CH606470A5 - - Google Patents

Info

Publication number
CH606470A5
CH606470A5 CH1023273A CH1023273A CH606470A5 CH 606470 A5 CH606470 A5 CH 606470A5 CH 1023273 A CH1023273 A CH 1023273A CH 1023273 A CH1023273 A CH 1023273A CH 606470 A5 CH606470 A5 CH 606470A5
Authority
CH
Switzerland
Application number
CH1023273A
Inventor
Klaus-Werner Ruff
Original Assignee
Loewe Opta Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722244307 external-priority patent/DE2244307C3/de
Application filed by Loewe Opta Gmbh filed Critical Loewe Opta Gmbh
Publication of CH606470A5 publication Critical patent/CH606470A5/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CH1023273A 1972-09-09 1973-07-13 CH606470A5 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722244307 DE2244307C3 (de) 1972-09-09 Verfahren zur Herstellung von alkalischen Bädern zur autokatalytischen stromlosen Abscheidung von Kupfer

Publications (1)

Publication Number Publication Date
CH606470A5 true CH606470A5 (en:Method) 1978-10-31

Family

ID=5855884

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1023273A CH606470A5 (en:Method) 1972-09-09 1973-07-13

Country Status (8)

Country Link
US (1) US3855141A (en:Method)
JP (1) JPS5549155B2 (en:Method)
AT (1) AT324065B (en:Method)
CH (1) CH606470A5 (en:Method)
FR (1) FR2199009B1 (en:Method)
GB (1) GB1416637A (en:Method)
IT (1) IT993886B (en:Method)
SE (1) SE387966B (en:Method)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919100A (en) * 1974-04-24 1975-11-11 Enthone Alkaline etchant compositions
JPS5124537A (en) * 1974-08-26 1976-02-27 Hitachi Ltd Etsuchinguyokuno saiseihoho
DE2917597A1 (de) * 1979-04-30 1980-11-13 Siemens Ag Verfahren zur regenerierung ammoniakalischer aetzloesungen zum aetzen von metallischem kupfer
US5013395A (en) * 1987-08-28 1991-05-07 International Business Machines Corporation Continuous regeneration of acid solution
US5227010A (en) * 1991-04-03 1993-07-13 International Business Machines Corporation Regeneration of ferric chloride etchants
US5145553A (en) * 1991-05-06 1992-09-08 International Business Machines Corporation Method of making a flexible circuit member
US6503363B2 (en) * 2000-03-03 2003-01-07 Seh America, Inc. System for reducing wafer contamination using freshly, conditioned alkaline etching solution
US7404904B2 (en) * 2001-10-02 2008-07-29 Melvin Stanley Method and apparatus to clean particulate matter from a toxic fluid
SE531697C2 (sv) * 2007-07-11 2009-07-07 Sigma Engineering Ab Etsnings- och återvinningsförfarande
CN110790416B (zh) * 2018-08-02 2021-11-19 广州超邦化工有限公司 一种处理化学镀铜废水的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3438901A (en) * 1965-10-22 1969-04-15 Neiko I Vassileff Metal treating bath and chelating agent for metal reactive acid baths
US3600244A (en) * 1969-02-20 1971-08-17 Ibm Process of etching metal with recovery or regeneration and recycling

Also Published As

Publication number Publication date
AT324065B (de) 1975-08-11
JPS5549155B2 (en:Method) 1980-12-10
US3855141A (en) 1974-12-17
SE387966B (sv) 1976-09-20
FR2199009A1 (en:Method) 1974-04-05
DE2244307B2 (de) 1975-08-21
JPS50110948A (en:Method) 1975-09-01
DE2244307A1 (de) 1974-03-28
FR2199009B1 (en:Method) 1978-03-10
GB1416637A (en) 1975-12-03
IT993886B (it) 1975-09-30

Similar Documents

Publication Publication Date Title
JPS5549155B2 (en:Method)
JPS4896259U (en:Method)
SE7115756L (en:Method)
CH1065773A4 (en:Method)
CH1444873A4 (en:Method)
CH1851272A4 (en:Method)
CH280672A4 (en:Method)
CH545876A (en:Method)
CH559080A5 (en:Method)
CH559409A5 (en:Method)
CH559527A5 (en:Method)
CH562509A5 (en:Method)
CH562554A5 (en:Method)
CH562577A5 (en:Method)
CH562588A5 (en:Method)
CH562940A5 (en:Method)
CH563700A5 (en:Method)
CH563726A5 (en:Method)
CH565521A5 (en:Method)
CH565550A5 (en:Method)
CH565690A5 (en:Method)
CH567660A5 (en:Method)
CH568368A5 (en:Method)
CH569186A5 (en:Method)
CH569293A5 (en:Method)

Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased