CH413020A - Verfahren und Vorrichtung zur Herstellung von elektronischen Bausteinen - Google Patents

Verfahren und Vorrichtung zur Herstellung von elektronischen Bausteinen

Info

Publication number
CH413020A
CH413020A CH1585363A CH1585363A CH413020A CH 413020 A CH413020 A CH 413020A CH 1585363 A CH1585363 A CH 1585363A CH 1585363 A CH1585363 A CH 1585363A CH 413020 A CH413020 A CH 413020A
Authority
CH
Switzerland
Prior art keywords
production
electronic components
electronic
components
Prior art date
Application number
CH1585363A
Other languages
English (en)
Inventor
Bozzone Paul
Original Assignee
Gretag Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gretag Ag filed Critical Gretag Ag
Priority to CH1585363A priority Critical patent/CH413020A/de
Priority to DE1964G0042095 priority patent/DE1233037B/de
Publication of CH413020A publication Critical patent/CH413020A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
CH1585363A 1963-12-23 1963-12-23 Verfahren und Vorrichtung zur Herstellung von elektronischen Bausteinen CH413020A (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CH1585363A CH413020A (de) 1963-12-23 1963-12-23 Verfahren und Vorrichtung zur Herstellung von elektronischen Bausteinen
DE1964G0042095 DE1233037B (de) 1963-12-23 1964-11-24 Verfahren und Einrichtung zur Herstellung von elektronischen Bausteinen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1585363A CH413020A (de) 1963-12-23 1963-12-23 Verfahren und Vorrichtung zur Herstellung von elektronischen Bausteinen

Publications (1)

Publication Number Publication Date
CH413020A true CH413020A (de) 1966-05-15

Family

ID=4412508

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1585363A CH413020A (de) 1963-12-23 1963-12-23 Verfahren und Vorrichtung zur Herstellung von elektronischen Bausteinen

Country Status (2)

Country Link
CH (1) CH413020A (de)
DE (1) DE1233037B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006038221A1 (de) * 2006-08-03 2008-02-07 Siemens Ag Vorrichtung zur elektrischen Abschirmung einer Hochspannungsdurchführung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB868877A (en) * 1958-05-20 1961-05-25 Samuel Adam Francis High density electronic packaging

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006038221A1 (de) * 2006-08-03 2008-02-07 Siemens Ag Vorrichtung zur elektrischen Abschirmung einer Hochspannungsdurchführung

Also Published As

Publication number Publication date
DE1233037B (de) 1967-01-26

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