CH603019A5 - - Google Patents
Info
- Publication number
- CH603019A5 CH603019A5 CH558076A CH558076A CH603019A5 CH 603019 A5 CH603019 A5 CH 603019A5 CH 558076 A CH558076 A CH 558076A CH 558076 A CH558076 A CH 558076A CH 603019 A5 CH603019 A5 CH 603019A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/109—Embedding of laminae within face of additional laminae
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2532009A DE2532009C3 (de) | 1975-07-17 | 1975-07-17 | Verfahren zur Herstellung eines elektrischen Bauteiles aus mindestens zwei Einzelteilen, die durch eine Isolierschicht getrennt sind |
Publications (1)
Publication Number | Publication Date |
---|---|
CH603019A5 true CH603019A5 (US20110009641A1-20110113-C00160.png) | 1978-08-15 |
Family
ID=5951781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH558076A CH603019A5 (US20110009641A1-20110113-C00160.png) | 1975-07-17 | 1976-05-04 |
Country Status (5)
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2820403C2 (de) * | 1978-05-10 | 1984-09-27 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Ankleben und zum Kontaktieren eines elektrischen Bauteils mit einer flächenförmigen Elektrode |
DE3544526A1 (de) * | 1985-12-17 | 1987-06-19 | Telefunken Electronic Gmbh | Montagegeraet zum einkleben von bauteilen in ein gehaeuse |
US4700473A (en) * | 1986-01-03 | 1987-10-20 | Motorola Inc. | Method of making an ultra high density pad array chip carrier |
US4678529A (en) * | 1986-07-02 | 1987-07-07 | Xerox Corporation | Selective application of adhesive and bonding process for ink jet printheads |
JPH02197183A (ja) * | 1988-03-29 | 1990-08-03 | Pennwalt Corp | 積層圧電構造及びその形成方法 |
JP2008537461A (ja) * | 2005-04-13 | 2008-09-11 | アダプティブエナジー・リミテッド・ライアビリティー・カンパニー | フレキシブル膜上に導体を備える圧電ダイヤフラムアセンブリ |
US8735734B2 (en) * | 2009-07-23 | 2014-05-27 | Lexmark International, Inc. | Z-directed delay line components for printed circuit boards |
US8198547B2 (en) | 2009-07-23 | 2012-06-12 | Lexmark International, Inc. | Z-directed pass-through components for printed circuit boards |
US8943684B2 (en) * | 2011-08-31 | 2015-02-03 | Lexmark International, Inc. | Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8752280B2 (en) | 2011-09-30 | 2014-06-17 | Lexmark International, Inc. | Extrusion process for manufacturing a Z-directed component for a printed circuit board |
US8790520B2 (en) * | 2011-08-31 | 2014-07-29 | Lexmark International, Inc. | Die press process for manufacturing a Z-directed component for a printed circuit board |
US9009954B2 (en) | 2011-08-31 | 2015-04-21 | Lexmark International, Inc. | Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material |
US9078374B2 (en) | 2011-08-31 | 2015-07-07 | Lexmark International, Inc. | Screening process for manufacturing a Z-directed component for a printed circuit board |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
US8830692B2 (en) | 2012-03-29 | 2014-09-09 | Lexmark International, Inc. | Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component |
US8822838B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for reducing radiated emissions |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3113287A (en) * | 1956-03-29 | 1963-12-03 | Raytheon Co | Electroacoustical transducer mounted on boat hull |
US2969300A (en) * | 1956-03-29 | 1961-01-24 | Bell Telephone Labor Inc | Process for making printed circuits |
US3131557A (en) * | 1960-10-03 | 1964-05-05 | Union Carbide Corp | Specular surface analysis |
US3290479A (en) * | 1963-12-09 | 1966-12-06 | Western Electric Co | Apparatus for bonding |
US3448516A (en) * | 1966-02-14 | 1969-06-10 | Norman R Buck | Method of preparing printed wiring |
US3517438A (en) * | 1966-05-12 | 1970-06-30 | Ibm | Method of packaging a circuit module and joining same to a circuit substrate |
US3520751A (en) * | 1967-01-30 | 1970-07-14 | Valve Corp Of America | Method of securing a label to an article |
US3547724A (en) * | 1967-02-07 | 1970-12-15 | Rogers Corp | Method of and apparatus for producing printed circuits |
US3629042A (en) * | 1968-06-20 | 1971-12-21 | W R Frank Packaging Engineers | Method of embossing a three dimensional medallion into a thermoplastic resin substrate |
-
1975
- 1975-07-17 DE DE2532009A patent/DE2532009C3/de not_active Expired
-
1976
- 1976-05-04 CH CH558076A patent/CH603019A5/xx not_active IP Right Cessation
- 1976-06-10 AT AT423076A patent/AT359584B/de active
- 1976-06-22 US US05/698,786 patent/US4147579A/en not_active Expired - Lifetime
- 1976-07-14 IT IT25285/76A patent/IT1067486B/it active
Also Published As
Publication number | Publication date |
---|---|
DE2532009C3 (de) | 1979-05-31 |
AT359584B (de) | 1980-11-25 |
DE2532009A1 (de) | 1977-01-20 |
ATA423076A (de) | 1980-04-15 |
IT1067486B (it) | 1985-03-16 |
US4147579A (en) | 1979-04-03 |
DE2532009B2 (de) | 1978-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |