CH474151A - Procédé de fabrication d'un composant semiconducteur - Google Patents
Procédé de fabrication d'un composant semiconducteurInfo
- Publication number
- CH474151A CH474151A CH688468A CH688468A CH474151A CH 474151 A CH474151 A CH 474151A CH 688468 A CH688468 A CH 688468A CH 688468 A CH688468 A CH 688468A CH 474151 A CH474151 A CH 474151A
- Authority
- CH
- Switzerland
- Prior art keywords
- manufacturing process
- semiconductor component
- semiconductor
- component
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR107707A FR1531647A (fr) | 1967-05-24 | 1967-05-24 | Composant semiconducteur à isolement amélioré |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH474151A true CH474151A (fr) | 1969-06-15 |
Family
ID=8631523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH688468A CH474151A (fr) | 1967-05-24 | 1968-05-08 | Procédé de fabrication d'un composant semiconducteur |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3532943A (fr) |
| BE (1) | BE715525A (fr) |
| CH (1) | CH474151A (fr) |
| DE (1) | DE1764231A1 (fr) |
| FR (1) | FR1531647A (fr) |
| GB (1) | GB1176119A (fr) |
| LU (1) | LU56126A1 (fr) |
| NL (1) | NL6806553A (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0033399B1 (fr) * | 1980-02-01 | 1985-04-17 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Dispositif à composant semiconducteur protégé contre des explosions |
| DE8703604U1 (fr) * | 1987-03-11 | 1988-07-21 | Euroatlas Gmbh Fuer Umformertechnik Und Optronik, 2800 Bremen, De | |
| DE19710207A1 (de) * | 1997-03-12 | 1998-09-24 | Siemens Ag | Gehäuse für ein Bauelement der Leistungselektronik sowie Bauteil mit einem solchen Gehäuse |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1649741A (en) * | 1924-09-22 | 1927-11-15 | Ruben Rectifier Corp | Electric-current rectifier |
| DE1042762B (de) * | 1955-02-26 | 1958-11-06 | Siemens Ag | Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht |
| US3193366A (en) * | 1961-07-12 | 1965-07-06 | Bell Telephone Labor Inc | Semiconductor encapsulation |
| US3226610A (en) * | 1962-03-01 | 1965-12-28 | Jr George G Harman | Constant-current semiconductor device |
-
1967
- 1967-05-24 FR FR107707A patent/FR1531647A/fr not_active Expired
-
1968
- 1968-04-26 DE DE19681764231 patent/DE1764231A1/de active Pending
- 1968-05-08 CH CH688468A patent/CH474151A/fr not_active IP Right Cessation
- 1968-05-09 NL NL6806553A patent/NL6806553A/xx unknown
- 1968-05-21 US US730705A patent/US3532943A/en not_active Expired - Lifetime
- 1968-05-22 LU LU56126D patent/LU56126A1/xx unknown
- 1968-05-22 BE BE715525D patent/BE715525A/xx unknown
- 1968-05-23 GB GB24780/68A patent/GB1176119A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| BE715525A (fr) | 1968-11-22 |
| FR1531647A (fr) | 1968-07-05 |
| LU56126A1 (fr) | 1970-01-14 |
| NL6806553A (fr) | 1968-11-25 |
| DE1764231A1 (de) | 1971-07-01 |
| US3532943A (en) | 1970-10-06 |
| GB1176119A (en) | 1970-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |