CH475062A - Solder seam formed from soft solder, process for its manufacture and material for its execution - Google Patents

Solder seam formed from soft solder, process for its manufacture and material for its execution

Info

Publication number
CH475062A
CH475062A CH1674966A CH1674966A CH475062A CH 475062 A CH475062 A CH 475062A CH 1674966 A CH1674966 A CH 1674966A CH 1674966 A CH1674966 A CH 1674966A CH 475062 A CH475062 A CH 475062A
Authority
CH
Switzerland
Prior art keywords
solder
execution
manufacture
seam formed
soft
Prior art date
Application number
CH1674966A
Other languages
German (de)
Inventor
Chester Raynes Bertram
Pescatrice Michael
Douglas Jayne Theodore
Original Assignee
Nibco
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US509053A external-priority patent/US3418179A/en
Application filed by Nibco filed Critical Nibco
Publication of CH475062A publication Critical patent/CH475062A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
CH1674966A 1965-11-22 1966-11-22 Solder seam formed from soft solder, process for its manufacture and material for its execution CH475062A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50907065A 1965-11-22 1965-11-22
US509053A US3418179A (en) 1965-11-22 1965-11-22 Materials for producing soft solder joints

Publications (1)

Publication Number Publication Date
CH475062A true CH475062A (en) 1969-07-15

Family

ID=27056408

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1674966A CH475062A (en) 1965-11-22 1966-11-22 Solder seam formed from soft solder, process for its manufacture and material for its execution

Country Status (6)

Country Link
BE (1) BE689969A (en)
CH (1) CH475062A (en)
DE (1) DE1558896A1 (en)
ES (1) ES333624A1 (en)
FR (1) FR1501290A (en)
GB (1) GB1131485A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2706139B1 (en) * 1993-06-08 1995-07-21 Thomson Csf Solder material.
FR3037745B1 (en) 2015-06-22 2020-11-20 Tekcem METHOD AND APPARATUS FOR AUTOMATIC TUNING OF AN IMPEDANCE MATRIX, AND RADIO TRANSMITTER USING THIS APPARATUS

Also Published As

Publication number Publication date
ES333624A1 (en) 1968-03-16
DE1558896A1 (en) 1970-04-23
BE689969A (en) 1967-05-02
GB1131485A (en) 1968-10-23
FR1501290A (en) 1967-11-10

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Legal Events

Date Code Title Description
PL Patent ceased