CH572798A5 - Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motor - Google Patents
Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motorInfo
- Publication number
- CH572798A5 CH572798A5 CH42674A CH42674A CH572798A5 CH 572798 A5 CH572798 A5 CH 572798A5 CH 42674 A CH42674 A CH 42674A CH 42674 A CH42674 A CH 42674A CH 572798 A5 CH572798 A5 CH 572798A5
- Authority
- CH
- Switzerland
- Prior art keywords
- laser beam
- holes
- driven
- stepper motor
- conical holes
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/16—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass plates with holes of very small diameter, e.g. for spinning or burner nozzles
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/0036—Laser treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Abstract
Process for producing precision holes, using pulsed or continuous laser radiation, the novelty being that form pulse to pulse, or in prescribed intervals of time, the local intensity-distribution of the laser beam is altered as a function of time. In the pref. device, a screen is inserted in the laser-resonator and the dia. of the aperture is altered from pulse or in prescribed steps w.r.t. time. The screen may be located near the max. reflection mirror or near the catcher mirror and it pref. consists of a disc provided with holes of different dia. arranged in a circle, the disc being driven by a stepper motor. Drilling holes using a laser beam, esp. in hard or brittle matls., e.g. sapphire, diamond, ceramics or metals, partic. conical holes and blind conical holes e.g. in diamond drawing dies or jewelled bearings for measuring instruments.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH42674A CH572798A5 (en) | 1974-01-14 | 1974-01-14 | Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH42674A CH572798A5 (en) | 1974-01-14 | 1974-01-14 | Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motor |
Publications (1)
Publication Number | Publication Date |
---|---|
CH572798A5 true CH572798A5 (en) | 1976-02-27 |
Family
ID=4186749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH42674A CH572798A5 (en) | 1974-01-14 | 1974-01-14 | Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motor |
Country Status (1)
Country | Link |
---|---|
CH (1) | CH572798A5 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000047359A1 (en) * | 1999-02-11 | 2000-08-17 | Robert Bosch Gmbh | Method for making defined conical holes using a laser beam |
US6201213B1 (en) * | 1996-10-01 | 2001-03-13 | Mitsubishi Denki Kabushiki Kaisha | Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined tapering |
US6285001B1 (en) * | 1995-04-26 | 2001-09-04 | 3M Innovative Properties Company | Method and apparatus for step and repeat exposures |
US6744010B1 (en) * | 1991-08-22 | 2004-06-01 | United Technologies Corporation | Laser drilled holes for film cooling |
-
1974
- 1974-01-14 CH CH42674A patent/CH572798A5/en not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6744010B1 (en) * | 1991-08-22 | 2004-06-01 | United Technologies Corporation | Laser drilled holes for film cooling |
US6285001B1 (en) * | 1995-04-26 | 2001-09-04 | 3M Innovative Properties Company | Method and apparatus for step and repeat exposures |
US6201213B1 (en) * | 1996-10-01 | 2001-03-13 | Mitsubishi Denki Kabushiki Kaisha | Method and device for machining a wiring board utilizing light shielding of a laser beam to select a machined tapering |
US6420676B2 (en) | 1996-10-01 | 2002-07-16 | Mitsubishi Denki Kabushiki Kaisha | Method for machining wiring board with laser beam and device for same |
WO2000047359A1 (en) * | 1999-02-11 | 2000-08-17 | Robert Bosch Gmbh | Method for making defined conical holes using a laser beam |
US6518543B1 (en) | 1999-02-11 | 2003-02-11 | Robert Bosch Gmbh | Method for making defined conical holes using a laser beam |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
OA04619A (en) | Method and apparatus for automatic and regulated perforation of a workpiece by laser beam. | |
CA953210A (en) | Precision cutting apparatus and method of operation therefor | |
CH572798A5 (en) | Conical holes produced by laser beam - using diaphragm with apertures of different dia. and driven by stepper motor | |
GB1239797A (en) | Method and apparatus for x-ray fluorescence gauging of a higher atomic number selected element in a coating on a base. | |
IT1037949B (en) | METHOD AND CUTTING APPARATUS WITH DEFLECTION OF THE BLADES USED FOR SAWING OPERATIONS | |
GB1373181A (en) | Method of and apparatus for drilling workpieces by means of laser beams | |
ES418367A1 (en) | Method and apparatus for making disc records | |
ES2017906A4 (en) | DEVICE AND METHOD FOR CODING AND DECODING THE CONVERSATION SIGNAL THROUGH MULTI-PULSE EXCITATION. | |
CA974600A (en) | Method and installation for the precision treatment of workpieces through laser beams | |
ATE102107T1 (en) | METHOD AND DEVICE FOR TREATMENT OF MATERIALS BY LASER. | |
JPS56164509A (en) | Trimming method for laminated-core inductance element | |
Ebeling | Application of high speed holocinematographical methods in cavitation research | |
GB1525818A (en) | Alarm generating apparatus | |
JPS5698829A (en) | Gap setting device | |
JPS5239393A (en) | Laser oscillation device | |
SU884526A1 (en) | Laser | |
Kaczmarek | Generation and measurement of picosecond light pulses(Nd glass and ruby lasers in mode locking operation for picosecond light pulses emission, noting pulse duration measurement) | |
JPS5210757A (en) | Measuring method of a jet solder wave | |
GB1024687A (en) | Laser excitation of atomic spectra | |
JPS5470058A (en) | Production of filter for light attenuator | |
JPS51132993A (en) | Laser tube | |
CA908876A (en) | Method and apparatus for calibrating pulsed neutron well logging instrument | |
FRENCH | On the theory and analysis of occultation light curves[Ph. D. Thesis] | |
AU7761675A (en) | Flashlamp pumped laser device employing fluid material for producing laser beam | |
DE2110869A1 (en) | Device for the orientation of a semiconductor single crystal rod to be sawn into wafers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |