CH592961A5 - - Google Patents
Info
- Publication number
- CH592961A5 CH592961A5 CH1232075A CH1232075A CH592961A5 CH 592961 A5 CH592961 A5 CH 592961A5 CH 1232075 A CH1232075 A CH 1232075A CH 1232075 A CH1232075 A CH 1232075A CH 592961 A5 CH592961 A5 CH 592961A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Devices For Conveying Motion By Means Of Endless Flexible Members (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1232075A CH592961A5 (hu) | 1975-09-23 | 1975-09-23 | |
DE19752546312 DE2546312A1 (de) | 1975-09-23 | 1975-10-16 | Halbleitereinheit und verfahren zur herstellung derselben |
DE19757532876U DE7532876U (de) | 1975-09-23 | 1975-10-16 | Halbleitereinheit |
NO763210A NO146220C (no) | 1975-09-23 | 1976-09-20 | Fremgangsmaate for justering av forutbestemt spennkraft i minst en skrueformet trykkfjaer i en halvlederenhet |
FR7628148A FR2326040A1 (fr) | 1975-09-23 | 1976-09-20 | Groupe a semi-conducteurs et procede de fabrication de celui-ci |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1232075A CH592961A5 (hu) | 1975-09-23 | 1975-09-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH592961A5 true CH592961A5 (hu) | 1977-11-15 |
Family
ID=4381916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1232075A CH592961A5 (hu) | 1975-09-23 | 1975-09-23 |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH592961A5 (hu) |
DE (2) | DE2546312A1 (hu) |
FR (1) | FR2326040A1 (hu) |
NO (1) | NO146220C (hu) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2135119A (en) * | 1983-01-19 | 1984-08-22 | Westinghouse Electric Corp | Self-aligning, self-loading semiconductor clamp |
FR2629153B1 (fr) * | 1988-03-22 | 1990-05-04 | Bull Sa | Dispositif de fixation a pression de deux pieces l'une a l'autre |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1185728B (de) * | 1960-05-18 | 1965-01-21 | Siemens Ag | Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement |
GB1001269A (hu) * | 1960-09-30 | 1900-01-01 | ||
CH442502A (de) * | 1965-04-23 | 1967-08-31 | Siemens Ag | Gleichrichteranlage |
SE316534B (hu) * | 1965-07-09 | 1969-10-27 | Asea Ab | |
CH526857A (de) * | 1970-09-29 | 1972-08-15 | Bbc Brown Boveri & Cie | Halbleitereinheit und Verfahren zur Herstellung derselben |
-
1975
- 1975-09-23 CH CH1232075A patent/CH592961A5/xx not_active IP Right Cessation
- 1975-10-16 DE DE19752546312 patent/DE2546312A1/de not_active Ceased
- 1975-10-16 DE DE19757532876U patent/DE7532876U/de not_active Expired
-
1976
- 1976-09-20 NO NO763210A patent/NO146220C/no unknown
- 1976-09-20 FR FR7628148A patent/FR2326040A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
NO763210L (no) | 1977-03-24 |
NO146220B (no) | 1982-05-10 |
DE7532876U (de) | 1977-06-30 |
NO146220C (no) | 1982-08-18 |
DE2546312A1 (de) | 1977-03-24 |
FR2326040A1 (fr) | 1977-04-22 |
FR2326040B1 (hu) | 1982-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |