CH570341A5 - - Google Patents

Info

Publication number
CH570341A5
CH570341A5 CH43774A CH43774A CH570341A5 CH 570341 A5 CH570341 A5 CH 570341A5 CH 43774 A CH43774 A CH 43774A CH 43774 A CH43774 A CH 43774A CH 570341 A5 CH570341 A5 CH 570341A5
Authority
CH
Switzerland
Application number
CH43774A
Original Assignee
Haushahn Fa C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19732317514 external-priority patent/DE2317514C2/de
Application filed by Haushahn Fa C filed Critical Haushahn Fa C
Publication of CH570341A5 publication Critical patent/CH570341A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
CH43774A 1973-04-07 1974-01-14 CH570341A5 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732317514 DE2317514C2 (de) 1973-04-07 Lotverbindung zwischen einem Halbleiterkörper und einem Trägerteil

Publications (1)

Publication Number Publication Date
CH570341A5 true CH570341A5 (enrdf_load_stackoverflow) 1975-12-15

Family

ID=5877315

Family Applications (1)

Application Number Title Priority Date Filing Date
CH43774A CH570341A5 (enrdf_load_stackoverflow) 1973-04-07 1974-01-14

Country Status (1)

Country Link
CH (1) CH570341A5 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2164980A1 (de) * 1970-12-30 1972-07-27 Inventio Ag Türantriebsvorrichtung mit Verriegelungsmechanismus für Aufzüge

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2164980A1 (de) * 1970-12-30 1972-07-27 Inventio Ag Türantriebsvorrichtung mit Verriegelungsmechanismus für Aufzüge

Also Published As

Publication number Publication date
DE2317514B1 (de) 1974-10-10
DE2317514A1 (enrdf_load_stackoverflow) 1974-10-10

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Legal Events

Date Code Title Description
PL Patent ceased
PL Patent ceased