CH565454A5 - - Google Patents
Info
- Publication number
- CH565454A5 CH565454A5 CH1750273A CH1750273A CH565454A5 CH 565454 A5 CH565454 A5 CH 565454A5 CH 1750273 A CH1750273 A CH 1750273A CH 1750273 A CH1750273 A CH 1750273A CH 565454 A5 CH565454 A5 CH 565454A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
- H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/037—Diffusion-deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/053—Field effect transistors fets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/136—Resistors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31958672A | 1972-12-29 | 1972-12-29 | |
| US477871A US3922707A (en) | 1972-12-29 | 1974-06-10 | DC testing of integrated circuits and a novel integrated circuit structure to facilitate such testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH565454A5 true CH565454A5 (OSRAM) | 1975-08-15 |
Family
ID=26982071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1750273A CH565454A5 (OSRAM) | 1972-12-29 | 1973-12-13 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3922707A (OSRAM) |
| CA (1) | CA997481A (OSRAM) |
| CH (1) | CH565454A5 (OSRAM) |
| FR (1) | FR2212650B1 (OSRAM) |
| GB (1) | GB1454415A (OSRAM) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1563193A (en) * | 1975-08-02 | 1980-03-19 | Ferranti Ltd | Semiconductor devices |
| US4161742A (en) * | 1975-08-02 | 1979-07-17 | Ferranti Limited | Semiconductor devices with matched resistor portions |
| US4032962A (en) * | 1975-12-29 | 1977-06-28 | Ibm Corporation | High density semiconductor integrated circuit layout |
| US4057894A (en) * | 1976-02-09 | 1977-11-15 | Rca Corporation | Controllably valued resistor |
| US4228450A (en) * | 1977-10-25 | 1980-10-14 | International Business Machines Corporation | Buried high sheet resistance structure for high density integrated circuits with reach through contacts |
| JPS5553462A (en) * | 1978-10-13 | 1980-04-18 | Int Rectifier Corp | Mosfet element |
| US4219797A (en) * | 1979-03-19 | 1980-08-26 | National Semiconductor Corporation | Integrated circuit resistance ladder having curvilinear connecting segments |
| FR2473789A1 (fr) * | 1980-01-09 | 1981-07-17 | Ibm France | Procedes et structures de test pour circuits integres a semi-conducteurs permettant la determination electrique de certaines tolerances lors des etapes photolithographiques. |
| US4272882A (en) * | 1980-05-08 | 1981-06-16 | Rca Corporation | Method of laying out an integrated circuit with specific alignment of the collector contact with the emitter region |
| JPS57100755A (en) * | 1980-12-15 | 1982-06-23 | Fujitsu Ltd | Semiconductor device |
| EP0128986B1 (en) * | 1982-12-23 | 1991-02-27 | Sumitomo Electric Industries Limited | Monolithic microwave integrated circuit and method for selecting it |
| US4547724A (en) * | 1983-02-07 | 1985-10-15 | Tektronix, Inc. | Method and apparatus for detection of non-linear electrical devices |
| US4902916A (en) * | 1988-11-14 | 1990-02-20 | International Business Machines Corporation | Identification of defects in emitter-coupled logic circuits |
| US5101152A (en) * | 1990-01-31 | 1992-03-31 | Hewlett-Packard Company | Integrated circuit transfer test device system utilizing lateral transistors |
| US5095267A (en) * | 1990-03-19 | 1992-03-10 | National Semiconductor Corporation | Method of screening A.C. performance characteristics during D.C. parametric test operation |
| US5039602A (en) * | 1990-03-19 | 1991-08-13 | National Semiconductor Corporation | Method of screening A.C. performance characteristics during D.C. parametric test operation |
| US5196802A (en) * | 1990-04-23 | 1993-03-23 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for characterizing the quality of electrically thin semiconductor films |
| US5072175A (en) * | 1990-09-10 | 1991-12-10 | Compaq Computer Corporation | Integrated circuit having improved continuity testability and a system incorporating the same |
| US6750527B1 (en) * | 1996-05-30 | 2004-06-15 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device having a plurality of wells, test method of testing the semiconductor integrated circuit device, and test device which executes the test method |
| JP4739467B2 (ja) * | 1997-04-03 | 2011-08-03 | ローム株式会社 | 光電気変換ic |
| JP3244057B2 (ja) * | 1998-07-16 | 2002-01-07 | 日本電気株式会社 | 基準電圧源回路 |
| KR100575619B1 (ko) * | 2003-10-08 | 2006-05-03 | 매그나칩 반도체 유한회사 | 테스트 패턴 |
| US8258806B2 (en) | 2007-12-24 | 2012-09-04 | Texas Instruments Incorporated | Self-isolating mixed design-rule integrated yield monitor |
| US9252202B2 (en) * | 2011-08-23 | 2016-02-02 | Wafertech, Llc | Test structure and method for determining overlay accuracy in semiconductor devices using resistance measurement |
| CN119380798B (zh) * | 2024-12-27 | 2025-04-29 | 碳芯微电子科技(深圳)有限公司 | 测试装置、测试系统及测试方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL282779A (OSRAM) * | 1961-09-08 | |||
| US3363154A (en) * | 1965-06-28 | 1968-01-09 | Teledyne Inc | Integrated circuit having active and passive components in same semiconductor region |
| US3644802A (en) * | 1968-05-31 | 1972-02-22 | Rca Corp | Ratio-compensated resistors for integrated circuit |
| US3558992A (en) * | 1968-06-17 | 1971-01-26 | Rca Corp | Integrated circuit having bonding pads over unused active area components |
| CH484521A (de) * | 1968-07-06 | 1970-01-15 | Foerderung Forschung Gmbh | Elektronische Schaltungsanordnung mit mindestens einem integrierten Schaltkreis |
| JPS492796B1 (OSRAM) * | 1969-02-28 | 1974-01-22 | ||
| US3629667A (en) * | 1969-03-14 | 1971-12-21 | Ibm | Semiconductor resistor with uniforms current distribution at its contact surface |
| NL161923C (nl) * | 1969-04-18 | 1980-03-17 | Philips Nv | Halfgeleiderinrichting. |
| US3689803A (en) * | 1971-03-30 | 1972-09-05 | Ibm | Integrated circuit structure having a unique surface metallization layout |
| US3676713A (en) * | 1971-04-23 | 1972-07-11 | Ibm | Saturation control scheme for ttl circuit |
| US3751680A (en) * | 1972-03-02 | 1973-08-07 | Signetics Corp | Double-clamped schottky transistor logic gate circuit |
-
1973
- 1973-11-01 CA CA184,838A patent/CA997481A/en not_active Expired
- 1973-11-20 FR FR7342440A patent/FR2212650B1/fr not_active Expired
- 1973-12-12 GB GB5752173A patent/GB1454415A/en not_active Expired
- 1973-12-13 CH CH1750273A patent/CH565454A5/xx not_active IP Right Cessation
-
1974
- 1974-06-10 US US477871A patent/US3922707A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE2364787A1 (de) | 1974-07-11 |
| GB1454415A (en) | 1976-11-03 |
| US3922707A (en) | 1975-11-25 |
| FR2212650B1 (OSRAM) | 1977-09-30 |
| FR2212650A1 (OSRAM) | 1974-07-26 |
| CA997481A (en) | 1976-09-21 |
| DE2364787B2 (de) | 1977-03-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |