CH592960A5 - - Google Patents
Info
- Publication number
- CH592960A5 CH592960A5 CH19576A CH19576A CH592960A5 CH 592960 A5 CH592960 A5 CH 592960A5 CH 19576 A CH19576 A CH 19576A CH 19576 A CH19576 A CH 19576A CH 592960 A5 CH592960 A5 CH 592960A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT4756976A IT1053295B (it) | 1976-01-09 | 1976-01-09 | Impianto per la prduzione a ciclo continuo di elementi in conglomerato di gesso e metodo di fabbricazione per il suo impiego |
CH19576A CH592960A5 (fr) | 1976-01-09 | 1976-01-09 | |
DE19767602776U DE7602776U1 (de) | 1976-01-09 | 1976-02-02 | Zylindrisches gehaeuse fuer ein leistungshalbleiter-bauelement |
DE19762603812 DE2603812A1 (de) | 1976-01-09 | 1976-02-02 | Zylindrisches gehaeuse fuer ein leistungshalbleiter-bauelement |
CA268,221A CA1039951A (fr) | 1975-01-20 | 1976-12-20 | Garniture anti-usure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH19576A CH592960A5 (fr) | 1976-01-09 | 1976-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH592960A5 true CH592960A5 (fr) | 1977-11-15 |
Family
ID=4181417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH19576A CH592960A5 (fr) | 1975-01-20 | 1976-01-09 |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH592960A5 (fr) |
DE (2) | DE2603812A1 (fr) |
IT (1) | IT1053295B (fr) |
-
1976
- 1976-01-09 CH CH19576A patent/CH592960A5/xx not_active IP Right Cessation
- 1976-01-09 IT IT4756976A patent/IT1053295B/it active
- 1976-02-02 DE DE19762603812 patent/DE2603812A1/de not_active Withdrawn
- 1976-02-02 DE DE19767602776U patent/DE7602776U1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE7602776U1 (de) | 1977-11-17 |
IT1053295B (it) | 1981-08-31 |
DE2603812A1 (de) | 1977-07-14 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |