CH547157A - LASER BEAM CUTTING MACHINE. - Google Patents

LASER BEAM CUTTING MACHINE.

Info

Publication number
CH547157A
CH547157A CH63173A CH547157DA CH547157A CH 547157 A CH547157 A CH 547157A CH 63173 A CH63173 A CH 63173A CH 547157D A CH547157D A CH 547157DA CH 547157 A CH547157 A CH 547157A
Authority
CH
Switzerland
Prior art keywords
laser beam
cutting machine
beam cutting
machine
laser
Prior art date
Application number
CH63173A
Other languages
German (de)
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of CH547157A publication Critical patent/CH547157A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M1/00—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
    • B27M1/08—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching by multi-step processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/38—Fabrics, fibrous materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/12—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Laser Beam Processing (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Control Of Cutting Processes (AREA)
  • Details Of Cutting Devices (AREA)
CH63173A 1972-01-19 1973-01-17 LASER BEAM CUTTING MACHINE. CH547157A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21900772A 1972-01-19 1972-01-19
US21895872A 1972-01-19 1972-01-19

Publications (1)

Publication Number Publication Date
CH547157A true CH547157A (en) 1974-03-29

Family

ID=26913421

Family Applications (1)

Application Number Title Priority Date Filing Date
CH63173A CH547157A (en) 1972-01-19 1973-01-17 LASER BEAM CUTTING MACHINE.

Country Status (8)

Country Link
JP (1) JPS4882491A (en)
BE (1) BE794242A (en)
CH (1) CH547157A (en)
FR (1) FR2173951B1 (en)
GB (1) GB1382541A (en)
IT (1) IT976922B (en)
NO (1) NO139420C (en)
SE (1) SE414465B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES8101972A1 (en) * 1979-01-31 1980-12-16 Gerber Garment Technology Inc Apparatus and method for working on successive segments of sheet material
JPS55109237A (en) * 1979-02-17 1980-08-22 Inoue Japax Res Inc Apparatus for production of figured plate glass
IT1165636B (en) * 1979-03-05 1987-04-22 Fiat Auto Spa METHOD AND APPARATUS FOR THE CONTROL OF COVERING GASES USED IN THE WORKING BY MEANS OF POWER LASER ON METAL PIECES
JPS58151982A (en) * 1982-03-02 1983-09-09 Mitsubishi Electric Corp How to prepare electric core material by laser processing
JPS60177985A (en) * 1984-02-24 1985-09-11 Agency Of Ind Science & Technol Laser working device
ES8606809A1 (en) * 1985-04-01 1986-06-01 Investronica Sa METHOD AND APPARATUS FOR CUTTING LAMINARY MATERIAL
JPS63230294A (en) * 1987-01-20 1988-09-26 Jido Hosei Syst Gijutsu Kenkyu Kumiai Smoke removing device for laser beam machining apparatus
JPH03281079A (en) * 1990-03-23 1991-12-11 Juki Corp Automatic cutting device
US5791215A (en) 1991-10-02 1998-08-11 Morrison Technology Limited Method of cutting patterns out of patterned fabrics with a cutting apparatus which includes a scanning device
DE102007061427B4 (en) 2007-12-20 2009-11-12 Airbus Deutschland Gmbh Apparatus for cutting and handling a substantially planar blank from a CFRP semi-finished product and method
FR3060432B1 (en) * 2016-12-16 2019-05-24 Lectra METHOD FOR PARTITIONING A PREDETERMINED PLACEMENT OF PIECES INTENDED TO BE CUTTED IN A FLEXIBLE SHEET MATERIAL
DE102017128394B4 (en) 2017-11-30 2019-10-17 Held-Systems Gmbh Method for cutting cut parts and device for cutting
KR102442414B1 (en) * 2018-02-05 2022-09-13 삼성디스플레이 주식회사 Laser cutting device and suction unit
EP3560652B1 (en) * 2018-04-23 2021-06-23 TRUMPF Werkzeugmaschinen GmbH + Co. KG Method of processing plate-shaped material by means of a cutting jet, and data processing program
CN110886081B (en) * 2019-10-14 2023-06-02 广东溢达纺织有限公司 Barrel strip cutting equipment and barrel strip cutting method
WO2021206732A1 (en) * 2020-04-10 2021-10-14 Hewlett-Packard Development Company, L.P. Blocking fluid progression among layers of fluidic devices
CN112522938B (en) * 2020-11-30 2022-02-08 广东元一科技实业有限公司 Method and device for cutting peripheral area of sheet material
CN114378452B (en) * 2021-12-30 2024-04-09 深圳泰德激光技术股份有限公司 Laser cutting method, device and storage medium based on assembly line
CN115673568B (en) * 2022-11-14 2024-01-05 三维天工（北京）科技有限公司 Artificial intelligence laser processing system
CN116408893B (en) * 2023-01-29 2024-03-01 扬州晶樱光电科技有限公司 Slicing device for photovoltaic cell
CN116352258B (en) * 2023-05-11 2025-07-25 西安中科微精光子科技股份有限公司 Low-temperature-environment-adjustable laser processing device and processing method thereof

Also Published As

Publication number Publication date
NO139420B (en) 1978-11-27
IT976922B (en) 1974-09-10
DE2301736A1 (en) 1973-08-02
JPS4882491A (en) 1973-11-05
BE794242A (en) 1973-05-16
NO139420C (en) 1979-03-21
DE2301736B2 (en) 1976-12-23
GB1382541A (en) 1975-02-05
SE414465B (en) 1980-08-04
FR2173951A1 (en) 1973-10-12
FR2173951B1 (en) 1978-11-24

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Legal Events

Date Code Title Description
PL Patent ceased