|
US3594619A
(en)
*
|
1967-09-30 |
1971-07-20 |
Nippon Electric Co |
Face-bonded semiconductor device having improved heat dissipation
|
|
US3599060A
(en)
*
|
1968-11-25 |
1971-08-10 |
Gen Electric |
A multilayer metal contact for semiconductor device
|
|
US3871015A
(en)
*
|
1969-08-14 |
1975-03-11 |
Ibm |
Flip chip module with non-uniform connector joints
|
|
US3871014A
(en)
*
|
1969-08-14 |
1975-03-11 |
Ibm |
Flip chip module with non-uniform solder wettable areas on the substrate
|
|
US3781609A
(en)
*
|
1971-11-03 |
1973-12-25 |
Ibm |
A semiconductor integrated circuit chip structure protected against impact damage from other chips during chip handling
|
|
US3719981A
(en)
*
|
1971-11-24 |
1973-03-13 |
Rca Corp |
Method of joining solder balls to solder bumps
|
|
US3894329A
(en)
*
|
1972-07-28 |
1975-07-15 |
Sperry Rand Corp |
Method of making high density electronic interconnections in a termination device
|
|
US3869787A
(en)
*
|
1973-01-02 |
1975-03-11 |
Honeywell Inf Systems |
Method for precisely aligning circuit devices coarsely positioned on a substrate
|
|
US3839727A
(en)
*
|
1973-06-25 |
1974-10-01 |
Ibm |
Semiconductor chip to substrate solder bond using a locally dispersed, ternary intermetallic compound
|
|
US4032058A
(en)
*
|
1973-06-29 |
1977-06-28 |
Ibm Corporation |
Beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads
|
|
US3881884A
(en)
*
|
1973-10-12 |
1975-05-06 |
Ibm |
Method for the formation of corrosion resistant electronic interconnections
|
|
JPS54139415A
(en)
*
|
1978-04-21 |
1979-10-29 |
Hitachi Ltd |
Semiconductor channel switch
|
|
US4246147A
(en)
*
|
1979-06-04 |
1981-01-20 |
International Business Machines Corporation |
Screenable and strippable solder mask and use thereof
|
|
US4290079A
(en)
*
|
1979-06-29 |
1981-09-15 |
International Business Machines Corporation |
Improved solder interconnection between a semiconductor device and a supporting substrate
|
|
JPS5728337A
(en)
*
|
1980-07-28 |
1982-02-16 |
Hitachi Ltd |
Connecting constructin of semiconductor element
|
|
US4505029A
(en)
*
|
1981-03-23 |
1985-03-19 |
General Electric Company |
Semiconductor device with built-up low resistance contact
|
|
EP0111611B1
(fr)
*
|
1982-10-28 |
1987-05-13 |
International Business Machines Corporation |
Perfectionnements aux procédés et équipements de dépôt par évaporation sous vide mettant en oeuvre un canon à électrons
|
|
US4545610A
(en)
*
|
1983-11-25 |
1985-10-08 |
International Business Machines Corporation |
Method for forming elongated solder connections between a semiconductor device and a supporting substrate
|
|
IT1215268B
(it)
*
|
1985-04-26 |
1990-01-31 |
Ates Componenti Elettron |
Apparecchio e metodo per il confezionamento perfezionato di dispositivi semiconduttori.
|
|
US4742023A
(en)
*
|
1986-08-28 |
1988-05-03 |
Fujitsu Limited |
Method for producing a semiconductor device
|
|
US4760948A
(en)
*
|
1986-12-23 |
1988-08-02 |
Rca Corporation |
Leadless chip carrier assembly and method
|
|
US4935627A
(en)
*
|
1989-03-13 |
1990-06-19 |
Honeywell Inc. |
Electrical interconnection apparatus for achieving precise alignment of hybrid components
|
|
FR2651025B1
(fr)
*
|
1989-08-18 |
1991-10-18 |
Commissariat Energie Atomique |
Assemblage de pieces faisant un angle entre elles et procede d'obtention de cet assemblage
|
|
US5255840A
(en)
*
|
1989-12-26 |
1993-10-26 |
Praxair Technology, Inc. |
Fluxless solder coating and joining
|
|
JPH045844A
(ja)
*
|
1990-04-23 |
1992-01-09 |
Nippon Mektron Ltd |
Ｉｃ搭載用多層回路基板及びその製造法
|
|
US5198695A
(en)
*
|
1990-12-10 |
1993-03-30 |
Westinghouse Electric Corp. |
Semiconductor wafer with circuits bonded to a substrate
|
|
US5173763A
(en)
*
|
1991-02-11 |
1992-12-22 |
International Business Machines Corporation |
Electronic packaging with varying height connectors
|
|
US5266520A
(en)
*
|
1991-02-11 |
1993-11-30 |
International Business Machines Corporation |
Electronic packaging with varying height connectors
|
|
US5316788A
(en)
*
|
1991-07-26 |
1994-05-31 |
International Business Machines Corporation |
Applying solder to high density substrates
|
|
US5203075A
(en)
*
|
1991-08-12 |
1993-04-20 |
Inernational Business Machines |
Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
|
|
US5133495A
(en)
*
|
1991-08-12 |
1992-07-28 |
International Business Machines Corporation |
Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween
|
|
US5186383A
(en)
*
|
1991-10-02 |
1993-02-16 |
Motorola, Inc. |
Method for forming solder bump interconnections to a solder-plated circuit trace
|
|
US5281684A
(en)
*
|
1992-04-30 |
1994-01-25 |
Motorola, Inc. |
Solder bumping of integrated circuit die
|
|
JP2796919B2
(ja)
*
|
1992-05-11 |
1998-09-10 |
インターナショナル・ビジネス・マシーンズ・コーポレーション |
メタライゼーション複合体および半導体デバイス
|
|
US5367195A
(en)
*
|
1993-01-08 |
1994-11-22 |
International Business Machines Corporation |
Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
|
|
US5396702A
(en)
*
|
1993-12-15 |
1995-03-14 |
At&T Corp. |
Method for forming solder bumps on a substrate using an electrodeposition technique
|
|
US5473814A
(en)
*
|
1994-01-07 |
1995-12-12 |
International Business Machines Corporation |
Process for surface mounting flip chip carrier modules
|
|
US6025258A
(en)
*
|
1994-01-20 |
2000-02-15 |
Fujitsu Limited |
Method for fabricating solder bumps by forming solder balls with a solder ball forming member
|
|
US6319810B1
(en)
|
1994-01-20 |
2001-11-20 |
Fujitsu Limited |
Method for forming solder bumps
|
|
US5643831A
(en)
*
|
1994-01-20 |
1997-07-01 |
Fujitsu Limited |
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
|
|
US6271110B1
(en)
|
1994-01-20 |
2001-08-07 |
Fujitsu Limited |
Bump-forming method using two plates and electronic device
|
|
US6528346B2
(en)
|
1994-01-20 |
2003-03-04 |
Fujitsu Limited |
Bump-forming method using two plates and electronic device
|
|
MY112145A
(en)
*
|
1994-07-11 |
2001-04-30 |
Ibm |
Direct attachment of heat sink attached directly to flip chip using flexible epoxy
|
|
US5539153A
(en)
*
|
1994-08-08 |
1996-07-23 |
Hewlett-Packard Company |
Method of bumping substrates by contained paste deposition
|
|
US6388203B1
(en)
|
1995-04-04 |
2002-05-14 |
Unitive International Limited |
Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
|
|
ATE240586T1
(de)
|
1995-04-05 |
2003-05-15 |
Unitive Int Ltd |
Eine löthöckerstruktur für ein mikroelektronisches substrat
|
|
US6344234B1
(en)
*
|
1995-06-07 |
2002-02-05 |
International Business Machines Corportion |
Method for forming reflowed solder ball with low melting point metal cap
|
|
US5660321A
(en)
*
|
1996-03-29 |
1997-08-26 |
Intel Corporation |
Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
|
|
JP3292068B2
(ja)
*
|
1996-11-11 |
2002-06-17 |
富士通株式会社 |
金属バンプの製造方法
|
|
US6000603A
(en)
*
|
1997-05-23 |
1999-12-14 |
3M Innovative Properties Company |
Patterned array of metal balls and methods of making
|
|
US7654432B2
(en)
|
1997-05-27 |
2010-02-02 |
Wstp, Llc |
Forming solder balls on substrates
|
|
US7007833B2
(en)
|
1997-05-27 |
2006-03-07 |
Mackay John |
Forming solder balls on substrates
|
|
US7819301B2
(en)
*
|
1997-05-27 |
2010-10-26 |
Wstp, Llc |
Bumping electronic components using transfer substrates
|
|
US7288471B2
(en)
*
|
1997-05-27 |
2007-10-30 |
Mackay John |
Bumping electronic components using transfer substrates
|
|
US6609652B2
(en)
|
1997-05-27 |
2003-08-26 |
Spheretek, Llc |
Ball bumping substrates, particuarly wafers
|
|
US6293456B1
(en)
|
1997-05-27 |
2001-09-25 |
Spheretek, Llc |
Methods for forming solder balls on substrates
|
|
US7842599B2
(en)
*
|
1997-05-27 |
2010-11-30 |
Wstp, Llc |
Bumping electronic components using transfer substrates
|
|
US6456099B1
(en)
*
|
1998-12-31 |
2002-09-24 |
Formfactor, Inc. |
Special contact points for accessing internal circuitry of an integrated circuit
|
|
US6047637A
(en)
*
|
1999-06-17 |
2000-04-11 |
Fujitsu Limited |
Method of paste printing using stencil and masking layer
|
|
DE60108413T2
(de)
|
2000-11-10 |
2005-06-02 |
Unitive Electronics, Inc. |
Verfahren zum positionieren von komponenten mit hilfe flüssiger antriebsmittel und strukturen hierfür
|
|
US6863209B2
(en)
|
2000-12-15 |
2005-03-08 |
Unitivie International Limited |
Low temperature methods of bonding components
|
|
US6489229B1
(en)
|
2001-09-07 |
2002-12-03 |
Motorola, Inc. |
Method of forming a semiconductor device having conductive bumps without using gold
|
|
US6732908B2
(en)
*
|
2002-01-18 |
2004-05-11 |
International Business Machines Corporation |
High density raised stud microjoining system and methods of fabricating the same
|
|
US7531898B2
(en)
|
2002-06-25 |
2009-05-12 |
Unitive International Limited |
Non-Circular via holes for bumping pads and related structures
|
|
US7547623B2
(en)
*
|
2002-06-25 |
2009-06-16 |
Unitive International Limited |
Methods of forming lead free solder bumps
|
|
WO2004001837A2
(en)
*
|
2002-06-25 |
2003-12-31 |
Unitive International Limited |
Methods of forming electronic structures including conductive shunt layers and related structures
|
|
TWI225899B
(en)
|
2003-02-18 |
2005-01-01 |
Unitive Semiconductor Taiwan C |
Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
|
|
US6951775B2
(en)
*
|
2003-06-28 |
2005-10-04 |
International Business Machines Corporation |
Method for forming interconnects on thin wafers
|
|
US7049216B2
(en)
*
|
2003-10-14 |
2006-05-23 |
Unitive International Limited |
Methods of providing solder structures for out plane connections
|
|
TW200603698A
(en)
|
2004-04-13 |
2006-01-16 |
Unitive International Ltd |
Methods of forming solder bumps on exposed metal pads and related structures
|
|
US20060205170A1
(en)
*
|
2005-03-09 |
2006-09-14 |
Rinne Glenn A |
Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices
|
|
US7745301B2
(en)
*
|
2005-08-22 |
2010-06-29 |
Terapede, Llc |
Methods and apparatus for high-density chip connectivity
|
|
US8957511B2
(en)
*
|
2005-08-22 |
2015-02-17 |
Madhukar B. Vora |
Apparatus and methods for high-density chip connectivity
|
|
WO2007085484A1
(de)
*
|
2006-01-30 |
2007-08-02 |
Behr Gmbh & Co. Kg |
Verfahren zur herstellung eines metallteils
|
|
US7674701B2
(en)
|
2006-02-08 |
2010-03-09 |
Amkor Technology, Inc. |
Methods of forming metal layers using multi-layer lift-off patterns
|
|
US7932615B2
(en)
|
2006-02-08 |
2011-04-26 |
Amkor Technology, Inc. |
Electronic devices including solder bumps on compliant dielectric layers
|
|
TW201208007A
(en)
*
|
2010-08-02 |
2012-02-16 |
Advanced Semiconductor Eng |
Semiconductor package
|
|
JP5870303B2
(ja)
*
|
2010-08-06 |
2016-02-24 |
パナソニックＩｐマネジメント株式会社 |
回路基板及びその製造方法
|
|
US10096540B2
(en)
*
|
2011-05-13 |
2018-10-09 |
STATS ChipPAC Pte. Ltd. |
Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
|
|
KR101782503B1
(ko)
*
|
2011-05-18 |
2017-09-28 |
삼성전자 주식회사 |
솔더 범프 붕괴를 억제하는 반도체 소자의 범프 형성방법
|
|
US20130140671A1
(en)
*
|
2011-12-06 |
2013-06-06 |
Win Semiconductors Corp. |
Compound semiconductor integrated circuit with three-dimensionally formed components
|