CH699122B1 - System and method for inspection of semiconductor components. - Google Patents

Abstract

A system and method for inspecting semiconductor packages. The system includes an illumination assembly (14), a prism structure (16), a first camera (24) and a second camera (26). The prism structure includes a plurality of surfaces. The light reflected by the semiconductor package placed in the processing position enters the prism structure before exiting and entering either the first camera or the second camera. The first camera (24) and the second camera (26) offer different magnifications. The first camera captures an image of the bottom surface and each of the four side surfaces of the semiconductor package. The second camera captures an image only of the bottom surface of the semiconductor package. The light provided by the illumination assembly has a predetermined group of properties that are variable to improve the detection of specific defects. Images captured by the first camera and the second camera are transferred to a controller for analysis.

Description

Description

Field of the invention

The present invention relates to a system and method for the inspection of semiconductor components, according to the preamble of claim 1 and 19 respectively.

Background / State of the art

[0002] Quality control in the manufacture of semiconductor packages or semiconductor elements is an increasingly important and expensive aspect of the semiconductor package manufacturing process. Semiconductor enclosures such as flat housings with four-sided pins without tabs (QFN, Quad Fiat No Leads), BGA (Bail Grid Arrays) and wafer encapsulation chips (WLCSP) Wafer Level Chip Scale Packaging) generally require rigorous quality controls and checks before distribution and export. The defect detection (hereinafter referred to as quality control) of semiconductor package surfaces enables the manufacturer to eliminate or correct such defects prior to the distribution and export of the semiconductor packages. Due to the increasing emphasis on the accuracy and quality of semi-conductor packages, and even the demand for them, the quality control of semiconductor package surfaces is becoming a milestone. increasingly important in the overall process of manufacturing semiconductor packages.

[0003] Semiconductor packages are typically controlled to detect the presence of surface defects such as internal cavities and improper configuration formation. In addition, the semiconductor packages are generally inspected for defects in replacement, pitch, coplanarity, and terminal-end alignment. In addition, semiconductor packages can be controlled for missing or improperly placed characters in manufacturers' markings or data that are printed on the surface of the semiconductor packages. Typically, it is necessary to check each bottom and top and side surface of the semiconductor packages prior to distribution and export.

[0004] Several systems and methods are known for the inspection of semiconductor packages. Photographic devices such as charge-coupled cameras (CCDs) are used predominantly for capturing images during the control of semiconductor packages. A typical system and method for control of semiconductor packages uses a single camera arrangement for simultaneous inspection of the bottom or top surface and side surfaces. However, the use of a single camera arrangement typically results in reduced inspection resolution or reduced defect detection due to the large combined control area of the bottom or top surface with the side surfaces. In addition, the lenses and mirrors that are used with the single camera arrangement generally require to be moved or positioned during the inspection. Moving the lenses and mirrors during the inspection usually results in losses due to calibration and adjustment control.

Another system for the inspection of semiconductor packages is described in the publication of US Patent Application 2003/0 086 083 A1 to Ebert et al. The system proposed by Ebert et al. includes multiple mirrors and individual lenses. A beam splitter in the system of Ebert et al. divides the reflected light of the semiconductor package along distinct high and low resolution paths to capture the high and low resolution images of the semiconductor package by a high and low resolution camera respectively. The low resolution image is used to identify an area of interest that is further magnified by the high resolution camera for further control. However, the system of Ebert et al. typically occupies a considerable volume. Moreover, the system of Ebert et al. involves the positioning of multiple mirrors and lenses that can both be resource-hungry and compromise accuracy. In addition, the high and low resolution images captured by the Ebert et al. constitute an identical image (although of different resolution) of the same area of interest.

[0006] US Patent 6,952,491 B2 and US Patent Application Publication No. US 2004/0263 834 A1, both in the name of Alumot et al., Describe a method and a device for the inspection of semiconductor elements. The method and the device of Alumot et al. perform the control of the surfaces of the semiconductor component in two phases. In a first phase, a surface of the semiconductor component is controlled at a relatively high speed and with a relatively low spatial resolution. In a second phase, selected locations of the surface of the semiconductor component are then monitored with relatively high spatial resolution. The information gathered during the first phase and the second phase is analyzed by an external processor or controller. Comparisons are made between the images obtained during the first and the second phase and reference images to enable detection of surface defects on the semiconductor component.

[0007] However, the two-phase control method disclosed by Alumot et al. is highly time consuming and resource hungry. Moreover, the detection of surface defects by the method and the device of Alumot et al. requires a comparison between the image obtained and the reference image, a process that can be considerably imprecise and time-consuming. In addition, the device and the method of Alumot et al. allow only the control of a surface of the semiconductor component. The device of Alumot et al. also includes a multitude of components and is

2 essentially bulky. The increased space required for the installation of Alumot et al. typically results in an increased required manufacturing area and, ultimately, higher production costs.

Therefore, those skilled in the art will understand that improvements to the systems and methods for the inspection of semiconductor packages will be required. An improved system and method for controlling semiconductor packages should allow higher and multiple resolutions of images captured for defect detection or quality control. In addition, the improved system should preferably be compact.

summary

According to a first aspect of the present invention, a semiconductor component inspection system is disclosed which is defined by the features of claim 1.

According to a second aspect of the present invention, a method is disclosed for the inspection of a semiconductor component, which is defined by the features of claim 19.

Brief description of figures [0011]

Fig. 1 shows a partial system configuration of a system for the inspection of semiconductor packages according to a first exemplary embodiment of the present invention; fig. 2 shows a partial sectional surface view of an angular illumination assembly and the lateral prism structure of the system of FIG. 1; fig. 3 shows an enlarged partial sectional front view of the lateral prism structure of FIG. 2 and its redirection of light; fig. 4 shows a diagram of the path of light according to a first optical path given by way of example between the semiconductor package and a first camera of the system of FIG. 1; fig. 5 shows the path of the light according to the first optical path given by way of example of FIG. 4; fig. 6 shows a diagram of the path of the light according to a second optical path given by way of example between the semiconductor package and a second camera of the system of FIG. 1; fig. 7 shows the path of the light according to the second optical path given by way of example of FIG. 6; fig. 8 shows a combination of the trajectories of light according to the first optical path, given by way of example, of FIG. 4 and the first optical path, given by way of example, of FIG. 6; fig. 9 shows an image captured by the first camera and an image captured by the second camera of the system of FIG. 1; fig. 10 shows the path of light through a set of prisms of the system for the inspection of semiconductor packages of FIG. 1; and FIG. 11 shows a process diagram for the inspection of semiconductor packages according to a second exemplary embodiment of the present invention.

detailed description

[0012] Quality control in the manufacture of semiconductor packages or semiconductor components is an aspect of increased importance and increasing cost. There are several systems and methods for quality control or for detecting surface defects in semiconductor packages. The available systems and methods have several disadvantages or problems as described above. A disadvantage is a limited resolution of images captured with systems comprising a single camera. Movement of component parts of existing systems, for example lenses and mirrors, generally results in losses due to calibration and adjustment control. In addition, current systems for quality control of semiconductor packages that include multiple cameras typically have a large footprint and thus increase the cost of production. Therefore, those skilled in the art will appreciate that improvements to systems and methods for quality control of semiconductor packages are required.

For the sake of brevity and clarity, the description of the present invention is hereinafter limited to a system and method for inspecting semiconductor packages that permit multiple magnification and surface control. multiple. However, this does not exclude different embodiments of the invention for other applications where the fundamental principles governing the different modes of execution, such as operational, functional or performance characteristics, are solicited.

Exemplary embodiments of a system and method for inspecting semiconductor packages are described hereinafter with reference to FIGS. 1 to 10, in which the same elements bear the same reference numbers.

A system 10 for the control of semiconductor packages (also known as semiconductor substrates) 12 is provided according to a first embodiment, given by way of example, of the present invention. Semiconductor packages 12 include, but are not limited to, flat boxes with pins on all four non-legged sides (QFN, Quad Fiat No Leads), ball grid housings (BGAs, Bail Grid Arrays), and housings. Wafer Level Chip Scale Packaging (WLCSP). Preferably, the system 10 comprises a lighting assembly 14 or a lighting device, a prism structure 16 and a number of cameras.

Each semiconductor package 12 preferably comprises an upper surface, a lower surface and four lateral surfaces. The upper surface and the lower surface of the semiconductor package 12 may also be referred to as the upper side or lower side of the semiconductor package 12. Preferably, each of the four side surfaces of the semiconductor package 12 is at an angle relative to the upper surface and bottom surface of the semiconductor package 12. Those skilled in the art will surely understand that the semiconductor package 12 may have more than four side surfaces. For example, the semiconductor package 12 may have an octagonal or decagonal shape with eight or ten corresponding side surfaces.

Preferably, the inspection of semiconductor packages 12 involves the image capture of the upper surface, the lower surface and each of the four side surfaces of the semiconductor package 12. A variant consists of the inspection of the semiconductor package 12 includes the image capture of any number of surfaces of the semiconductor package 12.

The system 10 for the inspection of semiconductor packages 12 preferably allows the capture of the image of the lower surface as well as each of the four lateral surfaces of the semiconductor packages 12. The capture of image of the bottom surface as well as each of the four side surfaces of the semiconductor package 12 facilitates the detection of defects located on any of the surfaces.

The surface defects of semiconductor packages 12 include, but are not limited to, voids, cracks, spots, contaminations, improper configurations, and imprecise interconnect positions. Surface defect detection allows detected surface defects to be corrected. Alternatively, the detection of surface defects of semiconductor packages 12 facilitates the removal of faulty semiconductor packages 12. Therefore, the inspection of semiconductor packages 12 preferably results in improved quality of the semiconductor packages 12 manufactured.

The semiconductor package 12 is preferably placed in the processing position 18 during image inspection or capture. The illumination assembly 14 may be actuated to supply or direct the light to the semiconductor package 12 placed in the treatment position 18. Preferably, the illumination assembly 14 comprises an angular illumination assembly 20 and a Axial illumination assembly 22. The angular illumination assembly 20 and the axial illumination assembly 22 preferably comprise multi-layered light-emitting diode (LED) devices. Alternatively, the angular illumination assembly 20 and the axial illumination assembly 22 comprise xenon flash illuminators. Another variant is that the angular illumination assembly 20 and the axial illumination assembly 22 comprise different types of lighting devices or apparatus known to those skilled in the art. In another variant, the angular illumination assembly 20 and the axial illumination assembly 22 each comprise different illumination or illumination devices.

[0021] Preferably, the angular illumination assembly 20 and the axial illumination assembly 22 are both arranged in a predetermined configuration. Further, preferably, the spatial arrangement or configuration of the angular illumination assembly 20 and the axial illumination assembly 22 is substantially fixed. As will be appreciated by those skilled in the art, the fixed spatial arrangement of the illumination assembly 14 improves the ease and efficiency of illumination operation of semiconductor packages 12 during inspection.

The angular illumination assembly 20 provides or directs the light to the lower surface and each of the four side surfaces of the semiconductor package 12 placed in the processing position 18. Preferably, the multi-layer diode devices The electroluminescent (LED) units of the angular illumination assembly 20 are each disposed at predetermined angles with respect to the lower surface of the semiconductor package 12 in the processing position 18. In addition, preferably, the predetermined angles may be be adjusted or varied accordingly to allow light to be directed to the semiconductor package at the required or desired angles. In addition, the multilayer LED devices are preferably spatially arranged to substantially prevent interference with the light reflected from the bottom surface and each of the four side surfaces of the semiconductor package 12. placed in the treatment position 18.

[0023] Preferably, the axial illumination assembly 22 supplies or directs the light mainly towards the lower surface of the semiconductor package 12 placed in the treatment position 18.

The system 10 for the inspection of semiconductor packages 12 further comprises a prism structure 16, also known as a reflector structure. The prism structure 16 comprises a plurality of surfaces or

4 of reflective surfaces. Preferably, the plurality of surfaces are specifically arranged or interconfigured relative to one another. More preferably, the plurality of surfaces is interposed to define a passage therebetween. Each of the plurality of surfaces has carefully predetermined properties or features. For example, at least one of the plurality of surfaces comprises a coating with a carefully predetermined reflection, transmission and absorption coefficient. In addition, at least one of the plurality of surfaces is preferably made by an optical bonding process.

Preferably, at least a portion of the light provided or directed towards the surfaces of the semiconductor package 12 placed in the processing position 18 is reflected by the surfaces of the semiconductor package 12. At least a portion of the light reflected by the semiconductor package 12 preferably enters the prism structure 16 before emerging and penetrating at least one of the plurality of cameras. The number of cameras is preferably two, namely a first camera 24 and a second camera 26 (also called first image capture device and second image capture device). Preferably, both the first camera 24 and the second camera 26 are high resolution cameras. The first camera 24 and the second camera 26 can each have the same high resolution. In a variant, the first camera 24 and the second camera 26 each have a different resolution.

Preferably, light entering the first camera 24 and the second camera 26 allows image capture by the first camera 24 and the second camera 26 respectively. The high resolution of the first camera 24 and the second camera 26 allows the capture of high resolution images. Therefore, the high resolution of the first camera 24 and the second camera 26 preferably improves the accuracy and ease of detection of surface defects by the system 10.

Preferably, the operation of the first camera 24, the second camera 26 and the lighting assembly 14 is controlled by one or a combination of computerized system and a programmable controller (not shown). The programmable controller is preferably connected or in signal communication with at least the angular illumination assembly 20 or the axial illumination assembly 22. Preferably, the programmable controller controls or determines the properties or characteristics of the provided light by at least the angular illumination assembly 20 or the axial illumination assembly 22 to the semiconductor package 12 placed in the processing position 18. The properties of the light controlled by the programmable controller include, but are not limited to, brightness or intensity, color and angle of illumination. For example, the programmable controller is capable of controlling the angle of each of the multilayer LED devices with respect to a reference plane defined at or along the bottom surface of the semiconductor component processing position 18, and thus the angle of light directed by each of the multilayer LED devices to the semiconductor package 12 placed in the processing position 18.

Preferably, the light reflected by the lower surface of the semiconductor component 12 is substantially perpendicular to the reference plane. In addition, preferably, each of the four lateral surfaces of the semiconductor component 12 is perpendicular to the reference plane. The light reflected by each of the four side surfaces of the semiconductor component is preferably substantially parallel to the reference plane.

The angular illumination assembly 20 and the axial illumination assembly 22 may be controlled to simultaneously illuminate the semiconductor package 12 with both angular and axial light. Alternatively, the angular illumination assembly 20 and the axial illumination assembly 22 may be controlled to effect angular illumination and axial illumination of the semiconductor package 12 alternately over time. The programmable controller is capable of individually controlling each of the different properties of the light provided by the illumination assembly 14. In addition, the controller is perfectly able to control or determine a group of properties of the light provided by the set. lighting 14.

The light is composed of elementary particles known as photons. Light has both wave and particle properties, a phenomenon commonly known as wave-particle duality. In general, light is also known as a beam of light rays or light waves. Each ray or light wave has a wavelength. The wavelength of a light ray determines the frequency of the light beam. The frequency of the light ray is a factor in determining the transmittance, absorption and reflectivity of the light beam when the light beam strikes or reaches a surface.

As mentioned above, the image capture or control of the surfaces of the semiconductor package 12 occurs when the semiconductor package 12 is placed in the processing position 18. Images are captured when the light ( also called, interchangeably, light rays) reflected by the surfaces of the semiconductor package 12 enters either the first camera 24 or the second camera 26.

[0032] Preferably, the light reflected by the surfaces of the semiconductor packages 12 passes first through the prism structure 16 before entering either the first camera 24 or the second camera 26. Preferably, the light that finally enters the first camera 24 following a first optical path through the prism structure 16. In addition, preferably, the light that finally enters the second camera 26 follows a second optical path through the prism structure 16.

A flow diagram of a first optical path 100 given as an example is illustrated in FIGS. 5 and 6. In step 1 of the first optical path 100, the light reflected from the lower surface and each of the four side surfaces of the semiconductor package 12 in the processing position 18 enters the prism structure. 16 through a first input surface 50. The first input surface 50 is preferably coated with an antireflection coating to prevent or substantially reduce the reflection of light impinging on the first input surface 50.

In step 120, the light entering the prism structure 16 is reflected by a second reflecting surface 52. The second reflecting surface 52 is preferably covered with a special coating. Preferably, the special coating has a reflection, transmission and absorption coefficient of 50%, 50% and 0% respectively. In addition, preferably, the coefficient of reflection, transmission and absorption is variable with a tolerance of up to ± 5%. Alternatively, the reflection coefficient, transmission and absorption is adjustable or variable depending on the needs.

The law of reflection states that an incident light beam striking an interface at an angle (that is to say the angle of incidence) i, measured between a line perpendicular to the interface (this is ie normal) and the incident light beam, will be reflected by the interface at the same angle i. In other words, the angle of reflection of light rays or of light is equal to the angle of incidence.

The amount of light rays reflected by the second reflecting surface 52 depends on the reflection coefficient, transmission and absorption of the special coating. Preferably, the light is reflected by the second reflecting surface 52 at an angle of reflection equal to that of the angle of incidence.

In step 130, the light reflected by the second reflecting surface is directed through a third reflecting surface 54 within the prism structure 16. Preferably, the light reaches or strikes the third reflecting surface 54 perpendicularly to prevent reflection by the third reflecting surface 54. The third reflecting surface 54 is preferably made by an optical bonding process. Preferably, the surfaces made by the optical bonding process have equal or substantially equivalent refractive indexes on both sides.

The light passing through the third reflecting surface 54 is then reflected by a fourth reflecting surface 56 within the prism structure 16 during step 140. Preferably, the light is directed towards the fourth reflecting surface 56. an angle (i.e. angle of incidence) to the normal of the fourth reflecting surface 56. The fourth reflecting surface 56 is preferably covered with the special coating similar to that of the second reflecting surface 52 In addition, preferably, the reflection coefficient, transmission and absorption of the special coating of the fourth reflecting surface 56 is substantially equivalent to that of the second reflecting surface 52. In a variant, the reflection coefficient, transmission and absorption of the special coating of the fourth reflecting surface 56 is different that of the second reflective surface 52. Both the second reflective surface 52 and the fourth reflective surface 56 may serve as a beam splitter. That is, the light directed to the second reflecting surface 52 or to the fourth reflecting surface 56 may be reflected as multiple light rays, each of multiple light rays being directed along a different path or in a different direction .

Preferably, the light is reflected by the fourth reflecting surface 56 at an angle of reflection equivalent to the angle of incidence. The amount of light rays or light reflected by the fourth reflecting surface 56 depends on the reflection, transmission and absorption coefficient of the special coating.

Preferably, the light reflected from the fourth reflecting surface 56 is preferably directed to a fifth reflecting surface 58. The fifth reflecting surface 58 preferably has a mirror finish with a reflection factor greater than 92%. In a variant, the mirror finish has a reflection factor of a different value. Increasing the reflection factor of the fifth reflective surface 58 allows a higher percentage of light rays striking that surface to be reflected there.

During step 150 of the first optical path 100, the light directed towards the fifth reflecting surface 58 is reflected thereon. The light is preferably reflected by the fifth reflecting surface 58 at an angle of reflection equivalent to the angle of incidence.

In step 160, the light reflected by the fifth reflecting surface 58 leaves the prism structure 16 through a first exit surface 60. Preferably, the first exit surface 60 shares the same properties. or properties substantially similar to those of the first surface 50. That is, the first exit surface 60 preferably comprises an antireflection coating to prevent or substantially reduce light reflection. An alternative is that the first exit surface 60 has different properties with respect to the first surface 50.

Light exiting the prism structure 16 through the first exit surface 60 passes through a first camera lens 62 before entering the first camera 24 during a final step 170. The first camera 24 defines preferably a first image capture plane. Preferably, the first optical lens 62 is spatially placed between the first output surface 60 and the first camera 24. In addition, preferably the spatial positions of the first camera 24 and the first optical lens 62 are substantially fixed. The first lens

Optical 62 preferably has a long distance lens object. The first optical lens 62 has a predetermined focal length to obtain a predetermined magnification or magnification. Preferably, the focal length, and therefore the magnification, of the first optical lens 62 can be varied as needed using techniques well known to those skilled in the art.

Preferably, the focal length or magnification obtained by the first optical lens 62 allows the light reflected from the lower surface and the light reflected by each of the four lateral surfaces of the semiconductor package 12 placed in position. processing 18 to enter the camera. Thus, the first camera 24 is preferably capable of capturing images of multiple surfaces, namely the bottom surface and each of the four side surfaces, of the semiconductor package 12 placed in the processing position 18.

A second optical path 200 given by way of example is illustrated in FIGS. 7 and 8. Preferably, step 210, step 220 and step 230 of the second optical path 200 are similar respectively to step 1 10, step 120 and step 130 of the first path Thus, in step 210, the light reflected from the lower surface of the semiconductor surface placed in the processing position 18 enters the prism structure 16 through the first surface 50. The light is then reflected by the second reflective surface 52 in step 220 at an angle of reflection equal to the angle of incidence. The light reflected by the second reflecting surface 52 then passes through the third reflecting surface 54 during step 230.

During step 240 of the second optical path 200, the light passing through the third reflecting surface 54 is transmitted through the fourth reflecting surface 56 within the prism structure 16. The percentage of light transmitted to through the fourth reflecting surface 56 preferably depends on the reflection coefficient, transmission and absorption of the special coating of the fourth reflecting surface 56. Preferably, the reflection coefficient, transmission and absorption of the special coating is 50 %, 50% and 0% respectively. As a result, 50% of the light rays striking the fourth reflecting surface 56 are preferably transmitted through the fourth reflecting surface 56.

The light transmitted through the fourth reflecting surface 56 leaves the prism structure 16 through a second exit surface 64 during step 250. Preferably, the second exit surface 64 shares the same properties or properties substantially similar to those of the first exit surface 60. That is, the second exit surface 64 is preferably coated with an antireflection coating to prevent or substantially reduce light reflection. An alternative consists of the second exit surface 64 having properties different from those of the first exit surface 60.

During step 260 of the second optical path 200, the light emerging from the prism structure 16 passes through a second optical lens 66 before entering the second camera 26. The second camera 26 preferably defines a second image capture plane. Preferably, the second optical lens 66 is placed spatially between the second output surface 64 and the second camera 26. In addition, preferably, the spatial positions of the second camera 26 and the second optical lens 66 are substantially fixed. The second optical lens 66 preferably provides a long distance lens object. In addition, the second optical lens 66 has a predetermined focal length to obtain a predetermined magnification. As for the first optical lens 62, the focal length, and hence the magnification, of the second optical lens 66 can be varied as needed using techniques well known to those skilled in the art.

Preferably, the enlargement of the second optical lens 66 is different from that of the first optical lens 62. Preferably, the focal length and the magnification obtained by the second optical lens 66 only allow the light reflected by the lower surface of the semiconductor casing 12 placed in the processing position 18 to enter the second camera 26. Thus, the second camera 26 is preferably able to capture images of a single surface, namely from the surface lower, the semiconductor casing 12 placed in the treatment position 18. Preferably, the enlargement of the second optical lens 66 is greater than that of the first optical lens 62, allowing a higher magnification of the image of the lower surface of the semiconductor package 12 by means of the second camera 26.

The difference in focal length, and thus magnification, of the first optical lens 62 with respect to the second optical lens 66 thus allows the system 10 to capture multiple magnification images or multiple views. Those skilled in the art will understand that increasing the number of camera lenses of the system 10, each with a different focal length, in combination with a corresponding increase in the number of surfaces of the prism structure 16, may allow the system 10 to capture images with an increasing number of enlargements or number of views.

The first camera 24 and the second camera 26 of the system 10 are preferably positioned substantially adjacent to each other, in line with the first exit surface 60 and the second exit surface 64 respectively. The physical space required by the positioning or placement of the first camera 24 and the second camera 26 preferably determines the distance or space required between the fourth reflective surface 56 and the fifth reflective surface 58 of the prism structure 16 .

Preferably, the use of the prism structure 16 reduces the space required for installation of the system 10 in comparison with existing systems for the inspection of semiconductor packages 12. In addition, preferably the first surface 50, the second reflecting surface 52, the third reflecting surface 54, the fourth reflecting surface 56 and the fifth reflecting surface 58 of the prism structure 16 are each fixed or stationary in space. The immobility of each of the aforementioned surfaces of the prism structure 16 substantially eliminates or reduces the losses due to calibration or adjustment control present in existing systems that use moving mirrors and lenses.

A method for the inspection of semiconductor packages 12 as illustrated in FIG. 10 is provided by way of example in a second embodiment of the present invention. Preferably, the method 300 uses the system 10.

In step 310, the semiconductor package 12 is placed in the processing position 18. The processing position 18 is preferably located within a lateral prism structure 68 of the system 10. From preferably, the lateral prism structure comprises a plurality of surfaces or mirrors, more specifically four surfaces. Preferably, the treatment position 18 is located essentially within a space defined by the four surfaces of the lateral prism structure 68. Preferably, each of the four lateral surfaces of the lateral prism structure 68 is intended to receive the light reflected from each of the four sides of the semiconductor package 12.

The lighting assembly then provides a first flash of light or illumination directed to the semiconductor package 12 in step 320. Preferably, the first flash of light illuminates the bottom surface as well as each of the four lateral surfaces of the semiconductor package 12 placed in the treatment position 18.

[0056] Preferably, the first light flash has a predetermined group of properties. The predetermined group of properties is preferably determined or controlled by the controller. As previously described, the group of properties preferably comprises a brightness or specific intensity, a color and an illumination angle. For example, the property group has a brightness of 50%, a red color, and an illumination angle of 50 degrees. Preferably, each property within the property group can be individually modified as needed.

The group of properties is preferably selected specifically to focus on a specific type of surface defect of semiconductor packages 12. The reason for this is that the detection of certain surface defects of semiconductor packages Conductors 12 is performed more precisely or easily using a light having a certain group of properties, as will be understood by those skilled in the art.

The first flash of light directed towards the semiconductor package 12 placed in the processing position 18 may be reflected by the lower surface and each of the four lateral surfaces of the semiconductor package 12. Preferably, the reflected light by the lower surface of the semiconductor package 12 is perpendicular to the light reflected by each of the four side surfaces of the semiconductor package 12.

In step 330, a first image of the semiconductor package 12 is captured by the first camera 24. Preferably, the first camera 24 is exposed for a predetermined period of time to allow the light of the to enter it. The penetration of light into the first camera 24 thus allows image capture by the first camera 24. Preferably, light entering the first camera 24 follows the first optical path 100.

Preferably, the images captured by the first camera 24 represent multiple surfaces of the semiconductor package 12 in the processing position 18. This means that the images captured by the first camera 24 preferably comprise an image of the surface The first captured image is preferably characterized by the predetermined group of properties of the first flash of light.

In step 340, the illumination assembly provides a second flash of light directed to the semiconductor package 12 placed in the processing position 18. Preferably, the second flash of light has the same predetermined group of properties as the first flash of light. In a variant, the second flash of light has a group of properties different from that of the first flash of light.

A second image is then captured by the second camera 26 during the step 350. Preferably, the second camera 26 is exposed for a predefined period of time to allow the light to enter. In the same way as for the first camera 24, the penetration of the light in the second camera 26 thus allows the image to be captured by the second camera 26. Preferably, the light entering the second camera 26 follows the second optical path 200.

Preferably, the images captured by the second camera 26 represent a single surface of the semiconductor package 12 placed in the processing position 18. That is to say that the images captured by the second camera 26 comprise only an image of the lower surface of the semiconductor package 12 placed in the treatment position 18.

8

Claims (38)

The second image, as in the case of the first image, is preferably characterized by the predetermined group of properties of the second flash of light. Therefore, both the second image and the first image preferably share a predetermined common group of properties and will hereafter constitute a first set of images. [0065] Preferably, the images within each set of images are characterized by the same group of properties. For example, each image within each set of images preferably shares the same brightness, color, and illumination angle. In an alternative, each image within each set of images shares a different common property group. As described above, the first set of images is captured or obtained by executing steps 320 to 350. Preferably, steps 320 to 350 may be repeated as often as necessary to allow multiple sets of games. pictures to be captured. Preferably, the group of properties of the light provided by the illumination assembly is variable or can be selected again at each repetition of steps 320 to 350. As previously described, varying the properties of the light supplied to the semi package -conducteur 12 improves the detection of different surface defects. Preferably, the first image and the second image, or the first set of images, captured by the first camera 24 and the second camera 26, are downloaded or transmitted to the programmable controller or the controller for their analysis during step 360. The programmable controller is preferably in signal communication with the first camera 24 and the second camera 26. Preferably, the images are downloaded to the programmable controller as image signals. The programmable controller is preferably programmed to analyze the images downloaded to it. The images downloaded to the programmable controller are preferably processed using methods and algorithms known to those skilled in the art, for example image differentiation, negative set-up, thresholding or contour detection to identify or detect surface defects of the device. In addition, preferably the programmable controller is capable of enabling automatic detection of surface defects of semiconductor packages 12 subject to inspection by the system 10. The method 300 for the inspection of semiconductor packages 12 preferably allows a sequential image capture by the first camera 24 and the second camera 26. In addition, preferably, the first camera 24 and the second camera 24. camera 26 capture the sequential images in an alternating sequence. The programmable controller preferably controls the synchronization of the alternating exposure of the first camera 24 and the second camera 26 for their alternating image capture. The alternating image capture by the first camera 24 and the second camera 26 helps reduce the impact of delays due to data transfer during image capture by the first camera 24 and the second camera 26. As a general rule, time is required for data transfer during image capture. The duration of the data transfer usually increases with a higher resolution of the cameras. The duration of the data transfer substantially influences the speed or efficiency of the image capture by the first camera 24 and the second camera 26, and therefore the total efficiency of the system 10 and method 300 for the inspection of semiconductor packages 12. Therefore, it will be evident that the alternating image capture by the first camera 24 and the second camera 26 reduces the impact of delays caused by the data transfer. This helps to increase the throughput of the semiconductor package inspection 12 and hence the production capacity. Although the exemplary embodiments of the present invention utilize alternating and temporally synchronized image capture, those skilled in the art will understand simultaneous image capture by the first camera 24. as well as by the second camera 26 is also possible with the system 10 proposed by the present invention. As mentioned above, a system and method for the inspection of semiconductor packages is described according to the exemplary embodiments of the present invention. Although only the exemplary embodiments of the present invention are disclosed, it will be apparent to those skilled in the art in light of this disclosure that many changes and / or modifications can be made without regard to the present invention. away from the scope and spirit of the present invention. claims A semiconductor component inspection system comprising: a reflector structure configured to receive light reflected from a first surface of a semiconductor component and light reflected by at least a second surface of the semiconductor component -conducteur, the first surface extending substantially in a first plane and there at least a second surface extending substantially in at least a second plane, the at least one second plane being spaced angularly from the first plane, the reflector structure being further configured to redirect light received from the first surface and there at least a second surface substantially in a first direction; and a beam splitter for dividing light directed in a first direction into a first light beam traveling a first path and a second light beam traveling a second path, 9 in which the first trajectory substantially crosses a first image capture plane and the second trajectory substantially crosses a second image capture plane, the image of at least the first surface or at least a second surface can be acquired from either the first or the second image capture plane to be subsequently controlled. The system of claim 1, further comprising: a first image capture device defining the first image capture plane; and a second image capturing device defining the second image capture plane, the first image capturing device and the second image capturing device each generating image signals of the acquired image of at least one of the first surface and there at least a second surface. The system of claim 2, further comprising: at least one first lens disposed in the first path and being shaped and dimensioned to change the optical magnification of the image of at least one of the first surface or at least one a second surface that can be acquired by the first image capture device; and at least one second lens disposed along the second path and being shaped and dimensioned to change the optical magnification of the image of at least one of the first surface or at least a second surface that can be acquired by the second device. image capture. The system of claim 2, wherein the first image capturing device and the second image capturing device are each in signal communication with a computerized device and a controller for processing the image of at least one of the first surface or at least one second surface each acquired by the first image capture device and the second image capture device and communicated to the computer device or the controller in the form of image signals to thereby control the semi component -driver. The system of claim 1, further comprising: a reflective surface arranged to receive the second light beam directed along the second path by the beam splitter, the second light beam in a second direction from the beam splitter to the reflective surface. and then a third direction when redirected by the reflective surface to the second image capture plane, the second direction and the third direction substantially coinciding with the second trajectory. 6. System according to claim 5, the first light beam in a first direction when traversing the first path and the third direction being substantially parallel to the first direction. The system of claim 1, the reflector structure comprising: at least a first reflective surface positioned to receive and direct light reflected from at least one second surface of the semiconductor component substantially along a first axis, wherein at least a part of the light reflected by the first surface essentially follows the first axis. 8. System according to claim 7, there at least a first reflecting surface being defined by at least one mirror or at least one prism. The system of claim 1, the reflector structure comprising: a plurality of first reflective surfaces positioned to receive and direct light reflected from a plurality of side surfaces of the semiconductor component substantially along a first axis, each of the plurality of lateral surfaces extending along one of a plurality of lateral planes and constituting therein at least a second surface, each of the plurality of lateral planes constituting the at least one second plane. The system of claim 9, each of the plurality of lateral planes being substantially perpendicular to the first plane. The system of claim 9, wherein the plurality of first reflective surfaces are interposed to define a passage therebetween, the first axis intersecting the semiconductor component and being substantially perpendicular to the first surface of the semiconductor component, and the component semiconductor being arranged for the passage of light reflected from its first surface through the passage and substantially along the first axis. The system of claim 1, further comprising: a second reflective surface positioned to intersect the first axis, the second reflective surface for receiving and redirecting light along the first axis to the beam splitter. The system of claim 12, further comprising: an illuminator for generating light, the illuminator being arranged to direct light generated therefrom along the first axis and to the semiconductor component, the second reflective surface being substantially interposed between the illuminator and the semiconductor component, the second reflective surface being permeable to light to allow passage of a portion of the light directed by the illuminator to the semiconductor component therethrough. The system of claim 9, further comprising: A first image capture device defining the first image capture plane for capturing a first image therein; a second image capture device defining the second image capture plane for capturing a second image, a first lens disposed in the first path and having an optical magnification factor to enable image capture of a plurality of side surfaces and the first surface of the semiconductor component as a first image by the first image pickup device; and a second lens disposed in the second path and having an optical magnification factor to allow image capture of the first surface of the semiconductor component as a second image by the second image pickup device. The system of claim 14, the optical magnification factor of the second lens being higher than the optical magnification factor of the first lens, and an image portion of the first surface of the semiconductor component in the second lens. second image constituting an enlargement of the image portion of the first surface of the semiconductor component in the first image. The system of claim 7, further comprising: a plurality of illumination devices operable to generate and arranged to direct light to the semiconductor component. The system of claim 16, the plurality of illumination devices further operable and arranged to direct light to the semiconductor component according to at least one of a plurality of angles. The system of claim 16, the plurality of illumination devices further operable and arranged to direct light to the semiconductor component with at least one of a plurality of colors, at least one of a plurality of levels. of brightness and at least one of a plurality of degrees of illumination. A method for inspecting semiconductor components, the method comprising: receiving light through a reflector structure, the received light comprising light reflected from a first surface of a semiconductor component and the light reflected from at least one second surface of the semiconductor component, the first surface extending substantially in a first plane and at least one second surface extending substantially in at least one second plane, at least one second plane being angularly spaced from the foreground, the reflector structure being further configured to redirect light received from the first surface and there at least a second surface substantially in a first direction; capturing a first image, the first image having a first view and at least one property of a first group of properties; capturing a second image, the second image having a second view and at least one property of a second group of properties; the first view comprising an image of the first surface and from there at least a second surface of the semiconductor component, the second view comprising an image of the first surface of the semiconductor component, and the treatment of at least one of the first and second images for inspecting at least the first or at least one second surface of the semiconductor component; wherein capturing the first image and capturing the second image are performed either simultaneously or sequentially to thereby allow simultaneous or sequential inspection of at least one of the first and at least one second surface of the semiconductor component . The method of claim 19, wherein the first image can be captured from a first image capture plane and the second image can be captured from a second image capture plane, the first image capture plane. and the second image capture plane being defined by a first image capture device and a second image capture device respectively. The method of claim 19, further comprising: receiving image signals corresponding to at least one of the first image or the second image, the image signals corresponding to the first image and the second image generated by a first image capture device and a second image capture device respectively; and processing the received image signals to thereby inspect at least one of the first surface or at least one second surface of the semiconductor component. The method of claim 19, further comprising: modifying at least one of the optical magnification of the first image and the optical magnification of the second image, wherein the modification of at least one of the magnification optical of the first image and the optical enlargement of the second image is performed by at least one of at least a first lens and at least a second lens respectively. 23. The method of claim 22, the first at least one lens having a first optical magnification factor to allow capture of the first image of the first view and the second at least one lens having 11 at a second optical magnification factor to allow capture of the second image of a second view, wherein the second optical magnification factor is higher than the first optical magnification factor and wherein a portion of image of the first surface of the semiconductor component in the second image is an enlargement of the image portion of the first surface of the semiconductor component in the first image. The method of claim 19, further comprising: directing the light to the semiconductor component, the light being reflected by the first surface and the second at least one surface of the semiconductor component to be received by the reflector structure, the reflector structure being configured to direct the light received and reflected by the first surface and there at least a second surface substantially in the first direction, the light directed in the first direction then being divided into a first light beam along a first path and a second light beam along a second path, wherein the first path substantially crosses a first image capture plane and the second path substantially crosses a second image capture plane. The method of claim 24, wherein the first image capture plane receives the first light beam and the second image capture plane receives the second light beam to thereby facilitate the capture of the first image and the second light image. image respectively. The method of claim 24, wherein the separation of light directed in the first direction into a first light beam and a second light beam is performed by a beam splitter. The method of claim 24, the reflector structure comprising: at least one reflective surface positioned to receive and direct light reflected from at least one second surface of the semiconductor component substantially along a first axis, wherein at least one part of the light reflected by the first surface essentially follows the first axis. 28. The method of claim 27, wherein there at least one reflecting surface is defined by at least one mirror or at least one prism. The method of claim 24, the reflector structure comprising: a plurality of first reflective surfaces positioned to receive and direct light reflected from a plurality of side surfaces of the semiconductor component substantially along a first axis, each of the plurality of lateral surfaces extending along one of a plurality of lateral planes and constituting therein at least a second surface, each of the plurality of lateral planes constituting the at least one second plane. The method of claim 29, wherein each of the plurality of lateral planes is substantially perpendicular to the first plane. The method of claim 29, the plurality of first reflective surfaces being interposed to define a passage therebetween, the first axis intersecting the semiconductor component and being substantially perpendicular to the first surface of the semiconductor component, and the semiconductor component. -conducteur being arranged for the passage of the light reflected by its first surface through the passage and essentially along the first axis. The method of claim 31, wherein the reflector structure further comprises a second reflective surface positioned to intersect the first axis, the second reflective surface being adapted to receive and redirect light along the first axis to a beam splitter. The method of claim 32, further comprising: orienting the light along a first axis and toward the semiconductor component, the light directed along the first axis being generated by an illuminator, the second reflecting surface being substantially interposed between the illuminator and the semiconductor component, the second reflective surface being permeable to light to allow passage of a portion of the light directed by the illuminator to the semiconductor component therethrough. The method of claim 19, further comprising: controlling a plurality of illuminators to direct light to the semiconductor component, wherein the plurality of illuminators can be operated to direct light to the semi-component -conductor at least one of a plurality of angles. The method according to claim 19, wherein the first image and the second image can each be characterized by the first group of properties and the second group of properties, the first group of properties and the second group of properties each comprising at least one from among at least one illumination color, at least one illumination intensity and at least one illumination angle. 36. The method of claim 19, wherein the first group of properties and the second group of properties each comprises at least one of at least one illumination color, at least one illumination intensity and at least one illumination angle. . 37. The method of claim 36, further comprising: Receiving light reflected from a plurality of side surfaces of the semiconductor component by a plurality of reflecting surfaces, each of the plurality of side surfaces extending along one of a plurality of side planes and constituting therein at least one second surface, each of the plurality of side planes constituting the at least one second plane, each of the plurality of reflecting surfaces being substantially parallel to one of the plurality of side planes. The method of claim 37, wherein the plurality of reflecting surfaces are defined by one of a plurality of mirrors and at least one prism. 13