CH534340A - Wärmetransportvorrichtung - Google Patents

Wärmetransportvorrichtung

Info

Publication number
CH534340A
CH534340A CH971371A CH971371A CH534340A CH 534340 A CH534340 A CH 534340A CH 971371 A CH971371 A CH 971371A CH 971371 A CH971371 A CH 971371A CH 534340 A CH534340 A CH 534340A
Authority
CH
Switzerland
Prior art keywords
heat transfer
transfer device
heat
transfer
Prior art date
Application number
CH971371A
Other languages
English (en)
Inventor
Jan Meijer Roelf
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH534340A publication Critical patent/CH534340A/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2225/00—Reinforcing means
    • F28F2225/04—Reinforcing means for conduits

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Packages (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
CH971371A 1970-07-04 1971-07-01 Wärmetransportvorrichtung CH534340A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL707009932A NL153326B (nl) 1970-07-04 1970-07-04 Warmtetransportinrichting.

Publications (1)

Publication Number Publication Date
CH534340A true CH534340A (de) 1973-02-28

Family

ID=19810508

Family Applications (1)

Application Number Title Priority Date Filing Date
CH971371A CH534340A (de) 1970-07-04 1971-07-01 Wärmetransportvorrichtung

Country Status (13)

Country Link
US (1) US3749159A (de)
JP (1) JPS527188B1 (de)
AT (1) AT307464B (de)
BE (1) BE769475A (de)
CA (1) CA937561A (de)
CH (1) CH534340A (de)
DE (1) DE2128566A1 (de)
DK (1) DK127697B (de)
FR (1) FR2097188B1 (de)
GB (1) GB1355422A (de)
NL (1) NL153326B (de)
NO (1) NO130371B (de)
SE (1) SE387169B (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7114471A (de) * 1971-10-21 1973-04-25 Philips Nv
JPS5139319B2 (de) * 1972-03-31 1976-10-27
JPS49132254U (de) * 1973-03-19 1974-11-13
JPS5088944U (de) * 1973-12-17 1975-07-28
JPS5628449Y2 (de) * 1975-06-10 1981-07-07
JPS5229650U (de) * 1975-07-31 1977-03-02
JPS5229651U (de) * 1975-07-31 1977-03-02
JPS5229649U (de) * 1975-07-31 1977-03-02
JPS5628453Y2 (de) * 1975-07-31 1981-07-07
JPS5628454Y2 (de) * 1975-07-31 1981-07-07
JPS5628455Y2 (de) * 1975-07-31 1981-07-07
JPS5256657U (de) * 1975-10-22 1977-04-23
JPS5290852A (en) * 1976-01-26 1977-07-30 Hitachi Heating Appliance Co Ltd Tabular, hollow generating plate
JPS5425552A (en) * 1977-07-28 1979-02-26 Oki Electric Cable Flat plate heat pipe
GB2117104A (en) * 1982-03-11 1983-10-05 Mahdjuri Sabet Faramarz Heat pipe for collecting solar radiation
US4523636A (en) * 1982-09-20 1985-06-18 Stirling Thermal Motors, Inc. Heat pipe
AU628369B2 (en) * 1988-08-22 1992-09-17 Robert Kenneth Prudhoe Passive heat transfer building panel
AU639775B2 (en) * 1990-05-01 1993-08-05 Commonwealth Scientific And Industrial Research Organisation Heat pipe
US5404272A (en) * 1991-10-24 1995-04-04 Transcal Carrier for a card carrying electronic components and of low heat resistance
US6227287B1 (en) * 1998-05-25 2001-05-08 Denso Corporation Cooling apparatus by boiling and cooling refrigerant
US6234242B1 (en) * 1999-04-30 2001-05-22 Motorola, Inc. Two-phase thermosyphon including a porous structural material having slots disposed therein
US6382309B1 (en) 2000-05-16 2002-05-07 Swales Aerospace Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction
EP1391673A3 (de) * 2002-08-21 2013-05-01 Samsung Electronics Co., Ltd. Wärmeaustauschplatte und Verfahren zu dessen Herstellung
US6782942B1 (en) * 2003-05-01 2004-08-31 Chin-Wen Wang Tabular heat pipe structure having support bodies
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
US20050284614A1 (en) * 2004-06-22 2005-12-29 Machiroutu Sridhar V Apparatus for reducing evaporator resistance in a heat pipe
KR100795753B1 (ko) * 2006-06-26 2008-01-21 (주)셀시아테크놀러지스한국 판형 열전달장치 및 그것의 제조 방법
TWM347809U (en) * 2008-05-26 2008-12-21 Xu xiu cang Fast temperature-averaging heat conductive device
CN112833563B (zh) * 2019-03-14 2023-02-17 山东大学 一种环路热管毛细部件的设计方法
DE102019130291A1 (de) * 2019-11-11 2021-05-12 Bayerische Motoren Werke Aktiengesellschaft Schmiermittelwanne und Verbrennungskraftmaschine für ein Fahrzeug

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3152774A (en) * 1963-06-11 1964-10-13 Wyatt Theodore Satellite temperature stabilization system
US3503438A (en) * 1968-10-25 1970-03-31 Acf Ind Inc Hydrogen release for a heat pipe

Also Published As

Publication number Publication date
AT307464B (de) 1973-05-25
GB1355422A (en) 1974-06-05
NL7009932A (de) 1972-01-06
NO130371B (de) 1974-08-19
FR2097188B1 (de) 1975-02-07
JPS471942A (de) 1972-01-31
JPS527188B1 (de) 1977-02-28
NL153326B (nl) 1977-05-16
FR2097188A1 (de) 1972-03-03
SE387169B (sv) 1976-08-30
BE769475A (fr) 1972-01-03
DE2128566A1 (de) 1972-01-20
CA937561A (en) 1973-11-27
DK127697B (da) 1973-12-17
US3749159A (en) 1973-07-31

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Legal Events

Date Code Title Description
PL Patent ceased