CH599837A5 - Silicon crystal cutting wire - Google Patents
Silicon crystal cutting wireInfo
- Publication number
- CH599837A5 CH599837A5 CH1398775A CH1398775A CH599837A5 CH 599837 A5 CH599837 A5 CH 599837A5 CH 1398775 A CH1398775 A CH 1398775A CH 1398775 A CH1398775 A CH 1398775A CH 599837 A5 CH599837 A5 CH 599837A5
- Authority
- CH
- Switzerland
- Prior art keywords
- wire
- cutting
- groove
- diamond
- grains
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
- B26B27/00—Hand cutting tools not provided for in the preceding groups, e.g. finger rings for cutting string, devices for cutting by means of wires
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Silicon crystal cutting wire has diamond grains embedded in resin matrix in helical groove with tips protruding from surface
Description
La présente invention concerne un fil métallique coupant, plus particulièrement destiné à couper avec une grande précision des matériaux durs et des monocristaux.
L'objet de cette invention consiste donc en un fil métallique coupant, caractérisé par le fait qu'il comporte au moins une rainure hélicoïdale dans laquelle sont fixés des grains abrasifs; une partie de ceux-ci faisant saillie hors de la surface cylindrique du fil.
Le dessin annexé illustre schématiquement et à titre d'exemple une forme d'exécution du fil selon l'invention.
La fig. 1 en est une vue de côté en perspective.
Les fig. 2A, B et C sont des détails du fil représenté à la fig. 1.
Le fil métallique, utilisé pour la réalisation du fil coupant selon l'invention, présente généralement une résistance à la traction et à la rupture élevée, et est d'un diamètre compris entre 0,05 et 2 mm de préférence entre 0,1 et 1 mm. lu peut être par exemple en nickel, en chrome, en un alliage de ceuxci, ou en tout autre métal ou alliage approprié, c'est-à-dire permettant d'obtenir les qualités et résistances mécaniques désirées.
Comme montré sur la fig. 1, le fil métallique 1 comporte sur toute sa longueur une rainure hélicoïdale 2, dont un détail est présenté sur la fig. 2A. Dans cette rainure 2 sont disposés des grains de diamant 3, maintenus entre eux et fixés dans ladite rainure 2 au moyen d'un matériau liant synthétique, par exemple une colle de type polymérique.
Pour obtenir l'effet coupant, les grains de diamant 3 sont disposés dans la rainure 2 de telle sorte qu'ils dépassent légèrement la surface du fil 1, comme on peut le voir sur les fig. 2B et 2C.
Enfin, pour améliorer la fixation des grains de diamant 3 dans la rainure 2, et par là pour améliorer la résistance à l'usure du fil coupant selon l'invention, les arêtes supérieures 4 (fig. 1) de la rainure 2 sont repoussées vers l'intérieur de façon à former des rebords 5 emprisonnant la masse formée par les grains de diamant et le liant, comme montré sur la fig. 2C.
Le fil métallique coupant selon l'invention peut être utilisé tel quel ou sur des dispositifs permettant la coupe en série. fl est particulièrement approprié pour couper des matériaux durs, et des monocristaux, par exemple un monocristal de silicium dur et fragile. De plus, le guidage d'un tel fil diamanté pouvant être rigoureusement contrôlé, la précision de coupe obtenue est excellente, nettement supérieure à celle que l'on peut obtenir avec les disques diamantés utilisés actuellement dans le même but. La perte de matière lors de la coupe est réduite au minimum, le diamètre du fil pouvant être très faible, un dixième de millimètre ou moins, alors que dans les dispositifs de coupe existant le chemin de l'organe de coupe est toujours de l'ordre du millimètre.
En outre, les caractéristiques mécaniques propres et la conception même de ce nouveau fil coupant assurent à celui-ci une grande résistance à l'usure donc une grande longévité, largement supérieur à celles des disques diamantés connus par exemple.
n est également possible de prévoir plusieurs rainures héli coïdales, angulairement décalées, courant le long du fil. Ceci à l'avantage de ces rainures forment un angle plus faible avec l'axe du fil et qu'il est possible de munir le fil avec plus de matière abrasive, ce qui augmente la longévité.
ll est évident qu'à la place du diamant d'autre poudres ou granulés abrasifs, tel que du corindon peuvent être utilisés.
REVENDICATION
Fil métallique coupant, caractérisé par le fait qu'il comporte au moins une rainure hélicoïdale dans laquelle sont fixé des grains abrasifs; une partie de ceux-ci faisant saillie hors de la surface cylindrique du fil.
SOUS-REVENDICATIONS
1. Fil selon la revendication, caractérisé par le fait que les grains abrasifs sont enrobés dans un liant polymérique servant également de colle pour maintenir lesdits grains dans la rainure hélicoïdale.
2. Fil selon la revendication et la sous-revendication 1, caractérisé par le fait que les grains abrasifs sont emprisonnés dans la rainure hélicoïdale par les rebords formés par les arêtes supérieures repoussées de ladite rainure.
3. Fil selon la revendication caractérisé par le fait que les grains abrasifs sont des grains de diamant.
4. Fil selon la revendication ou l'une des sous-revendications 1 à 3, caractérisé par le fait que le diamètre du fil est compris entre 0,1 et 1 mm.
5. Fil selon la revendication ou l'une des sous-revendications 1 à 3, caractérisé par le fait qu'il est en chrome, en nickel ou en alliage de ceux-ci.
**ATTENTION** fin du champ DESC peut contenir debut de CLMS **.
The present invention relates to a cutting metal wire, more particularly intended for cutting hard materials and single crystals with great precision.
The object of this invention therefore consists of a cutting metal wire, characterized in that it comprises at least one helical groove in which abrasive grains are fixed; part of these protruding out of the cylindrical surface of the wire.
The appended drawing illustrates schematically and by way of example an embodiment of the wire according to the invention.
Fig. 1 is a side perspective view.
Figs. 2A, B and C are details of the wire shown in fig. 1.
The metal wire, used for making the cutting wire according to the invention, generally has a high tensile and breaking strength, and has a diameter of between 0.05 and 2 mm, preferably between 0.1 and 1 mm. it can be, for example, nickel, chromium, an alloy thereof, or any other suitable metal or alloy, ie making it possible to obtain the desired qualities and mechanical strengths.
As shown in fig. 1, the metal wire 1 comprises over its entire length a helical groove 2, a detail of which is shown in FIG. 2A. In this groove 2 are arranged diamond grains 3, held together and fixed in said groove 2 by means of a synthetic binder material, for example a polymer type adhesive.
To obtain the cutting effect, the diamond grains 3 are arranged in the groove 2 so that they slightly protrude from the surface of the wire 1, as can be seen in FIGS. 2B and 2C.
Finally, to improve the fixing of the diamond grains 3 in the groove 2, and thereby to improve the wear resistance of the cutting wire according to the invention, the upper edges 4 (FIG. 1) of the groove 2 are pushed back. inwardly so as to form rims 5 trapping the mass formed by the diamond grains and the binder, as shown in FIG. 2C.
The cutting metal wire according to the invention can be used as it is or on devices allowing series cutting. fl is particularly suitable for cutting hard materials, and single crystals, for example hard and brittle silicon single crystal. In addition, the guiding of such a diamond wire being able to be strictly controlled, the cutting precision obtained is excellent, significantly higher than that which can be obtained with the diamond discs currently used for the same purpose. The loss of material when cutting is reduced to a minimum, the diameter of the wire can be very small, a tenth of a millimeter or less, while in existing cutters the path of the cutting member is always order of the millimeter.
In addition, the specific mechanical characteristics and the very design of this new cutting wire provide it with great resistance to wear and therefore great longevity, much greater than those of known diamond discs, for example.
It is also possible to provide several helical grooves, angularly offset, running along the wire. This has the advantage that these grooves form a smaller angle with the axis of the wire and that it is possible to provide the wire with more abrasive material, which increases longevity.
It is obvious that instead of diamond other abrasive powders or granules, such as corundum can be used.
CLAIM
Cutting metal wire, characterized in that it comprises at least one helical groove in which abrasive grains are fixed; part of these protruding out of the cylindrical surface of the wire.
SUB-CLAIMS
1. Wire according to claim, characterized in that the abrasive grains are coated in a polymeric binder also serving as an adhesive to maintain said grains in the helical groove.
2. Wire according to claim and sub-claim 1, characterized in that the abrasive grains are trapped in the helical groove by the flanges formed by the upper ridges of said groove.
3. Wire according to claim characterized in that the abrasive grains are diamond grains.
4. Wire according to claim or one of sub-claims 1 to 3, characterized in that the diameter of the wire is between 0.1 and 1 mm.
5. Wire according to claim or one of sub-claims 1 to 3, characterized in that it is made of chromium, nickel or an alloy thereof.
** ATTENTION ** end of DESC field can contain start of CLMS **.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1398775A CH599837A5 (en) | 1975-10-29 | 1975-10-29 | Silicon crystal cutting wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1398775A CH599837A5 (en) | 1975-10-29 | 1975-10-29 | Silicon crystal cutting wire |
Publications (1)
Publication Number | Publication Date |
---|---|
CH599837A5 true CH599837A5 (en) | 1978-05-31 |
Family
ID=4396997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1398775A CH599837A5 (en) | 1975-10-29 | 1975-10-29 | Silicon crystal cutting wire |
Country Status (1)
Country | Link |
---|---|
CH (1) | CH599837A5 (en) |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999046077A2 (en) * | 1998-03-11 | 1999-09-16 | Norton Company | Superabrasive wire saw and method for making the saw |
US6102024A (en) * | 1998-03-11 | 2000-08-15 | Norton Company | Brazed superabrasive wire saw and method therefor |
CN102285011A (en) * | 2011-08-07 | 2011-12-21 | 江西金葵能源科技有限公司 | Method for cutting solar-grade polycrystalline silicon sheets by using diamond wires |
CN103286867A (en) * | 2013-06-04 | 2013-09-11 | 衡水英利新能源有限公司 | Steel wire for cutting silicon slices and production method of steel wire |
US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9533397B2 (en) | 2012-06-29 | 2017-01-03 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
-
1975
- 1975-10-29 CH CH1398775A patent/CH599837A5/en not_active IP Right Cessation
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6102024A (en) * | 1998-03-11 | 2000-08-15 | Norton Company | Brazed superabrasive wire saw and method therefor |
WO1999046077A3 (en) * | 1998-03-11 | 2003-07-24 | Norton Co | Superabrasive wire saw and method for making the saw |
WO1999046077A2 (en) * | 1998-03-11 | 1999-09-16 | Norton Company | Superabrasive wire saw and method for making the saw |
US9067268B2 (en) | 2009-08-14 | 2015-06-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9862041B2 (en) | 2009-08-14 | 2018-01-09 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body |
US9028948B2 (en) | 2009-08-14 | 2015-05-12 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated body, and methods of forming thereof |
US9248583B2 (en) | 2010-12-30 | 2016-02-02 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9186816B2 (en) | 2010-12-30 | 2015-11-17 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
CN102285011A (en) * | 2011-08-07 | 2011-12-21 | 江西金葵能源科技有限公司 | Method for cutting solar-grade polycrystalline silicon sheets by using diamond wires |
US9375826B2 (en) | 2011-09-16 | 2016-06-28 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9211634B2 (en) | 2011-09-29 | 2015-12-15 | Saint-Gobain Abrasives, Inc. | Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof |
US9533397B2 (en) | 2012-06-29 | 2017-01-03 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9278429B2 (en) | 2012-06-29 | 2016-03-08 | Saint-Gobain Abrasives, Inc. | Abrasive article for abrading and sawing through workpieces and method of forming |
US9254552B2 (en) | 2012-06-29 | 2016-02-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9687962B2 (en) | 2012-06-29 | 2017-06-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9902044B2 (en) | 2012-06-29 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US10596681B2 (en) | 2012-06-29 | 2020-03-24 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US9409243B2 (en) | 2013-04-19 | 2016-08-09 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
CN103286867B (en) * | 2013-06-04 | 2015-08-19 | 衡水英利新能源有限公司 | Silicon chip cutting steel wire and preparation method thereof |
CN103286867A (en) * | 2013-06-04 | 2013-09-11 | 衡水英利新能源有限公司 | Steel wire for cutting silicon slices and production method of steel wire |
US9878382B2 (en) | 2015-06-29 | 2018-01-30 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US10137514B2 (en) | 2015-06-29 | 2018-11-27 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
US10583506B2 (en) | 2015-06-29 | 2020-03-10 | Saint-Gobain Abrasives, Inc. | Abrasive article and method of forming |
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Legal Events
Date | Code | Title | Description |
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PL | Patent ceased |