CH506185A - Baugruppe mit mindestens einer flüssigkeitsgekühlten, elektrischen Scheibenzelle - Google Patents

Baugruppe mit mindestens einer flüssigkeitsgekühlten, elektrischen Scheibenzelle

Info

Publication number
CH506185A
CH506185A CH223170A CH223170A CH506185A CH 506185 A CH506185 A CH 506185A CH 223170 A CH223170 A CH 223170A CH 223170 A CH223170 A CH 223170A CH 506185 A CH506185 A CH 506185A
Authority
CH
Switzerland
Prior art keywords
cooled
assembly
liquid
disk cell
electrical disk
Prior art date
Application number
CH223170A
Other languages
German (de)
English (en)
Inventor
Friedrich Dipl Ing Scherbaum
Ludwig Klaus
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH506185A publication Critical patent/CH506185A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Aerodynamic Tests, Hydrodynamic Tests, Wind Tunnels, And Water Tanks (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Rectifiers (AREA)
CH223170A 1969-03-22 1970-02-17 Baugruppe mit mindestens einer flüssigkeitsgekühlten, elektrischen Scheibenzelle CH506185A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691914790 DE1914790A1 (de) 1969-03-22 1969-03-22 Fluessigkeitsgekuehlte Baugruppe mit Scheibenzellen

Publications (1)

Publication Number Publication Date
CH506185A true CH506185A (de) 1971-04-15

Family

ID=5729065

Family Applications (1)

Application Number Title Priority Date Filing Date
CH223170A CH506185A (de) 1969-03-22 1970-02-17 Baugruppe mit mindestens einer flüssigkeitsgekühlten, elektrischen Scheibenzelle

Country Status (8)

Country Link
US (1) US3603381A (xx)
JP (1) JPS4923627B1 (xx)
AT (1) AT297152B (xx)
CH (1) CH506185A (xx)
DE (1) DE1914790A1 (xx)
FR (1) FR2039831A5 (xx)
NO (1) NO127076B (xx)
SE (1) SE363540B (xx)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE350874B (xx) * 1970-03-05 1972-11-06 Asea Ab
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel
US3864607A (en) * 1972-03-16 1975-02-04 Programmed Power Stackable heat sink assembly
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3808471A (en) * 1972-10-26 1974-04-30 Borg Warner Expandible pressure mounted semiconductor assembly
US3785435A (en) * 1972-11-15 1974-01-15 Avco Corp Thermal damper for plate type heat exchangers
US4010489A (en) * 1975-05-19 1977-03-01 General Motors Corporation High power semiconductor device cooling apparatus and method
DE2609512C2 (de) * 1976-03-08 1982-11-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Gasisolierte Thyristoranordnung
DE2617776A1 (de) * 1976-04-23 1977-10-27 Siemens Ag Kuehldose fuer einen thyristor
US4188996A (en) * 1977-05-04 1980-02-19 Ckd Praha, Oborovy Podnik Liquid cooler for semiconductor power elements
FR2451632A1 (fr) * 1979-03-12 1980-10-10 Alsthom Atlantique Montage de semi-conducteurs de puissance refroidis par un flugene
DE2928388C3 (de) * 1979-07-13 1982-01-28 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum Auswechseln von Scheibenthyristoren einer Thyristorsäule
US4315225A (en) * 1979-08-24 1982-02-09 Mcdonnell Douglas Corporation Heat sink laser diode array
DE3007168C2 (de) * 1980-02-26 1984-11-22 Siemens AG, 1000 Berlin und 8000 München Flüssigkeitsgekühlte Halbleitersäule
US4338652A (en) * 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
EP0102654B1 (de) * 1982-09-10 1986-05-28 BBC Aktiengesellschaft Brown, Boveri & Cie. Horizontalachsige Stromrichteranordnung
DE3322288A1 (de) * 1983-06-16 1984-12-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Kuehlanordnung fuer halbleiter-scheibenzellen
FR2550887B1 (fr) * 1983-08-19 1986-11-07 Jeumont Schneider Element pretare pour le maintien en place et le serrage de semi-conducteurs et de radiateurs disposes en colonne par alternance
FR2748888B1 (fr) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa Dispositif a elements semi-conducteurs de puissance
USD420335S (en) * 1998-01-16 2000-02-08 Inductotherm Corp. Location device
EP1148547B8 (en) * 2000-04-19 2016-01-06 Denso Corporation Coolant cooled type semiconductor device
DE10164522B4 (de) * 2001-12-17 2005-05-25 Siemens Ag Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung
DE102004059963A1 (de) * 2003-12-18 2005-08-11 Denso Corp., Kariya Einfach zusammengesetzter Kühler
JP2005332863A (ja) * 2004-05-18 2005-12-02 Denso Corp パワースタック
US20060219396A1 (en) * 2005-04-04 2006-10-05 Denso Corporation Lamination-type cooler
EP2109885B1 (en) * 2007-01-26 2016-05-04 Inductotherm Corp. Compression clamping of semiconductor components
US7773382B2 (en) * 2007-08-22 2010-08-10 Rockwell Automation Technologies, Inc. System and method for supporting one or more heat-generating electrical devices
US20090108441A1 (en) * 2007-10-31 2009-04-30 General Electric Company Semiconductor clamp system
TWM347807U (en) * 2008-05-14 2008-12-21 Kuen Bao Electric Co Ltd Cooling system with high power thyristors
JP2014078599A (ja) * 2012-10-10 2014-05-01 Denso Corp 電力変換装置
US8896023B2 (en) * 2013-02-20 2014-11-25 Alstom Technology Ltd Silicon devices/heatsinks stack assembly and a method to pull apart a faulty silicon device in said stack assembly
DE102013227000B4 (de) * 2013-12-20 2020-04-16 Siemens Aktiengesellschaft Elektrisches Modul

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2179293A (en) * 1938-08-25 1939-11-07 Westinghouse Electric & Mfg Co Cooled contact rectifier
US2504281A (en) * 1946-04-18 1950-04-18 Ericsson Telefon Ab L M Device for condensers
DE1514406B1 (de) * 1965-02-20 1971-04-01 Siemens Ag Halbleiteranordnung

Also Published As

Publication number Publication date
JPS4923627B1 (xx) 1974-06-17
AT297152B (de) 1972-03-10
NO127076B (xx) 1973-04-30
SE363540B (xx) 1974-01-21
DE1914790A1 (de) 1970-10-01
US3603381A (en) 1971-09-07
FR2039831A5 (xx) 1971-01-15

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Legal Events

Date Code Title Description
PL Patent ceased