CL2011000271A1 - Circuito electrico para prevenir daños en circuitos que contiene: una primera capa de fibra de vidrio sobre una superficie superior y una segunda capa de vidrio; aparato y metodo asociado - Google Patents

Circuito electrico para prevenir daños en circuitos que contiene: una primera capa de fibra de vidrio sobre una superficie superior y una segunda capa de vidrio; aparato y metodo asociado

Info

Publication number
CL2011000271A1
CL2011000271A1 CL2011000271A CL2011000271A CL2011000271A1 CL 2011000271 A1 CL2011000271 A1 CL 2011000271A1 CL 2011000271 A CL2011000271 A CL 2011000271A CL 2011000271 A CL2011000271 A CL 2011000271A CL 2011000271 A1 CL2011000271 A1 CL 2011000271A1
Authority
CL
Chile
Prior art keywords
electrical circuit
layer
housing
glass fiber
fiber layer
Prior art date
Application number
CL2011000271A
Other languages
English (en)
Inventor
Roland Hotchkiss
Richard Hotchkiss Jr
Ricky Fussell
Andrea Haa
Original Assignee
Surge Suppression Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surge Suppression Incorporated filed Critical Surge Suppression Incorporated
Publication of CL2011000271A1 publication Critical patent/CL2011000271A1/es

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/044—Physical layout, materials not provided for elsewhere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0066—Constructional details of transient suppressor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/042—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage comprising means to limit the absorbed power or indicate damaged over-voltage protection device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Insulated Conductors (AREA)
  • Insulating Bodies (AREA)

Abstract

UN CIRCUITO ELÉCTRICO ENCAPSULADO PARA PREVENIR DAÑOS EN CIRCUITOS COLOCADO DENTRO DE UNA CARCASA QUE TIENE UNA PRIMERA Y SEGUNDA CAPA DE FIBRA DE VIDRIO QUE SE COLOCA SOBRE UNA SUPERFICIE SUPERIOR DEL CIRCUITO ELÉCTRICO ENCAPSULADO. UNA TAPA DE LA CARCASA SELLA EL CIRCUITO ELÉCTRICO Y UN ORIFICIO FORMADO EN UNA PARED LATERAL PERMITE QUE EL CABLEADO EN EL INTERIOR SE EXTIENDA HACIA AFUERA. LA PRIMERA CAPA DE FIBRA DE VIDRIO ES UNA CAPA TEJIDA MIENTRAS QUE LA SEGUNDA CAPA DE FIBRA DE VIDRIO ES UNA CAPA TIPO ACOLCHADA. EL CABLEADO ATRAVIESA LA PRIMERA CAPA TEJIDA DE FIBRA DE VIDRIO ANTES DE EXTENDERSE HACIA AFUERA A TRAVÉS DEL ORIFICIO EN LA CARCASA. LA PRIMERA CAPA DE FIBRA DE VÍDRIO SE ENCUENTRA METIDA ENTRE Y ALREDEDOR DEL CIRCUITO ELÉCTRICO Y SE ADHIERE AL INTERIOR DE LA CARCASA AL SUJETARSE AL MATERIAL DEL ENCAPSULADO MIENTRAS SE ENDURECE. EN UNA REALIZACIÓN PREFERIBLE, EL CIRCUITO ELÉCTRICO EN CONJUNTO CON EL MATERIAL DEL AISLAMIENTO ES UTILIZADO EN UN DISPOSITIVO DE SUPRESIÓN DE SOBRETENSIONES TRANSITORIAS.
CL2011000271A 2008-08-08 2011-02-08 Circuito electrico para prevenir daños en circuitos que contiene: una primera capa de fibra de vidrio sobre una superficie superior y una segunda capa de vidrio; aparato y metodo asociado CL2011000271A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/188,476 US8107207B2 (en) 2008-08-08 2008-08-08 Potted electrical circuit with protective insulation
PCT/US2009/053234 WO2010017535A2 (en) 2008-08-08 2009-08-08 Potted electrical circuit with protective insulation

Publications (1)

Publication Number Publication Date
CL2011000271A1 true CL2011000271A1 (es) 2011-04-15

Family

ID=41652725

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2011000271A CL2011000271A1 (es) 2008-08-08 2011-02-08 Circuito electrico para prevenir daños en circuitos que contiene: una primera capa de fibra de vidrio sobre una superficie superior y una segunda capa de vidrio; aparato y metodo asociado

Country Status (9)

Country Link
US (2) US8107207B2 (es)
EP (1) EP2332398B1 (es)
BR (1) BRPI0917032B1 (es)
CA (1) CA2767978C (es)
CL (1) CL2011000271A1 (es)
CO (1) CO6351840A2 (es)
CR (1) CR20110120A (es)
PE (1) PE20110646A1 (es)
WO (1) WO2010017535A2 (es)

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Also Published As

Publication number Publication date
CO6351840A2 (es) 2011-12-20
EP2332398B1 (en) 2014-05-07
US20100033885A1 (en) 2010-02-11
US8107208B2 (en) 2012-01-31
CR20110120A (es) 2011-05-05
US8107207B2 (en) 2012-01-31
CA2767978A1 (en) 2010-02-11
WO2010017535A2 (en) 2010-02-11
BRPI0917032B1 (pt) 2019-03-06
EP2332398A2 (en) 2011-06-15
CA2767978C (en) 2016-01-19
PE20110646A1 (es) 2011-10-07
US20080304200A1 (en) 2008-12-11
BRPI0917032A2 (pt) 2016-02-16
EP2332398A4 (en) 2013-01-23
WO2010017535A3 (en) 2010-05-14

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