CH599827A5 - - Google Patents

Info

Publication number
CH599827A5
CH599827A5 CH1276675A CH1276675A CH599827A5 CH 599827 A5 CH599827 A5 CH 599827A5 CH 1276675 A CH1276675 A CH 1276675A CH 1276675 A CH1276675 A CH 1276675A CH 599827 A5 CH599827 A5 CH 599827A5
Authority
CH
Switzerland
Application number
CH1276675A
Inventor
Martin Von Allmen
Hans-Peter Schwob
Original Assignee
Lasag Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lasag Ag filed Critical Lasag Ag
Priority to CH1276675A priority Critical patent/CH599827A5/xx
Priority to FR7629072A priority patent/FR2326267A1/fr
Priority to DE19762644014 priority patent/DE2644014A1/de
Priority to GB40735/76A priority patent/GB1545933A/en
Publication of CH599827A5 publication Critical patent/CH599827A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/11—Mode locking; Q-switching; Other giant-pulse techniques, e.g. cavity dumping
    • H01S3/1123—Q-switching
    • H01S3/115—Q-switching using intracavity electro-optic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
CH1276675A 1975-10-02 1975-10-02 CH599827A5 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CH1276675A CH599827A5 (de) 1975-10-02 1975-10-02
FR7629072A FR2326267A1 (fr) 1975-10-02 1976-09-28 Procede et dispositif pour l'enlevement de matieres a l'aide de rayons laser
DE19762644014 DE2644014A1 (de) 1975-10-02 1976-09-30 Verfahren zum abtragen von material mittels laserstrahlen und anordnung zum durchfuehren des verfahrens
GB40735/76A GB1545933A (en) 1975-10-02 1976-10-01 Method of ablating metal workpieces with laser radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1276675A CH599827A5 (de) 1975-10-02 1975-10-02

Publications (1)

Publication Number Publication Date
CH599827A5 true CH599827A5 (de) 1978-05-31

Family

ID=4386206

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1276675A CH599827A5 (de) 1975-10-02 1975-10-02

Country Status (4)

Country Link
CH (1) CH599827A5 (de)
DE (1) DE2644014A1 (de)
FR (1) FR2326267A1 (de)
GB (1) GB1545933A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384582A1 (de) * 1989-02-16 1990-08-29 The Wiggins Teape Group Limited Oberflächenbearbeitung mittels Laser-Energie

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2943107C2 (de) * 1979-10-25 1984-07-26 Robert 6600 Saarbrücken Langen Verfahren zum Entrosten
US4734558A (en) * 1983-05-16 1988-03-29 Nec Corporation Laser machining apparatus with controllable mask
DE3424825A1 (de) * 1984-07-06 1986-02-06 Gerd Prof. Dr.-Ing. 6101 Roßdorf Herziger Verfahren und einrichtung zum bearbeiten von werkstuecken mittels laserstrahl
US4930901A (en) * 1988-12-23 1990-06-05 Electro Scientific Industries, Inc. Method of and apparatus for modulating a laser beam
GB2226970B (en) * 1989-01-11 1992-10-21 British Aerospace Methods of manufacture and surface treatment using laser radiation
US5352495A (en) * 1989-02-16 1994-10-04 The Wiggins Teape Group Limited Treatment of a surface by laser energy
US5197074A (en) * 1991-12-26 1993-03-23 Electro Scientific Industries, Inc. Multi-function intra-resonator loss modulator and method of operating same
DE4230496A1 (de) * 1992-09-11 1994-03-17 Bergmann Hans Wilhelm Verfahren zum Feinabtrag mit gepulster Laserstrahlung
DE4310023A1 (de) * 1993-03-27 1994-09-29 Laser Medizin Zentrum Ggmbh Be Gütegeschalteter Langpuls-Festkörperlaser mit faseroptischer Resonatorverlängerung
DE4336947A1 (de) * 1993-03-27 1995-05-04 Laser Medizin Zentrum Ggmbh Be Langpuls-Laser mit Resonatorverlängerung mittels optischem Wellenleiter
US6806440B2 (en) 2001-03-12 2004-10-19 Electro Scientific Industries, Inc. Quasi-CW diode pumped, solid-state UV laser system and method employing same
US6781090B2 (en) 2001-03-12 2004-08-24 Electro Scientific Industries, Inc. Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same
US7352784B2 (en) 2004-07-20 2008-04-01 Jds Uniphase Corporation Laser burst boosting method and apparatus
CN111618432B (zh) * 2019-02-28 2021-08-17 上海微电子装备（集团）股份有限公司 一种激光焊接方法和激光焊接系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH455071A4 (de) * 1971-03-29 1972-08-15
US3806829A (en) * 1971-04-13 1974-04-23 Sys Inc Pulsed laser system having improved energy control with improved power supply laser emission energy sensor and adjustable repetition rate control features

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0384582A1 (de) * 1989-02-16 1990-08-29 The Wiggins Teape Group Limited Oberflächenbearbeitung mittels Laser-Energie

Also Published As

Publication number Publication date
GB1545933A (en) 1979-05-16
FR2326267A1 (fr) 1977-04-29
DE2644014A1 (de) 1977-04-14
FR2326267B1 (de) 1982-05-07

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Legal Events

Date Code Title Description
PL Patent ceased