CA929675A - Fabrication of beam leads - Google Patents

Fabrication of beam leads

Info

Publication number
CA929675A
CA929675A CA929675A CA929675DA CA929675A CA 929675 A CA929675 A CA 929675A CA 929675 A CA929675 A CA 929675A CA 929675D A CA929675D A CA 929675DA CA 929675 A CA929675 A CA 929675A
Authority
CA
Canada
Prior art keywords
fabrication
beam leads
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA929675A
Other languages
English (en)
Inventor
Alberto Loro
Colin A. Hamer
Original Assignee
Microsystems International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microsystems International Ltd filed Critical Microsystems International Ltd
Application granted granted Critical
Publication of CA929675A publication Critical patent/CA929675A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
CA929675A 1972-02-16 1972-02-16 Fabrication of beam leads Expired CA929675A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA134841 1972-02-16

Publications (1)

Publication Number Publication Date
CA929675A true CA929675A (en) 1973-07-03

Family

ID=4092355

Family Applications (1)

Application Number Title Priority Date Filing Date
CA929675A Expired CA929675A (en) 1972-02-16 1972-02-16 Fabrication of beam leads

Country Status (5)

Country Link
JP (1) JPS4895180A (enExample)
CA (1) CA929675A (enExample)
DE (1) DE2307021A1 (enExample)
FR (1) FR2172242A1 (enExample)
NL (1) NL7215385A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2352468A1 (fr) * 1976-05-17 1977-12-16 Philips Nv Plaquette elementaire munie d'un micro-circuit et de spherules de soudure formees par voie electrolytique, et procede pour la fabrication de cette plaquette
FR2388064A1 (fr) * 1977-04-18 1978-11-17 Philips Nv Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2352468A1 (fr) * 1976-05-17 1977-12-16 Philips Nv Plaquette elementaire munie d'un micro-circuit et de spherules de soudure formees par voie electrolytique, et procede pour la fabrication de cette plaquette
FR2388064A1 (fr) * 1977-04-18 1978-11-17 Philips Nv Procede pour renforcer par voie galvanique un motif de base conducteur et dispositif obtenu suivant ce procede

Also Published As

Publication number Publication date
NL7215385A (enExample) 1973-08-20
FR2172242A1 (enExample) 1973-09-28
JPS4895180A (enExample) 1973-12-06
DE2307021A1 (de) 1973-09-13

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