CA997481A - Dc testing of integrated circuits and a novel integrated circuit structure to facilitate such testing - Google Patents

Dc testing of integrated circuits and a novel integrated circuit structure to facilitate such testing

Info

Publication number
CA997481A
CA997481A CA184,838A CA184838A CA997481A CA 997481 A CA997481 A CA 997481A CA 184838 A CA184838 A CA 184838A CA 997481 A CA997481 A CA 997481A
Authority
CA
Canada
Prior art keywords
testing
facilitate
circuit structure
integrated circuit
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA184,838A
Other languages
English (en)
Other versions
CA184838S (en
Inventor
Larry E. Freed
Daniel Tuman
William J. Nestork
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA997481A publication Critical patent/CA997481A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
    • H01L27/0744—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common without components of the field effect type
    • H01L27/075—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. lateral bipolar transistor, and vertical bipolar transistor and resistor
    • H01L27/0755—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/053—Field effect transistors fets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/085—Isolated-integrated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/136—Resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CA184,838A 1972-12-29 1973-11-01 Dc testing of integrated circuits and a novel integrated circuit structure to facilitate such testing Expired CA997481A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31958672A 1972-12-29 1972-12-29
US477871A US3922707A (en) 1972-12-29 1974-06-10 DC testing of integrated circuits and a novel integrated circuit structure to facilitate such testing

Publications (1)

Publication Number Publication Date
CA997481A true CA997481A (en) 1976-09-21

Family

ID=26982071

Family Applications (1)

Application Number Title Priority Date Filing Date
CA184,838A Expired CA997481A (en) 1972-12-29 1973-11-01 Dc testing of integrated circuits and a novel integrated circuit structure to facilitate such testing

Country Status (5)

Country Link
US (1) US3922707A (it)
CA (1) CA997481A (it)
CH (1) CH565454A5 (it)
FR (1) FR2212650B1 (it)
GB (1) GB1454415A (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801867A (en) * 1982-12-13 1989-01-31 Sumitomo Electric Industries, Ltd. Monolithic microwave integrated circuit with probing pads

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4161742A (en) * 1975-08-02 1979-07-17 Ferranti Limited Semiconductor devices with matched resistor portions
GB1563193A (en) * 1975-08-02 1980-03-19 Ferranti Ltd Semiconductor devices
US4032962A (en) * 1975-12-29 1977-06-28 Ibm Corporation High density semiconductor integrated circuit layout
US4057894A (en) * 1976-02-09 1977-11-15 Rca Corporation Controllably valued resistor
US4228450A (en) * 1977-10-25 1980-10-14 International Business Machines Corporation Buried high sheet resistance structure for high density integrated circuits with reach through contacts
JPS5553462A (en) * 1978-10-13 1980-04-18 Int Rectifier Corp Mosfet element
US4219797A (en) * 1979-03-19 1980-08-26 National Semiconductor Corporation Integrated circuit resistance ladder having curvilinear connecting segments
FR2473789A1 (fr) * 1980-01-09 1981-07-17 Ibm France Procedes et structures de test pour circuits integres a semi-conducteurs permettant la determination electrique de certaines tolerances lors des etapes photolithographiques.
US4272882A (en) * 1980-05-08 1981-06-16 Rca Corporation Method of laying out an integrated circuit with specific alignment of the collector contact with the emitter region
JPS57100755A (en) * 1980-12-15 1982-06-23 Fujitsu Ltd Semiconductor device
US4547724A (en) * 1983-02-07 1985-10-15 Tektronix, Inc. Method and apparatus for detection of non-linear electrical devices
US4902916A (en) * 1988-11-14 1990-02-20 International Business Machines Corporation Identification of defects in emitter-coupled logic circuits
US5101152A (en) * 1990-01-31 1992-03-31 Hewlett-Packard Company Integrated circuit transfer test device system utilizing lateral transistors
US5095267A (en) * 1990-03-19 1992-03-10 National Semiconductor Corporation Method of screening A.C. performance characteristics during D.C. parametric test operation
US5039602A (en) * 1990-03-19 1991-08-13 National Semiconductor Corporation Method of screening A.C. performance characteristics during D.C. parametric test operation
US5196802A (en) * 1990-04-23 1993-03-23 The United States Of America As Represented By The Secretary Of The Navy Method and apparatus for characterizing the quality of electrically thin semiconductor films
US5072175A (en) * 1990-09-10 1991-12-10 Compaq Computer Corporation Integrated circuit having improved continuity testability and a system incorporating the same
US6750527B1 (en) * 1996-05-30 2004-06-15 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device having a plurality of wells, test method of testing the semiconductor integrated circuit device, and test device which executes the test method
JP4739467B2 (ja) * 1997-04-03 2011-08-03 ローム株式会社 光電気変換ｉｃ
JP3244057B2 (ja) 1998-07-16 2002-01-07 日本電気株式会社 基準電圧源回路
KR100575619B1 (ko) * 2003-10-08 2006-05-03 매그나칩 반도체 유한회사 테스트 패턴
US8258806B2 (en) 2007-12-24 2012-09-04 Texas Instruments Incorporated Self-isolating mixed design-rule integrated yield monitor
US9252202B2 (en) * 2011-08-23 2016-02-02 Wafertech, Llc Test structure and method for determining overlay accuracy in semiconductor devices using resistance measurement

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL282779A (it) * 1961-09-08
US3363154A (en) * 1965-06-28 1968-01-09 Teledyne Inc Integrated circuit having active and passive components in same semiconductor region
US3644802A (en) * 1968-05-31 1972-02-22 Rca Corp Ratio-compensated resistors for integrated circuit
US3558992A (en) * 1968-06-17 1971-01-26 Rca Corp Integrated circuit having bonding pads over unused active area components
CH484521A (de) * 1968-07-06 1970-01-15 Foerderung Forschung Gmbh Elektronische Schaltungsanordnung mit mindestens einem integrierten Schaltkreis
JPS492796B1 (it) * 1969-02-28 1974-01-22
US3629667A (en) * 1969-03-14 1971-12-21 Ibm Semiconductor resistor with uniforms current distribution at its contact surface
NL161923C (nl) * 1969-04-18 1980-03-17 Philips Nv Halfgeleiderinrichting.
US3689803A (en) * 1971-03-30 1972-09-05 Ibm Integrated circuit structure having a unique surface metallization layout
US3676713A (en) * 1971-04-23 1972-07-11 Ibm Saturation control scheme for ttl circuit
US3751680A (en) * 1972-03-02 1973-08-07 Signetics Corp Double-clamped schottky transistor logic gate circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801867A (en) * 1982-12-13 1989-01-31 Sumitomo Electric Industries, Ltd. Monolithic microwave integrated circuit with probing pads

Also Published As

Publication number Publication date
FR2212650B1 (it) 1977-09-30
GB1454415A (en) 1976-11-03
FR2212650A1 (it) 1974-07-26
DE2364787A1 (de) 1974-07-11
US3922707A (en) 1975-11-25
CH565454A5 (it) 1975-08-15
DE2364787B2 (de) 1977-03-17

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