CH469424A - Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung - Google Patents

Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung

Info

Publication number
CH469424A
CH469424A CH857668A CH857668A CH469424A CH 469424 A CH469424 A CH 469424A CH 857668 A CH857668 A CH 857668A CH 857668 A CH857668 A CH 857668A CH 469424 A CH469424 A CH 469424A
Authority
CH
Switzerland
Prior art keywords
circuit board
printed circuit
making same
layer printed
layer
Prior art date
Application number
CH857668A
Other languages
English (en)
Inventor
Bolleter Fred
Original Assignee
Contiflex Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Contiflex Ag filed Critical Contiflex Ag
Priority to CH857668A priority Critical patent/CH469424A/de
Publication of CH469424A publication Critical patent/CH469424A/de
Priority to DE19691926590 priority patent/DE1926590A1/de
Priority to FR6918310A priority patent/FR2010544A1/fr
Priority to BE734329D priority patent/BE734329A/xx
Priority to NL6908856A priority patent/NL6908856A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09454Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09609Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10333Individual female type metallic connector elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CH857668A 1968-06-10 1968-06-10 Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung CH469424A (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH857668A CH469424A (de) 1968-06-10 1968-06-10 Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung
DE19691926590 DE1926590A1 (de) 1968-06-10 1969-05-23 Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung
FR6918310A FR2010544A1 (de) 1968-06-10 1969-06-04
BE734329D BE734329A (de) 1968-06-10 1969-06-10
NL6908856A NL6908856A (de) 1968-06-10 1969-06-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH857668A CH469424A (de) 1968-06-10 1968-06-10 Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
CH469424A true CH469424A (de) 1969-02-28

Family

ID=4342138

Family Applications (1)

Application Number Title Priority Date Filing Date
CH857668A CH469424A (de) 1968-06-10 1968-06-10 Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung

Country Status (5)

Country Link
BE (1) BE734329A (de)
CH (1) CH469424A (de)
DE (1) DE1926590A1 (de)
FR (1) FR2010544A1 (de)
NL (1) NL6908856A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3621116A (en) * 1969-12-29 1971-11-16 Bertram C Adams Printed circuit board
US4551789A (en) * 1981-12-23 1985-11-05 International Business Machines Corporation Multilayer ceramic substrates with several metallization planes

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3020196C2 (de) * 1980-05-28 1982-05-06 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung
WO1985002751A1 (en) * 1983-12-15 1985-06-20 Laserpath Corporation Partially aligned multi-layered circuitry
FR2612356A1 (fr) * 1987-03-13 1988-09-16 Thomson Csf Carte de circuit imprime pour la realisation de prototypes
GB8803891D0 (en) * 1988-02-19 1988-03-23 Bicc Plc Improved circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3621116A (en) * 1969-12-29 1971-11-16 Bertram C Adams Printed circuit board
US4551789A (en) * 1981-12-23 1985-11-05 International Business Machines Corporation Multilayer ceramic substrates with several metallization planes

Also Published As

Publication number Publication date
BE734329A (de) 1969-11-17
DE1926590A1 (de) 1969-12-11
FR2010544A1 (de) 1970-02-20
NL6908856A (de) 1969-12-12

Similar Documents

Publication Publication Date Title
CA921619A (en) Method and apparatus for making interconnecting circuit boards
DE3280409D1 (de) Mehrschichtige gedruckte leiterplatte und verfahren zu ihrer herstellung.
IL31521A0 (en) Connector and method for attaching same to printed circuit board
CH528277A (de) Mehrschichtenski und Verfahren zu seiner Herstellung
LU79267A1 (de) Leiterplatten fuer bedruckte schaltkreise und verfahren zu ihrer herstellung
CH523000A (de) Vorrichtung zum Steckverbinden wenistens einer gedruckten Leiterplatte
BE762669A (fr) Connecteurs pour panneaux de circuits imprimes
CA944435A (en) Inspection apparatus for printed circuit boards
CH508278A (de) Integrierte Schaltung und Verfahren zu ihrer Herstellung
CH504148A (de) Verfahren zur Herstellung einer Leiterplatte
GB1506062A (en) Circuit boards for multiple flashlamp units
CH469424A (de) Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung
CH488259A (de) In der Art von gedruckten Schaltungen ausgebildete Spule
LU81560A1 (de) Mehrschichtige gedruckte leiterplatte und verfahren zu ihrer auslegung
JPS5250563A (en) Printed circuit board connecting system
AT359583B (de) Mehrlagige elektronische schichtschaltung und verfahren zu ihrer herstellung
DE2014138B2 (de) Verfahren zur herstellung von gedruckten leiterplatten
IL31484A0 (en) Method of soldering printed circuit components
LU81559A1 (de) Mehrschichtige gedruckte leiterplatte und verfahren zu ihrer auslegung
ZA706172B (en) Printed circuit boards
JPS52100169A (en) Multilayer printed circuit board
LU81558A1 (de) Mehrschichtige,gedruckte leiterplatte und verfahren zu ihrer auslegung
FR2305097A1 (fr) Chassis pour cartes et circuits imprimes
CH517429A (fr) Circuit imprimé
CA977574A (en) Apparatus for use when testing the solderability of holes in circuit boards