CA980509A - Paste vehicle and color paste containing the same - Google Patents

Paste vehicle and color paste containing the same

Info

Publication number
CA980509A
CA980509A CA154,543A CA154543A CA980509A CA 980509 A CA980509 A CA 980509A CA 154543 A CA154543 A CA 154543A CA 980509 A CA980509 A CA 980509A
Authority
CA
Canada
Prior art keywords
paste
same
vehicle
color
paste containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA154,543A
Other languages
English (en)
Other versions
CA154543S (en
Inventor
Siegfried Knepper
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FINKE (KARL) oHG
Original Assignee
FINKE (KARL) oHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FINKE (KARL) oHG filed Critical FINKE (KARL) oHG
Application granted granted Critical
Publication of CA980509A publication Critical patent/CA980509A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D17/00—Pigment pastes, e.g. for mixing in paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B67/00—Influencing the physical, e.g. the dyeing or printing properties of dyestuffs without chemical reactions, e.g. by treating with solvents grinding or grinding assistants, coating of pigments or dyes; Process features in the making of dyestuff preparations; Dyestuff preparations of a special physical nature, e.g. tablets, films
    • C09B67/0071—Process features in the making of dyestuff preparations; Dehydrating agents; Dispersing agents; Dustfree compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
  • Paints Or Removers (AREA)
CA154,543A 1971-10-26 1972-10-19 Paste vehicle and color paste containing the same Expired CA980509A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19255171A 1971-10-26 1971-10-26

Publications (1)

Publication Number Publication Date
CA980509A true CA980509A (en) 1975-12-30

Family

ID=22710143

Family Applications (1)

Application Number Title Priority Date Filing Date
CA154,543A Expired CA980509A (en) 1971-10-26 1972-10-19 Paste vehicle and color paste containing the same

Country Status (7)

Country Link
JP (1) JPS4942831B2 (cg-RX-API-DMAC10.html)
CA (1) CA980509A (cg-RX-API-DMAC10.html)
CH (1) CH594728A5 (cg-RX-API-DMAC10.html)
GB (1) GB1406505A (cg-RX-API-DMAC10.html)
HK (1) HK45576A (cg-RX-API-DMAC10.html)
IT (1) IT965168B (cg-RX-API-DMAC10.html)
MY (1) MY7600184A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123077A (en) * 1974-08-20 1976-02-24 Matsushita Electronics Corp Denkyokuriidosenno setsuzokuhoho
JPS5348487A (en) * 1976-10-14 1978-05-01 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
HK45576A (en) 1976-07-23
CH594728A5 (cg-RX-API-DMAC10.html) 1978-01-31
GB1406505A (en) 1975-09-17
IT965168B (it) 1974-01-31
JPS4942831B2 (cg-RX-API-DMAC10.html) 1974-11-16
JPS4857578A (cg-RX-API-DMAC10.html) 1973-08-13
MY7600184A (en) 1976-12-31

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