CH600734A5 - - Google Patents

Info

Publication number
CH600734A5
CH600734A5 CH497276A CH497276A CH600734A5 CH 600734 A5 CH600734 A5 CH 600734A5 CH 497276 A CH497276 A CH 497276A CH 497276 A CH497276 A CH 497276A CH 600734 A5 CH600734 A5 CH 600734A5
Authority
CH
Switzerland
Application number
CH497276A
Inventor
Hans Hadersbeck
Ernst Andrascek
Alfred Groeber
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH600734A5 publication Critical patent/CH600734A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CH497276A 1975-06-03 1976-04-21 CH600734A5 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752524581 DE2524581A1 (de) 1975-06-03 1975-06-03 Flexible gedruckte schaltung

Publications (1)

Publication Number Publication Date
CH600734A5 true CH600734A5 (xx) 1978-06-30

Family

ID=5948132

Family Applications (1)

Application Number Title Priority Date Filing Date
CH497276A CH600734A5 (xx) 1975-06-03 1976-04-21

Country Status (11)

Country Link
US (1) US4121044A (xx)
JP (1) JPS51147764A (xx)
AT (1) AT352205B (xx)
BE (1) BE842555A (xx)
CH (1) CH600734A5 (xx)
DE (1) DE2524581A1 (xx)
FR (1) FR2313843A1 (xx)
GB (1) GB1497240A (xx)
IT (1) IT1081074B (xx)
NL (1) NL7605954A (xx)
SE (1) SE7606217L (xx)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2833480C3 (de) * 1978-07-31 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Schaltungsplatte für die elektrische Nachrichtentechnik
US4223435A (en) * 1978-08-21 1980-09-23 Advanced Circuit Technology Circuit board with self-locking terminals
DE2938254C2 (de) * 1979-09-21 1982-04-22 Siemens AG, 1000 Berlin und 8000 München Flexible gedruckte Schaltung
US4551914A (en) * 1983-10-05 1985-11-12 Hewlett-Packard Company Method of making flexible circuit connections
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
NL8403755A (nl) * 1984-12-11 1986-07-01 Philips Nv Werkwijze voor de vervaardiging van een meerlaags gedrukte bedrading met doorverbonden sporen in verschillende lagen en meerlaags gedrukte bedrading vervaardigd volgens de werkwijze.
JPS61176184A (ja) * 1985-01-31 1986-08-07 日本メクトロン株式会社 両面フレキシブル回路基板の導通構造
US4676564A (en) * 1985-10-28 1987-06-30 Burroughs Corporation Access device unit for installed pin grid array
US4703984A (en) * 1985-10-28 1987-11-03 Burroughs Corporation Flexible access connector with miniature slotted pads
US4891014A (en) * 1989-03-03 1990-01-02 Rogers Corporation Method of forming contact bumps in contact pads
US5041903A (en) * 1990-06-11 1991-08-20 National Semiconductor Corp. Vertical semiconductor interconnection method and structure
US5092035A (en) * 1990-09-10 1992-03-03 Codex Corporation Method of making printed circuit board assembly
US5189261A (en) * 1990-10-09 1993-02-23 Ibm Corporation Electrical and/or thermal interconnections and methods for obtaining such
DE4041507A1 (de) * 1990-12-22 1992-06-25 Bosch Gmbh Robert Verfahren zum fuegen einer leiterbahnfolie mit einem elektrischen bauteil, damit erzeugtes geraet sowie vorrichtung zum montieren einer leiterbahnfolie
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
US5161403A (en) * 1991-06-25 1992-11-10 Digital Equipment Corporation Method and apparatus for forming coplanar contact projections on flexible circuits
US5397239A (en) * 1993-12-17 1995-03-14 Circuit-Wise, Inc. Molded hinged connector
US5384435A (en) * 1994-01-28 1995-01-24 Molex Incorporated Mounting terminal pins in substrates
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5983492A (en) 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US6249135B1 (en) 1997-09-19 2001-06-19 Fujitsu Limited Method and apparatus for passive optical characterization of semiconductor substrates subjected to high energy (MEV) ion implantation using high-injection surface photovoltage
EP0921596A1 (en) * 1997-11-24 1999-06-09 Molex Incorporated Terminal blades mounted on flexible substrates
US6585538B2 (en) * 1999-04-22 2003-07-01 Visteon Global Technologies, Inc. Continuous conductor connector system for printed circuit boards
US7059868B1 (en) 2000-03-07 2006-06-13 Western Digital (Fremont), Inc. Connection of trace circuitry in a computer disk drive system
DE10122414A1 (de) * 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Durchkontaktierung von flexiblen Leiterplatten
DE10156395A1 (de) * 2001-11-16 2003-05-28 Giesecke & Devrient Gmbh Verfahren und Vorrichtung zum Durchkontaktieren von Substraten und Leiterplatten
US6740824B2 (en) * 2002-06-25 2004-05-25 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making same
US6781088B2 (en) 2002-09-12 2004-08-24 Wilson Greatbatch Technologies, Inc. Pin to thin plate joint and method for making the joint
US6808422B2 (en) * 2003-03-19 2004-10-26 Delphi Technologies, Inc. Filter insert for an electrical connector assembly
US6805277B1 (en) * 2003-04-16 2004-10-19 Lotes Co., Ltd. Process for soldering electric connector onto circuit board
KR101109347B1 (ko) * 2009-11-30 2012-01-31 삼성전기주식회사 스핀들모터의 연성회로기판

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1814804B2 (de) * 1968-12-14 1973-10-04 Standard Elektrik Lorenz Ag, 7000 Stuttgart Schaltungsanordnung zur Übertragung von Tastwahlinformationen über eine Trennstelle in Fernsprechanlagen
DE2107591A1 (de) * 1971-02-17 1972-08-31 Siemens Ag Verfahren zur Durchkontaktierung von beidseitig mit Leiterbahnen beschichteten Folien

Also Published As

Publication number Publication date
IT1081074B (it) 1985-05-16
US4121044A (en) 1978-10-17
FR2313843A1 (fr) 1976-12-31
SE7606217L (sv) 1976-12-04
JPS51147764A (en) 1976-12-18
GB1497240A (en) 1978-01-05
BE842555A (fr) 1976-10-01
AT352205B (de) 1979-09-10
ATA340076A (de) 1979-02-15
DE2524581A1 (de) 1976-12-23
NL7605954A (nl) 1976-12-07
FR2313843B1 (xx) 1980-01-04

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Legal Events

Date Code Title Description
PL Patent ceased