type, is used for the electrical contact 121 of above-mentioned first combination is electrically connected to respectively the electrical contact 122 of second combination.These electrically connect circuit 130 can be shown in Fig. 2 A, connect the electrical contact 121 of the combination of first on 110 2 adjacent side of this framework and the electrical contact 122 of second combination in the right-angle bending mode, or shown in Fig. 2 B, connect the electrical contact 121 of first on 110 ' two relative sides of this framework combinations ' and the electrical contact 122 of second combination ' (in the embodiment shown in Fig. 2 A and Fig. 2 B with linear fashion, only electrically connecting circuit with 5 is the explanation of presenting a demonstration property of example, on concrete the enforcement, these numbers that electrically connect circuit may be up to a hundred; If these numbers that electrically connect circuit are numerous, can adopt the multilayer mode to design the layout that these electrically connect circuit).
Fig. 3 shows the another application of the invention example.As shown in the figure, suppose to have a multicore sheet socket type circuit board 40 to be provided with 6 chip carrier sockets 41,42,43,44,45,46, and suppose that manufacturer will utilize the circuit board 40 of this multicore sheet socket-type to make one three and handle the type computer motherboard, then manufacturer 3 processor chips can be planted respectively wherein 4 chip carrier sockets 41,42,44, and simultaneously the embodiment 100 ' of the chip crossover assembly of the multicore sheet socket type circuit board of the present invention shown in Fig. 2 B is planted to the 5th chip carrier socket 45, can produce one three and handle the type computer motherboard.
Generally speaking, the invention provides a kind of chip crossover assembly of multicore sheet socket type circuit board of novelty, can be applicable to the circuit board of multicore sheet socket-type, and the bus line between the chip carrier socket on this circuit board adopts specific bus structure, wherein one or more chip carrier sockets are used to plant, with the chip apparatus of planting on the other chip carrier socket, be electrically connected to the chip apparatus of planting on the another one chip carrier socket in the cross-over connection mode.The chip crossover assembly of multicore sheet socket type circuit board of the present invention allows the user utilize with a kind of circuit board, can arbitrarily design and produce the multiprocessing type hardware platform of processor with arbitrary number, do not need to design and make various different circuit board respectively, therefore can assist to reduce manufacturing cost at the demand of the processor of different numbers.Therefore the present invention has better progressive and practicality than prior art.
Claims (5)
1. the chip crossover assembly of a multicore sheet socket type circuit board, the circuit board of chip carrier socket type at the most of arranging in pairs or groups, this multicore sheet socket type circuit board is provided with a plurality of chip carrier sockets, it comprises first chip carrier socket at least, second chip carrier socket and the 3rd chip carrier socket, bus line between these chip carrier sockets is to adopt HT type bus structure, and be plugged with first chip apparatus on this first chip carrier socket, then be plugged with second chip apparatus on this second chip carrier socket, this chip crossover assembly is used for planting to the 3rd chip carrier socket, with first chip apparatus of planting on this first chip carrier socket, be electrically connected to second chip apparatus of planting on this second chip carrier socket via the 3rd chip carrier socket in the cross-over connection mode, it is characterized in that the chip crossover assembly of this multicore sheet socket type circuit board comprises at least:
Framework;
The electrical contact of first combination, be placed on this framework, and wherein each electrical contact corresponds to each the bar bus line between the 3rd chip carrier socket and this first chip carrier socket, be used to make the electrical contact of first combination to plug together the 3rd chip carrier socket, electrically touch the bus line between the 3rd chip carrier socket and this first chip carrier socket;
The electrical contact of second combination, be placed on this framework, and wherein each electrical contact corresponds to each the bar bus line between the 3rd chip carrier socket and this second chip carrier socket, be used to make the electrical contact of second combination to plug together, electrically touch the bus line between the 3rd chip carrier socket and this second chip carrier socket to the 3rd chip carrier socket; And
The electric connection circuit of one combination is placed on this framework, and it is that the electrical contact that is used for this first combination is electrically connected to this second electrical contact that makes up respectively.
2. the chip crossover assembly of multicore sheet socket type circuit board as claimed in claim 1 is characterized in that, this multicore sheet socket type circuit board is a uniprocessor type computer motherboard.
3. the chip crossover assembly of multicore sheet socket type circuit board as claimed in claim 1 is characterized in that, this multicore sheet socket type circuit board is a multiprocessing type computer motherboard.
4. the chip crossover assembly of multicore sheet socket type circuit board as claimed in claim 1 is characterized in that, the electrical contact of the electrical contact of this first combination and this second combination is to make the needle-like pin.
5. the chip crossover assembly of multicore sheet socket type circuit board as claimed in claim 1 is characterized in that, the electrical contact of the electrical contact of this first combination and this second combination is the soldered ball of making.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100965468A CN100346331C (en) | 2004-11-30 | 2004-11-30 | Chip bridging device for multiple chip socket type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100965468A CN100346331C (en) | 2004-11-30 | 2004-11-30 | Chip bridging device for multiple chip socket type circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1783047A CN1783047A (en) | 2006-06-07 |
| CN100346331C true CN100346331C (en) | 2007-10-31 |
Family
ID=36773253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100965468A Expired - Fee Related CN100346331C (en) | 2004-11-30 | 2004-11-30 | Chip bridging device for multiple chip socket type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100346331C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1180412A (en) * | 1995-12-08 | 1998-04-29 | 三星电子株式会社 | Jtag testing of buses using plug-in cards with jtag logic mounted thereon |
| TW490825B (en) * | 2001-04-26 | 2002-06-11 | Advanced Semiconductor Eng | Electronic packaging structure |
| CN1361458A (en) * | 2000-12-27 | 2002-07-31 | 扬智科技股份有限公司 | Computer system backing up different type of DRAMs |
| CN1387259A (en) * | 2001-05-17 | 2002-12-25 | 蓝信彰 | Elastic combined slot for programmable multi-chip module |
-
2004
- 2004-11-30 CN CNB2004100965468A patent/CN100346331C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1180412A (en) * | 1995-12-08 | 1998-04-29 | 三星电子株式会社 | Jtag testing of buses using plug-in cards with jtag logic mounted thereon |
| CN1361458A (en) * | 2000-12-27 | 2002-07-31 | 扬智科技股份有限公司 | Computer system backing up different type of DRAMs |
| TW490825B (en) * | 2001-04-26 | 2002-06-11 | Advanced Semiconductor Eng | Electronic packaging structure |
| CN1387259A (en) * | 2001-05-17 | 2002-12-25 | 蓝信彰 | Elastic combined slot for programmable multi-chip module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1783047A (en) | 2006-06-07 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071031 Termination date: 20101130 |