CH578276A5 - Equipment cooling assembly - Google Patents

Equipment cooling assembly

Info

Publication number
CH578276A5
CH578276A5 CH1621774A CH1621774A CH578276A5 CH 578276 A5 CH578276 A5 CH 578276A5 CH 1621774 A CH1621774 A CH 1621774A CH 1621774 A CH1621774 A CH 1621774A CH 578276 A5 CH578276 A5 CH 578276A5
Authority
CH
Switzerland
Prior art keywords
cooling assembly
equipment cooling
control electrodes
devices
conducting devices
Prior art date
Application number
CH1621774A
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1621774A priority Critical patent/CH578276A5/en
Priority to DE19752501029 priority patent/DE2501029A1/en
Priority to FR7539889A priority patent/FR2336854A1/en
Publication of CH578276A5 publication Critical patent/CH578276A5/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)

Abstract

The cooling arrangement is based on a series of water cooled tubes with cross-connections through a number of semi-conductors. The greatest potential difference between conducting devices (Ko, Kn) in contact with the cooling medium is dropped between control electrodes (5, 5') at the same potential as the conducting devices. Further devices (K1 .. Kn-1) are mounted at equipotential points (a1 ... an-1) between the control electrodes.
CH1621774A 1974-12-06 1974-12-06 Equipment cooling assembly CH578276A5 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CH1621774A CH578276A5 (en) 1974-12-06 1974-12-06 Equipment cooling assembly
DE19752501029 DE2501029A1 (en) 1974-12-06 1975-01-13 DEVICE FOR COOLING ELECTRICAL DEVICES AT DIFFERENT ELECTRICAL POTENTIALS BY USING A FLOATING MEDIUM
FR7539889A FR2336854A1 (en) 1974-12-06 1975-12-26 Cooling electrical devices at different potentials - using pair of flow tubes for circulating cooling agent and connected to metallic cooling plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1621774A CH578276A5 (en) 1974-12-06 1974-12-06 Equipment cooling assembly

Publications (1)

Publication Number Publication Date
CH578276A5 true CH578276A5 (en) 1976-07-30

Family

ID=4415395

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1621774A CH578276A5 (en) 1974-12-06 1974-12-06 Equipment cooling assembly

Country Status (1)

Country Link
CH (1) CH578276A5 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9309428U1 (en) * 1993-06-24 1993-08-12 Siemens AG, 80333 München Power converter module
US5544035A (en) * 1993-12-23 1996-08-06 Abb Management Ag Converter arrangement having a low-inductance commutation circuit
DE19632173A1 (en) * 1996-08-09 1998-02-12 Asea Brown Boveri Power converter circuitry
DE19805820A1 (en) * 1998-02-13 1999-08-19 Asea Brown Boveri Semiconductor clamped stack for high power rectifier
WO2015124511A1 (en) * 2014-02-21 2015-08-27 Maschinenfabrik Reinhausen Gmbh Switching unit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9309428U1 (en) * 1993-06-24 1993-08-12 Siemens AG, 80333 München Power converter module
US5544035A (en) * 1993-12-23 1996-08-06 Abb Management Ag Converter arrangement having a low-inductance commutation circuit
DE19632173A1 (en) * 1996-08-09 1998-02-12 Asea Brown Boveri Power converter circuitry
US5986906A (en) * 1996-08-09 1999-11-16 Asea Brown Boveri Ag Converter circuit arrangement
DE19805820A1 (en) * 1998-02-13 1999-08-19 Asea Brown Boveri Semiconductor clamped stack for high power rectifier
WO2015124511A1 (en) * 2014-02-21 2015-08-27 Maschinenfabrik Reinhausen Gmbh Switching unit

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Legal Events

Date Code Title Description
PL Patent ceased