CH475846A - Polyamidplatte oder -rohr, als Träger für Kupferschichten bestimmt - Google Patents

Polyamidplatte oder -rohr, als Träger für Kupferschichten bestimmt

Info

Publication number
CH475846A
CH475846A CH956166A CH956166A CH475846A CH 475846 A CH475846 A CH 475846A CH 956166 A CH956166 A CH 956166A CH 956166 A CH956166 A CH 956166A CH 475846 A CH475846 A CH 475846A
Authority
CH
Switzerland
Prior art keywords
carrier
copper layers
tube intended
polyamide plate
polyamide
Prior art date
Application number
CH956166A
Other languages
German (de)
English (en)
Inventor
Schneider Johannes
Franz Arnold
Pungs Wolfgang
Original Assignee
Dynamit Nobel Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynamit Nobel Ag filed Critical Dynamit Nobel Ag
Publication of CH475846A publication Critical patent/CH475846A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CH956166A 1965-07-05 1966-07-01 Polyamidplatte oder -rohr, als Träger für Kupferschichten bestimmt CH475846A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED0047657 1965-07-05

Publications (1)

Publication Number Publication Date
CH475846A true CH475846A (de) 1969-07-31

Family

ID=7050572

Family Applications (1)

Application Number Title Priority Date Filing Date
CH956166A CH475846A (de) 1965-07-05 1966-07-01 Polyamidplatte oder -rohr, als Träger für Kupferschichten bestimmt

Country Status (5)

Country Link
BE (1) BE683615A (enrdf_load_stackoverflow)
CH (1) CH475846A (enrdf_load_stackoverflow)
GB (1) GB1120575A (enrdf_load_stackoverflow)
LU (1) LU51467A1 (enrdf_load_stackoverflow)
NL (1) NL6609324A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0323671A1 (en) * 1987-12-31 1989-07-12 Dsm N.V. Moulded printed circuit board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935090A (en) * 1981-09-03 1990-06-19 Gte Products Corporation Photoflash array quick-cure laminating process
EP0089387A1 (en) * 1982-03-19 1983-09-28 Uop Inc. Preparation of copper-clad laminates
KR20150052116A (ko) * 2012-08-30 2015-05-13 솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨. 연료 전지 구성요소

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0323671A1 (en) * 1987-12-31 1989-07-12 Dsm N.V. Moulded printed circuit board

Also Published As

Publication number Publication date
NL6609324A (enrdf_load_stackoverflow) 1967-01-06
GB1120575A (en) 1968-07-17
LU51467A1 (enrdf_load_stackoverflow) 1966-09-06
BE683615A (enrdf_load_stackoverflow) 1967-01-04

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Legal Events

Date Code Title Description
PL Patent ceased