CA3236172A1 - System and method for rapid substrate cooling - Google Patents

Abstract

Disclosed is a cooling system (104) and method for a metal processing system (100). The cooling system (104) includes a cooling header (114), an exhaust system (118), a temperature sensor (128), and a controller (130). The cooling header (114) selectively dispenses a coolant onto a metal substrate (110), and the exhaust system (118) removes heated coolant from the metal substrate (110). The temperature sensor (128) is downstream from the cooling header (114) and detects a temperature profile of the metal substrate (110) across a width of the metal substrate. The controller (130) is communicatively coupled to the cooling header (114) and the temperature sensor (128), and the controller (130) controls the cooling header (114) based at least on a detected temperature profile.

Description

SYSTEM AND METHOD FOR RAPID SUBSTRATE COOLING
REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional Patent Application No.
63/263,092, filed on October 27, 2021 and entitled SYSTEMS AND METHODS FOR
RAPID
SUBSTRATE COOLING, the content of which is hereby incorporated by reference in its entirety.
FIELD OF THE INVENTION

[0002] This application generally relates to metal processing, and, more specifically, to systems and methods for rapid cooling of a metal substrate during metal processing.
BACKGROUND

[0003] During metal processing, rolling may be used to reduce a thickness of a metal substrate (such as stock sheets or strips of aluminum, aluminum alloys, or various other metals) by passing the metal substrate through a pair of work rolls. Depending on the desired properties of the final metal product, the metal substrate may be hot rolled, cold rolled, and/or warm rolled. Hot rolling generally refers to a rolling process where the temperature of the metal is above the recrystallization temperature of the metal. Cold rolling generally refers to a rolling process where the temperature of the metal is below the recrystallization temperature of the metal. Warm rolling generally refers to a rolling process where the temperature of the metal is below the recrystallization temperature but above the temperature during cold rolling.

[0004] The line speed of the metal substrate exiting the last stand of a rolling mill is often limited by the temperature of the metal substrate as it exits the rolling mill because the exit temperature influences the material properties of the metal substrate and/or aspects of a coil of the metal substrate such as flatness. Operating a rolling mill at higher speeds or reductions may lead to a situation where the cooling from the work rolls of the rolling mill cannot remove enough deformation energy to maintain the metal product below a critical softening temperature, and the metal substrate above the critical softening temperature may be susceptible to substrate quality issues such as water staining, sagging, or off flatness. Accordingly, rolling mills are typically run at reduced speeds, but such reduced speeds limit the capacity of the rolling mill.

5 PCT/US2022/047487 SUMMARY
[0005] Embodiments covered by this patent are defined by the claims below, not this summary.
This summary is a high-level overview of various embodiments and introduces some of the concepts that are further described in the Detailed Description section below.
This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used in isolation to determine the scope of the claimed subject matter.
The subject matter should be understood by reference to appropriate portions of the entire specification of this patent, any or all drawings, and each claim.

[0006] According to certain embodiments, a cooling system for a metal processing system includes a cooling header, an exhaust system, a temperature sensor, and a controller. The cooling header is configured to selectively dispense a coolant onto a metal substrate, and the exhaust system includes a removal device that is configured to remove coolant that is dispensed by the cooling header. The temperature sensor may be downstream from the cooling header, and the temperature sensor is configured to detect a temperature profile of the metal substrate across a width of the metal substrate. The controller is communicatively coupled to the cooling header and the temperature sensor, and the controller is configured to control the cooling header based at least on a detected temperature profile.

[0007] According to various embodiments, a cold rolling mill includes an exit stand and a cooling system downstream from the exit stand. The cooling system includes a cooling header configured to selectively dispense a coolant onto a metal substrate exiting the exit stand.

[0008] According to some embodiments, a cold rolling mill includes an exit stand and a cooling system downstream from the exit stand. The cooling system includes a cooling header that includes a plurality of nozzles. Each nozzle of the plurality of nozzles is configured to selectively dispense a coolant onto a metal substrate exiting the exit stand. The cooling system also includes a controller that is communicatively coupled with the cooling header and is configured to individually control each nozzle of the plurality of nozzles.

[0009] Various implementations described herein can include additional systems, methods, features, and advantages, which cannot necessarily be expressly disclosed herein but will be apparent to one of ordinary skill in the art upon examination of the following detailed description and accompanying drawings. It is intended that all such systems, methods, features, and advantages be included within the present disclosure and protected by the accompanying claims.
BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The specification makes reference to the following appended figures, in which use of like reference numerals in different figures is intended to illustrate like or analogous components.

[0011] FIG. 1 is a schematic of a metal processing system with a cooling system according to embodiments.

[0012] FIG. 2 is a schematic of a metal processing system with a cooling system according to embodiments.

[0013] FIG. 3 is a perspective view of a metal processing system with a cooling system according to embodiments.

[0014] FIG. 4 illustrates the metal processing system and cooling system of FIG. 3 with the metal substrate omitted for clarity.

[0015] FIG. 5 illustrates a metal processing system with a cooling system according to embodiments.

[0016] FIG. 6 illustrates a portion of the metal processing system of FIG. 5.

[0017] FIG. 7 illustrates a cooling feature in accordance with an embodiment.

[0018] FIG. 8 illustrates a cooling feature in accordance with an embodiment.

[0019] FIG. 9 illustrates a cooling feature in accordance with an embodiment.
DETAILED DESCRIPTION

[0020] The subject matter of embodiments of the present disclosure is described here with specificity to meet statutory requirements, but this description is not necessarily intended to limit the scope of the claims. The claimed subject matter may be embodied in other ways, may include different elements or steps, and may be used in conjunction with other existing or future technologies. This description should not be interpreted as implying any particular order or arrangement among or between various steps or elements except when the order of individual steps or arrangement of elements is explicitly described. Directional references such as "up,"

"down," "top," "bottom," "left," "right," "front," and "back," among others, are intended to refer to the orientation as illustrated and described in the figure (or figures) to which the components and directions are referencing.

[0021] Described herein are cooling systems and methods for cooling a metal substrate such as aluminum or aluminum alloys during metal processing. Metal processing systems may include, but are not limited to, hot rolling mills, cold rolling mills, and warm rolling mills. As such, while the following description refers to cold rolling mills, the embodiments described herein are not limited to such metal processing systems and may be utilized in various other types of metal processing systems as desired. Moreover, the embodiments are not limited to use on aluminum or aluminum alloys, but may be used with any desired metal including, but not limited to, For example, the substrate may include steel, steel-based materials, magnesium, magnesium-based materials, copper, copper-based materials, or any other suitable metal.

[0022] In some aspects, the cooling system for the metal processing system such as cold rolling is positioned downstream from a last (or exit) stand of the rolling mill. In various aspects, the cooling system is between the last stand of the rolling mill and a rewinder of the metal processing system and may be used to control the exit temperature of the metal substrate before coiling at the rewinder.

[0023] The cooling system may include a cooling header, an exhaust system, one or more temperature sensors, and a controller. The cooling header may include one or nozzles, and each of the one or more nozzles may be independently controlled such that a cooling profile of the coolant across a width of the metal substrate can be selectively controlled.
The cooling header may selectively dispense a coolant onto the metal substrate as a super fine mist or micronized droplets. In certain examples, to maximize the duration and/or amount of cooling from the coolant, the cooling header may be positioned proximate to the last stand of the rolling mill. In various aspects, the cooling header may be positioned proximate to the last stand to maximize the allowed time for coolant evaporation. Additionally, placing the cooling header proximate to the roll could reduce the chance of decrease in cooling efficiency due to the laminar air flow generated by the high speed surface (e.g., because laminar air flow need time to accelerate).

[0024] The exhaust system includes one or more removal devices that remove coolant after the coolant has been dispensed from the cooling header and removed at least some of the heat from

25 PCT/US2022/047487 the metal substrate. In certain aspects, the one or more removal devices are positioned a predetermined distance downstream from the cooling header. The predetermined distance may optionally correspond to a duration of cooling at a predetermined line speed.
Optionally, the predetermined line speed may be a maximum line speed, although it need not be in other examples. In some non-limiting examples, the maximum line speed may be about 1800 m/min, although it may be other line speeds as desired and as discussed in detail below. Additionally or alternatively, the predetermined distance may optionally correspond to an amount of cooling or heat transfer of the coolant at a predetermined rate at which the coolant is dispensed from the cooling header. In other examples, the one or more removal devices may be positioned as desired relative to the cooling header.
[0025] The one or more temperature sensors may be positioned downstream from the cooling header and/or optionally upstream from the cooling header. Each temperature sensor may detect a temperature profile of the metal substrate across the width of the metal substrate. The controller may be communicatively coupled to the one or more temperature sensors and the cooling header.
In various examples, the controller may control the cooling header based on a detected temperature profile from the one or more temperature sensors such that the cooling header provides a desired cooling profile. Optionally, the cooling profile may be an amount of cooling at a predetermined line speed such that the exit temperature of the metal substrate is at or below a critical softening temperature of the metal substrate and/or a desired coiling temperature of the metal substrate. In some cases, the predetermined line speed may be 1800 m/min, although it need not be in other examples. The critical softening temperature is the temperature at which the metal substrate starts to overheat and becomes susceptible to surface problems such as off flatness, water staining, etc. In various examples, the critical softening temperature may depend on the material composition of the metal substrate and/or a gauge of the metal substrate.

[0026] FIG. 1 illustrates an example of a metal processing system 100 that includes at least one work stand 102 of a rolling mill 103 and a cooling system 104 according to various embodiments. In the example of FIG. 1, the rolling mill 103 is a cold rolling mill, although in other examples, the rolling mill 103 may be a warm rolling mill and/or a hot rolling mill as desired. While a single work stand 102 is illustrated, it will be appreciated that in other examples the rolling mill 103 may include a plurality of work stands 102, such as two work stands 102, three work stands 102, four work stands 102, or any other desired number of work stand 102.

The work stand 102 includes a pair of vertically aligned work rolls 108A-B. In the example of FIG. 1, the work stand 102 also includes backup rolls 106A-B that support the work rolls 108A-B. In other examples, the work stand 102 may also include intermediate rolls.
A roll gap 105 is defined between the work rolls 108A-B, and metal substrate 110 such as an aluminum or aluminum alloy sheet is passed through the roll gap 105 along a passline in a processing direction (represented by arrow 107). In various examples, the work stand 102 is the last or exit stand of the rolling mill 103, and the metal substrate 110 exiting the work stand 102 is passed to the cooling system 104 before it is coiled as a coil 112 with a rewinder. FIG.
1 illustrates the metal substrate 110 being coiled into the coil 112 in an over-wind configuration, but it will be appreciated that in other examples, the metal substrate 110 may be coiled in an under-wind configuration (see FIG. 2).

[0027] The cooling system 104 includes a cooling header 114, an exhaust system 118, a temperature sensor 128, and a controller 130. In various examples, and as illustrated in FIG. 1, the cooling system 104 may be between the exit stand 102 and a rewinder that forms the coil 112 of the metal substrate 110.

[0028] The cooling header 114 may selectively dispense a coolant 116 onto the surface of the metal substrate 110 after it has exited the work stand 102. The coolant 116 may be various suitable materials for removing heat from the metal substrate 110. As one non-limiting example, the coolant 116 may be water or a cooling gas, although other suitable coolants may be utilized.
In one non-limiting example, the cooling header 114 may be an atomizing spray header, although various other suitable types of headers may be utilized. In various examples, to maximize the allowed coolant evaporation time, the cooling header 114 may be positioned downstream of and proximate to the work stand 102 of the rolling mill 103. In various examples, the cooling header 114 is positioned on one side of the passline of the metal substrate 110. In the example of FIG. 1, the cooling header 114 is positioned above the passline of the metal substrate 110, although in other examples, the cooling header 114 may be positioned below the passline of the metal substrate 110. In various examples, the cooling header 114 is positioned on the side of the passline of the metal substrate 110 that is opposite from the coil 112. For example, in the over-wind configuration illustrated in FIG. 1, the cooling header 114 is positioned above the passline of the metal substrate 110 while in an under-wind configuration, the cooling header 114 may be positioned below the passline of the metal substrate 110 (see FIG. 2). In various examples, positioning the cooling header 114 on one side of the passline (and optionally on the side opposite from the coil 112) may maximize an amount of time for heating and removal of the coolant from the metal substrate 110. In other examples, the spray header may be positioned on both sides of the metal substrate.

[0029] The cooling header 114 may optionally include one or more nozzles that collectively extend across a width (or a portion of a width) of the metal substrate 110.
The nozzles are configured to dispense the coolant as micronized droplets or a super fine mist and may be various suitable types of nozzles for dispensing the coolant as micronized droplets or the super fine mist. Without being bound by any theory, it is believed that the micronized droplets increase the heat transfer efficiency (and thus cooling rate) of the coolant, provide a more uniform coolant distribution on the metal substrate 110, and reduce the Leidenfrost effect, which may occur when material having a temperature higher than the boiling temperature of the coolant is immersed or contacted with the coolant. In other examples, the micronized droplets may provide improved heat transfer at a line speed less than about 1800 m/min.

[0030] In some embodiments, and as discussed in the following examples, the metal processing system 100 may use various other techniques or methods for dispensing the coolant to overcome the Leidenfrost effect. In such embodiments, the metal processing system 100 and/or the cooling system 104 includes one or more cooling features that modify (e.g., increase or decrease) a Leidenfrost point of the coolant to minimize or prevent the Leidenfrost effect at these temperatures and/or while the metal substrate is cooled from a first temperature (to a second temperature that is less than the first temperature. In some non-limiting examples, the cooling features may modify the Leidenfrost point to be up to about 500 C, although in other embodiments it may be controlled to other temperatures as desired. Such cooling features may include, but are not limited to, controlling a coolant droplet size, providing an electrical charge of the coolant and/or the metal substrate, and/or providing a predetermined surface geometry of the metal substrate. In certain aspects, the cooling feature may modify the Leidenfrost point to reduce and/or prevent the formation of a vapor layer while the metal substrate is at the aforementioned temperatures and/or being cooled from a first temperature to a second temperature that is less than the first temperature.

[0031] In some embodiments, one or more of the cooling features may be controlled to increase the Leidenfrost point of the coolant. In such embodiments, the increased Leidenfrost point may allow the liquid coolant to rapidly cool a metal substrate through nucleate boiling at higher temperatures and reduce the time window in which unfavorable phase-transformations are occurring. The increased Leidenfrost point may also allow for lower volumes of liquid to be used for quenching to achieve a desired cooling rate. In various embodiments, the cooling feature(s) may be selectively controlled during metal processing such that quenching efficiency is improved while reducing the total volume of coolant needed to obtain a desired metal substrate temperature. In some aspects, the cooling system 104 with cooling feature(s) may promote rapid cooling of the metal substrate compared to traditional cooling systems. The cooling feature(s) may minimize and/or prevent problems with the metal substrate such as off flatness, water staining, etc. by controlling the amount of coolant dispensed on the metal substrate. Furthermore, such methods can mitigate the damaging impact of the Leidenfrost effect on cooling by ensuring a liquid coolant goes through nucleate boiling rather than sit suspended above a vapor layer on the surface of the metal substrate.

[0032] In one non-limiting example, the metal processing system 100 may form droplets of coolant having a reduced size, such as from about 400-500 p.m, such as about 300 p.m, such as less than or equal to 100 p.m. The metal processing system 100 may form the droplets having the reduced size using various techniques or systems as desired, including but not limiting to mixing the coolant with air, ultrasonic techniques, providing the coolant through small physical holes, using a rotating disc, using vibration, various combinations thereof, or other techniques or systems as desired. FIG. 7 illustrates an example of the metal substrate 110 with micronized droplets 701 that are able to reach the surface of the metal substrate 110 without being suspended above a vapor layer. In some cases, due to the reduced volume and surface profile of the micronized droplets 701, a vapor layer capable of supporting a larger volume of water is not able to form and the micronized droplets 701 are able to cool the surface of metal substrate 110.

[0033] In another non-limiting example, the metal processing system 100 may use non-neutral electrical charges when applying the coolant. In such examples, the metal processing system 100 may induce an electrical charge on the surface of the metal substrate 110 prior to applying coolant to the metal substrate 110 using the cooling system 304, and the coolant applied to the metal substrate 110 may have an electrical charge that is opposite the electrical charge on the surface of the metal substrate 110. FIG. 8 illustrates an example of the metal substrate 110 when the cooling feature includes a non-neutral electric charge 803 of the coolant 801 and an opposite non-neutral electric charge 805 of the surface of the metal substrate 110. In one non-limiting embodiment, the non-neutral electric charge 803 may be induced in the coolant 801 by passing the coolant through a means of electrostatic induction prior to application to the metal substrate 110. Alternatively, the coolant 801 may be a naturally occurring, polar fluid, where a net charge is present throughout the coolant 801. The non-neutral electric charge 805 may be induced in the metal substrate 110 by means of electrostatic induction, application of an electric field, or any other method or combinations of methods wherein a charge can be held present at a surface boundary of the metal substrate 110. In some cases, the charge 805 may be induced prior to receiving the metal substrate 110 in the cooling system 104, or may be applied at the time of cooling. In FIG. 8, the electric charge 803 of the coolant 801 is negative and the electric charge 805 of the surface of the metal substrate 110 is positive, although embodiments exist where the charge profile is reversed. In these embodiments, the attractive forces that form between coolant electric charge 803 and metal substrate electric charge 805 modify the Leidenfrost point of the coolant 801, changing the temperature at which a trapped vapor layer forms.

[0034] In yet another non-limiting example, the metal processing system 100 may use a surface geometry of the metal substrate 110 to modify the Leidenfrost point of the coolant. In such examples, the surface geometry of the metal substrate 110 (e.g., a roughness, surface profile, flatness distribution, etc.) may be modified prior to applying the coolant to the metal substrate 110 using various techniques. FIG. 9 illustrates an example of the metal substrate 110 when the cooling feature includes surface texture 907 on the metal substrate 110. In this embodiment, the surface texture 907 provides a roughness profile of metal substrate 110 that may lend itself to breaking up a vapor layer that may form when metal substrate 110 is above a Leidenfrost point of the coolant 901 and without surface modifications. The surface of metal substrate 110 may be modified at any point prior to cooling using various means or techniques, including but not limited to textured rolls, imparting abrasions, or other means not limited by this disclosure. The modifications may occur at a point upstream of the cooling system 104. In these examples, altered surface properties or geometries that help alleviate the Leidenfrost effect include, but are not limited to, a roughness, a distribution of micro-valleys, and/or other surface-area altering modifications. In certain embodiments, modifying the surface geometry may mitigate the effects of the Leidenfrost effect by creating greater amounts of surface area for the coolant 901 to interface with the metal substrate 110. In some cases, the surface profile allows downward surface tension to overcome some of the effects of an upwards vapor layer, resulting in the desired nucleate boiling, and thus, rapid cooling.

[0035] The previous examples are provided for illustrative purposes and should not be considered limiting as other techniques may be used as desired in other embodiments. Moreover, the cooling system 104 need not necessarily use any of the aforementioned techniques to dispense coolant on the metal substrate 110.

[0036] As discussed in detail below, each of the nozzles of the cooling header 114 may be independently controlled by the controller 130 to provide a desired cooling profile.

[0037] Referring back to FIGS. 1 and 2, the exhaust system 118 is positioned downstream from the cooling header 114. In some optional examples, the exhaust system 118 is a predetermined distance downstream from the cooling header 114 that corresponds to a desired cooling rate and/or cooling duration at a predetermined line speed. In other examples, the exhaust system 118 may be positioned at various distances relative to the cooling header 114 as desired.

[0038] The exhaust system 118 includes a removal device 120 that is positioned below the passline of the metal substrate 110. In some cases, the removal device 120 is on the same side of the passline as the cooling header 114, although it need not be in other examples. In the example of FIG. 1, the removal device 120 and cooling header 114 are positioned on opposing sides of the passline. The removal device 120 may be various suitable devices that may selectively generate a suction or vacuum force (represented by arrow 124) that gathers or otherwise collects coolant after it has been heated by the metal substrate 110. In one non-limiting example, the removal device 120 may be a vacuum nozzle and/or vacuum system. In certain embodiments, the removal device 120 may be at least a 3500 CFM vacuum, such as a 4000 CFM
vacuum, although in other embodiments, the air flowing through vacuum system may be other rates as desired. In some non-limiting examples, the vacuum may further assist with cooling of the metal substrate 110. In other cases, other suitable removal devices 120 may be utilized. In one non-limiting example, the coolant is water, and the removal device 120 is configured to remove the heated coolant in the form of steam. The removal device 120 may be dimensioned to extend across the width (or a portion of the width) of the metal substrate 110 such that the heated coolant may be removed across the width (or a portion of the width) of the metal substrate 110.

[0039] The exhaust system 118 optionally includes a removal device 122. In various cases, the removal device 122 may be above the passline of the metal substrate 110. In various aspects, the removal device 122 is proximate to the top surface to remove any residue coolant that may sit on the metal. Optionally, one or more edge removal devices (such as blowers or other suitable devices) may be provided at the bottom side to prevent any top surface coolant from wrapping around the metal edges and wetting the bottom side. Compared to the removal device 120, the removal device 122 may be any suitable device that may selectively generate a directing or guiding force (represented by arrow 126) onto coolant that at least directs coolant off the metal substrate 110 and optionally towards the removal device 120. In one non-limiting example, the removal device 122 is an air mover or a blower, although other suitable removal devices may be utilized. In some cases, the removal device 122 may be vertically aligned with the removal device, although it need not be in other examples.

[0040] As illustrated in FIG. 1, the temperature sensor 128 may be downstream from the cooling header 114. The temperature sensor 128 is adapted to detect a temperature profile of the metal substrate 110 across the width of the metal substrate 110 during processing. The temperature sensor 128 may positioned on either side of the passline of the metal substrate 110 as desired. If more than one temperature sensor 128 is used, they may be positioned on the same or opposite sides of the passline of the metal substrate 110.

[0041] The controller 130 is communicatively coupled to the temperature sensor 128 and receives the detected temperature profile of the metal substrate 110 from the temperature sensor 128. The controller 130 is also communicatively coupled to the cooling header 114. In various examples, the controller 130 may control the cooling header 114 based on the detected temperature profile and/or such that the cooling header 114 dispenses the coolant pursuant to a cooling profile. In some cases, the controller 130 may determine the cooling profile by comparing the detected temperature profile from the temperature sensor 128 with a predetermined temperature profile. Optionally, the predetermined temperature profile may be the critical softening temperature of the metal substrate 110 and/or a desired coiling temperature of the metal substrate, although it need not be in other examples. In various examples, the cooling profile may correspond to a cooling rate or amount of cooling that the coolant provides at a predetermined line speed. In various aspects, the predetermined line speed is an increased line speed compared to a typical line speed. In some non-limiting examples, a typical line speed may be less than or equal to about 1550 m/min, and the increased line speed may be line speeds greater than about 1550 m/min, such as about 1800 m/min. In other examples, the predetermined line speed may be less than about 1800 m/min or greater than about 1800 m/min.
In various aspects, the cooling profile may be controlled by controlling one or more of a spray pattern of coolant from one or more nozzles individually, a spray pattern of the coolant being dispensed across the width of the metal substrate 110, a flow rate of coolant from one or more nozzles, a duration at which the coolant is dispensed from one or more nozzles, how many of the one or more nozzles are activated or turned on, or other suitable characteristics or controls as desired.
Accordingly, controlling the cooling header 114 such that the coolant is dispensed pursuant to the cooling profile may include one or more of controlling an air pressure in one or more of the nozzles of the cooling header 114, controlling a coolant (or water) pressure of one or more nozzles of the cooling header 114, controlling a flow rate of the coolant from one or more nozzles of the cooling header 114, controlling a duration at which the coolant is dispensed, controlling a spray pattern of one or more nozzles individually, controlling a spray pattern across the width of the metal substrate 110, controlling how many of the one or more nozzles are activated or turned on, or various other suitable controls. In one non-limiting example, the cooling header 114 may be controlled such that a flow rate of the coolant is at least 50 liters/minute, such as 55 liters/minute, although in other examples the flow rate may be adjusted as desired. In some optional examples, the cooling header may be utilized to correct a tight edges problem based on flatness input from a shape roll.

[0042] FIG. 2 illustrates a metal processing system 200 with the rolling mill 103 and a cooling system 204 according to various embodiments. Compared to the metal processing system 100, the metal substrate 110 is coiled in an under-wind configuration.

[0043] The cooling system 204 is substantially similar to the cooling system 104 except that the cooling system 204 includes the cooling header 114 below the passline of the metal substrate 110 and on the same side of the passline as the removal device 120. Compared to the cooling system 104, the cooling system 204 also includes a temperature sensor 232 that is substantially similar to the temperature sensor 128 but is upstream from the cooling header 114. In various cases, the controller 130 may be communicatively coupled to the temperature sensor 232 and may control the cooling header 114 based at least partially on a detected temperature profile from the temperature sensor 232. As one non-limiting example, the temperature sensor 232 may detect a temperature profile across the width of the metal substrate 110 after it exits the work stand 102 and prior to cooling with the cooling system 204. In this example, the controller 130 may compare the detected temperature profile from the temperature sensor 232 with the detected temperature profile from the temperature sensor 128 to determine an actual rate of cooling that the coolant from the cooling header 114 provides. In some cases, the controller 130 may control the cooling header 114 based on a difference between the actual rate of cooling and a desired rate of cooling (e.g., such that the metal substrate has a desired temperature profile).

[0044] FIGS. 3 and 4 illustrate a metal processing system 300 with a rolling mill 303 and a cooling system 304 according to various embodiments. The rolling mill 303 is substantially similar to the rolling mill 103 and includes at least one work stand 302 that has work rolls 308A-B and intermediate rolls 306A-B. As best illustrated in FIG. 3, the work stand 302 includes a coolant containment box 340 that may collect any coolant that may be directed onto the intermediate rolls 306A-B to limit or prevent the coolant from contacting the metal substrate 310. Similar to the metal processing system 200, the metal substrate 310 processed by the metal processing system 300 is coiled in an under-wind configuration to form a coil 312 of the metal substrate 310.

[0045] The cooling system 304 is substantially similar to the cooling system 204 and includes a cooling header 314, an exhaust system 318 with the removal device 320 and the removal device 322, and a temperature sensor 328 downstream from the cooling header 314. As represented by the triangle 334, the temperature sensor 328 may detect a temperature profile of the metal substrate 310 across the width of the metal substrate 310. Although not illustrated in FIGS. 3 and 4, the cooling system 304 also includes a controller that is communicatively coupled with the cooling header 314 and the temperature sensor 328. Compared to the cooling system 204, the cooling system 304 does not include a temperature sensor upstream from the cooling header 314.

[0046] As best illustrated in FIG. 4, the cooling header 314 may include a plurality of nozzles 336, and the cooling header 314 is dimensioned to extend across the width of the metal substrate 310. The number, type, and arrangement of nozzles 336 should not be considered limiting. In various aspects, the controller of the cooling system 304 may independently control each nozzle 336 such that the cooling header 314 provides the desired cooling profile. In other examples, the controller of the cooling system 304 may control at least one nozzle 336 in conjunction with another nozzle 336.

[0047] Referring to FIGS. 3 and 4, the removal device 320 of the exhaust system 318 is a vacuum nozzle and the removal device 322 of the exhaust system 318 is a blower. As best illustrated in FIG. 4, the removal device 322 is dimensioned to extend across the width of the metal substrate 310.

[0048] In some optional examples, the cooling system 304 includes a recirculation system 338 that is in fluid communication with the exhaust system 318 and the cooling header 314. In these examples, coolant that is collected by the exhaust system 318 may be treated or otherwise prepared for subsequent cooling by the recirculation system 338, and the recirculation system 338 may recirculate the treated coolant back to the cooling header 314.

[0049] FIGS. 5 and 6 illustrate a metal processing system 500 with the rolling mill 303 and a cooling system 504 according to various embodiments. The cooling system 504 is substantially similar to the cooling system 304 and includes a cooling header 514, an exhaust system 518 with a removal device 520, and the temperature sensor 328 downstream from the cooling header 514.
Similar to the cooling system 304, the cooling system 504 may include a controller that is communicatively coupled with the cooling header 514 and the temperature sensor 328.

[0050] Similar to the cooling header 314, the cooling header 514 may include a plurality of nozzles 536, and the cooling header 514 is dimensioned to extend across the width of the metal substrate 310. The number, type, and arrangement of nozzles 536 should not be considered limiting. In some aspects, the nozzles 536 may are a different style and/or type compared to the nozzles 336, although they need not be in other embodiments. Similar to the cooling system 304, the controller of the cooling system 504 may control the nozzles 536 as desired, including independently from one another or nozzles may be controlled in conjunction.

[0051] Compared to the cooling system 304, a distance between the cooling header 514 and the removal device 520 is reduced and/or minimized. Similar to the removal device 320, the removal device 520 is a vacuum nozzle that optionally may extend across the width of the metal substrate 310. Compared to the removal device 320, where an opening of the device 320 is facing directly upwards, the removal device 520 includes a receiving portion 521 that is elongated in the direction of travel of the metal substrate 310 and optionally proximate to the cooling header 514 to increase coolant collection, which may be in the form of steam. In certain aspects, the cooling system 504 may avoid and/or minimize cooling at the edges of the metal substrate 310 to minimize or reduce the possibility that tight edges are created in the metal substrate 310, which may lead to strip break.

[0052] A method of controlling the temperature of a metal substrate with a cooling system is also provided. While reference will be made to the cooling system 104, it will be appreciated that the following description is applicable to any of the cooling systems described herein, as well as other cooling systems within the spirit of this disclosure.

[0053] In various examples, the method of controlling the temperature of the metal substrate 110 includes receiving the metal substrate 110 at the cooling system 204 and with the metal substrate 110 moving at a predetermined line speed. In some optional examples, the predetermined line speed may be about 1800 m/min, although it need not be in other examples.
The method may include detecting a temperature profile of the metal substrate 110 across the width of the metal substrate 110. In various examples, the method may include comparing the detected temperature profile with a predetermined or desired temperature profile. In various examples, the predetermined desired temperature profile is a temperature profile that is less than or equal to the critical softening temperature of the metal substrate 110 and/or a desired coiling temperature of the metal substrate, although it need not be in other examples.

[0054] In certain aspects, the method may include determining a cooling profile for the cooling header 114 based on a difference between the detected temperature profile and the predetermined or desired temperature profile. The method may include controlling the cooling header 114 such that the cooling header 114 provides coolant pursuant to the cooling profile and such that the coolant cools the metal substrate 110 to have the predetermined or desired temperature profile at the predetermined line speed. In some cases, controlling the cooling header 114 may include controlling one or more of a spray pattern of coolant from one or more nozzles individually, a spray pattern of the coolant being dispensed across the width of the metal substrate 110, a flow rate of coolant from one or more nozzles, a duration at which the coolant is dispensed from one or more nozzles, how many of the one or more nozzles are turned on, or other suitable characteristics or controls as desired.

[0055] A collection of exemplary embodiments are provided below, including at least some explicitly enumerated as "Illustrations" providing additional description of a variety of example embodiments in accordance with the concepts described herein. These illustrations are not meant to be mutually exclusive, exhaustive, or restrictive; and the disclosure not limited to these example illustrations but rather encompasses all possible modifications and variations within the scope of the issued claims and their equivalents.

[0056] Illustration 1. A cooling system for a metal processing system, the cooling system comprising: a cooling header configured to selectively dispense a coolant onto a metal substrate;
an exhaust system downstream from the cooling header, wherein the exhaust system comprises a removal device that is configured to remove coolant dispensed by the cooling header; a temperature sensor downstream from the cooling header, wherein the temperature sensor is configured to detect a temperature profile of the metal substrate across a width of the metal substrate; and a controller communicatively coupled to the cooling header and the temperature sensor, wherein the controller is configured to control the cooling header based at least on a detected temperature profile.

[0057] Illustration la. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header is an atomizing spray header.

[0058] Illustration 2. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header and the removal device of the exhaust system are positioned relative to a passline of a metal substrate through the cooling system, and wherein the cooling header and the removal device of the exhaust system are on opposing sides of the passline.

[0059] Illustration 3. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header and the removal device of the exhaust system are positioned relative to a passline of a metal substrate through the cooling system, and wherein the cooling header and the removal device of the exhaust system are on a same side of the passline.

[0060] Illustration 4. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header and the removal device of the exhaust system are below the passline.

[0061] Illustration 5. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the removal device of the exhaust system is configured to generate a vacuum force.

[0062] Illustration 6. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the removal device of the exhaust system is a first removal device, and wherein the exhaust system further comprises a second removal device downstream from the cooling header.

[0063] Illustration 7. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the first removal device is a vacuum device, and wherein the second removal device is a blower.

[0064] Illustration 8. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header, the first removal device, and the second removal device are positioned relative to a passline of a metal substrate through the cooling system, wherein the cooling header and the first removal device are on a first side of the passline, and wherein the second removal device is on a second side of the passline opposite from the first side.

[0065] Illustration 9. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header and the first removal device are below the passline, and wherein the second removal device is above the passline.

[0066] Illustration 10. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the second removal device is vertically aligned with the first removal device.

[0067] Illustration 11. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header comprises a plurality of nozzles, and wherein each nozzle of the plurality of nozzles is independently controlled by the controller.

[0068] Illustration 12. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the temperature sensor is a first temperature sensor, and wherein the cooling system further comprises a second temperature sensor upstream from the cooling header.

[0069] Illustration 13. The cooling system of any preceding or subsequent illustrations or combination of illustrations, further comprising a flatness sensor configured to detect a flatness profile of the metal substrate across a width of the metal substrate, wherein the controller is communicatively coupled to the flatness sensor and is configured to control the cooling header based at least on a detected flatness profile.

[0070] Illustration 14. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the controller is further configured to:
determine a desired exit temperature profile of metal substrate; receive the detected temperature profile from the temperature sensor; determine a cooling profile for the coolant at a predetermined line speed based on the desired exit temperature profile and the detected temperature profile; and control the cooling header such that the cooling header dispenses the coolant pursuant to the cooling profile.

[0071] Illustration 15. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the desired exit temperature profile is a coiling temperature of the metal substrate.

[0072] Illustration 16. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein controlling the cooling header comprises controlling at least one of a spray pattern across the width of the metal substrate or a flow rate of the coolant from the cooling header.

[0073] Illustration 17. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the desired exit temperature profile is predetermined.

[0074] Illustration 18. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the controller is configured to determine the desired exit temperature profile based at least partially on a material composition of the metal substrate.

[0075] Illustration 19. The cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the predetermined line speed is about 1800 m/min.

[0076] Illustration 20. A metal processing system comprising: an exit stand of a rolling mill;
and the cooling system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling system is downstream from the exit stand.

[0077] Illustration 21. The metal processing system of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling header is positioned proximate to the exit stand.

[0078] Illustration 22. The metal processing system of any preceding or subsequent illustrations or combination of illustrations, wherein the exhaust system is a predetermined distance downstream from the cooling header, and wherein the predetermined distance is based on a desired cooling rate of the metal substrate at a predetermined line speed of the metal substrate exiting the exit stand.

[0079] Illustration 23. The metal processing system of any preceding or subsequent illustrations or combination of illustrations, wherein the controller is further configured to: determine a desired exit temperature profile of metal substrate prior to coiling; receive the detected temperature profile from the temperature sensor; determine a cooling profile for the coolant at a predetermined line speed based on the desired exit temperature profile and the detected temperature profile; and control the cooling header such that the cooling header dispenses the coolant pursuant to the cooling profile.

[0080] Illustration 24. The metal processing system of any preceding or subsequent illustrations or combination of illustrations, wherein the predetermined line speed is about 1800 m/min.

[0081] Illustration 25. The metal processing system of any preceding or subsequent illustrations or combination of illustrations, wherein the rolling mill is a cold rolling mill.

[0082] Illustration 26. A method of cooling a metal substrate using the cooling system of any preceding or subsequent illustrations or combination of illustrations, the method comprising:
receiving the detected temperature profile from the temperature sensor;
determining a cooling profile for the coolant at a predetermined line speed based on a desired exit temperature profile of the metal substrate before coiling and the detected temperature profile;
and controlling the cooling header such that the cooling header dispenses the coolant pursuant to the cooling profile.

[0083] Illustration 27. A cold rolling mill comprising: an exit stand; and a cooling system downstream from the exit stand, the cooling system comprising a cooling header configured to selectively dispense a coolant onto a metal substrate exiting the exit stand.

[0084] Illustration 28. The cold rolling mill of any preceding or subsequent illustrations or combination of illustrations, further comprising a rewind coiler, wherein the cooling system is between the exit stand and the rewind coiler.

[0085] Illustration 29. The cold rolling mill of any preceding or subsequent illustrations or combination of illustrations, further comprising an exhaust system downstream from the cooling header, wherein the exhaust system comprises a removal device that is configured to remove coolant dispensed by the cooling header.

[0086] Illustration 30. The cold rolling mill of any preceding or subsequent illustrations or combination of illustrations, further comprising: a temperature sensor downstream from the cooling header, wherein the temperature sensor is configured to detect a temperature profile of the metal substrate across a width of the metal substrate; and a controller communicatively coupled to the cooling header and the temperature sensor, wherein the controller is configured to control the cooling header based at least on a detected temperature profile.

[0087] Illustration 31. A cold rolling mill comprising: an exit stand; and a cooling system downstream from the exit stand, the cooling system comprising: a cooling header comprising a plurality of nozzles, each nozzle of the plurality of nozzles configured to selectively dispense a coolant onto a metal substrate exiting the exit stand; and a controller communicatively coupled with the cooling header and configured to individually control each nozzle of the plurality of nozzles.

[0088] Illustration 32. The cold rolling mill of any preceding or subsequent illustrations or combination of illustrations, further comprising: a temperature sensor configured to detect a temperature profile across a width of the metal substrate, wherein the controller is communicatively coupled with the temperature sensor is configured to control each nozzle of the plurality of nozzles based on a detected temperature profile from the temperature sensor.

[0089] Illustration 33. A method of cooling a metal substrate with a cooling system, the method comprising: receiving a metal substrate at a first temperature, applying a coolant to a surface of the metal substrate by directing the coolant through at least one nozzle, the at least one nozzle configured to direct the coolant as micronized droplets; and controlling a droplet size of the coolant as it is directed through the at least one nozzle to modify a Leidenfrost point of the coolant.

[0090] Illustration 34. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the metal substrate comprises an aluminum alloy.

[0091] Illustration 35. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the first temperature is 590 C.

[0092] Illustration 36. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one nozzle is at least one cone-shaped nozzle.

[0093] Illustration 37. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the coolant comprises water.

[0094] Illustration 38. The method of any preceding or subsequent illustrations or combination of illustrations, wherein receiving the metal substrate at the first temperature comprises receiving the metal substrate from a piece of metal processing equipment.

[0095] Illustration 38. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the piece of metal processing equipment comprises a work stand of a rolling mill, and wherein the rolling mill comprises at least one of a hot rolling mill, a cold rolling mill, or a warm rolling mill.

[0096] Illustration 39. The method of any preceding or subsequent illustrations or combination of illustrations, wherein: the surface of the metal substrate is an upper surface; the at least one nozzle comprises at least two nozzles; a first nozzle of the at least two nozzles is positioned above a passline of the metal substrate through the quenching system; a second nozzle of the at least two nozzles is positioned below the passline of the metal substrate; and applying the coolant comprises directing the coolant onto the upper surface of the metal substrate with the first nozzle and directing coolant onto a lower surface of the metal substrate with the second nozzle.

[0097] Illustration 40. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the cooling feature comprises a flow-rate of coolant through the at least one nozzle, and wherein the flow rate of coolant comprises 55 Umin.

[0098] Illustration 41. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the coolant is selected from the group consisting of water, oil, air, a charged solution and/or other suitable liquid coolant.

[0099] Illustration 41. The method water, oil, air, a charged solution and/or other suitable liquid coolant, wherein applying the coolant comprises applying the coolant such that the temperature of the metal substrate decreases at a rate of at least 100 C/s, and optionally at least 500 C/s.

[0100] Illustration 42. The method 100 C/s, wherein the at least one nozzle comprises at least one movable nozzle.

[0101] Illustration 43. The method 100 C/s, further comprising moving the at least one movable nozzle to a second surface of the metal substrate that is at the first temperature.

[0102] Illustration 44. A method of quenching a metal substrate with a quenching system, the method comprising: receiving a metal substrate at a first temperature;
inducing a non-neutral electric charge on a surface of the metal substrate; and applying a coolant to the surface of the metal substrate by directing the coolant through at least one nozzle, wherein the coolant comprises a complementary electrical charge to the electrical charge induced on the surface of the metal substrate to modify a Leidenfrost point of the coolant.

[0103] Illustration 45. A method of quenching a metal substrate with a quenching system, the method comprising: receiving a metal substrate at a first temperature;
modifying a surface of the metal substrate such that the surface geometry modifies a Leidenfrost point of a coolant; and applying the coolant to a surface of the metal substrate by directing the coolant through at least one nozzle towards the modified surface of the metal substrate.

[0104] The above-described aspects are merely possible examples of implementations, merely set forth for a clear understanding of the principles of the present disclosure. Many variations and modifications can be made to the above-described embodiment(s) without departing substantially from the spirit and principles of the present disclosure. All such modifications and variations are intended to be included herein within the scope of the present disclosure, and all possible claims to individual aspects or combinations of elements or steps are intended to be supported by the present disclosure. Moreover, although specific terms are employed herein, as well as in the claims that follow, they are used only in a generic and descriptive sense, and not for the purposes of limiting the described embodiments, nor the claims that follow.

Claims (20)

WO 2023/076125 PCT/US2022/047487That which is claimed:

1. A cooling system for a metal processing system, the cooling system comprising:
a cooling header configured to selectively dispense a coolant onto a metal substrate;
an exhaust system downstream from the cooling header, wherein the exhaust system comprises a removal device that is configured to remove coolant dispensed by the cooling header;
a temperature sensor downstream from the cooling header, wherein the temperature sensor is configured to detect a temperature profile of the metal substrate across a width of the metal substrate; and a controller communicatively coupled to the cooling header and the temperature sensor, wherein the controller is configured to control the cooling header based at least on a detected temperature profile.

2. The cooling system of claim 1, wherein the cooling header is an atomizing spray header.

3. The cooling system of claim 1, wherein the cooling header and the removal device of the exhaust system are positioned relative to a passline of a metal substrate through the cooling system, and wherein the cooling header and the removal device of the exhaust system are on a same side of the passline.

4. The cooling system of claim 3, wherein the cooling header and the removal device of the exhaust system are below the passline.

5. The cooling system of claim 1, wherein the removal device of the exhaust system is a first removal device, and wherein the exhaust system further comprises a second removal device downstream from the cooling header.

6. The cooling system of claim 5, wherein the first removal device is a vacuum device, and wherein the second removal device is a blower.

7. The cooling system of claim 5, wherein the cooling header, the first removal device, and the second removal device are positioned relative to a passline of a metal substrate through the cooling system, wherein the cooling header and the first removal device are on a first side of the passline, and wherein the second removal device is on a second side of the passline opposite from the first side.

8. The cooling system of claim 7, wherein the cooling header and the first removal device are below the passline, and wherein the second removal device is above the passline.

9. The cooling system of claim 1, wherein the cooling header comprises a plurality of nozzles, and wherein each nozzle of the plurality of nozzles is independently controlled by the controller.

10. The cooling system of claim 1, wherein the temperature sensor is a first temperature sensor, and wherein the cooling system further comprises a second temperature sensor upstream from the cooling header.

11. The cooling system of claim 1, wherein the controller is further configured to:
determine a desired exit temperature profile of metal substrate;
receive the detected temperature profile from the temperature sensor;
determine a cooling profile for the coolant at a predetermined line speed based on the desired exit temperature profile and the detected temperature profile; and control the cooling header such that the cooling header dispenses the coolant pursuant to the cooling profile.

12. The cooling system of claim 11, wherein controlling the cooling header comprises controlling at least one of a spray pattern across the width of the metal substrate or a flow rate of the coolant from the cooling header.

13. The cooling system of claim 1, wherein the cooling header and the removal device of the exhaust system are positioned relative to a passline of a metal substrate through the cooling system, and wherein the cooling header and the removal device of the exhaust system are on opposing sides of the passline.

14. A metal processing system comprising:
an exit stand of a rolling mill, wherein the rolling mill is a cold rolling mill; and the cooling system of claim 1, wherein the cooling system is downstream from the exit stand.

15. The metal processing system of claim 14, wherein the controller is further configured to:
determine a desired exit temperature profile of metal substrate prior to coiling;
receive the detected temperature profile from the temperature sensor;
determine a cooling profile for the coolant at a predetermined line speed based on the desired exit temperature profile and the detected temperature profile; and control the cooling header such that the cooling header dispenses the coolant pursuant to the cooling profile.

16. A cold rolling mill comprising:
an exit stand; and a cooling system downstream from the exit stand, the cooling system comprising a cooling header configured to selectively dispense a coolant onto a metal substrate exiting the exit stand.

17. The cold rolling mill of claim 16, further comprising:
a rewind coiler, wherein the cooling system is between the exit stand and the rewind coiler; and an exhaust system downstream from the cooling header, wherein the exhaust system comprises a removal device that is configured to remove coolant dispensed by the cooling header.

18. The cold rolling mill of claim 16, further comprising:
a temperature sensor downstream from the cooling header, wherein the temperature sensor is configured to detect a temperature profile of the metal substrate across a width of the metal substrate; and a controller communicatively coupled to the cooling header and the temperature sensor, wherein the controller is configured to control the cooling header based at least on a detected temperature profile.

19. A cold rolling mill comprising:
an exit stand; and a cooling system downstream from the exit stand, the cooling system comprising:
a cooling header comprising a plurality of nozzles, each nozzle of the plurality of nozzles configured to selectively dispense a coolant onto a metal substrate exiting the exit stand; and a controller communicatively coupled with the cooling header and configured to individually control each nozzle of the plurality of nozzles.

20. The cold rolling mill of claim 19, further comprising:
a temperature sensor configured to detect a temperature profile across a width of the metal substrate, wherein the controller is communicatively coupled with the temperature sensor is configured to control each nozzle of the plurality of nozzles based on a detected temperature profile from the temperature sensor.