CN100334803C

CN100334803C - Method of synchronous manufacturing complez piezoelectric oscillators

Info

Publication number: CN100334803C
Application number: CNB031097499A
Authority: CN
Inventors: 战国
Original assignee: TAIYI ELECTRONIC CO Ltd
Current assignee: TAIYI ELECTRONIC CO Ltd
Priority date: 2003-04-15
Filing date: 2003-04-15
Publication date: 2007-08-29
Anticipated expiration: 2023-04-15
Also published as: CN1538619A

Abstract

The present invention relates to a method of synchronously manufacturing multiple piezoelectric oscillators, which is carried out on a base plate. Conducting lines in bases of the piezoelectric oscillators and electrical connection relations between side leads of the peripheries of the bases are blocked first to test and encapsulate each piezoelectric oscillator before the base plate is not separated, which saves cost and enhances production efficiency.

Description

Make the method for a plurality of piezoelectric oscillators synchronously

Technical field

The present invention relates to a kind of manufacture method of piezoelectric oscillator, particularly relate to a kind of test earlier, encapsulate after, carry out substrate again and separate, so can make the method for a plurality of piezoelectric oscillators synchronously.

Background technology

In various electronic installations, because accurate reference time and reference frequency need be provided, can make circuit or the correct start of timer in the electronic installation, therefore usually can see the appearance of piezoelectric oscillator (piezoelectric oscillator).

As its name suggests, piezoelectric oscillator is made by piezoelectric (for example quartzy), and an electrode is set respectively on the piezoelectric crystal opposite sides of long plate shape, when after imposing voltage on the electrode, because so effect of electric field has caused the deformation of piezoelectric crystal, and that the deformation of piezoelectric crystal then can produce a reverse voltage is poor, so piezoelectric crystal is vibration repeatedly with regard to being energized, in addition, since the directivity that its frequency of oscillation can depend on piezoelectric crystal cutting with and the thickness degree, so often used by industry.And in the manufacturing of piezoelectric oscillator, the practice in the past is as follows:

Consult Fig. 1,2, preparation one substrate 900 as shown in Figure 1 at first earlier, this substrate 900 is formed by stacking by a plurality of ceramic base material, and each blockage in illustrating can be separated from each other and become the pedestal 902 of the piezoelectric oscillator 901 shown in Fig. 2.Certainly, before becoming a substrate 900, the pin 904 of metal connecting line between each layer ceramic base material or perforation (via hole) 903 and pedestal 902 belows is to be embedded in therebetween according to the circuit layout of design in that a plurality of ceramic base materials are carried out sintering.

Then, substrate 900 is separated into the pedestal 902 of a plurality of oscillators 901 according to each square, and in regular turn ready piezoelectric crystal 905 is inserted in the pedestal 902, and piezoelectric crystal 905 tested, whether observe with desired reference frequency near after, again the quality of piezoelectric crystal 905 is optionally adjusted in addition capping 906 on each pedestal 902 at last, just finished the encapsulation of each oscillator 901, as shown in Figure 2.

Cooperate Fig. 3, it shown in the figure upward view of the pedestal 902 on the substrate 900, on traditional method for making, because the piezoelectric oscillator 901 normal surface mount technologies (SMT) that adopt are fixed on the circuit board, therefore anchor clamps can't contact with the pin 904 of piezoelectric oscillator 901 belows and test, so when pedestal 902 moulding of piezoelectric oscillator 901, can be earlier be embedded with corresponding to four corners of each piezoelectric oscillator 901 on each layer ceramic base material with pedestal 902 below the side lead 907 that electrically connects mutually of pin 904.But just because of each pedestal 902 side lead 907 to each other is mutual electric connections, so in the manufacture process of above-mentioned oscillator 901, also can't be tested, have only when substrate 900 when disjunction becomes quarter when each bar line of cut separates and with side lead 907 in addition, just blocked the electrical connection of 902 of each pedestals, so when inserting after the piezoelectric crystal 905, can be by the pin 904 of pedestal 902 belows, with the action that anchor clamps are tested, the action that encapsulates again at last.

But because microminiaturized now trend, make that the integral body of piezoelectric oscillator 901 is big or small between several millimeters, therefore for independent piezoelectric oscillator 901, particularly in the test or the process of encapsulation, just the clamping contraposition of piezoelectric oscillator 901 is very not inconvenient, and on processing procedure owing to must allow actions such as each piezoelectric oscillator 901 is tested repeatedly by anchor clamps in proper order, encapsulation, its consumed time is also long, also causes the increase of manufacturing cost simultaneously.

Summary of the invention

Therefore, the object of the present invention is to provide and a kind ofly just can not carry out element test before the separating base plate, and the method for a plurality of piezoelectric oscillators of synchronous manufacturing of the piezoelectric oscillator that after encapsulation, is separated.

The method that the present invention makes a plurality of piezoelectric oscillators synchronously is to carry out on a substrate, this substrate has a plurality of insulating barriers, an and circuit layout that is arranged between described insulating barrier, described substrate and definable go out the pedestal of a plurality of piezoelectric oscillators, and be provided with a plurality of side leads between described pedestal and make described pedestal electrically connect each other, described circuit layout has a conducting wire that is arranged in each described pedestal, and each described conducting wire is to electrically connect mutually with each described pedestal described side lead on every side, described conducting wire has a plurality of pins that are arranged on each described base bottom surface, a plurality of be arranged on each described pedestal and for the connection pad of a piezoelectric crystal solid welding, and a plurality of be arranged in each described pedestal and with described pin, the metal connecting line that described connection pad electrically connects mutually.

The present invention's method has comprised steps A) block the electric connection of described conducting wire and each described pedestal described side lead on every side in each described pedestal.B) described piezoelectric crystal is arranged on the described connection pad, each described piezoelectric crystal is electrically connected by the metal connecting line and the described pin of described conducting wire.C) via described pin described piezoelectric crystal is carried out frequency test.D) the described pedestal of capping is to finish the encapsulation of described piezoelectric oscillator.E) separate the described substrate finish after the encapsulation and become described piezoelectric oscillator.

Comprehensively above-mentioned, the manufacture method of piezoelectric oscillator of the present invention is not earlier being blocked the electrical connection between conducting wire in each pedestal and the side lead before the separating base plate, promptly, make that piezoelectric crystal does not have electrical connection each other in each pedestal, therefore can utilize the full wafer substrate directly to test, and after encapsulation, carry out substrate again and separate, so can reduce cost, and shorten the processing procedure time, improved the accuracy of element contraposition, realized that simultaneously the present invention makes the purpose of a plurality of piezoelectric oscillators synchronously.

Description of drawings

The present invention is described in detail below in conjunction with drawings and Examples, in the accompanying drawing:

Fig. 1 is a vertical view, illustrates that one includes the substrate of a plurality of pedestals.

Fig. 2 is a part of cutaway view, and in the past a piezoelectric oscillator is described.

Fig. 3 is the part upward view of this substrate.

Fig. 4 is a vertical view, and employed substrate in the preferred embodiment of manufacture method of piezoelectric oscillator of the present invention is described.

Fig. 5 is the enlarged drawing of regional V among Fig. 4, and the pedestal of a piezoelectric oscillator is described.

Fig. 6 is a part of cutaway view of described pedestal.

Fig. 7 is the flow chart of described preferred embodiment.

Fig. 8 is a upward view, and the situation that the pin of a pedestal links to each other with the pin of other pedestal is described.

Fig. 9 is a schematic diagram, and the situation after metal connecting line is blocked is described.

Figure 10 is a routine view, illustrates that a piezoelectric crystal is set at the situation on this pedestal.

Figure 11 is a vertical view, illustrates that described piezoelectric crystal is set at the situation on the described pedestal.

Figure 12 is an end view, illustrates to finish capping and become a piezoelectric oscillator.

Figure 13 is a schematic diagram, illustrates that the pin of described piezoelectric oscillator and a side lead are by the situation of solid welding on a circuit board in the lump.

Embodiment

Consult Fig. 4 to Fig. 6, the method that the present invention makes a plurality of piezoelectric oscillators synchronously is to carry out on a substrate 1, checkerboard lines shown in Fig. 4 promptly refer to the line of cut of substrate 1, just each blockage 8 just corresponding the pedestal 11 of a piezoelectric oscillator, as Fig. 5 and shown in Figure 6.And this pedestal 11 is via a plurality of insulating barriers, just via multilayer ceramic base material in addition sintering form, in the present embodiment, be to be example with three layers, this pedestal 11 can be divided into a diapire 111, and around this diapire 111 and upwardly extending sidewall 112, four corners that pedestal 11 and pedestal are 11 also are embedded with side lead 21～24, and side lead 21～24 makes that each pedestal 11 was the state that presents electric connection before substrate 1 does not separate as yet.

Substrate 1 also has a circuit layout, in the present embodiment, this circuit layout refers to a conducting wire 31 that is arranged in each pedestal 11, and conducting wire 31 has comprised two connection pads 315,316 of the metal connecting line (or perforation) 310 between each insulating barrier, the pin 311～314 (consulting Fig. 8) that is arranged on pedestal 11 bottom surfaces, voltage supply electric crystal (figure does not show) setting.

Cooperate Fig. 7, the manufacture method of piezoelectric oscillator of the present invention comprises the following step: at first, as step 61, block the electric connection of each pedestal 11 interior described conducting wires 31 and each described pedestal 11 side lead 21～24 on every side, be to be divided into step two times in the present embodiment: as shown in Figure 8, (1) pin 311,313 that will be connected with connection pad 315,316 is arranged on

adjacent side lead

21,23 places discretely, after making that just piezoelectric crystal is arranged on the connection pad 315,316, can't electrically connect mutually with side lead 21～24.Then, as shown in Figure 9, because metal connecting line 310 and

side lead

21,23 that each different pedestals are 11 electrically connect mutually, therefore make that each pedestal 11 electrically connects each other mutually, so here (2) utilize laser cutting part metals line 310 (as zone 9 among the figure), make metal connecting line 310 to be connected with side lead 21,23.In addition,, but only supply solid welding on circuit board, therefore do not need to be separated from each other with

contiguous side lead

22,24 owing to pin 312,314 can't interconnect with piezoelectric crystal.

Then, as step 62, and cooperate Figure 10 and shown in Figure 11, on each described pedestal 11, a piezoelectric crystal 42 is set, and utilize conducting resinl that piezoelectric crystal 42 is arranged on the connection pad 315,316, make the piezoelectric crystal 42 and the part of metal connecting line 310 electrically connect.Certainly, respectively be provided with one on the end face of this piezoelectric crystal 42 and the bottom surface in order to this piezoelectric crystal is imposed the electrode of electric field, for convenience of description, do not state clearly especially in graphic, but know owing to carried out above-mentioned step 61, so piezoelectric crystal 42 does not electrically connect with

side lead

21,23, more can not electrically connect with

side lead

22,24.

Step 63 is carried out the frequency adjustment to piezoelectric crystal 42.Because in step 61, pin 311,313 is separated setting with

side lead

21,23, just cut off the annexation of 21～24 in metal connecting line 310 and side lead, so before substrate 1 not being separated, though the side lead 22,24 that each pedestal is 11 still electrically connects mutually, the piezoelectric crystal 42 in each pedestal 11 has not had electrical connection to each other.Therefore in this step, substrate 1 full wafer can be sent in the test machine and directly be tested, and have step following time:

C1) import a test signal to piezoelectric crystal 42 by pin 311/313, and make piezoelectric crystal 42 vibrations.C2) measure the frequency of oscillation of piezoelectric crystal 42, and with a predetermined oscillation frequency ratio.C3) according to the electrode on comparative result deposition (deposit) or etching (etch) piezoelectric crystal 42 end faces, finely tune the quality of piezoelectric crystal 42 integral body whereby, the frequency of oscillation that makes piezoelectric crystal 42 is near the predetermined oscillation frequency.Known by industry owing to finely tune the method for piezoelectric crystal 42 by deposition and etching, therefore repeated no more.

Step 64 as shown in figure 12, is utilized a loam cake 5 to come closure base 11 and is finished the encapsulation of each piezoelectric oscillator 3.At last, as step 65, each bar cut-off rule separates for substrate 1 in Fig. 6, therefore obtains a plurality of piezoelectric oscillators 3.

It should be noted that, though in step 61, cut off

side lead

21,23 and the electrical connection of 310 of metal connecting lines, but as shown in figure 13, when oscillator 3 being welded on the circuit board 4, weld pad 410 areas that voltage supply electrical oscillator 3 is welded can design big slightly than the area of pin 311, make piezoelectric oscillator 3 by solid welding on circuit board 4 time, can be with pin 311, side lead 21 is welded on the weld pad 410 in the lump, therefore side lead 21 and pin 311 have been electrically connected mutually, so when piezoelectric oscillator 3 is welded on the circuit board 4, still can comes input test signal and can not be affected by side lead 21.

Claims

1. method of making synchronously a plurality of piezoelectric oscillators, be on a substrate, to carry out, this substrate has a plurality of insulating barriers, an and circuit layout that is arranged between described insulating barrier, described substrate and definable go out the pedestal of a plurality of piezoelectric oscillators, and be provided with a plurality of side leads between described pedestal and make described pedestal electrically connect each other, described circuit layout has a conducting wire that is arranged in each described pedestal, and each described conducting wire is to electrically connect mutually with each described pedestal described side lead on every side, described conducting wire has a plurality of pins that are arranged on each described base bottom surface, a plurality of connection pads that also supply a piezoelectric crystal solid welding on each described pedestal that are arranged on, and a plurality of be arranged in each described pedestal and with described pin, the metal connecting line that described connection pad electrically connects mutually is characterized in that described method comprises the following step:

A) block the electric connection of described conducting wire and each described pedestal described side lead on every side in each described pedestal;

B) described piezoelectric crystal is arranged on the described connection pad, each described piezoelectric crystal is electrically connected by the metal connecting line and the described pin of described conducting wire;

C) via described pin described piezoelectric crystal is carried out frequency test;

D) the described pedestal of capping is to finish the encapsulation of described piezoelectric oscillator; And

E) separate the described substrate finish after the encapsulation and become described piezoelectric oscillator.

2. make synchronously the method for a plurality of piezoelectric oscillators according to claim 1, it is characterized in that described steps A) more comprise step following time:

The pin that will electrically connect mutually with described piezoelectric crystal is arranged on the bottom surface of described pedestal and contiguous described side lead discretely;

With the part of laser penetration and the described metal connecting line of disjunction, to block the electric connection of described metal connecting line and described side lead.

3. make synchronously the method for a plurality of piezoelectric oscillators according to claim 1, it is characterized in that described step C) more comprise step following time:

C1) import a test signal to the described piezoelectric crystal via described pin, make described piezoelectric crystal oscillating;

C2) measure the frequency of oscillation of described piezoelectric crystal, and compare with a predetermined oscillation frequency; And

C3) according to the described piezoelectric crystal of comparative result deposition/etching, to finely tune the quality of described piezoelectric crystal, the frequency of oscillation that makes described piezoelectric crystal is near described predetermined oscillation frequency.