CN100338748C - Tape coiling and process for making it - Google Patents
Tape coiling and process for making it Download PDFInfo
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- CN100338748C CN100338748C CNB021247242A CN02124724A CN100338748C CN 100338748 C CN100338748 C CN 100338748C CN B021247242 A CNB021247242 A CN B021247242A CN 02124724 A CN02124724 A CN 02124724A CN 100338748 C CN100338748 C CN 100338748C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The present invention relates to a tape coiling and a manufacturing method thereof. Metals, as Ag, Bi, Au, Mg, Ni, Pd, etc., are plated on pins. The phenomena of the surface indentation of the pins and the crystal whisker can be improved by plating the metals.
Description
Technical field
The present invention relates to a kind of winding (tape) and preparation method thereof, and particularly relevant for a kind of winding and the manufacture method that can improve pin surface depression (concave) and whisker (whisker) phenomenon.
Background technology
In today of height information society, the market of multimedia application is constantly being expanded rapidly.The integrated circuit encapsulation technology also need cooperate digitlization, networking, the zone connectionization of electronic installation and the trend development that uses hommization.For reaching above-mentioned requirement, many-sided requirements such as high speed processingization, multifunction, productive setization, miniaturization and and low priceization of necessary strengthening electronic assembly are so the integrated circuit encapsulation technology is also along with developing towards microminiaturized, densification.The wire bonds technology has been since semiconductor industry develops, the encapsulation technology that continues to continue to use, but because the trend of electronic building brick high-density packages makes the wire bonds technology can't be used in the higher packaging body of packaging density.Therefore, (TapeAutomated Bonding's automatic coating technique of film of replacement wire bonds technology TAB) arises at the historic moment.Not only volume is little, in light weight for packaging body after being encapsulated by the automatic coating technique of film, but and because film itself has the characteristic of bending (flexible), so can be so that follow-up packaging body has more elasticity on assembling.
Please refer to Fig. 1, it illustrates and is existing winding.The main framework of winding is on a film (film) 100, and film 100 has a plurality of component holes 110, and disposes weldering cover (a solder mask) 108 on the film 100.Dispose a plurality of pins 102 between film 100 and weldering cover 108, pin 102 can be extended in the component holes 110 by film 100, and the material of pin 102 is generally the copper metal.Wherein, have a tin metal layer 106 on the surface of pin 102, but pin 102 does not have tin metal layer 106 with film 100, weldering cover on 108 surfaces that are connected, and between tin metal layer 106 and pin 102, have a tin-copper alloy layer 104.
Then please refer to Fig. 2, it illustrates the making flow process into winding among Fig. 1.The making flow process of above-mentioned (Fig. 1) winding mainly comprises provides film (200), pin to form (202), weldering cover coating (204), pin zinc-plated (206) and baking steps such as (208).
Then please at first provide the step (200) of film, the film 100 that a winding shape is provided and has a plurality of component holes 110 simultaneously with reference to Fig. 1 and Fig. 2.Then carry out the step (202) that pin forms, on film 100, press Copper Foil, then again with lithography technology with copper foil patternization, to form pin 102.Then weld the step (204) of cover coating, will weld cover 108 and coat on the film 100, carry out the zinc-plated step of pin (206) afterwards, on the surface that pin 102 exposes, form a tin metal layer 106 with the mode of electroplating.The step of toasting at last (208) is so that form tin-copper alloy layer 104 at the interface between pin 102 and the tin metal layer 106.
Winding by above-mentioned tin plating technique made has the phenomenon (describing in detail as the back) that pin 102 surfaces produce depression, and can produce whisker on the surface of tin metal layer 106.
Then please refer to Fig. 3, it illustrates to having the winding pin now in tin plating technique, produces the schematic diagram of depression because of corrosion.Prior art after weldering cover 108 has been made owing to weld the thickness attenuation of covering 108 edges, thus be subjected to easily zinc-plated soup erosion and by pin 102 sur-face peelings.And between weldering cover of peeling off 108 and pin 102, can produce redox reaction, and wherein, the copper atom on the pin 102 can be oxidized to copper ion and dissociate to soup, and therefore, becoming on the surface of pin 102 can appearance depression 112.And copper atom can discharge electronics when being oxidized to copper ion, and these electronics can make the tin ion in the zinc-plated soup be reduced into tin metal 106 and be attached on the pin 102.
Then please refer to Fig. 4, it illustrates and is existing winding.The main framework of winding is on a film 300, and film 300 has a plurality of component holes 310.Disposing a plurality of pins 302 on the film 300 and between the weldering cover 308, pin 302 can be extended in the component holes 310 by film 300, and the material of pin 302 is generally the copper metal.Wherein, have a tin metal layer 306 on the surface of pin 302, but do not have tin metal layer 306 on pin 302 and the surface that film 300 is connected, and between tin metal layer 306 and pin 302, have a tin-copper alloy layer 304.In other words, have tin-copper alloy layer 304 and tin metal layer 306 between weldering cover 308 and the pin 302.
Then please refer to Fig. 5, it illustrates the making flow process into winding among Fig. 4.The making flow process of above-mentioned (Fig. 4) winding mainly comprises provides film (400), pin to form (402), pin zinc-plated (404), baking (406) and weldering cover coating steps such as (408).
Then please at first provide the step (400) of film, the film 300 that a winding shape is provided and has a plurality of component holes 310 simultaneously with reference to Fig. 4 and Fig. 5.Then carry out the step (402) that pin forms, on film 300, press Copper Foil, then again with lithography technology with copper foil patternization, to form pin 302.Then carry out the zinc-plated step of pin (404), on the surface of pin 302, form a tin metal layer 306, have tin metal layer 306 on feasible pin 302 surfaces except pin 302 and film 300 junctions with the mode of electroplating.The step of toasting afterwards (406) is so that form tin-copper alloy layer 304 at the interface between pin 302 and the tin metal layer 306.Last step (408) of just welding the cover coating is coated on the film 300 will weld cover 308.
Above-mentioned pin zinc-plated (404), baking (406) and weldering cover coating (408) though process sequence can improve the phenomenons that pin 302 surfaces produce depression, on the surface of tin metal layer 306, still can produce whisker.
Then please refer to Fig. 6, it illustrates and is existing winding.The main framework of winding is on a film 500, and film 500 has a plurality of component holes 510.Disposing a plurality of pins 502 on the film 500 and between the weldering cover 508, pin 502 can be extended in the component holes 510 by film 500, and the material of pin 502 is generally the copper metal.Wherein, have tin-copper alloy layer 504 on the surface of pin 502, but do not have tin-copper alloy layer 504 on pin 502 and the surface that film 500 is connected.And on the surface of tin-copper alloy layer 504, have tin metal layer 506, but do not have tin metal layer 506 on tin-copper alloy layer 504 and the surface that film 500, welding cover layer 508 are connected.In other words, only have tin-copper alloy layer 504 between pin 502 and the weldering cover 508, but do not have tin metal layer 506.
Then please refer to Fig. 7, it illustrates the making flow process into winding among Fig. 6.The making flow process of above-mentioned (Fig. 6) winding mainly comprises provides film (600), pin to form (602), once zinc-plated (604), baking (606), the coating of weldering cover (608) and the zinc-plated steps such as (610) of secondary.
Then please at first provide the step (600) of film, the film 500 that a winding shape is provided and has a plurality of component holes 510 simultaneously with reference to Fig. 6 and Fig. 7.Then carry out the step (602) that pin forms, on film 500, press Copper Foil, then again with lithography technology with copper foil patternization, to form pin 502.Then carry out once zinc-plated step (604), on the surface of pin 502, form a tin metal layer, have the tin metal layer on feasible pin 502 surfaces except pin 502 and film 500 junctions with the mode of electroplating.The step of then toasting (606) forms tin-copper alloy layer 504 so that go up on pin 502 surfaces.Weld the step (608) of cover coating afterwards, will weld cover 508 and coat on the film 500.At last carry out the zinc-plated step of secondary (610) again, on tin-copper alloy layer 504 surface that tin metal layer 506 are formed on exposure.
The zinc-plated technology of above-mentioned secondary can be improved the phenomenon that pin 502 surfaces produce depression and whisker simultaneously.
Summary of the invention
Therefore, purpose of the present invention is proposing a kind of winding and preparation method thereof, to improve the phenomenon of its pin surface depression and whisker.
For realizing above-mentioned purpose of the present invention, propose a kind of winding and constituted by a film, a weldering cover and a plurality of pin.Wherein, film has at least one component holes and a plurality of pin, and pin is extended in the component holes by film, and the weldering cover is disposed on the film.Have a tin-copper alloy layer, one tin-copper-first metal alloy layer and a tin metal layer on the pin surface, the material of first metal for example is metals such as silver, bismuth, gold, magnesium, nickel, palladium.Among the present invention, the tin-copper alloy layer is disposed on pin and the surface in addition, film junction, tin-copper-first metal alloy layer is disposed on the surface of tin-copper alloy layer, and the tin metal layer is disposed at tin-copper-first metal alloy layer and welds on the surface in addition, cover junction.
For realizing above-mentioned purpose of the present invention, propose a kind of winding and constituted by a film, a weldering cover and a plurality of pin.Wherein, film has at least one component holes and a plurality of pin, and pin is extended in the component holes by film, and the weldering cover is disposed on the film.Have a bronze medal-first metal alloy layer, one tin-copper-first metal alloy layer and a tin metal layer on the pin surface.The material of first metal for example is metals such as silver, bismuth, gold, magnesium, nickel, palladium.Among the present invention, copper-first metal alloy layer is disposed on pin and the surface in addition, film junction, tin-copper-first metal alloy layer is disposed at copper-first metal alloy layer and covers on the surface in addition, junction with weldering, and the tin metal layer is disposed on the surface of tin-copper-first metal alloy layer.
In the above-mentioned winding of the present invention, the material of film for example is a polyimides, and the material of weldering cover for example is an epoxy resin.
For realizing above-mentioned purpose of the present invention, a kind of manufacture method of winding is proposed, at first provide a film, have at least one component holes on the film, then on film, form a plurality of pins, the material of pin for example is the copper metal.After pin forms, on the pin surface, form one first tin metal layer (once zinc-plated).Form a first metal layer then on the first tin metal laminar surface, the material of the first metal layer for example is metals such as silver, bismuth, gold, magnesium, nickel, palladium.Then carry out the baking first time again, on the pin surface, to form a tin-copper alloy layer and one tin-copper-first metal alloy layer.Afterwards, on film, form a weldering cover.On tin-copper-first metal alloy laminar surface, form one second tin metal layer at last, and carry out the baking second time.
In the manufacture method of the winding that the present invention is above-mentioned, the first tin metal layer, the first metal layer and the second tin metal layer for example form with plating mode.
For realizing above-mentioned purpose of the present invention, a kind of manufacture method of winding is proposed, at first provide a film, have at least one component holes on the film, then on film, form a plurality of pins, the material of pin for example is the copper metal.After pin forms, form a first metal layer on the pin surface, the material of the first metal layer for example is metals such as silver, bismuth, gold, magnesium, nickel, palladium.Carry out the baking first time then,, then on film, form a weldering cover again on the pin surface, to form a bronze medal-first metal alloy layer.On copper-first metal alloy laminar surface, form a tin metal layer afterwards.At last, carry out the baking second time, between copper-first metal alloy layer and tin metal layer, to form one tin-copper-first metal alloy layer.
In the manufacture method of the winding that the present invention is above-mentioned, the first metal layer and tin metal layer for example form with plating mode.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, described in detail.
Description of drawings
Fig. 1 illustrates and is existing winding;
Fig. 2 illustrates the making flow process into winding among Fig. 1;
Fig. 3 illustrates to having the winding pin now in tin plating technique, produces the schematic diagram of depression because of corrosion;
Fig. 4 illustrates and is existing winding;
Fig. 5 illustrates the making flow process into winding among Fig. 4;
Fig. 6 illustrates and is existing winding;
Fig. 7 illustrates the making flow process into winding among Fig. 6;
Fig. 8 illustrates and is the winding according to first embodiment of the invention;
Fig. 9 illustrates the manufacture method into winding among Fig. 8;
Figure 10 illustrates and is the winding according to second embodiment of the invention; And
Figure 11 illustrates the manufacture method into winding among Figure 10.
[figure number explanation]
100,300,500,700: film
102,302,502,702: pin
104,304,504: the tin-copper alloy layer
106,306,506,708: the tin metal layer
108,308,508,710: the weldering cover
110,310,510,716: component holes
112: depression 200: film is provided
202: pin forms 204: the coating of weldering cover
206: pin zinc-plated 208: baking
400: film 402 is provided: pin forms
404: pin zinc-plated 406: baking
408: weldering cover coating 704: tin-copper alloy
706: tin-copper-silver alloy 712: copper-silver alloy
714: tin-copper-silver alloy 600: film is provided
602: pin forms 604: once zinc-plated
606: baking 608: the coating of weldering cover
610: secondary zinc-plated 800: film is provided
802: pin forms 804: once zinc-plated
806: silver-plated 808: baking
810: weldering cover coating 812: secondary is zinc-plated
814: baking 900: film is provided
902: pin forms 904: silver-plated
906: baking 908: the coating of weldering cover
910: zinc-plated 912: baking
Embodiment
Preferred embodiment
Winding carrying packaging body (Tape Carrier Package, TCP) mainly be to utilize a winding to carry a chip, with interior pin joining technique (Inner Lead Bonding, ILB) chip is connected with interior pin in the winding, with packing colloid part winding and chip is bonded in it more afterwards.Because whisker regular meeting makes when pin engages (bonding) with crystal grain the problem of generation line short (circuitshortage); therefore and the depression on the pin can cause the problem of reliabilities such as pin breakage usually, must avoid the generation of whisker and depression on the pin in winding (interior pin or outside the pin) surface.
At first please refer to Fig. 8, it illustrates and is the winding according to first embodiment of the invention.Winding mainly be framework on a film 700, film 700 has a plurality of component holes 716, the material of film for example is a polyimides.Disposing a plurality of pins 702 on the film 700 and between the weldering cover 710, pin 702 can be extended in the component holes 716 by film 700.Wherein, the material of weldering cover 710 is an epoxy resin for example, and the material of pin 702 is generally the copper metal.Have tin-copper alloy layer 704 on the surface of pin 702, but do not have tin-copper alloy layer 704 on pin 702 and the surface that film 700 is connected.And on the surface of tin-copper alloy layer 704, has one tin-copper-silver alloy 706.
Please refer to Fig. 8 equally, on the surface of tin-copper-silver alloy 706, have tin metal layer 708, but do not have tin metal layer 706 on tin-copper-silver alloy 706 and the surface that film 700, welding cover layer 710 are connected.In other words, only have tin-copper alloy layer 704 and tin-copper-silver alloy 706 between pin 702 and the weldering cover 710, but do not have tin metal layer 708.
Then please refer to Fig. 9, it illustrates the manufacture method into winding among Fig. 8.The making flow process of above-mentioned (Fig. 8) winding mainly comprises provides film (800), pin to form (802), once zinc-plated (804), silver-plated (806), baking (808), weld cover coating (810), secondary zinc-plated (812) and baking steps such as (814).
Then please at first provide the step (800) of film simultaneously with reference to Fig. 8 and Fig. 9, be the film 700 that a winding shape is provided and has a plurality of component holes 716.Then carry out the step (802) that pin forms, on film 700, press Copper Foil, then again with lithography technology with copper foil patternization, to form pin 702.Then carry out once zinc-plated step (804), for example on the surface of pin 702, form a tin metal layer, have the tin metal layer on feasible pin 702 surfaces except pin 702 and film 700 junctions with the mode of electroplating.Wherein, the thickness of tin metal layer for example is between 0.15 micron to 0.20 micron.
Then carry out silver-plated step (806), for example on the tin metal layer, form the silver metal layer with the mode of electroplating.Wherein, the plating bath that is coated with the silver metal layer for example is potassium cyanide silver (KAg (CN)
2), its concentration for example is 20 gram/litres (g/L), and the time that it is coated with for example is 20 seconds.
The step of then toasting (808) forms tin-copper alloy layer 704 and tin-copper-silver alloy layer 706 so that go up on pin 702 surfaces.Wherein, the condition of baking for example is to toast 1 hour under the temperature of 150 degree Celsius.
Then weld the step (810) of cover coating, will weld cover 710 and coat on the film 700.Carry out the zinc-plated step of secondary (812) afterwards, for example tin metal layer 708 is formed on tin-copper-silver alloy layer 706 surface of exposure with the mode of electroplating.Wherein, the thickness of tin metal layer 708 for example is between 0.25 micron to 0.35 micron.Last step (814) of toasting again, the condition of baking for example are to toast 1 hour under the temperature of 150 degree Celsius, so that the thickness of tin metal layer 708 is adjusted between 0.15 micron to 0.20 micron.
Second embodiment
Then please refer to Figure 10, it illustrates and is the winding according to second embodiment of the invention.Winding mainly be framework on a film 700, film 700 has a plurality of component holes 716, the material of film for example is a polyimides.Disposing a plurality of pins 702 on the film 700 and between the weldering cover 710, pin 702 can be extended in the component holes 716 by film 700.Wherein, the material of weldering cover 710 is an epoxy resin for example, and the material of pin 702 is generally the copper metal.Have copper-silver alloy layer 712 on the surface of pin 702, but do not have copper-silver alloy layer 712 on pin 702 and the surface that film 700 is connected.
Please refer to Figure 10 equally, on the surface of copper-silver alloy layer 712, have one tin-copper-silver alloy 714, but copper-silver alloy layer 712 does not have tin-copper-silver alloy 714 with film 700, weldering cover on 710 surfaces that are connected.In addition, on the surface of tin-copper-silver alloy 714, has tin metal layer 708.In other words, only have copper-silver alloy layer 712 between pin 702 and the weldering cover 710, but do not have tin-copper-silver alloy 714 and tin metal layer 708.
Then please refer to Figure 11, it illustrates the manufacture method into winding among Figure 10.The making flow process of above-mentioned (Figure 10) winding mainly comprises provides film (900), pin to form (902), silver-plated (904), baking (906), weldering cover coating (908), zinc-plated (910) and baking steps such as (912).
Please at first provide the step (900) of film, the film 700 that a winding shape is provided and has a plurality of component holes 716 simultaneously with reference to Figure 10 and Figure 11 at last.Then carry out the step (902) that pin forms, on film 700, press Copper Foil, then again with lithography technology with copper foil patternization, to form pin 702.
Then carry out once silver-plated step (904), for example on the surface of pin 702, form a silver metal layer, have the silver metal layer on feasible pin 702 surfaces except pin 702 and film 700 junctions with the mode of electroplating.Wherein, the plating bath that is coated with the silver metal layer for example is potassium cyanide silver (KAg (CN)
2), its concentration for example is 20 gram/litres (g/L), and the time that it is coated with for example is 20 seconds.
The step of then toasting (906) forms copper-silver alloy layer 714 so that go up on pin 702 surfaces.Then weld the step (908) of cover coating, will weld cover 710 and coat on the film 700.Carry out zinc-plated step (910) afterwards again, for example tin metal layer 708 is formed on copper-silver alloy layer 712 surface of exposure with the mode of electroplating.Last step (912) of toasting again, the condition of baking for example are to toast 1 hour under the temperature of 150 degree Celsius, so that the elder generation of tin metal layer 708 and copper-silver alloy layer 712 forms tin-copper-silver alloy layer 714.
For convenience of description, be that example describes only in the above embodiment of the present invention with " silver metal ", yet and non-limiting metal material used in the present invention is confined to silver metal, above-mentioned copper-silver alloy 712 or the silver metal composition in tin-copper-silver alloy 706 also can be replaced by other composition, for example metals such as bismuth, gold, magnesium, nickel, palladium.
In sum, winding of the present invention and preparation method thereof has following advantage at least:
1. winding of the present invention and preparation method thereof can effectively avoid the phenomenon that caves on the pin surface to produce.
2. the generation of whisker on the pin surface can be effectively avoided in winding of the present invention and preparation method thereof.
Though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; can be used for a variety of modifications and variations, so protection scope of the present invention should be as the criterion with the scope that claim was defined.
Claims (14)
1. a winding is characterized in that, comprising:
One film, this film has at least one component holes;
One weldering cover, this weldering cover is disposed on this film; And
A plurality of pins, these pin configuration are between this film and this weldering cover, and these pins extend in this component holes by this film, and wherein the material of these pins comprises the copper metal, and these pins comprise:
One tin-copper alloy layer, this tin-copper alloy layer are disposed on these pins and the surface in addition, this film junction;
One tin-copper-first metal alloy layer, this tin-copper-first metal alloy layer is disposed on the surface of this tin-copper alloy layer, wherein the material of this first metal comprise silver, bismuth, gold, magnesium, nickel, palladium one of them; And
One tin metal layer, this tin metal layer are disposed on this tin-copper-first metal alloy layer and the surface in addition, this weldering cover junction.
2. winding as claimed in claim 1 is characterized in that: the material of this film comprises polyimides.
3. winding as claimed in claim 1 is characterized in that: the material of this weldering cover comprises epoxy resin.
4. a winding is characterized in that, comprising:
One film, this film has at least one component holes;
One weldering cover, this weldering cover is disposed on this film; And
A plurality of pins, these pin configuration are between this film and this weldering cover, and these pins extend in this component holes by this film, and wherein the material of these pins comprises the copper metal, and these pins comprise:
One bronze medal-first metal alloy layer, this copper-first metal alloy layer are disposed on the surface beyond these pins and this film junction, wherein the material of this first metal comprise silver, bismuth, gold, magnesium, nickel, palladium one of them;
One tin-copper-first metal alloy layer, this tin-copper-first metal alloy layer are disposed on this copper-first metal alloy layer and the surface in addition, this weldering cover junction; And
One tin metal layer, this tin metal layer is disposed on the surface of this tin-copper-first metal alloy layer.
5. winding as claimed in claim 4 is characterized in that: the material of this film comprises polyimides.
6. as claim 4 a described winding, it is characterized in that: the material of this weldering cover comprises epoxy resin.
7. the manufacture method of a winding is characterized in that, comprising:
One film is provided, has at least one component holes on this film;
Form a plurality of pins on this film, the material of these pins comprises the copper metal;
On this pin surface, form one first tin metal layer;
On this first tin metal laminar surface, form a first metal layer, wherein the material of this first metal layer comprise silver, bismuth, gold, magnesium, nickel, palladium one of them;
Carry out one first baking, on these pin surfaces, to form a tin-copper alloy layer and one tin-copper-first metal alloy layer;
Formation one weldering cover on this film, these pins of this weldering cover meeting cover part; And
On this tin-copper-first metal alloy laminar surface, form one second tin metal layer.
8. the manufacture method of winding as claimed in claim 7 is characterized in that: this first tin metal layer comprises with plating mode and forming.
9. the manufacture method of winding as claimed in claim 7 is characterized in that: this first metal layer comprises with plating mode and forming.
10. the manufacture method of winding as claimed in claim 7 is characterized in that: this second tin metal layer comprises with plating mode and forming.
11. the manufacture method of winding as claimed in claim 7 is characterized in that: this second tin metal layer also comprises and carries out one second baking procedure after forming.
12. the manufacture method of a winding is characterized in that, comprising:
One film is provided, has at least one component holes on this film;
Form a plurality of pins on this film, the material of these pins comprises the copper metal;
On this pin surface, form a first metal layer, wherein the material of this first metal layer comprise silver, bismuth, gold, magnesium, nickel, palladium one of them;
Carry out one first baking, on these pin surfaces, to form a bronze medal-first metal alloy layer;
Formation one weldering cover on this film, these pins of this weldering cover meeting cover part;
On this copper-first metal alloy laminar surface, form a tin metal layer; And
Carry out one second baking, between this copper-first metal alloy layer and this tin metal layer, to form one tin-copper-first metal alloy layer.
13. the manufacture method of winding as claimed in claim 12 is characterized in that: this first metal layer comprises with plating mode and forming.
14. the manufacture method of winding as claimed in claim 12 is characterized in that: this tin metal layer comprises with plating mode and forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021247242A CN100338748C (en) | 2002-06-25 | 2002-06-25 | Tape coiling and process for making it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021247242A CN100338748C (en) | 2002-06-25 | 2002-06-25 | Tape coiling and process for making it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1464541A CN1464541A (en) | 2003-12-31 |
| CN100338748C true CN100338748C (en) | 2007-09-19 |
Family
ID=29743890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021247242A Expired - Fee Related CN100338748C (en) | 2002-06-25 | 2002-06-25 | Tape coiling and process for making it |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100338748C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109390238A (en) * | 2018-10-25 | 2019-02-26 | 南通皋鑫电子股份有限公司 | The secondary silver plating process of high-voltage diode pin |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4441118A (en) * | 1983-01-13 | 1984-04-03 | Olin Corporation | Composite copper nickel alloys with improved solderability shelf life |
| CN1185036A (en) * | 1996-12-10 | 1998-06-17 | 古河电气工业株式会社 | Connecting material for electronic elements, and the connection and semiconductor device using same |
| JP2000036521A (en) * | 1998-05-11 | 2000-02-02 | Mitsui Mining & Smelting Co Ltd | Film carrier tape for mounting electronic part and manufacture thereof |
-
2002
- 2002-06-25 CN CNB021247242A patent/CN100338748C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4441118A (en) * | 1983-01-13 | 1984-04-03 | Olin Corporation | Composite copper nickel alloys with improved solderability shelf life |
| CN1185036A (en) * | 1996-12-10 | 1998-06-17 | 古河电气工业株式会社 | Connecting material for electronic elements, and the connection and semiconductor device using same |
| JP2000036521A (en) * | 1998-05-11 | 2000-02-02 | Mitsui Mining & Smelting Co Ltd | Film carrier tape for mounting electronic part and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1464541A (en) | 2003-12-31 |
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