CH448274A - Semiconductor component - Google Patents

Semiconductor component

Info

Publication number
CH448274A
CH448274A CH597965A CH597965A CH448274A CH 448274 A CH448274 A CH 448274A CH 597965 A CH597965 A CH 597965A CH 597965 A CH597965 A CH 597965A CH 448274 A CH448274 A CH 448274A
Authority
CH
Switzerland
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
CH597965A
Other languages
German (de)
Inventor
Marino Joseph
J Bilo William
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of CH448274A publication Critical patent/CH448274A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
CH597965A 1964-05-28 1965-04-28 Semiconductor component CH448274A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37101064A 1964-05-28 1964-05-28

Publications (1)

Publication Number Publication Date
CH448274A true CH448274A (en) 1967-12-15

Family

ID=23462125

Family Applications (1)

Application Number Title Priority Date Filing Date
CH597965A CH448274A (en) 1964-05-28 1965-04-28 Semiconductor component

Country Status (1)

Country Link
CH (1) CH448274A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500959A1 (en) * 1981-02-27 1982-09-03 Thomson Csf Housing for electronic devices - comprises base and hood, sealed at periphery contg. liquid which evaporates to dissipate heat via hood

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2500959A1 (en) * 1981-02-27 1982-09-03 Thomson Csf Housing for electronic devices - comprises base and hood, sealed at periphery contg. liquid which evaporates to dissipate heat via hood

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