CH442531A - Transistor mit Mesa- oder Planaraufbau - Google Patents

Transistor mit Mesa- oder Planaraufbau

Info

Publication number
CH442531A
CH442531A CH218464A CH218464A CH442531A CH 442531 A CH442531 A CH 442531A CH 218464 A CH218464 A CH 218464A CH 218464 A CH218464 A CH 218464A CH 442531 A CH442531 A CH 442531A
Authority
CH
Switzerland
Prior art keywords
mesa
transistor
planar structure
planar
Prior art date
Application number
CH218464A
Other languages
German (de)
English (en)
Inventor
Wilhelmus Jochems Pie Johannes
Gerardus Kock Hendrikus
Werdt Reinier De
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH442531A publication Critical patent/CH442531A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
CH218464A 1963-03-29 1964-02-24 Transistor mit Mesa- oder Planaraufbau CH442531A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL290931 1963-03-29

Publications (1)

Publication Number Publication Date
CH442531A true CH442531A (de) 1967-08-31

Family

ID=19754574

Family Applications (1)

Application Number Title Priority Date Filing Date
CH218464A CH442531A (de) 1963-03-29 1964-02-24 Transistor mit Mesa- oder Planaraufbau

Country Status (10)

Country Link
US (1) US3324360A (enExample)
AT (1) AT251038B (enExample)
BE (1) BE643480A (enExample)
CH (1) CH442531A (enExample)
DE (1) DE1489140A1 (enExample)
DK (1) DK112395B (enExample)
ES (1) ES296319A1 (enExample)
GB (1) GB1065531A (enExample)
NL (1) NL290931A (enExample)
SE (1) SE313374B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1564648A1 (de) * 1966-07-06 1970-02-12 Siemens Ag Mesa-Transistor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL299567A (enExample) * 1952-06-14
US3100927A (en) * 1957-12-30 1963-08-20 Westinghouse Electric Corp Semiconductor device
US3204321A (en) * 1962-09-24 1965-09-07 Philco Corp Method of fabricating passivated mesa transistor without contamination of junctions

Also Published As

Publication number Publication date
ES296319A1 (es) 1964-05-01
AT251038B (de) 1966-12-12
DK112395B (da) 1968-12-09
BE643480A (enExample) 1964-08-06
US3324360A (en) 1967-06-06
GB1065531A (en) 1967-04-19
SE313374B (enExample) 1969-08-11
DE1489140A1 (de) 1969-04-30
NL290931A (enExample) 1900-01-01

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