CH591762A5 - - Google Patents

Info

Publication number
CH591762A5
CH591762A5 CH355275A CH355275A CH591762A5 CH 591762 A5 CH591762 A5 CH 591762A5 CH 355275 A CH355275 A CH 355275A CH 355275 A CH355275 A CH 355275A CH 591762 A5 CH591762 A5 CH 591762A5
Authority
CH
Switzerland
Application number
CH355275A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH355275A priority Critical patent/CH591762A5/xx
Priority to DE19757513490 priority patent/DE7513490U/de
Priority to DE19752518666 priority patent/DE2518666A1/de
Priority to FR7607634A priority patent/FR2305021A1/fr
Priority to JP2976776A priority patent/JPS51118966A/ja
Publication of CH591762A5 publication Critical patent/CH591762A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10156—Shape being other than a cuboid at the periphery
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH355275A 1975-03-20 1975-03-20 CH591762A5 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH355275A CH591762A5 (de) 1975-03-20 1975-03-20
DE19757513490 DE7513490U (de) 1975-03-20 1975-04-26 Haltevorrichtung
DE19752518666 DE2518666A1 (de) 1975-03-20 1975-04-26 Verfahren zum aufbringen von glasuren auf die oberflaeche von halbleiter-aktivteilen, haltevorrichtung zur ausfuehrung des verfahrens und dessen anwendung zum passivieren von pn-uebergaengen
FR7607634A FR2305021A1 (fr) 1975-03-20 1976-03-17 Procede pour l'application de glacures sur la surface des parties actives d'elements a semi-conducteurs, dispositif de serrage pour la mise en oeuvre du procede et application de celui-ci a la passivation des jonctions pn
JP2976776A JPS51118966A (en) 1975-03-20 1976-03-18 Method of glazing activated surface of semiconductor * holder for practising thereby and application of passivating pn transition thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH355275A CH591762A5 (de) 1975-03-20 1975-03-20

Publications (1)

Publication Number Publication Date
CH591762A5 true CH591762A5 (de) 1977-09-30

Family

ID=4258446

Family Applications (1)

Application Number Title Priority Date Filing Date
CH355275A CH591762A5 (de) 1975-03-20 1975-03-20

Country Status (4)

Country Link
JP (1) JPS51118966A (de)
CH (1) CH591762A5 (de)
DE (2) DE2518666A1 (de)
FR (1) FR2305021A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5367363A (en) * 1976-11-27 1978-06-15 Mitsubishi Electric Corp Semiconductor device
FR2469000A1 (fr) * 1979-10-30 1981-05-08 Silicium Semiconducteur Ssc Structure de thyristor tres haute tension glassive et son procede de fabrication
FR2515874A1 (fr) * 1981-11-05 1983-05-06 Comp Generale Electricite Procede d'encapsulation plastique de cellules solaires
DE3832732A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterdiode
DE3832750A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterbauelement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1438826A (fr) * 1964-06-30 1966-05-13 Ibm Formation de films de verre par pulvérisation réactive
US3473959A (en) * 1964-08-10 1969-10-21 Licentia Gmbh Method for coating semiconductors and apparatus
US3437505A (en) * 1965-06-28 1969-04-08 Ibm Method for depositing glass particles on the entire exposed surface of an object
US3639975A (en) * 1969-07-30 1972-02-08 Gen Electric Glass encapsulated semiconductor device fabrication process

Also Published As

Publication number Publication date
DE2518666A1 (de) 1976-09-30
FR2305021A1 (fr) 1976-10-15
DE7513490U (de) 1977-05-26
JPS51118966A (en) 1976-10-19

Similar Documents

Publication Publication Date Title
DK92476A (de)
BR7608506A (de)
DD118915A1 (de)
CH22175A4 (de)
BG21456A1 (de)
BG22242A1 (de)
BG22261A1 (de)
BG22426A1 (de)
BG22435A1 (de)
BG22513A1 (de)
CH1132075A4 (de)
CH147275A4 (de)
DD126246A1 (de)
CH459576A4 (de)
CH563879A5 (de)
CH584777A5 (de)
CH585088A5 (de)
CH586541A5 (de)
CH587100A5 (de)
CH587146A5 (de)
CH587378B5 (de)
CH588391A5 (de)
CH592193A5 (de)
CH592199B5 (de)
CH592495A5 (de)

Legal Events

Date Code Title Description
PL Patent ceased