CA992220A - Method of semiconductor chip separation - Google Patents

Method of semiconductor chip separation

Info

Publication number
CA992220A
CA992220A CA167,267A CA167267A CA992220A CA 992220 A CA992220 A CA 992220A CA 167267 A CA167267 A CA 167267A CA 992220 A CA992220 A CA 992220A
Authority
CA
Canada
Prior art keywords
semiconductor chip
chip separation
separation
semiconductor
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA167,267A
Other languages
English (en)
Other versions
CA167267S (en
Inventor
Frank Scacciaferro
Carl Yakubowski
Manik P. Makhijani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA992220A publication Critical patent/CA992220A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y10S156/931—Peeling away backing
    • Y10S156/932—Peeling away backing with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
CA167,267A 1972-04-26 1973-03-21 Method of semiconductor chip separation Expired CA992220A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US247639A US3915784A (en) 1972-04-26 1972-04-26 Method of semiconductor chip separation

Publications (1)

Publication Number Publication Date
CA992220A true CA992220A (en) 1976-06-29

Family

ID=22935700

Family Applications (1)

Application Number Title Priority Date Filing Date
CA167,267A Expired CA992220A (en) 1972-04-26 1973-03-21 Method of semiconductor chip separation

Country Status (6)

Country Link
US (1) US3915784A (es)
AR (1) AR199567A1 (es)
BR (1) BR7303004D0 (es)
CA (1) CA992220A (es)
ES (1) ES413721A1 (es)
GB (1) GB1421408A (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3969813A (en) * 1975-08-15 1976-07-20 Bell Telephone Laboratories, Incorporated Method and apparatus for removal of semiconductor chips from hybrid circuits
US4071944A (en) * 1975-10-20 1978-02-07 Western Electric Co., Inc. Adhesively and magnetically holding an article
US4466852A (en) * 1983-10-27 1984-08-21 At&T Technologies, Inc. Method and apparatus for demounting wafers
US4472218A (en) * 1983-12-23 1984-09-18 At&T Technologies, Inc. Removing articles from an adhesive web
JP3197788B2 (ja) * 1995-05-18 2001-08-13 株式会社日立製作所 半導体装置の製造方法
US5837556A (en) * 1997-01-06 1998-11-17 Sundstrand Corporation Method of removing a component from a substrate
GB2380602B (en) * 2001-05-19 2005-03-02 Wentworth Lab Ltd Wafer alignment device
CN102555097B (zh) * 2012-03-28 2014-08-06 杭州海纳半导体有限公司 适用于多线切割机加工时工件装载的夹具及紧固方法
CN107696312A (zh) * 2017-10-12 2018-02-16 江苏秉宸科技有限公司 一种硅棒切割底座
CN114952023B (zh) * 2022-06-24 2024-01-30 长沙麓邦光电科技有限公司 用于制备光栅尺的夹具及其联控方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3454428A (en) * 1964-08-03 1969-07-08 Dow Chemical Co Method and apparatus for cleaning chips and the like
US3632074A (en) * 1967-10-09 1972-01-04 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
US3690984A (en) * 1967-10-09 1972-09-12 Western Electric Co Releasable mounting method of placing an oriented array of semiconductor devices on the mounting
US3584741A (en) * 1969-06-30 1971-06-15 Ibm Batch sorting apparatus
US3681139A (en) * 1969-10-16 1972-08-01 Western Electric Co Method for handling and maintaining the orientation of a matrix of miniature electrical devices
US3663326A (en) * 1970-01-09 1972-05-16 Western Electric Co Article holding methods and assemblage
US3666588A (en) * 1970-01-26 1972-05-30 Western Electric Co Method of retaining and bonding articles
US3627124A (en) * 1970-01-29 1971-12-14 Western Electric Co Method for separating selected articles from an array
US3687369A (en) * 1970-10-12 1972-08-29 North American Car Corp Cleaning apparatus

Also Published As

Publication number Publication date
AR199567A1 (es) 1974-09-13
GB1421408A (en) 1976-01-21
ES413721A1 (es) 1977-04-01
BR7303004D0 (pt) 1974-07-11
US3915784A (en) 1975-10-28

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