CH618316B - METHOD FOR MANUFACTURING A MINIATURIZED ELECTRONIC DEVICE AND DEVICE OBTAINED BY THIS PROCESS. - Google Patents
METHOD FOR MANUFACTURING A MINIATURIZED ELECTRONIC DEVICE AND DEVICE OBTAINED BY THIS PROCESS.Info
- Publication number
- CH618316B CH618316B CH166077A CH166077A CH618316B CH 618316 B CH618316 B CH 618316B CH 166077 A CH166077 A CH 166077A CH 166077 A CH166077 A CH 166077A CH 618316 B CH618316 B CH 618316B
- Authority
- CH
- Switzerland
- Prior art keywords
- supports
- elements
- manufacturing
- electronic device
- miniaturized electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/08—Housings
- G04G17/083—Watches distributed over several housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Electric Clocks (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Thermistors And Varistors (AREA)
Abstract
The miniature electronic circuit module, e.g. for a pocket calculator, an electronic watch or medical devices, has a number of circuit elements (2) mounted on a series of supports (A, B, C) which are coupled together via flexible means. The connections between two or more elements (2) on different supports are provided via a cable obtained by adhering insulated wires to the flexible coupling means between the two supports. The different supports (A, B, C) may be folded one on top of the other and the elements (2) on one support may be interconnected by cables adhered to the surface of that support.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7606726A FR2344203A1 (en) | 1976-03-09 | 1976-03-09 | Miniature electronic circuit module - has circuit elements mounted on separate supports intercoupled by flexible links |
Publications (2)
Publication Number | Publication Date |
---|---|
CH618316B true CH618316B (en) | |
CH618316GA3 CH618316GA3 (en) | 1980-07-31 |
Family
ID=9170174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH166077A CH618316GA3 (en) | 1976-03-09 | 1977-02-11 | Method for manufacturing a miniaturised electronic device and device obtained by this method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS52109165A (en) |
CH (1) | CH618316GA3 (en) |
FR (1) | FR2344203A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3137864A1 (en) * | 1981-09-23 | 1983-04-14 | Siemens AG, 1000 Berlin und 8000 München | FASTENING AND CONTACTING ARRANGEMENT FOR AN LCD DISPLAY UNIT OF AN ELECTRONIC DEVICE HOUSED IN A HOUSING |
US4533787A (en) * | 1981-11-26 | 1985-08-06 | Autophon Ag. | Printed circuit assembly |
FR2576430B1 (en) * | 1985-01-21 | 1987-02-27 | Bequet Claude | ANALOG LINEAR WATCH |
WO1990013989A1 (en) * | 1989-04-28 | 1990-11-15 | Motorola, Inc. | Printed circuit board having multiple form factors |
US5117282A (en) * | 1990-10-29 | 1992-05-26 | Harris Corporation | Stacked configuration for integrated circuit devices |
EP0489995A1 (en) * | 1990-12-12 | 1992-06-17 | International Business Machines Corporation | Flexible printed circuit package and flexible printed circuit for incorporation into such a package |
US5198965A (en) * | 1991-12-18 | 1993-03-30 | International Business Machines Corporation | Free form packaging of specific functions within a computer system |
DE19960250A1 (en) * | 1999-12-14 | 2001-06-21 | Honsberg & Co Kg | Flexible i.e. foldable circuit board for equipping with electronic components, uses separate equipping boards which fold over one another via flexible hinge areas |
-
1976
- 1976-03-09 FR FR7606726A patent/FR2344203A1/en active Granted
-
1977
- 1977-02-11 CH CH166077A patent/CH618316GA3/en unknown
- 1977-03-07 JP JP2398877A patent/JPS52109165A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2344203B1 (en) | 1981-09-25 |
JPS52109165A (en) | 1977-09-13 |
FR2344203A1 (en) | 1977-10-07 |
CH618316GA3 (en) | 1980-07-31 |
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