CH520401A - Semiconductor component and method for its manufacture - Google Patents
Semiconductor component and method for its manufactureInfo
- Publication number
- CH520401A CH520401A CH668071A CH668071A CH520401A CH 520401 A CH520401 A CH 520401A CH 668071 A CH668071 A CH 668071A CH 668071 A CH668071 A CH 668071A CH 520401 A CH520401 A CH 520401A
- Authority
- CH
- Switzerland
- Prior art keywords
- manufacture
- semiconductor component
- semiconductor
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2027105A DE2027105C3 (en) | 1970-06-03 | 1970-06-03 | Method for manufacturing a semiconductor component |
Publications (1)
Publication Number | Publication Date |
---|---|
CH520401A true CH520401A (en) | 1972-03-15 |
Family
ID=5772836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH668071A CH520401A (en) | 1970-06-03 | 1971-05-05 | Semiconductor component and method for its manufacture |
Country Status (6)
Country | Link |
---|---|
BE (1) | BE768009A (en) |
CH (1) | CH520401A (en) |
DE (1) | DE2027105C3 (en) |
FR (1) | FR2093995B3 (en) |
GB (1) | GB1303382A (en) |
NL (1) | NL7107559A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5754043B2 (en) * | 1973-05-21 | 1982-11-16 | ||
DE2700463A1 (en) * | 1977-01-07 | 1978-07-13 | Siemens Ag | Semiconductor component edge passivating process - involves stacking of semiconductor components and passivating outer surface of stack |
JPS59113648A (en) * | 1982-12-20 | 1984-06-30 | Hitachi Ltd | Plastic molded type semiconductor device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3379356A (en) * | 1964-09-25 | 1968-04-23 | Int Standard Electric Corp | Arrangement for an insulating panel soldering device according to the flowsolder process |
US3426098A (en) * | 1965-05-20 | 1969-02-04 | Schenectady Chemical | Polyester-polyimide wire enamel |
US3411122A (en) * | 1966-01-13 | 1968-11-12 | Ibm | Electrical resistance element and method of fabricating |
DE6751565U (en) * | 1968-08-01 | 1969-02-06 | Licentia Gmbh | ARRANGEMENT FOR ISOLATION OF RECTIFIERS |
US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
-
1970
- 1970-06-03 DE DE2027105A patent/DE2027105C3/en not_active Expired
-
1971
- 1971-05-05 CH CH668071A patent/CH520401A/en not_active IP Right Cessation
- 1971-05-10 GB GB1396571*[A patent/GB1303382A/en not_active Expired
- 1971-05-18 FR FR7117994A patent/FR2093995B3/fr not_active Expired
- 1971-06-02 BE BE768009A patent/BE768009A/en unknown
- 1971-06-02 NL NL7107559A patent/NL7107559A/xx not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
NL7107559A (en) | 1971-12-07 |
DE2027105B2 (en) | 1980-06-26 |
FR2093995A7 (en) | 1972-02-04 |
DE2027105C3 (en) | 1981-03-26 |
FR2093995B3 (en) | 1973-10-19 |
BE768009A (en) | 1971-11-03 |
GB1303382A (en) | 1973-01-17 |
DE2027105A1 (en) | 1971-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CH528830A (en) | Fastener and process for its manufacture | |
CH549637A (en) | DETERGENT AND METHOD FOR MANUFACTURING IT. | |
CH521118A (en) | Sponge and process for its manufacture | |
AT320360B (en) | Hose and process for its manufacture | |
AT315916B (en) | Semiconductor component and method for its manufacture | |
AT331109B (en) | FEED AND METHOD FOR MANUFACTURING IT | |
CH535493A (en) | Disc-shaped semiconductor device and method for its manufacture | |
CH504100A (en) | Semiconductor component and method for its manufacture | |
CH555267A (en) | PACKAGE AND METHOD FOR ITS MANUFACTURING. | |
CH499877A (en) | Semiconductor component and method for its manufacture | |
CH528819A (en) | Semiconductor component and method for its manufacture | |
CH528149A (en) | Semiconductor device with heterogeneous transition and method for its manufacture | |
CH522288A (en) | Semiconductor device and method of manufacturing the same | |
CH499189A (en) | Inductive component and method for its manufacture | |
AT320243B (en) | Box girder and process for its manufacture | |
CH520401A (en) | Semiconductor component and method for its manufacture | |
CH510331A (en) | Semiconductor device and method of manufacturing the same | |
CH542022A (en) | Abrasive tool and process for its manufacture | |
CH520404A (en) | Semiconductor device and method for its manufacture | |
AT334327B (en) | SUPPORTED CATALYST AND METHOD FOR MANUFACTURING IT | |
CH537700A (en) | Herbicide and process for its preparation | |
CH531253A (en) | Semiconductor component and method for its manufacture | |
AT308028B (en) | Drill stabilizer and process for its manufacture | |
ATA604172A (en) | MUELLSACK AND METHOD FOR ITS MANUFACTURING | |
CH518838A (en) | Nail strips and process for their manufacture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |