CH570341A5 - - Google Patents
Info
- Publication number
- CH570341A5 CH570341A5 CH43774A CH43774A CH570341A5 CH 570341 A5 CH570341 A5 CH 570341A5 CH 43774 A CH43774 A CH 43774A CH 43774 A CH43774 A CH 43774A CH 570341 A5 CH570341 A5 CH 570341A5
- Authority
- CH
- Switzerland
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19732317514 DE2317514C2 (de) | 1973-04-07 | Lotverbindung zwischen einem Halbleiterkörper und einem Trägerteil |
Publications (1)
Publication Number | Publication Date |
---|---|
CH570341A5 true CH570341A5 (it) | 1975-12-15 |
Family
ID=5877315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH43774A CH570341A5 (it) | 1973-04-07 | 1974-01-14 |
Country Status (1)
Country | Link |
---|---|
CH (1) | CH570341A5 (it) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2164980A1 (de) * | 1970-12-30 | 1972-07-27 | Inventio Ag | Türantriebsvorrichtung mit Verriegelungsmechanismus für Aufzüge |
-
1974
- 1974-01-14 CH CH43774A patent/CH570341A5/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2164980A1 (de) * | 1970-12-30 | 1972-07-27 | Inventio Ag | Türantriebsvorrichtung mit Verriegelungsmechanismus für Aufzüge |
Also Published As
Publication number | Publication date |
---|---|
DE2317514B1 (de) | 1974-10-10 |
DE2317514A1 (it) | 1974-10-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |