CH469424A - Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung - Google Patents
Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer HerstellungInfo
- Publication number
- CH469424A CH469424A CH857668A CH857668A CH469424A CH 469424 A CH469424 A CH 469424A CH 857668 A CH857668 A CH 857668A CH 857668 A CH857668 A CH 857668A CH 469424 A CH469424 A CH 469424A
- Authority
- CH
- Switzerland
- Prior art keywords
- circuit board
- printed circuit
- making same
- layer printed
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10333—Individual female type metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH857668A CH469424A (de) | 1968-06-10 | 1968-06-10 | Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung |
DE19691926590 DE1926590A1 (de) | 1968-06-10 | 1969-05-23 | Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung |
FR6918310A FR2010544A1 (de) | 1968-06-10 | 1969-06-04 | |
BE734329D BE734329A (de) | 1968-06-10 | 1969-06-10 | |
NL6908856A NL6908856A (de) | 1968-06-10 | 1969-06-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH857668A CH469424A (de) | 1968-06-10 | 1968-06-10 | Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
CH469424A true CH469424A (de) | 1969-02-28 |
Family
ID=4342138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH857668A CH469424A (de) | 1968-06-10 | 1968-06-10 | Mehrschichtige gedruckte Schaltung und Verfahren zu ihrer Herstellung |
Country Status (5)
Country | Link |
---|---|
BE (1) | BE734329A (de) |
CH (1) | CH469424A (de) |
DE (1) | DE1926590A1 (de) |
FR (1) | FR2010544A1 (de) |
NL (1) | NL6908856A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621116A (en) * | 1969-12-29 | 1971-11-16 | Bertram C Adams | Printed circuit board |
US4551789A (en) * | 1981-12-23 | 1985-11-05 | International Business Machines Corporation | Multilayer ceramic substrates with several metallization planes |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3020196C2 (de) * | 1980-05-28 | 1982-05-06 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung |
WO1985002751A1 (en) * | 1983-12-15 | 1985-06-20 | Laserpath Corporation | Partially aligned multi-layered circuitry |
FR2612356A1 (fr) * | 1987-03-13 | 1988-09-16 | Thomson Csf | Carte de circuit imprime pour la realisation de prototypes |
GB8803891D0 (en) * | 1988-02-19 | 1988-03-23 | Bicc Plc | Improved circuit board |
-
1968
- 1968-06-10 CH CH857668A patent/CH469424A/de unknown
-
1969
- 1969-05-23 DE DE19691926590 patent/DE1926590A1/de active Pending
- 1969-06-04 FR FR6918310A patent/FR2010544A1/fr not_active Withdrawn
- 1969-06-10 NL NL6908856A patent/NL6908856A/xx unknown
- 1969-06-10 BE BE734329D patent/BE734329A/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3621116A (en) * | 1969-12-29 | 1971-11-16 | Bertram C Adams | Printed circuit board |
US4551789A (en) * | 1981-12-23 | 1985-11-05 | International Business Machines Corporation | Multilayer ceramic substrates with several metallization planes |
Also Published As
Publication number | Publication date |
---|---|
BE734329A (de) | 1969-11-17 |
DE1926590A1 (de) | 1969-12-11 |
FR2010544A1 (de) | 1970-02-20 |
NL6908856A (de) | 1969-12-12 |
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