CN100334628C - Optical pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical pickup device which has a light emitting element holder superior in heat dissipation and suppresses a large variance in wavelength of a laser beam emitted from the light emitting element, is made compact and can resist somewhat rough handling.

Description

Optic pick-up

CROSS-REFERENCE TO RELATED APPLICATIONS

Japanese patent application No.2004-367434 and No.2004-131172's is whole open, comprises that its instructions, claims, accompanying drawing and summary are incorporated herein by reference at this.

Technical field

The present invention relates to have the optic pick-up that the light-emitting component in being present is set, this has superior heat dispersion and anti-damage.

Background technology

Fig. 7 illustrates the embodiment of conventional optical pick-up device.

Laser diode (being abbreviated as " LD ") emission of lasering beam, and be also referred to as light-emitting component.The LD driver is abbreviated as " LDD " hereinafter.With reference to Fig. 7, LDD 510 is used to drive LD 520 so that the laser drive circuit of LD520 emission laser.Electric current is supplied to LD 520 from LDD 510, and then, LD 520 emission of lasering beam are used to record the information on the dish 700 and/or the information of reading and recording on dish 700.

Shine on the dish 700 through diffraction grating 530, intermediate lens 540, half-reflecting mirror 550 and object lens 560 from the laser of LD520 output.From coiling the 700 part laser beam irradiations that reflect to photodiode IC (it is abbreviated as PDIC) 570.PDIC 570 will represent that the light signal of the light beam that received converts electric signal to, and it is used for the servo control mechanism (not shown) of operating optical pick device 501 lens mount (not shown).The PDIC that detection shines the light on it is also referred to as photodetector.Servo control mechanism described here is meant the state of measuring the control object, and measurement result and predetermined reference value are relatively come to proofread and correct automatically the mechanism of control.

In addition, the part laser beam from LD 520 outputs enters preceding monitor diode (FMD) 580.The FMD monitoring is used to provide feedback with the control laser diode from laser diode emitted laser bundle.

LDD 510, LD 520, diffraction grating 530, intermediate lens 540, half-reflecting mirror 550, object lens 560, PDIC 570 and FMD 580 are installed on the frame 502, and it is not shown.In addition, LDD 510, LD 520, PDIC 570 and FMD 580 are connected to flexible printed circuit board (FPC) 505, make can realize between them being electrically connected.By being parallel to insulating trip for example Copper Foil of metal forming is set, forms flexible printed circuit board (it is abbreviated as FPC hereinafter), wherein print many circuit leads on the insulating trip, and protective seam also is set thereon.Optic pick-up 501 comprises above-mentioned various element.Here, though optic pick-up 501 also comprises the structural detail (not shown) except above-mentioned these elements, for convenience's sake, in Fig. 7, omit these elements.

Optic pick-up 501 be used to read on the medium data or with data recording to medium.Here, medium comprises various types of CDs, for example, and such as the read-only optical disc of CD-ROM, DVD-ROM etc., write down (write-once) CD and writing/can wipe or CD-RW such as CD-R, DVD ± R etc. such as CD-RW, DVD ± RW, DVD-RAM etc.

Here, " CD " is the abbreviation of compact disk (compact disc), and " DVD " is digital universal disc (digital versatile disc) " abbreviation.In addition, the ROM in " CD-ROM " or " DVD-ROM " is " abbreviation of ROM (read-only memory) (read only memory), so CD-ROM and DVD-ROM are read-only disks.In addition, the R representative " can write down " in " CD-R " and " DVD ± R ", so CD-R and DVD ± R recordable disc.RW in " CD-RW " and " DVD ± RW " representative " can rewrite ", so CD-RW and DVD ± RW are rewritable disks.In addition, DVD-RAM is the abbreviation of " digital general disc and RAM (digitalversatile disc random access memory) ", so it is readable, can write and can wipe.

Optic pick-up 501 is used for reading and recording and is recorded in various the record or rewritable CD in the data of above-mentioned various CDs or with data.

Give LDD 510 by applying electric current, LD 520 emission laser.At this moment, LD 520 produces heat, and it causes the temperature variation of LD 520.From LD 520 emission of lasering beam the time, the oscillation wavelength of laser depends on temperature in LD520.Therefore, when the temperature significant change of LD 520, from LD 520 emitted laser bundle wavelength variations.In addition, when electric current when LDD 510 supplies to LD 520, impel LD 520 emission of lasering beam, LDD 510 also produces heat.Therefore, the main thermal source in LDD 510 and the LD 520 formation optic pick-ups 501.

Countermeasure as the heat of resisting the laser driver generation proposes the heat abstractor in the shaven head, and the metal laser device seat coating that semiconductor laser wherein is installed has the heat radiation coating of thermolysis.

In recent years, require further to reduce the optical disc apparatus (not shown) or be installed in the weight and the size of the optic pick-up 501 in the optical disc apparatus.In order to meet this requirement, propose to use the frame of resin formation, replace tradition to be used to hold the metal machine frame of LD 520, diffraction grating 530, intermediate lens 540, half-reflecting mirror 560, PDIC 570 etc., thereby realize alleviating of weight.If replace metal machine frame, can alleviate the weight of optic pick-up 501 with the resin frame.

But the frame heat radiation that is made of metal is better than the frame that resin is made.Therefore, if the resin frame is used for optic pick-up, the problem that LD 520 produces heat is difficult to solve.

As mentioned above, when from LD 520 emission of lasering beam, temperature is depended in the Wavelength of Laser vibration.Therefore, when the temperature variation of LD 520 is remarkable, also change from the wavelength of LD 520 emitted laser bundles.Therefore, when heat heating that LD 520 is produced by LD 520 self, exist from the problem of the wavelength variations of LD 520 emitted laser bundles, and stop the laser beam of LD 520 emission fixed wave length.

For the ease of the heat radiation of LD (light emitting diode) 520, for example, propose a large amount of heat radiator (not shown) is being set on the LD (light emitting diode) 520 or on the fixture of LD (light emitting diode) 520.But the structure of this proposal causes another problem, that is, provide a large amount of heat radiator to increase the size of optic pick-up 501.

For the module manufacturer of optic pick-up or the module manufacturer of optical disc apparatus, also require optic pick-up to hold out against rough loading and unloading.

Summary of the invention

The invention provides a kind of optic pick-up; it comprises the light-emitting component of emission of lasering beam and the frame that light-emitting component is installed; wherein light-emitting component is contained in the seat that is used for protecting light-emitting component; this comprises the outshot that is used to distribute the heat that light-emitting component produces; and outshot is positioned at frame; projecting part is both as the thermal component that is used to increase the light-emitting component heat radiation; prevent that as when colliding frame, being used to seat breaks away from the seat holding components of frame again; projecting part forms and is essentially rectangular bar-shaped; and comprise first side and second side that is provided with in the first side thereof opposite side; receiving-member comprises corresponding to the first side wall of first side with corresponding to second sidewall of second side; and the connecting wall that is provided for connecting the first side wall and second sidewall, connecting wall is with the upper and lower of zigzag pattern setting at receiving-member.

Description of drawings

According to following accompanying drawing, describe the preferred embodiments of the present invention in detail, wherein:

Fig. 1 is the decomposition diagram of optic pick-up according to an embodiment of the invention;

Fig. 2 holds the decomposition diagram of the seat of light-emitting component at the state that is about to be installed to frame;

Fig. 3 is that the seat that holds light-emitting component is being installed to the skeleton view of the state of frame;

Fig. 4 holds the seat of light-emitting component another decomposition diagram at the state that is about to be installed to frame;

Fig. 5 is that the seat that holds light-emitting component is being installed to another skeleton view of the state of frame;

Fig. 6 is the skeleton view of optic pick-up at assembled state; With

Fig. 7 is the key diagram of an embodiment of background technology optic pick-up.

Embodiment

Based on accompanying drawing, describe preferred embodiment in detail below according to optic pick-up of the present invention.

Fig. 1 is the decomposition diagram of optic pick-up according to an embodiment of the invention.Fig. 2 holds the decomposition diagram of the seat of light-emitting component at the state that is about to be installed to frame.Fig. 3 is that the seat that holds light-emitting component is being installed to the skeleton view of the state of frame.Fig. 4 holds the seat of light-emitting component another decomposition diagram at the state that is about to be installed to frame.Fig. 5 is that the seat that holds light-emitting component is being installed to another skeleton view of the state of frame.Fig. 6 is the skeleton view of optic pick-up at assembled state.

Fig. 1,2,3 and 6 is skeleton views of the optic pick-up seen from the upper face side, and Figure 4 and 5 are skeleton views of the optic pick-up seen from lower side.Be noted that in instructions for convenience of description optic pick-up and use term " top " and " bottom ".

Light pick-up is abbreviated as " OPU ".The optical disc apparatus (not shown) that is equipped with optic pick-up is used for the data of reading and recording on CD, for example information.Optical disc apparatus also is used for the data of for example information are recorded in CD.For example, CD for example comprises the read-only optical disc of " CD-ROM " and " DVD-ROM ", for example " CD-R ", " DVD-R's " and " DVD+R " writes down writing/can wiping or CD-RW of (write-once) CD and for example " CD-RW ", " DVD-RW ", " DVD+RW ", " DVD-RAM ", " HD DVD " and " Blu-ray disc ".

" HD DVD " is the abbreviation of high definition DVD." HD DVD " is the CD that has the memory capacity bigger than traditional DVD with traditional DVD compatibility simultaneously.When red laser was used for traditional CD and DVD, royal purple laser was used for reading and recording in " HD DVD " optical disc data.Here, " blue light " refers to royal purple laser, and it is used to realize than reading the higher recording density that realizes with the red laser of write signal at traditional C D and DVD.

Electric current is supplied with light-emitting component 20 (shown in Fig. 1-6) from the laser driver (not shown), then, and light-emitting component 20 emission of lasering beam.Laser driver is that driven light-emitting element 20 is so that the laser drive circuit of light-emitting component 20 emission of lasering beam.

Light-emitting component 20 emission wavelengths are approximately the laser beam of 770-805nm (nanometer), are used for play CD.In addition, light-emitting component 20 emission wavelengths are approximately the laser beam of 630-670nm (nanometer), are used for DVD playing back.Like this, light-emitting component 20 formations can be launched the dual wavelength laser diode of different wave length laser beam.For example, use this dual wavelength LD 20 to help to reduce the quantity of LD element, thereby reduce the size and the weight of optic pick-up 1.

Dual wavelength LD 20 is contained in and is made of metal and has in the laser socket 25 of superior heat dispersion.The laser socket 25 that LD 20 is installed is called LD seat 25 etc.

By providing electric current to LD 20, use LD 20 emitted laser bundles to record the information on the CD or the information of reading and recording on CD from laser driver.

, shine on the CD by being arranged to laser hole 5Bn from LD 20 emitted laser bundles (Fig. 2 and 3) through diffraction grating 70 (Fig. 1-3), prism 80 (Fig. 2 and 3), intermediate lens 40, catoptron 50 and object lens 60 (Fig. 6) through the sidewall 5Bi of the peripheral wall 5B that constitutes frame main body 5H.

Diffraction grating 70 (Fig. 1 and 2) uses diffraction light, being divided into a main beam and two beamlets from LD 20 emitted laser bundles.Prism 80 is used to prevent the astigmatism that causes when the laser beam that is used for DVD is transmitted by it.Intermediate lens 40 aggregation laser bundles.Catoptron (it is abbreviated as " RM ") 50 is reflected most of laser beam and makes the part laser beam transmission.Here, for example can use half-reflecting mirror to replace catoptron 50.Object lens (it is abbreviated as " OBL ") 60 are used to make from LD 20 emitted laser bundles and focus on CD, for example CD or DVD.It also is in the lens mount of being made by synthetic resin 65 that the object lens of being made by synthetic resin 60 are contained in.

See through the half-reflecting mirror 55 that is installed in the frame main body 5H (Fig. 1-5) from the part laser beam of CD reflection, then, see through and be essentially rectangle, be arranged on the opening portion 5D of the more front of half-reflecting mirror 55, and shine on the photodetector 10 (Fig. 1 and 6) that is arranged on frame main body 5H outside.Photodetector 10 is arranged on from the optical axis extended line of the part laser beam of CD reflection.Photodetector 10 receives laser and converts light signal to electric signal, and passes through the servo control mechanism (Fig. 6) of actuator 30, makes to keep the lens mount 60 of OBL 60 to move to suitable position.

Half-reflecting mirror 55 (Fig. 1-5) is abbreviated as " HM ", and its transmissive portions divides laser beam and reflecting part laser beam.As used herein, actuator is meant the device that is used for moving and adjusting certain objects.Actuator 30 (Fig. 6) comprises the coil that is roughly rectangular column of the inside surface that twines lens mount 65 and is arranged near the coil 32 magnet.In addition, actuator 30 comprises the lens mount 65 with coil that electric current flows through.30 pairs of actuators hold the lens mount 65 of OBL 60 and carry out focus control and tracking Control.

In addition, for example, shown in Fig. 1-6, monitor diode (not shown) before further preferably optic pick-up is provided with is used for monitoring from LD 20 emitted laser bundles and feedback is provided, so that control LD 20.

LDD, LD 20 (Fig. 1 and 6), actuator 30 (Fig. 6), PDIC 10 (Fig. 1 and 6) and capacitor 91 (Fig. 1 and 6) and 92 (Fig. 6) are connected to flexible print circuit 100 with electric connection mode.In addition, the various electricity/electronic components that comprise PDIC 10, LD 20 and electric capacity 91 and 92 are installed on the flexible print circuit 100.

As shown in Figure 1, flexible print circuit 100 comprises the main circuit part 101 that constitutes flexible print circuit 100 main bodys and from the sub-circuit portion 110,120 and 130 of main circuit part 101 branches.Flexible print circuit 100 forms the thin-walled circuit board with superior flexibility.

Flexible print circuit 100 (Fig. 1 and 6) comprises main circuit part 101, connector part 105, first sub-circuit portion 110, second sub-circuit portion 120 and the 3rd sub-circuit portion 130.Main circuit part 101 constitutes the main body of flexible print circuit 100.Connector part 105 is formed on the main circuit part 101 and is connected to the counting circuit plate.First sub-circuit portion 110 is from 101 extensions of main circuit part and be connected to PDIC 10, is used to be electrically connected PDIC 10.Second sub-circuit portion 120 is from 101 extensions of main circuit part and be connected to dual wavelength LD 20, is used to be electrically connected LD 20.Tertiary circuit part 130 (Fig. 1) is from 101 extensions of main circuit part and be connected to the actuator 30 (Fig. 6) that drives lens mount 65, is used to be electrically connected actuator 30.

Flexible printed circuit board is as flexible print circuit 100 (Fig. 1 and 6).For example Copper Foil and the protective seam (not shown) that is formed on these sheets form FPC by the insulating trip that has printed many circuit lead (not shown) on it, the metal forming (not shown) that is parallel to the insulating trip setting.In Fig. 1 and 6, for convenience's sake, show FPC 100 in simplified form, and omitted circuit lead.

The LD seat 25 (Fig. 2 and 3), diffraction grating 70, prism 80, intermediate lens 40, RM 50, HM 55, PDIC 10 (Fig. 1 and 6) and the FPC 100 that hold LD 20 are installed in the frame 5.And the actuator 30 (Fig. 6) that objective holder 60 is driven into correct position also is arranged in the frame 5.Optic pick-up 1 comprises above-mentioned various structural member.

Frame 5 (Fig. 2 and 3) comprises frame main body 5H (Fig. 2 and 3), is used to store diffraction grating 70, prism 80, intermediate lens 40, RM 50, HM 55, the lens mount 65 that comprises OBL 60 (Fig. 6) and actuator 30.The profile of frame main body 5H is formed by the peripheral wall 5B that peripheral wall 5A that comprises substrate wall 5Ab at least and edge are substantially perpendicular to the direction extension of substrate wall 5Ab.Among the lens mount 65 (Fig. 6) of diffraction grating 70, prism 80, intermediate lens 40, RM 50, HM 55, maintenance OBL60 and the big rack section 5C that actuator 30 is contained in frame main body 5H.

In addition, frame 5 comprises frame main body 5H, the first guiding parts 5I and two second guiding parts 5II.Above-mentioned each element is installed among the frame main body 5H.The first guiding parts 5I is from frame main body 5H extension and first axis of guide (not shown) is housed.The second guiding parts 5II extends along the direction opposite with the first guiding parts 5I from frame main body 5H, and second axis of guide (not shown) is housed.

The first guiding parts 5I and the second guiding parts 5II are by injection moulding and the whole formation of frame main body 5H.The first guiding parts 5I and the second guiding parts 5II use with frame main body 5H identical materials and make.The method that injection moulding forms frame 5 makes it might make large batch of frame 5 effectively, has both made frame 5 have complicated shape shown in Fig. 2 and 4.

Shown in Fig. 1-6, optic pick-up 1 comprise at least the LD 20 of emission of lasering beam and make by heat-resisting synthetic polymer its on LD 20 is installed frame 5.The main body of LD 20 be contained in be made of metal and profile in the pedestal 25H of LD seat 25 of protection LD 20.Pedestal 25H has the shape of the rectangular box of being essentially, and LD 20 is mounted in it.The heat that produces from LD 20 is delivered to the metal LD seat 25.Can distribute the heat that produces by LD 20 immediately and the projecting part 27 (Fig. 1,2 and 4) that is essentially the rectangle cylindricality is arranged among the pedestal 25H that forms LD seat 25.Projecting part 27 is positioned at the rack unit 5C of whole frame 5.More particularly, projecting part 27 is positioned at the rack unit 5C by the peripheral wall 5A encirclement of frame 5.

The structure of above-mentioned optic pick-up 1 makes it distribute the heat that is produced by LD20 by whole LD seat 25 easily, and whole LD seat 25 is made of metal and comprises and be arranged on the guard block 27 that is used to protect LD 20 on the LD seat 25.Because guard block 27 has the cylindricality of the substantial rectangular that is used to distribute the heat that is produced by LD20, it is arranged on the pedestal 25H of the LD seat 25 that holds LD 20, thereby increases the surface area of whole LD seat 25.The projecting part 27 that forms on LD seat 25 plays for example heat radiator effect of electricity/electronic element radiating of LD 20 of quickening.Therefore, can prevent from holding the LD seat 25 of LD 20, to gather heat, thereby help by whole LD seat 25 heat radiations.

Can prevent that like this LD from can not launch the problem of fixed wave length laser beam.Particularly, raise because suppress the LD20 temperature, LD 20 can launch the laser beam of fixed wave length.Heat radiator is meant the metalwork that absorbs and distribute the heat that the CPU by computing machine etc. produces.

The projecting part 27 that is used to distribute the LD seat 25 of the heat that is produced by LD 20 is arranged in the rack unit 5C of whole frame 5.The projecting part 27 that so also can prevent LD seat 25 is outwards outstanding from optic pick-up 1.Projecting part 27 is positioned at the rack unit 5C of the peripheral wall 5A encirclement of frame 5.When assembling optic pick-up 1, this structure prevents that the projecting part 27 of LD seat 25 is outwards outstanding from optic pick-up 1.

Therefore, the device of the compact size that optic pick-up 1 constitutes as a whole, as shown in Figure 6.The rack unit 5C of the rack unit 5C of frame 5 or whole frame 5 refers to as used herein, the frame chamber 5C that is surrounded by substrate wall 5Ab that forms frame main body 5H and the peripheral wall 5B that extends along the direction that is substantially perpendicular to substrate wall 5Ab.

Preferably, have the low zinc-bearing alloy of superior etch resistant properties and cost and be used for LD seat 25.Zinc and aluminium are the non-ferrous metals with superior etch resistant properties and proportion lower than ferrous metal.For example use this non-ferrous metal, zinc, aluminium or contain zinc and the alloy of aluminium can prevent that LD seat 25 from getting rusty, and heat radiation that can LD seat 25 preferably.

The projecting part 27 of LD seat 25 (Fig. 1,2 and 4) had both formed the thermal component that is used to quicken LD 20 heat radiations that is essentially the rectangular column shape, form the seat holding components that is essentially the rectangular column shape again, when colliding frame 5 unintentionally, it prevents that LD seat 25 breaks away from frame 5.

More particularly, form heat radiation and supporter from pedestal 25H projecting part 27 outstanding, that be essentially rectangular column shape, formation LD seat 25, it is both as being used to quicken LD 20 heat sink strips heat radiation, that be essentially rectangular bar shapes, support bar as the seat that is essentially rectangular bar shapes again, it prevents that LD seat 25 breaks away from frame 5 when being not intended to collide frame 5.

Because this heat radiation and the supporter 27 that are provided with in LD seat 25, heat is distributed immediately by whole LD seat 25.In addition, even be not intended to collide frame 5, it prevents easily that also the LD seat 25 that holds LD 20 breaks away from frame 5.Therefore, even device is loaded and unloaded by rough, it also can provide the optic pick-up 1 of anti-damage.

The projecting part that is essentially the rectangular column shape 27 outstanding on the pedestal 25H that constitutes LD seat 25 is the single projecting parts 27 that are essentially rectangular bar-shaped, and it forms the rectangular parallelepiped protrusion part of elongating.The frame main body 5H (Fig. 2 and 4) that constitutes frame 5 comprises that the projecting part 27 of LD seat 25 can insert wherein corresponding to receiving-member 5F single projecting part 27, that be essentially the rectangle elongated shape.

The frame 5 of said structure makes the projecting parts 27 on the outstanding main body 25H that is formed on the LD seat 25 that holds LD 20 insert at an easy rate among the predetermined receiving-member 5F on the main body 5H that is formed on frame 5.Therefore, LD seat 25 can be easily mounted on the frame 5.

In addition, be essentially the receiving-member 5F that rectangle elongates box-like because on frame, formed, the single projecting part 27 that is essentially rectangular bar-shaped that is provided with on LD seat 25 can insert wherein, the LD seat 25 that the fracture of optic pick-up 1 from causing so it is easy to prevent breaks away from the problem of frames 5, has both made at optic pick-up 1 to be loaded and unloaded by roughness sometimes and when making collision be applied on the frame 5 of optic pick-up 1.Thereby can provide the optic pick-up 1 of anti-damage.

The opening features 5E of the basic rectangular shape of the frame main body 5H by forming frame 5, the projecting part that is essentially rectangular bar-shaped 27 that is provided with on LD seat 25 are inserted into and are essentially among the receiving-member 5F that rectangle elongates box-like.By this way, LD seat 25 inserts and is installed on the frame 5.

Shown in Fig. 1-6, a plurality of thin-walled heat radiator 28 are arranged on the main body 25H of LD seat 25, are used to distribute the heat of LD seat 25.With this heat radiator that is provided with on the main body 25H of LD seat 25 28, the heat built-up that can prevent LD 20 generations is in LD seat 25.This will further prevent from being contained in the wavelength significant change of the LD 20 emitted laser bundles in the LD seat 25.

In addition,, can prevent heat built-up in optic pick-up 1, cause that the temperature anomaly of optic pick-up 1 raises owing to use LD seat 25 with superior heat dispersion.This has also further been avoided using optic pick-up 1 under the very large condition of temperature variation.

Form each heat radiator 28, make it be carved into a main body 25H, rather than outstanding from the main body 25H of LD seat 25.Thereby, be carved into the pedestal 25H of LD seat 25 and a plurality of thin-walled heat radiator 28 of forming, and be essentially rectangular bar-shaped, be formed difference and the element that separates with supporter 27 from the outwards outstanding single heat radiation that is provided with of the main body 25H of LD seat 25.

Be formed the bar shaped that substantial rectangular is elongated from the outstanding projecting part that is essentially plain film shape 27 (Fig. 1,2 and 4) that is provided with of the pedestal 25H that forms LD seat 25, and comprise a side (first side) 27a that is essentially planar shaped and the another side that is essentially planar shaped (second side) 27b that is arranged on the first side 27a opposite side.

In addition, the receiving-member 5F (Fig. 2 and 4) that is arranged among the frame main body 5H of frame 5 forms elongated shape, its have corresponding to a side of the projecting part 27 of LD seat 25 (first side) 27a, be essentially a sidewall (the first side wall) 5Fa of flat shape and corresponding to another side (second side) 27b of the projecting part 27 of LD seat 25, be essentially another sidewall (second sidewall) 5Fb of flat shape.

Be essentially flat shape, be used to connect connecting wall 5G1 (Fig. 2), 5G2 and the 5G3 (Fig. 4) of a sidewall 5Fa and another sidewall 5Fb, the whole formation of frame 5H of itself and frame 5 constitutes the receiving-member 5F that elongates.In the upper and lower of the receiving-member 5F of the elongation of frame 5 the zigzag pattern is set with the integrally formed connecting wall 5G1 of the frame 5H of frame 5 (Fig. 2), 5G2 and 5G3 (Fig. 4).

Use this structure, the heat energy that produces from the LD 20 that is contained in the LD seat 25 enough discharges from frame 5, can not rest in the receiving-member 5F of frame 5, can receive the outshot 27 of LD seat 25 among the receiving-member 5F.Specifically, the heat that produces from the LD 20 that are contained in the LD seat 25 is the outside that is dispersed into frame 5 of each opening portion 5F1 (Fig. 2 and 3), 5F2 (Figure 4 and 5) and the 5F3 by frame 5 mainly, each opening portion 5F1,5F2 and 5F3 are arranged on the zone, upper and lower of receiving-member 5F, and connecting wall 5G1,5G2 and the 5G3 of zigzag wherein is not set.

In addition, both made to be not intended to collide the frame 5 that forms optic pick-up 1, and also can prevent the obvious displacement of the installation site of LD seat 25 relative frames 5.Specifically, when collision comprises the optic pick-up 1 of frame 5 unintentionally, the projecting part 27 of LD seat 25 bumps against a sidewall 5Fa or another sidewall 5Fb that forms receiving-member 5F, or connects a sidewall 5Fa and another sidewall 5Fb and be arranged to connecting wall 5G1,5G2 and the 5G3 of zigzag pattern.Therefore, when colliding optic pick-up 1, because bumping against, the projecting part 27 of LD seat 25 forms the wall of receiving-member, so the not further displacement of the position of the projecting part 27 of LD seat 25 by 5F.Therefore, even be not intended to collide frame 5, can avoid also comprising that the LD seat 25 of LD 20 breaks away from the problem of frame 5 and 1 fracture of consequent optic pick-up.

The frame main body 5H of frame 5 comprises the heat radiation that can hold LD seat 25 and the reception space 5F of supporter 27, the heat radiation and the supporter 27 (Fig. 2 and 4) that are provided with corresponding to the pedestal 25H at LD seat 25.Outstanding heat radiation that forms and supporter 27 are as forming less than the parts of the reception space 5F that forms on the main body 5H of frame 5 on the pedestal 25H of LD seat 25.Thereby the heat radiation of LD seat 25 and supporter 27 can insert the predetermined reception space 5F of frame 5, make and leave the gap between two parts.Specifically, the heat radiation of LD seat 25 and supporter 27 are received space 5F and receive, so that when LD seat 25 is installed on the frame 5, can adjust the installation site of LD seat 25 relative frames 5.

Use said structure, when LD 20 is installed on the frame 5, can easily adjust the installation site of the LD 20 that is contained in the LD seat 25, LD seat 25 comprises heat radiation and supporter 27.Because the heat radiation of LD seat 25 can be adjusted by the relative predetermined reception space 5F that is provided with on frame 5 with supporter 27, can accurately be installed on the frame 5 so comprise the LD seat 25 of LD 20.In addition, the structural detail of light path system also can accurately be installed, for example LD 20, diffraction grating 70 and prism 80.

On frame 5, also form guide 5Bj, be used to make things convenient for the location (Fig. 1 and 4) of LD seat 25 relative frames 5, and the pairing guide 25Bj corresponding to guide 5Bj also is set on LD seat 25.When being installed to LD seat 25 on the frame 5, the pairing guide 25Bj of LD seat 25 is installed among the guide 5Bj of frame 5, thereby LD seat 25 can be provided with and be installed on the frame 5.

More particularly, corresponding to the recessed guide 5Bj that on the sidewall 5Bi of the peripheral wall 5B that constitutes frame main body 5H, is provided with, on the sidewall 5Bi of the peripheral wall 5B that constitutes frame main body 5H, be provided for the recessed guide 5Bj that convenient relative frame 5 is adjusted the installation site of LD seat 25.In addition, on the sidewall 25Bi of the pedestal 25H that constitutes LD seat 25, be provided for the protruding guide 25Bj that convenient relative frame 5 is adjusted the installation site of LD seat 25.

In comprising the optic pick-up 1 of guide 5Bj and 25Bj as mentioned above, the LD seat 25 that holds LD20 can be easily mounted on the frame 5, is in the accurately states (Fig. 3 and 5) of location of LD seat 25.Structure on the frame 5 can be installed in accurately by the LD seat 25 that wherein holds LD 20, high-precision optic pick-up 1 can be realized.

In addition, because the pairing guide 25Bj of LD seat 25 packs among the guide 5Bj of frame 5, optic pick-up 1 was loaded and unloaded by roughness sometimes and the frame 5 that forms optic pick-up 1 is clashed into, LD seat 25 also is not easy to break away from frame 5.Therefore, can prevent optic pick-up 1 fracture.The optic pick-up that carries out position adjustment and anti-jitter easily also can be provided.

When LD seat 25 was installed to frame 5 (Fig. 1-5), a sidewall 25Bi who forms the pedestal 25H of LD seat 25 alignd with the sidewall 5Bi of the peripheral wall 5B of the main body 5H that forms frame 5.In addition, when LD seat 25 is packed frame 5 into, be used to carry out bonding operation by applying the light-curing adhesive 200 (Fig. 3 and 5) that light solidifies thereon, so that LD seat 25 is fixed on the frame 5.More particularly, when being installed to LD seat 25 on the frame 5 (Fig. 1-5), the ultraviolet curing bonding agent 200 (Fig. 3 and 5) that solidifies with ultraviolet ray irradiation carries out bonding, thereby LD seat 25 is fixed on the frame 5.In the accompanying drawings, for convenience's sake, with solid black region representation bonding agent 200.

By using for example bonding processing of ultraviolet curing bonding agent 200 of light-curing adhesive 200, be used to keep the LD seat 25 of LD 20 to be fixed to frame 5 easily and promptly.Shine light-curing adhesive 200 acceleration by light the solidification of light-curing adhesive 200, thereby LD seat 25 is bonded on the frame 5.More particularly, with ultraviolet irradiation ultraviolet radiation curing adhesive 200, quicken the solidification of ultraviolet curing bonding agent 200, thereby LD seat 25 is bonded on the frame 5 immediately.In addition, for example ultraviolet curing bonding agent 200 is as bonding agent owing to use light-curing adhesive 200, and LD seat 25 is fixed to frame 5 accurately.Therefore, can provide LD seat 25 wherein to be fixed to the high-precision optical pick device 1 of frame 5 exactly.

Light-curing adhesive 200 for example ultraviolet curing bonding agent 200 (Fig. 3) is applied to an edge part (first marginal portion) 5Bp (Fig. 1 and Fig. 3) of a sidewall 5Bi of the peripheral wall 5B of the main body 5H that forms frame 5.Specifically, bonding agent 200 is applied to the upper end 5Bp of the sidewall 5Bi of the peripheral wall 5B that forms frame main body 5H.

And light-curing adhesive 200 for example ultraviolet curing bonding agent 200 (Fig. 3) is applied to an edge part (first marginal portion) 25Bp (Fig. 1-Fig. 3) of the sidewall 25Bi of the main body 25H that forms LD seat 25.Specifically, bonding agent 200 is applied to the upper end 25Bp of a sidewall 25Bi who forms LD pedestal 25H.

Apply bonding agent 200 (Fig. 3), so that the edge part 25Bp (Fig. 3) of the sidewall 25Bi of the main body 25H of the edge part 5Bp (Fig. 1-3) of the sidewall 5Bi of the main body 5H of bridge joint formation frame 5 and formation LD seat 25.Because the solidifying of bonding agent 200, be formed for the coupling part 200 of the main body 25H of the main body 5H of strong bond frame 5 and LD seat 25.

In addition, light-curing adhesive 200 for example ultraviolet curing bonding agent 200 (Fig. 5) be applied to another marginal portion (second marginal portion) 5Bq (Figure 4 and 5) of a sidewall 5Bi of the peripheral wall 5B of the main body 5H that forms frame 5.Specifically, bonding agent 200 is applied to another marginal portion (second marginal portion) 5Bq (Figure 4 and 5) at an edge part (first marginal portion) the 5Bp opposite side of a sidewall 5Bi.In other words, bonding agent 200 is applied to the bottom 5Bq of the sidewall 5Bi of the peripheral wall 5B that forms frame main body 5H.

And light-curing adhesive 200 for example ultraviolet curing bonding agent 200 (Fig. 5) is applied to another marginal portion (second marginal portion) 25Bq (Figure 4 and 5) of the sidewall 25Bi of the main body 25H that forms LD seat 25.Specifically, another marginal portion (second marginal portion) 25Bq (Fig. 1-3) of an edge part (first marginal portion) 25Bp (Fig. 1-3) opposite side that is applied at a sidewall 25Bi of bonding agent 200.In other words, bonding agent 200 is applied to the bottom 25Bq of a sidewall 25Bi who forms LD pedestal 25H.

Apply bonding agent 200 (Fig. 5), so that another marginal portion 25Bq (Fig. 3) of the sidewall 25Bi of the main body 25H of another marginal portion 5Bq (Figure 4 and 5) of the sidewall 5Bi of the main body 5H of bridge joint formation frame 5 and formation LD seat 25.Because the solidifying of bonding agent 200, be formed for the coupling part 200 of the main body 25H of the main body 5H of strong bond frame 5 and LD seat 25.

Upper end by bonding agent 200 being applied to frame 5 and LD seat 25 respectively and bottom 5Bp, 5Bq, 25Bp, 25Bq then, solidify to form tie point 200 bonding agent 200, and LD seat 25 can be fixed firmly on the frame 5.Here, the range of size of coupling part 200 is at basic first grain of rice with basically between the size of a grain of rice.

As a kind of example of ultraviolet curing bonding agent of light-curing adhesive, for example comprise the optics UV bonding agent NOA 60 and the NOA 77 that make by U.S. Norland Products company.Ultraviolet curing bonding agent for example optics UV bonding agent NOA 60 and NOA 77 is acrylic adhesive and single composition ultraviolet curing bonding agent, and it does not need mixing material on request when using two composition ultraviolet curing bonding agent.Therefore, carry out applying of bonding agent at a high speed effectively.Here, " UV " is meant " ultraviolet ray ", thereby the ultraviolet curing bonding agent is called the UV curing adhesive.According to design specifications of optic pick-up and flexible print circuit etc., two composition UV-adhesive for example can be used for bonding processing.Here, two composition ultraviolet curing bonding agents for example comprise two composition epoxy ultraviolet curing bonding agents.

With reference to Fig. 1 and 6, be used for being installed in optic pick-up 1 to the FPC 100 (Fig. 1 and 6) of LD 20 power supply streams.The LD 20 that remains on LD seat 25 is connected to coupling part 123, to such an extent as to realize with second sub-circuit portion 120 that is arranged on FPC 100 between be electrically connected.Welding is from the terminal part 24 of the LD seat 25 outside LD 20 that give prominence to and the conductor part (not shown) of the coupling part 123 of second sub-circuit portion 120 of FPC 100, thereby LD 20 is connected to FPC 100, is used for electrical connection (Fig. 6) between the two.

Specifically, from the outside through hole 124 (Fig. 1-6) the coupling part 123 of second sub-circuit portion 120 of terminal part 24 (Fig. 1-5) by being arranged on FPC 100 of outstanding LD 20 of LD seat 25, penetrate the coupling part 123 of second sub-circuit portion 120 of FPC 100.At this state, be soldered to from the outwards outstanding terminals 24 (Fig. 6) of LD seat 25 on the circuit lead (not shown) of second sub-circuit portion 120 of FPC 100, be used to realize and being electrically connected of the circuit lead (not shown) of FPC 100.

In addition, second sub-circuit portion 120 of FPC 100 is provided with along the peripheral wall 5B (Fig. 1-3 and 6) that forms frame 5.The peripheral wall 5B (Fig. 6) that forms frame 5 extends near the coupling part 123 of second sub-circuit portion 120 of FPC 100.Be arranged on the guide arm 5Ba of peripheral wall 5B in the outside of another sidewall 5Fb that forms receiving-member 5F, extend near the coupling part 123 of second sub-circuit portion 120 of FPC 100, and second sub-circuit portion 120 of guiding FPC 100.

Use said structure, both made to be not intended to collide the frame 5 that forms optic pick-up 1, also be easy to prevent to be used to keep the LD seat 25 of LD 20 to break away from frame 5, thereby prevent optic pick-up 1 damage.From the terminal part 24 of the LD seat 25 outside LD 20 that give prominence to and the conductor part of the coupling part 123 of second sub-circuit portion 120 of FPC 100, keep the LD seat 25 of LD 20 to be securely fixed in more on the frame 5 by welding.

In addition, second sub-circuit portion 120 of FPC 100 is provided with along the guide wall 5Ba of the peripheral wall 5B that forms frames 5, and the guide wall 5Ba that forms the peripheral wall 5B of frame 5 is configured to extend near the coupling part 123 of second sub-circuit portion 120 of FPC 100.This structure also makes FPC 100 be fixed to frame 5 more firmly.What so further make the coupling part 123 that is welded to second sub-circuit portion 120 that forms FPC 100 is used to that to keep the LD seat 25 relative frames 5 of LD 20 be stable.Therefore, be easy to prevent to keep the LD seat 25 of LD 20 to break away from frame 5, and avoid the problem of damage optic pick-up 1 when being not intended to collide optic pick-up 1.

For example various electricity/electronic components of PDIC 10 and LD 20 are connected to flexible print circuit 100 by welding, to realize electrical connection between the two.Therefore, heat-resisting synthetic polymer, for example heat-resisting superior polyimide resin is used as the base part of FPC 100.Polyimide (polymide) is abbreviated as " PI ".The FPC that forms base part with polyimide resin for example comprises NittoFlex (registered trademark) that is made by Nitto Denko company and the Kapton (registered trademark) that is made by DU PONT-TORAY company.

NittoFlex (registered trademark) product of Nitto Denko company for example comprises high precision FPC (double-side type), high precision FPC, miniature access FPC, high insulation resistance reliability FPC, high heat-resisting FPC, high flexible life FPC etc.Kapton (registered trademark) product of DU PONT-TORAY company for example comprises H type, V-arrangement, super V-type, EN type, KJ type etc.The Kapton (registered trademark) of DU PONT-TORAY company can be used in very wide temperature range, from about-269 ℃ ultralow temperature to about+400 ℃ high temperature.

In addition, use considers that environmental factor and lead-free so-called lead-free solder are as welding compound.When optic pick-up 1 or the flexible print circuit 100 that is installed to optic pick-up 1 go out of use, use lead-free solder can prevent that physical environment is subjected to plumbous adverse effect.The example of lead-free solder for example comprises the ECO SOLDER M30 that is made by Senju metal industry company.In addition, the example of reflow type lead-free solder comprises the ECOSOLDER L21 that is made by Senju metal industry company.Here, common welding compound can be used for replacing lead-free solder.The example of ordinary solder for example comprises the SPARKLE PASTE OZ series of being made by Senju metal industry company.

In the example of welding method, be applied to major part with the reflow soldering agent with the emulsus form, for example will weld in the container that object is placed on reflux solder, wherein reflux solder fuses being approximately under 240-250 ℃ the temperature, then, cooling object is finished the soldering of object so gradually.Because the base part of FPC 100 is formed by the polyimide of the desired anti-about 240-250 ℃ temperature of soldering, FPC 100 is out of shape owing to being heated so for example can prevent.

Here, use heat-proof polyimide, its be exposed to about 250-400 ℃ pine for can not cause for example thermal deformation of any defective.Use heat resisting temperature the device of about polyimide below 250 ℃ not ability live in to state the temperature that soldering requires.On the other hand, use heat resisting temperature to be approximately 400 ℃ or to be higher than 400 ℃ device very expensive, and be unfavorable for producing in enormous quantities.For example, use when be exposed to can not cause in about 300 ℃ temperature any defective for example the device of the heat-proof polyimide of thermal deformation can enough withstand above-mentioned soldering.

Form the frame 5 (Fig. 2 and 4) of optic pick-up 1 by the thermoplastic synthetic resin material, this material can be used for injection moulding and heat-resisting.

Can be used for also heat-resisting thermoplastic synthetic resin material's frame 5 of injection moulding by forming, the optic pick-up 1 of weight reduction can be supplied with for example assembly merchant of optical disc apparatus.The weight that also needs the optical disc apparatus (not shown) that further alleviates optic pick-up 1 or comprise optic pick-up 1.In this, when by can be used for injection moulding and the heat-resisting formed frame of plastic synthetic resin material and be installed to optic pick-up 1 time, can obtain the optic pick-up 1 of weight reduction.Specifically, replace metal material to form frame 5, can obtain the frame 5 of weight reduction as base material by utilizing the synthetic resin material.

About thermal conductivity, the frame 5 that metal material forms is better than the frame 5 that resin material forms.But, because keep the pedestal 25H of the LD seat 25 of LD 20 to comprise the projecting part 27 that is essentially the rectangle cylindricality, be used to quicken directly distributing of the heat that self produces by LD 20, can prevent in the LD 20 of heat accumulation in remaining on LD seat 25 that LD 20 self produces.Therefore, thus can solve from the wavelength variations of LD 20 emitted laser bundles and stop from the problem of the laser beam of LD 20 emission fixed wave length.More particularly, according to the present invention, the frame 5 that optic pick-up 1 had been adopted utilize synthetic resin is to alleviate the weight of optic pick-up 1, and LD 20 also can launch the laser beam of fixed wave length.

The example that can be used for injection moulding and heat-resisting plastic synthetic resin material comprises the polyarylene sulfide resin, for example has the polyphenylene sulfide that superior electrical characteristics for example comprise thermal stability and insulativity, mechanical property, dimensional stability etc.Polyphenylene sulfide is abbreviated as " PPS ".Strong heat-resisting serial DIC-PPS glass fibre (cross-couplings type) FZ-1130-D5 that uses polyphenylens sulfide resin for example to comprise to make etc. by DainipponInk and Chemicals company as the synthetic resin material of base material.Glass fibre adds in the base material, can strengthen the mechanical property of frame 5 etc.In the present embodiment, frame 5 can form with PPS.

As mentioned above, utilize synthetic polymer for example PPS form frame 5 as base material by injection moulding.By adopting based on injection molding forming method, can make a large amount of frame 5 effectively, both made frame 5 have the shape of the complexity shown in Fig. 2 and 4.In addition, have than the lightweight frame 5 of the frame that forms by metal, cause the weight saving of optic pick-up 1 by using for example PPS of synthetic resin, can forming.Further cause being equipped with the weight saving of the optical disc apparatus (not shown) of optic pick-up 1.

Alternatively, according to the design specifications of optic pick-up etc., can use non-ferrous metal for example zinc and aluminium or contain zinc or the alloy of aluminium replaces for example PPS of synthetic resin.Zinc and aluminium are to have good corrosion stability and than the non-ferrous metal of the light specific gravity of iron.

Now, describe that with reference to Fig. 1-6 the LD seat 25 that is made of metal is installed to frame 5 processes of being made by synthetic resin that are used to assemble optic pick-up 1, LD seat 25 holds LD 20 and comprises and be used to the projecting part 27 that dispels the heat and support in pedestal 25H.

As shown in Figure 2, diffraction grating 70, prism 80, intermediate lens 40, RM 50, HM 55 etc. are contained in the rack unit 5C that is formed by the peripheral wall 5A that constitutes frame 5.In addition, the actuator 30 that is used for object lens 60 (Fig. 6) are moved to correct position also is formed in the rack unit 5C of frame 5.In addition, shown in Fig. 2-5, keep the seat 25 of LD 20 to be installed on the frame 5.

Then, shown in Fig. 3 and 5, the UV-adhesive 200 that will be used for LD seat 25 is fixed to frame 5 is applied to LD seat 25 and frame 5.With ultraviolet irradiation ultraviolet radiation curing adhesive, be used for curing adhesive 200, thereby securely LD seat 25 be fixed on the frame 5.

Subsequently, frame 5 is aimed in the mounting portion 108 that comprises the flexible print circuit 100 of PDIC (Fig. 1), LD 20 and be arranged on the coil that other the various electricity/electronic components on the frame 5 for example form actuator 30 and be connected to flexible print circuit 100, thus can realize electrical connection (Fig. 6) between the two.

Then, cover the upper surface of frame 5, be used to protect the various elements in the frame 5 with cover plate 150.Form and have the cover plate 150 of superior thermal diffusivity by metal, comprise the black encirclement part of making by synthetic polymer and forms around lens mount 65 160.

First axis of guide (not shown) is installed among the first guide 5I of frame 5, and second axis of guide (not shown) is installed among the second guide 5II of frame 5.Then, when it was supported by first and second axis of guides, optic pick-up 1 can move.Use the heat-resisting synthetic polymer identical as base material, form each guide 5I and 5II of being arranged on the frame 5, thereby they have superior stability with frame main body 5H material therefor.The frame 5 of optic pick-up 1 can be basically vertically moving along the main circuit part 101 of flexible print circuit 100.

Optic pick-up 1 can be installed on the optical disc apparatus of being diverted to data read, and for example, it is with respect to CD-ROM and DVD-ROM.In addition, optic pick-up 1 can be installed in corresponding to for example read-only optical disc of CD-ROM, DVD-ROM, for example CD-R, DVD-R and DVD+R write down (write-once) CD, and for example CD-RW, DVD-RW, DVD+RW, DVD-RAM, HD-DVD and Blu-ray disc write/can wipe or the optical disc apparatus of CD-RW in.

In addition, optical disc apparatus with optic pick-up 1 can be installed in the audio/video device (not shown) of the audio devices of personal computer, for example CD Player of for example laptop PC (not shown) and desktop PC (not shown) and for example DVD player.Hereinafter, personal computer is abbreviated as " PC ".In addition, optical disc apparatus can be used for multiple media, comprises CD CD and DVD CD.

Optical disc apparatus forms player (not shown) etc., wherein can use CD and/or DVD.Installation and use CD Player, DVD player maybe can be used for the player of CD and DVD in PC on knee or static state (desktop) PC.Desktop PC is the computing machine of the difficult transportation that can use on the table.

Requirement is more in light weight than desktop PC to be equipped with the optical disc apparatus (not shown) that forms small driver with PC on knee thin thickness.PC on knee has the structure different with desktop PC.Particularly, PC on knee comprises display and integrally formed personal computer main frame.By display being folded on the personal computer main frame, PC on knee is reduced to very thin size.When folding, PC on knee is as having A4 size or littler multi-purpose computer.PC on knee is also referred to as book-type PC (notebook PC) and transportation easily.

The frame 5 (Fig. 1-6) that constitutes optic pick-up 1 can be contained in the small PC dish device on knee.Therefore, frame 5 forms thin and flat basically shape.

Because be used for directly distributing heat radiation projecting part 27 (Fig. 1 from the heat of LD 20 generations, 2 and 4) in the pedestal 25H that forms LD seat 25, form, the optic pick-up 1 that comprises LD 20 and LD seat 25 was installed in had been exposed to than in the PC dish device on knee under the worse operational temperature conditions of desktop PC dish device,, optic pick-up 1 also can proper function.

Recently the PC on knee of development has improved performance, and also be tending towards having littler size, lighter weight and thinner thickness.Optic pick-up also has size, weight and the thickness that reduces.In addition, along with the raising of performance, PC on knee produces a large amount of heat.Therefore, because PC on knee is less than desktop PC, and because the performance of PC on knee improves, the inside of PC on knee may have the temperature higher than desktop PC.Therefore, the optic pick-up 1 that is provided with in PC dish device on knee may be exposed in the high temperature and the influence of being heated.The optic pick-up 1 that is arranged in the PC dish device on knee for example uses under about 0 ℃-70 ℃ temperature conditions.

But when the LD seat 25 that keeps LD 20 comprised the heat radiation projecting part 27 that is used for directly distributing the heat that produces from LD 20, suppressing as mentioned above, the temperature of LD 20 raise.The temperature that suppresses LD 20 raises and makes the laser beam of LD 20 emission fixed wave length.Thereby can prevent the significant change of the LD 20 emitted laser Shu Bochang of the optic pick-up 1 from be arranged on PC dish device on knee.

Optic pick-up of the present invention is not limited to example illustrated.For example, optic pick-up of the present invention can be installed in PC or cooling device is set for example in the audio/video devices of cooling fan.In addition, optic pick-up of the present invention can be installed in PC or cooling device is not set for example in the audio/video devices of cooling fan.

In addition, the present invention can be applicable to such optic pick-up, and first sub-circuit portion 110 that wherein constitutes flexible print circuit 100 comprises support chip made of aluminum or the support chip of being made by heat-resistant synthetic resin; Perhaps can be applicable to such optic pick-up, first sub-circuit portion 110 that wherein constitutes flexible print circuit 100 does not comprise support chip made of aluminum or the support chip of being made by heat-resistant synthetic resin.

Although the preferred embodiments of the present invention of having used specific term description, these descriptions only are for purposes of illustration, should be appreciated that, do not depart from the spirit and scope of accessory claim, can make changing and modification.

Claims (8)

1. optic pick-up comprises:

Light-emitting component is used for emission of lasering beam; With

Frame, light-emitting component are installed in wherein,

Wherein

Light-emitting component is contained in the seat that is used for protecting light-emitting component,

Described seat comprises the projecting part that is used to distribute the heat that is produced by light-emitting component,

Projecting part is positioned at frame, and projecting part prevents that as being used to seat breaks away from the seat holding components of frame again both as the thermal component that is used to increase the light-emitting component heat radiation when colliding frame,

Projecting part forms and is essentially rectangular bar-shaped, and comprises first side and second side that is provided with in the first side thereof opposite side,

Receiving-member comprises corresponding to the first side wall of first side with corresponding to second sidewall of second side, and

Be provided for connecting the connecting wall of the first side wall and second sidewall, connecting wall is with the upper and lower of zigzag pattern setting at receiving-member.

2. optic pick-up as claimed in claim 1, wherein

Projecting part form single projecting part and

In frame, projecting part is set and inserts wherein receiving-member corresponding to projecting part.

3. optic pick-up as claimed in claim 1, wherein

In frame, can insert the receiving-member of projecting part corresponding to the projecting part setting of seat,

Projecting part forms size also can insert receiving-member less than receiving-member, leaves the gap simultaneously between projecting part and receiving-member, and

When seat was installed on the frame, projecting part was contained in the receiving-member, thereby the relative frame of energy is adjusted the installation site of seat.

4. optic pick-up as claimed in claim 2, wherein

Frame comprises guide, and its convenient seat is the location of frame relatively,

Seat comprises the pairing guide corresponding to the guide of frame, and

When seat was installed on the frame, the pairing guide of seat was contained in the guide of frame, and seat is the frame location relatively.

5. optic pick-up as claimed in claim 1, wherein

The ultraviolet curing bonding agent that solidifies with the ultraviolet light irradiation is used for seat is fixed to frame.

6. optic pick-up as claimed in claim 1, wherein

Be provided for supply of current and give the flexible print circuit of light-emitting component, flexible print circuit comprises the coupling part that is connected to light-emitting component,

Welding is connected to flexible print circuit with light-emitting component, thereby realizes the electrical connection between them from the conductor part of the coupling part of outstanding end fitting of seat and flexible print circuit, and

Flexible print circuit is along the peripheral wall setting that constitutes frame, and this peripheral wall extends near the coupling part.

7. optic pick-up as claimed in claim 1, wherein

Form frame with the synthetic resin material.

8. optic pick-up as claimed in claim 1, wherein

Frame can be connected the dish device that is used for laptop computer.

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