CA3216165A1

CA3216165A1 - Contactless looper for metal processing and related methods

Info

Publication number: CA3216165A1
Application number: CA3216165A
Authority: CA
Inventors: Antoine Jean Willy Pralong; Timothy F. STANISTREET; Adolfo RAIS; Hansjuerg Alder; Renato Rufino Xavier
Original assignee: Novelis Inc Canada
Current assignee: Novelis Inc Canada
Priority date: 2021-04-13
Filing date: 2022-03-24
Publication date: 2022-10-20
Also published as: KR20230167122A; CN117203001A; WO2022221807A1; JP2024519666A; US20240216971A1; MX2023011787A; DE212022000178U1; BR112023020510A2; EP4323128A1

Abstract

A contactless looper for a metal substrate includes an entrance, an exit, and at least one deflection device between the entrance and the exit. The contactless looper is configured to receive a metal substrate moving in a processing direction from the entrance to the exit and impart a deflection along the processing direction in a metal substrate such that a position of the metal substrate at the at least one deflection device is vertically offset from a height of the metal substrate at the entrance of the looper. A method of processing a metal substrate with the contactless looper includes receiving the metal substrate at the entrance of the contactless looper along a passline, imparting a deflection in the metal substrate with the looper, and passing the metal substrate out the exit of the contactless looper.

Description

CONTACTLESS LOOPER FOR METAL PROCESSING AND RELATED
METHODS
CROSS-REFERENCE TO RELATED APPLICATION
[00011 This application claims the benefit of and priority to U.S. Provisional Application No.
63/174,076, filed on April 13, 2021, which is hereby incorporated by reference in its entirety for all purposes.
FIELD OF THE INVENTION
[00021 This application relates to metallurgy generally, and, more specifically, to systems and methods for processing a metal article with a looper.
BACKGROUND
[00031 Web handling is an important aspect of many manufacturing processes.
The tension in the web is a key process parameter, as excessive tension may lead to breaks or cracks while compression may lead to buckling. In some cases, the web may be a metal product such as a rolled metal product that may be relatively thin and wide. Tension in the metal product is usually measured by recording the force the metal product produces on a deflection roll and the deflection angle of the metal product on the deflection roll. This method requires a physical contact between the deflection roll and the metal product. If no physical contact is permitted, due to quality or other constraints, there is not currently any practical method to measure and control tension. For example, a heating apparatus or at other locations or devices may not permit physical contact due to quality or other constraints.
SUMMARY
[00041 Embodiments covered by this patent are defined by the claims below, not this summary. This summary is a high-level overview of various embodiments and introduces some of the concepts that are further described in the Detailed Description section below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used in isolation to determine the scope of the claimed subject matter. The SUBSTITUTE SHEET (RULE 26) subject matter should be understood by reference to appropriate portions of the entire specification of this patent, any or all drawings, and each claim.
[00051 According to certain embodiments, a contagtless looper includes an entrance and an exit, and the contactless looper receives a metal substrate moving in a processing direction from the entrance to the exit. The contaa ess looper also includes at least one deflection device between the entrance and the exit, and the at least one deflection device imparts a deflection along the processing direction in a metal substrate without contacting the metal substrate such that a position of the metal substrate downstream from the entrance of the looper is vertically offset from a position of the metal substrate at the entrance of the looper.
[00061 According to some embodiments, a processing line for a metal substrate includes a contactiess looper that imparts a deflection in the Metal substrate moving in a processing direction without contacting the metal substrate. The contactless looper includes an entrance, an exit, and at least one deflection device between the entrance and the exit.
The con tactless looper defines a passline from the entrance to the exit for the metal substrate, and the entrance defines a base height of the passline. The looper vertically offsets the passline such that a position of the passline at the at least one deflection device is offset from the base height.
[00071 According to various embodiments, a method of processing a metal substrate moving in a processing direction with a contactless looper includes receiving the metal substrate at an entrance of the contactless looper along a passline. The method also includes imparting a deflection in the metal substrate with the looper as the metal substrate is moving in the processing direction and without contacting the metal substrate, where the deflection is in the vertical direction. The method also includes passing the metal substrate out an exit of the contacti ess looper.
[00081 According to certain embodiments, a continuous heating apparatus includes an entrance, an exit, and a looper. A heating device may be provided between the entrance and the exit. in some embodiments, the looper may be the heating device, although it heed not he in other embodiments. During processing, the heating apparatus receives a metal substrate moving in. a processing direction from the entrance to the exit and heats the metal substrate.
The lower is between the entrance and the exit, and during processing, the looper imparts a deflection in. a metal substrate such that a position of the metal substrate downstream from the entrance of the looper is vertically offset from a position of the metal substrate at the entrance of the looper.

2 SUBSTITUTE SHEET (RULE 26) [00091 According to some embodiments, a continuous processing line for a metal substrate includes a heating apparatus that heats the metal substrate moving in a processing direction.
The heating apparatus includes an entrance, an exit, and a looper between the entrance and the exit. A heating device may be provided between the entrance and the exit. In some embodiments, the looper may be the heating device, although it need not be in other embodiments. in various embodiments, the heating apparatus defines a passline from the entrance to the exit for the metal substrate. The entrance defines a base height of the passline, and the looper vertically offsets the passline such that a position of the passline downstream from the entrance of the looper is 'vertically offset from the base height.
[00101 According to some embodiments, a method of continuously processing a metal substrate moving in a processing direction with a heating apparatus includes receiving the metal substrate at an entrance of the heating apparatus along a passline and heating the metal substrate downstream from the entrance. The method also includes imparting a deflection in the metal substrate with a looper as the metal substrate is moving in the processing direction. In various embodiments, the deflection is in vertical. The method includes passing the metal substrate out an exit of the heating apparatus.
[00111 Various implementations described herein may include additional systems, methods, features, and advantages, which cannot necessarily be expressly disclosed herein but will be apparent to one of ordinary skill in the art upon examination of the following detailed description and accompanying drawings. It is intended that all such systems, methods, features, and advantages be included within the present disclosure and protected by the accompanying claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[00121 The specification makes reference to the following appended figures, in which use of like reference numerals in different figures is intended to illustrate like or analogous compon en is.
[00131 FIG. I illustrates a metal processing system with a heating apparatus according to embodiments.
[00141 FIG. 2 illustrates heating elements of the heating apparatus of FIG. l with the heating apparatus in a tension control configuration. according to embodiments.

3 SUBSTITUTE SHEET (RULE 26) [00151 FIG. 3 illustrates the heating elements of the heating apparatus of FIG. 1 with the heating apparatus in another tension control configuration according to embodiments.
[00161 FIG. 4 illustrates the heating elements of the heating apparatus of FIG. I with the heating apparatus in another tension control configuration according to embodiments.
[00171 FIG. 5 illustrates the heating elements of the heating apparatus of FIG. 1 with the heating apparatus in another tension control configuration according to embodiments.
[00181 FIG. 6 illustrates a contact:less looper according to embodiments.
[00191 FIG. 7 illustrates another contactiess looper according to embodiments.
DETAILED DESCRIPTION
[00201 The subject matter of embodiments is described herein with specificity to meet statutory requirements, but this description is not necessarily intended to limit the scope of the claims. The claimed subject matter may be embodied in other ways, may include different elements or steps, and may be used in conjunction with other existing or future technologies.
This description should not be interpreted as implying any particular order or arrangement among or between various steps or elements except when the order of individual steps or arrangement of elements is explicitly described. Directional references such as "up," "down,"
"top," "bottom,' "left," "right," "front," and "back," among others, are intended to refer to the orientation as illustrated and described in the figure (or figures) to which the components and direction.s are referencing. While the systems and methods described herein can be used with any metal, they may be especially useful with aluminum or aluminum alloys.
[00211 Described herein are systems and methods for controlling tension in a metal substrate on a processing line for the metal substrate by using a contactless looper. As used herein, a looper is a device for imparting a deflection in the metal substrate along a processing direction (i.e., the length direction). In various embodiments, the dell ecti on is a vertical deflection. In addition, as used herein, imparting a deflection means imparting the deflection without contacting the metal substrate (e.g., a deflection-imparting device is a "conta.ctiess" deflection-imparting device) unless otherwise indicated. In some embodiments, the looper imparts the deflection by applying a force on the metal substrate that actively creates the deflection, or the looper may not balance the weight of the metal substrate (e.g., does not uniformly support the metal substrate), and the metal substrate downstream from the entrance of the looper forms a catenary as the deflection.

4 SUBSTITUTE SHEET (RULE 26) [00221 in some embodiments, a heating apparatus may include the looper, but in other embodiments, the looper need not be provided within the heating apparatus.
When the heating apparatus is provided, the heating apparatus may be a continuous heating apparatus, although in other embodiments it need not be. The looper imparts a deflection in the metal substrate while the metal substrate is in the heating apparatus and/or at a location between processing equipment that contacts the metal substrate, in various embodiments, the looper imparts the del-lee:lion in the metal substrate moving in a processing direction such that a passline of the metal substrate downstream from the entrance of the looper is vertically offset from the passline of the metal substrate at an entrance and/or an. exit of the heating apparatus (and/or at the upstream processing equipment and/or at the downstream processing equipment).
As used herein, any description relating to the "entrance" or the "exit" of the heating apparatus is equally applicable to upstream processing equipment and downstream processing equipment (e.g., in embodiments where the looper is not provided with the heating apparatus) unless otherwise indicated, and entrance and exit are used to refer to areas upstream (entrance) or downstream (exit) from the one or more deflection devices of the looper.
[00231 In some embodiments, the looper imparts a single deflection, while in other embodiments, the looper in ay impart a plurality of deflections. The one or more deflections may be vertically offset above or below the passline of the metal substrate at the entrance and/or the exit, An amplitude of the deflection, or an amount by which the looper offsets the metal substrate relative to the entrance and/or exit, may be controlled by controlling at least one of a vertical position of the looper, a speed of the metal substrate at the entrance of the heating apparatus, and/or a speed of the metal substrate at the exit of the heating apparatus. in some embodiments, the amplitude of the deflection may be controlled by controlling a magnitude, direction, or other characteristic of a force that is applied on the metal substrate. In such embodiments, the vertical position of the at least one deflection device may be fixed or may be adjustable as desired. As a non-limiting example, the at least one deflection device may be a magnetic rotor that imparts a force on the metal substrate to form the deflection, and the amplitude of the deflection may be controlled. by adjusting a. vertical position of an. axis of the magnetic rotor, a rotational speed of the magnetic rotor (e.g., to adjust magnitude), or both. The deflection provided by the looper in the heating apparatus (or other location) reduces the rigidity. of the metal substrate in the processing direction and may allow for improved control of the tension in the metal substrate in the heating apparatus (or other location).
SUBSTITUTE SHEET (RULE 26) [0024] in certain embodiments, the looper imparts the deflection in the metal substrate without contacting the metal substrate within the heating apparatus. By not contacting the metal substrate within the heating apparatus, the looper avoids damaging the metal substrate and/or otherwise negatively affecting the metal substrate that would otherwise occur due to physical contact with the metal substrate within the heating apparatus.
[00251 The looper may be various devices suitable for levitating or floating the metal substrate within the heating apparatus (or at other locations as desired) while imparting a deflection in the metal sUbstrate. As one non-limiting example, the looper may include one or more air or gas nozzles that float the metal substrate and impart the deflection in the metal substrate by directing a gas against the metal substrate. A.s another non-limiting example, the looper may include at least one magnet producing magnetic levitation due to the relative motion between the electrically conducting metal substrate and magnets. This levitation method can be a magnetic rotor that is rotatable about an axis and that levitates the electrically conducting metal substrate, and in certain embodiments, the looper includes a plurality of magnetic rotors. As another non-limiting example, the looper may include at least one electromagnet or el ectro-permanent magnet with an alternating current flowing through it, thereby producing magnetic levitation due to oscillating electromagnetic fields affecting an electrically conducting metal substrate.
[00261 When the looper includes the magnetic rotor(s) or the electromagnet(s), in addition to levitating the metal substrate, the magnetic rotor(s) or the electromagnet(s) of the looper may also be heaters of the heating apparatus that heat the metal substrate. As one non-limiting example, the magnetic rotor(s) or the electromagnet(s) of the looper may be heaters in a soak section (and/or any other section.) of the heating apparatus. in various embodiments, the magnetic forces from the magnetic rotor(s) of the looper used to levitate the metal substrate may allow for a change in the tension in the metal substrate. The eddy currents induced in the metal from the magnetic rotor(s) or the electrom agnet(s) of the looper may also optionally heat the metal product as the metal product moves in the processing direction. In other embodiments, the looper need not heat the metal substrate and/or additional heating elements may be provided when the looper is within the heating apparatus.
[0027] FIG. 1 illustrates an embodiment of a processing line 100 for a metal substrate 104.
The processing line 100 includes a heating apparatus 102 that may be used to heat the metal substrate 104 to a desired temperature as the metal substrate 104 in ov es in a processing direction 114. The heating apparatus 102 includes an entrance 128 and an exit 130 downstream SUBSTITUTE SHEET (RULE 26) from the entrance 128. During processing, the heating apparatus -102 receives the metal substrate 104 at the entrance 128, heats the metal substrate 104 with heating devices (not shown in FIG. 1) between the entrance 128 and the exit 130, and passes the metal substrate 104 out the exit 130.
[00281 in various embodiments, the processing line 100 includes at least one piece of processing equipment 108 downstream from the heating apparatus 102 and at least one piece of processing equipment 106 upstream from the heating apparatus 102. The processing equipment 106 and the processing equipment 108 may each be various types of equipment for processing the metal substrate 104 as desired by physically contacting the metal substrate 104 as it moves in the processing direction 114. As some non-limiting examples, the processing equipment 106 and/or the processing equipment 108 may be pinch rolls, a rolling mill, a coiler, a caster, a cutting device, a coating device, a painting device, a slitter, a leveler, a quench, and/or other various types of processing equipment as desired for the processing line 100. In the example of FIG. 1, the processing equipment 106 is a pinch roll 110 and the processing equipment 108 is a work stand of a roiling mill 112. As discussed in detail below, in various embodiments, the processing equipment 106 may be controlled to control a speed of the metal substrate 104 at the entrance 128, and the processing equipment 108 may be controlled to control a speed of the metal substrate 104 at the exit 130.
[00291 A controller 118 may be communicatively coupled to the heating apparatus 102, the processing equipment 106, and/or the processing equipment 108. The controller 118 may be various suitable processing devices or other controllers for selectively controlling the processing line 100 with the heating apparatus 102 to minimize influences on tension in the metal substrate 104 during processing of the metal substrate 104 and/or to actively control the tension in the metal substrate 104.
[00301 FIG-S. 2-5 illustrate the heating apparatus 102 in detail. As illustrated, the heating apparatus 102 includes at least one heating device 134 and a looper 132. The configurations of the loopers 132 illustrated in FIGS. 2-5 are not limited to the heating apparatus and instead may be used as contactless loopers without the heating apparatus or as otherwise desired.
Optionally, the controller 118 is communicatively coupled to the looper 13.2 and at least one of the pieces of processing equipment 106 or 108. The at least one heating device 134 heats the metal substrate 104, and the looper 132 imparts at least one deflection 122 in the metal substrate 104 between the entrance 128 and the exit 130 by applying a force on the metal substrate. in SUBSTITUTE SHEET (RULE 26) some cases and as discussed in detail below, a single component may be both a heating device 134 and a component of the looper 132, although it need not be in other embodiments.
[00311 The heating device(s) 134 may be various suitable devices or heaters for heating the metal substrate 104 as desired, including but not limited to magnetic rotors, electromagnets, el ecno-permanent magnets, direct flame impingement devices, hot gas devices, infrared devices, combinations thereof, or other suitable devices as desired. In the embodiment of KiS.
2-5, the heating apparatus 102 includes a plurality of magnetic rotors 116A-G
as the heating devices. As mentioned below, in certain embodiments, at least some of the magnetic rotors 116A-G may also levitate the metal substrate as part of the lower 132.
However, in other embodiments, and as also discussed below, die magnetic rotors 116A-G need not be components of the looper 132 and/or the components of the looper 132 need not heat the metal substrate.
[00321 Each magnetic rotor 116A-G is rotatable about an axis of rotation.
'file magnetic rotors 116A-G can be rotated through any suitable method, including through a rotor motor (e.g., electric motor, pneumatic motor, or otherwise) or sympathetic movement of a nearby magnetic source (e.g., another rotating magnet or changing magnetic field). A source of rotational power can be directly or indirectly coupled to a magnetic rotor to rotate the magnetic rotor. The axis of rotation of each magnetic rotor 116A-G may be in any suitable direction. In the embodiment illustrated in FIG. 2, each magnetic rotor 116A-G has an axis of rotation that is approximately parallel to a lateral width of the metal substrate 104 and approximately perpendicular to a.
longitudinal axis (e.g., length) of the metal substrate 104 or approximately perpendicular to the processing direction 114 of the processing line 100. Approximately perpendicular can include perpendicular or within 1", 2', 3", 4', 5 , 60, 70, 8', 9", or 10' of perpendicular, or similar, as appropriate.
100331 Each magnetic rotor 116A-G may include one or more magnetic sources, such as electromagnets or permanent magnets. Rotational movement of a particular magnetic rotor causes its magnet source(s) to induce a moving or changing magnetic field adjacent the magnetic rotor through which the metal substrate 104 can pass. A.s the metal substrate 104 passes through die changing magnetic field generated by a rotating magnetic rotor, eddy currents can be generated or induced in the metal substrate 104. These eddy currents can thus heat the metal substrate 104 as they flow through the resistance of the metal substrate.
Additionally or alternatively, eddy currents generated in the metal substrate 104 can create SUBSTITUTE SHEET (RULE 26) magnetic fields that oppose the magnetic fields from the magnetic rotors, thus creating a repulsion that can be used to levitate the metal substrate 104.
[00341 Levitation can likewise be achieved with other types of heating devices 134 (or non-heating devices) as desired, and the force used to levitate the metal substrate 104 need not be a magnetic force. As non-limiting examples, gas directed from one or more hot gas devices on to the metal substrate may be used to heat and/or levitate the metal substrate 104 as the metal substrate passes over the hot gas device(s), and/or at least one electromagnet or electro-permanent magnet with an alternating current flowing through it may produce magnetic levitation due to oscillating electromagnetic fields and/or may produce heat in the metal substrate 104 due to eddy currents.
[00351 As mentioned, the looper 132 of the heating apparatus 102 is between the entrance 128 and the exit 130 and imparts the at least one deflection 122 in the metal substrate 104 in the processing direction 114. The looper 132 may be various suitable deflection devices for imparting the at least one deflection 122 in the metal substrate 104 between the entrance 128 and the exit 130 of the heating apparatus 102 without contacting the metal substrate 104. As some non-limiting examples, the looper 132 may include one or more electromagnets or elearo-permanent magnets to float the metal substrate 104, one or more nozzles for directing a gas against the metal substrate 104 to float the metal substrate 104, one or more magnetic rotors to float the metal substrate 104, combinations thereof, or other suitable devices as desired. In the embodiment of FIGS. 2-5, the looper 132 includes the magnetic rotors 11613-F;
however, the number of magnetic rotors 116 used as the looper 132 should not be considered limiting. In this embodiment, the magnetic rotors 116B-F may both heat the metal substrate 104 (as the heating devices 134) and impart the deflection 122 in the metal substrate 104 (as the looper 13.2) by applying a magnetic force on the metal substrate 104. In other embodiments, the magnetic rotors of the looper 132 need not heat the metal substrate 104 and may be magnetic rotors separate from those used as heating devices 134.
[00361 As illustrated in FIG. .2, the looper 132 imparts the at least one deflection 122 in the metal substrate 104 in the processing direction 114 by imparting a force on the metal substrate such that a height of the metal substrate 104 downstream from the entrance of the looper 132 is offset from a base height 120 of the pa.ssline of the metal substrate 104, which is the height of the passline of the metal substrate 104 at the entrance 128 and/or the exit 130. In various embodiments, the metal substrate 104 is at the base height 1.20 at both the entrance 128 and the exit 130. While a single deflection 122 is illustrated in FIG. 2, the number of deflections 122 SUBSTITUTE SHEET (RULE 26) should not be considered limiting. As some non-limiting examples, FIGS. 3-5 each illustrate the looper 132 imparting two opposite deflections 122A-B in the metal substrate 104.
Moreover, the direction a the deflection 122 relative to the base height 120 (i.e., upward or downward) should not be considered limiting. As some non-limiting examples, in FIG. 2, the looper 132 imparts a single, upward deflection 122, and FIGS. 3-5 each illustrate the looper 132 imparting a downward deflection 122A and an upward deflection 122B. in embodiments with a plurality of deflections 122, the looper 132 may impart the deflections 122 such that they are symmetrical in the up and down directions, although they need not be in other examples.
[00371 An amplitude of the deflection 122 may be controlled by controlling a vertical position of the at least one magnetic rotor 116 and/or a characteristic of the force that is applied by the at least one magnetic rotor 116 (e.g., magnitude of the force, direction of the force, etc.). In one non-limiting example, the amplitude of the deflection 122 may be controlled by controlling a rotational speed of the magnetic rotor 116 to control a magnitude of the force. Optionally, the direction of rotation, vertical position, and other aspects of the magnetic rotor 116 may be controlled to further control the amplitude of the deflection 122. In some examples, the amplitude of the deflection 122 is fixed. in other embodiments, the amplitude of the deflection 122. is adjustable. When a plurality of magnetic rotors 116 (or other deflection devices) are provided, the force applied by one deflection device on the metal substrate 1.04 may be the same as or different from the force applied by another deflection device on the metal substrate 104. Likewise, when a plurality of magnetic rotors 116 (or other deflection devices) are provided, the forces applied by each deflection device may be fixed or adjustable as desired.
[00381 in various embodiments, the amplitude of the deflection 122 is at least partially controlled by positioning at least one magnetic rotor 116 at a vertical position that is offset from a vertical position of another magnetic rotor 116, which may he a magnetic rotor 116 of the heating devices 134 and/or of the looper 132. As a non-limiting example, in FIG. 2, the magnetic rotor 116B is vertically offset above the magnetic rotor 116A, the magnetic rotor 116C is vertically offset above the magnetic rotor 116B, the magnetic rotor 116D is vertically offset above the magnetic rotor 116C, the magnetic rotor 116E is vertically offset below the magnetic rotor 116D, and the magnetic rotor 116F is vertically offset below the magnetic rotor 116E and vertically offset above the magnetic rotor 1160. in this embodiment, the magnetic rotors 116A and 116G may be vertically aligned and support the metal substrate 104 at the base height 120. As another non-limiting example, in FIG. 3, the magnetic rotors 116E3 and 116C
SUBSTITUTE SHEET (RULE 26) are vertically offset below the magnetic rotors 116A and 116G such that the deflection 122A
is a downward loop, and the magnetic rotors 116D-F are vertically offset above the magnetic rotors 116A and 116G such that the deflection 122B is an upward deflection. In embodiments with a plurality of deflections 122, the amplitude of one deflection 122 need not be the same as the amplitude of another deflection 122. The vertical position of the magnetic rotors 116B-of the looper 132 (or other devices used as the looper 132) may be fixed or may be adjustable via, various suitable devices or mechani sins as desired, in various embodiments, one or more of the magnetic rotors 116B-F of the looper 132 is vertically adjustable such that a vertical position of the metal substrate 104 downstream from the entrance of the looper 132 is adjustable relative to the base height 120. In some embodiments, one or more magnetic rotors 116B-F may be vertically adjustable such that a weight of the metal substrate 104 remains equally supported by each magnetic rotor 116B-F and/or such that the heating power generated in the metal substrate 104 is equally distributed even if there are disturbances in speed and/or length of the metal substrate. in some embodiments, one or more magnetic rotors I 16B-F may be vertically adjustable such that a weight of the metal substrate 104 is not equally supported creating tension or compression in the processing direction of the metal substrate.
[00391 Referring to FIGS. 2 and 3, in some embodiments, the processing line 100 is controlled (e.g., by the controller 118) such that time-changes in tension in the metal substrate 104 in the heating apparatus 102 are minimized or eliminated by the looper 132. In these examples, control of the processing line 100 may include imparting a single deflection 122 (e.g., FIG. 2) or a plurality of deflections 122A-B (e.g., FIG. 3) in the metal substrate 104 via the looper 132.
Control of the processing line 100 to minimize or eliminate time-changes in tension may include controlling (e.g., maintaining, increasing, or decreasing) the speed of the metal substrate 104 at the entrance 128 by controlling the processing equipment 106 and/or controlling the speed of the metal substrate 104 at the exit 130 by controlling the processing equipment 108 such that the amplitude of the deflection 122 or the deflections 122A-B is maintained. Additionally or alternatively, one or more of the magnetic rotors 1 16B--F may optionally be vertically adjusted such that the amplitude of the deflection 122 or the dell egti ons 122A-B is maintained and/or such that the strip tension is maintained. In some of these examples, controlling (or varying) the speed of the metal substrate 104 at the entrance 128 and/or the exit 130 allows for changes in tension to be absorbed by the amplitude of the deflection 122 or the deflections 122A-B.

SUBSTITUTE SHEET (RULE 26) [00401 Referring to FIGS. 4 and 5, in various embodiments, the processing line '100 is controlled (e.g., by the controller 118) such that the tension in the metal substrate 104 in the heating apparatus 102 is actively controlled or adjusted as desired. In these examples, control of the processing line 100 may include imparting a single deflection or a plurality of deflections 122.A-B in the metal substrate 104 via the looper 132, and controlling the speed of the metal substrate '104 at the entrance 128 by controlling the processing equipment 106 and/or controlling the speed of the metal substrate, 104 at the exit 130 by C011 troll ing the processing equipment 108 such that the speed of the metal substrate 104 is maintained. In these examples, a change in the amplitude of the deflection 122 or the deflections 122A-B due to thermal expansion, creep, etc. may change the tension in the metal substrate 104.
Additionally or alternatively, one or more of the magnetic rotors 116B-F may optionally be vertically adjusted such that the amplitude of the deflection 122 or the deflections 122A.-.13 is actively adjusted by the looper 132 and/or the tension is actively changed.
[00411 FIG. 4 illustrates a non-limiting example where the looper 132 is controlled such that the metal substrate 104 has increased tension (represented by arrows 424A-B).
In FIG. 4, the amplitudes of the deflections 122A-B is decreased compared to the amplitudes of the deflections 122A-B in FIG 3 where the looper was controlled to minimize or eliminate any changes in tension.
[00421 FIG. 5 illustrates another non-limiting example where the looper 132 is controlled such that the metal substrate 104 has decreased tension (represented by arrows 526.A-B). In FIG. 5, the amplitudes of the deflections 122A-B is increased compared to the amplitudes of the deflections 122A-B in FIG. 3 where the looper was controlled to minimize or eliminate any changes in tension.
[00431 FIG. 6 illustrates a looper 632 that is substantially similar to the looper 132 and includes a plurality of magnetic rotors 11.6A-C. Similar to the looper 132, other devices or mechanisms may be utilized in addition to or in place of the magnetic rotors 116A-C as desired with the looper 632. Compared to the looper 132, the looper 632 is not provided within a heating apparatus and is provided between processing equipment. In other embodiments, the looper 632 may be provided within a heating apparatus. Compared to the looper 132, one of the magnetic rotors of the looper 632 (magnetic rotor 116B) is provided above the passline of the metal substrate 104 and the other magnetic rotors are provided below the passline of the metal substrate 104. This pattern of magnetic rotors 116A.-C imparts one deflection 122B in the metal substrate 104 relative to the metal positions 122A and 122C as the metal substrate SUBSTITUTE SHEET (RULE 26) passes through the looper 632. The metal positions 122A and 122C may be dell ecti OTIS that are vertically offset from the passible of the metal substrate 104 at the upstream processing equipment and/or the downstream processing equipment, although in other embodiments the metal positions 122A and 122C need not be vertically offset from the passline.
Various other patterns of magnetic rotors above and/or below the passline of the metal substrate 104 may be utilized as desired and/or to impart deflections in the metal substrate as desired.
[00441 FIG. 7 illustrates a looper 732 that is substantially similar to the looper 132 and includes a plurality of magnetic rotors 116A-H. Similar to the looper 132, other devices or mechanisms may be utilized in addition to or in place of the magnetic rotors 116A-C as desired with the I ooper 732. Compared to the I ooper 132, which fully supports the metal substrate 104 within the looper, the looper 732 does not fully support the metal substrate 104 within the looper 732, meaning that along the length of the looper 132, there are areas that do not levitate the metal substrate 104. In the embodiment illustrated, the gap between the magnetic rotor 116D and the magnetic rotor 116D leaves a portion 731 of the metal substrate 104 unsupported, and the unsupported portion 731 (e.g., portion forming a catenary) and forms the deflection 122. The amplitude of the deflection 122 may be controlled via similar mechanisms as discussed previously (e.g., vertical position, magnitude of the force, etc.), and the size of the deflection 122 in the processing direction may be controlled by adjusting the size of the gap between adjacent magnetic rotors 116 (or other levitation devices) of the looper 732.
[00451 The loopers described herein may allow for various types of control of the metal substrate.
[00461 As one non-limiting example, the loopers may not provide active tension control, in these embodiments, the co tactless loopers may apply a force on the metal substrate, which may increase when the gap between a magnetic rotor or other suitable deflection device and the metal substrate decreases. In these embodiments, the apparent stiffness of the metal substrate in the processing direction may become smaller than the stiffness of the material, and disturbances of process condi ti OTIS (e.g., entry and exit speeds, thermal expansion or contraction, etc.) may induce less tension variation compared to no looper.
[00471 In another non-limiting example, the lowers described herein may provide control of the metal substrate using any adequate type of control method. As a non-limiting example, the loopers may allow for control of variables including, but not limited to, the tension, the amplitude of the deflection, and/or measured variables (e.g., motor power) and/or non-SUBSTITUTE SHEET (RULE 26) measured variables (e.g., mass flow, decoupled states, etc.). In such embodiments, the looper may include one or more sensors including but not limited to an amplitude sensor, a vertical position sensor, a tension meter/sensor, a tension model, a sensor that measures of the load of the levitation devices, a motor load sensor, a loop current sensor, a fluid flow rate sensor, combinations thereof, or other sensors as desired. These sensors may provide actual, measured, or estimated values of one or more controlled variables. A controller or other suitable operator may compare the controlled values with target values, and the controller may change the value of one or more actuators such that the controlled values match the target values. Actuators may include but are not limited to the entry speed, the exit speed, the vertical position of the deflection, and/or other characteristics of the levitation devices (e.g., rotor speed, coil frequency, fluid flow pressure).
[00481 As another non-limiting example, the loopers described herein may allow for control of the amplitude of the deflection. In such embodiments, the levitation gap between the metal substrate and the levitation devices may be calculated to correspond to a given strip tension, and the entry speed and/or the exit speed may be controlled such that the actual amplitude of the deflection matches the target amplitude.
[00491 As a further non-limiting example, the loopers described herein may allow for control of estimated tension in the metal substrate by controlling the entry speed and/or the exit speed of the metal substrate and/or the levitation gap between the metal substrate and the levitation devices.
[0050l Various other control of the tension in the metal substrate 104 or other variables of the metal substrate 104 may be achieved by controlling the processing equipment 106, the processing equipment 108, and/or the looper 132 as desired.
Illustrations [00511 A collection of exemplary embodiments are provided below, including at least some explicitly enumerated as "Illustrati ons" providing additional description of a variety of example embodiments in accordance with the concepts described herein. These illustrations are not in cant to be mutual ly exclusive, exhaustive, or restrictive; and the disclosure not limited to these example illustrations but rather encompasses all possible modifications and variations within the scope of the issued claims and their equivalents.

SUBSTITUTE SHEET (RULE 26) 100521 Illustration 1. A heating apparatus comprising: an entrance; an exit, wherein the heating apparatus is configured to receive a metal substrate moving in a processing direction from the entrance to the exit and heat the metal substrate; and a looper between the entrance and the exit, wherein the looper is configured to impart a deflection along the processing direction in a metal substrate such that a height of the metal substrate downstream from the entrance of the looper is offset from a height of the metal substrate at the entrance of the looper.
[00531 Illustration 2. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device imparts a vertical force in the metal substrate that does not balance a weight of the metal substrate such that a portion of the metal substrate downstream from die en trance of the looper forms a.
catenary.
[00541 Illustration 3. The contactless looper of any preceding or subsequent illustrations or combination of illustrations; wherein the at least one deflection device comprises a first deflection device and a second deflection device, wherein the first deflection device is configured to impart a first force on the metal substrate, and wherein the second deflection device is configured to impart a second force on the metal substrate that is different from the first force.
[00551 Illustration 4. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the force from the at least one deflection device is adjustable.
[00561 Illustration 5. The comactless looper of any preceding or subsequent illustrations or combination of illustration.s, wherein the at least one deflection device comprises a magnetic rotor, and wherein a magnitude of the force from the at least one deflection device is adjustable by varying a rotational speed of the magnetic rotor.
[00571 Illustration 6. The conta.ctiess looper of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device is further configured to heat the metal substrate while imparting the deflection.
[00581 Illustration 7. The conta.ctless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the contactless looper is configured to control at least one of an amplitude of the deflection or a tension in the metal substrate.
[00591 Illustration 8. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the contactless looper is configured to control the amplitude of the deflection by actuating the deflection force.
SUBSTITUTE SHEET (RULE 26) 10060i Illustration 9. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the contactless looper is configured to control the deflection force by actuating at least one of a size of a gap between the deflection device and the metal substrate, a magnitude of the deflection force, a vertical position of the deflection device, or a rotational speed of a. magnetic rotor.
[00611 Illustration 10. The heating apparatus of any preceding or subsequent illustrations or combination of illustrations, wherein the looper is configured to impart the deflection in the metal substrate without contacting the metal substrate.
[00621 Illustration 11. The heating apparatus of any preceding or subsequent illustrations or combination of illustrations, wherein the deflection is a first deflection, and wherein the looper is configured to impart a plurality of deflections in the processing direction in the metal substrate.
[00631 Illustration 1.2, The heating apparatus of any preceding or subsequent illustrations or combination of illustrations, further comprising: a plurality of magnetic rotors, wherein each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate, wherein the plurality of magnetic rotors are configured to levitate the metal substrate moving in the processing direction, and wherein the looper comprises at least one magnetic rotor of the plurality of magnetic rotors.
[00641 Illustration 13. The heating apparatus of any preceding or subsequent illustrations or combination of illustrations, wherein a vertical position of the at least one magnetic rotor of the looper is offset from a vertical position of another magnetic rotor of the plurality of magnetic rotors.
[00651 Illustration 14. The heating apparatus of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one magnetic rotor of the looper is vertically adjustable such that the height of the metal substrate downstream from the entrance of the looper is vertically adjustable.
[00661 Illustration 15. The heating apparatus of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one magnetic rotor of the looper is a first magnetic rotor, wherein the looper further comprises a second magnetic rotor of the plurality of magnetic rotors, and wherein a vertical position of the first magnetic rotor is offset from a vertical position of the second magnetic rotor.

SUBSTITUTE SHEET (RULE 26) [0067] illustration 16. A processing line for a metal substrate, the processing line comprising a heating apparatus configured to heat the metal substrate moving in a processing direction, the heating apparatus comprising: an entrance; an exit; and a looper between the entrance and the exit, wherein the heating apparatus defines a pa.ssline from the entrance to the exit for the metal substrate, wherein the entrance defines a base height of the pa.ssline; and wherein the looper vertically offsets the passiine such that a height of the passline downstream from the entrance of the looper is offset from the base height.
[00681 Illustration 17. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller, wherein the controller is configured to control at least one of an amplitude of die deflection or tension in the metal substrate by actuating at least one of a line speed of the metal substrate or the deflection force.
[00691 Illustration 18. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the at least one deflection device, wherein the controller is configured to control an amplitude of the deflection of the metal substrate by actuating one of at least: a gap between the metal substrate and the at least one deflection device, a magnitude of the deflection force exerted by at least one deflection device of the looper on the metal substrate.
[00701 illustration 19. The processing line of any preceding or subsequent illustrations or combination of illustrations wherein the line speed of the metal substrate at the at least one of the en trance or the exit of the contactless looper is either maintained or controlled.
[00711 Illustration 20. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the at least one deflection device, wherein the controller is configured compensate for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate occuning between die entrance and the exit by actuating one of at least:
an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.
[00721 illustration 21. The processing line of any preceding or subsequent illustrations or combination of illustrations wherein the line speed of the metal substrate at the at least one of the entrance or the exit of the contactless looper is either maintained or controlled.

SUBSTITUTE SHEET (RULE 26) 10073i Illustration 22. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the at least one deflection device, wherein the controller is configured to control the tension in the metal substrate by actuating one of at least: an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, a magnitude of the deflection force exerted by at least one deflection device of the looper on the metal substrate.
[00741 Illustration 23. The processing line of any preceding or subsequent illustrations or combination of illustrations wherein the line speed of the metal substrate at the at least one of the en trance or the exit of the contactless looper is either maintained or controlled.
100751 Illustration 24. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising: a first piece of processing equipment upstream from the heating apparatus, wherein the first piece of processing equipment is configured to contact the metal substrate immediately upstream from the heating apparatus;
and a second piece of processing equipment downstream from the heating apparatus, wherein the second piece of processing equipment is configured to contact the metal substrate immediately downstream from the heating apparatus, wherein the looper is configured to vertically offset the passline without contacting the metal substrate.
[00761 Illustration 25. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the first piece of processing equipment and the second piece of processing equipment, Wherein the controller is configured to selectively: decrease an amount by which the height of the passible downstream from the entrance of the looper is offset from the base height by at least one of decreasing a line speed of the metal substrate at the first piece of processing equipment or increasing a line speed of the metal substrate at the second piece of processing equipment; and increase the amount by which the height of the passible downstream from the entrance of the looper is offset from the base height by at least one of increasing the line speed of the metal substrate at the first piece of processing equipment or decreasing the line speed of the metal substrate at the second piece of processing equipment.
[00771 Illustration 26. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein at least one of a vertical position of the deflection device SUBSTITUTE SHEET (RULE 26) or a deflection force exerted by a deflection device on the metal substrate is maintained or controlled.
[00781 Illustration 27. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the first piece of processing equipment and the second piece of processing equiprnent, wherein the controller is configured to compensate for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate occurring between the upstream and downstream processing equipment, wherein the controller is configured to actuate at least one of a line speed of the metal substrate at the first piece of processing equipment or a line speed of the metal substrate at -the second piece of processing equipment.
[00791 Illustration 28. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein at least one of a vertical position of the deflection device or a deflection force exerted by a deflection device on the metal substrate is maintained or con troll ed.
[00801 Illustration 29. The processing line of any preceding or subsequent illustrations or combination of illustrations; further comprising a controller communicatively coupled to the first piece of processing equipment and the second piece of processin.g equipment, wherein the controller is configured to selectively: increase the tension in the metal substrate by at least one of decreasing a line speed of the metal substrate at the first piece of processing equipment or increasing a line speed of the metal substrate at the second piece of processing equipment; and decrease the tension in the metal substrate by at least one of increasing a line speed of the metal substrate at the first piece of processing equipment or decreasing a line speed of the metal substrate at the second piece of processing equipment.
[00811 Illustration 30, The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein at least one of a vertical position of the deflection device or the deflection force exerted by a deflection device on the metal substrate is maintained or controlled.
[00821 Illustration 31. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein the looper comprises at least one ma.gnetic rotor, wherein the at least one magnetic rotor is rotatable about an axis that is perpendicular to the processing SUBSTITUTE SHEET (RULE 26) direction and parallel to a lateral width of the metal substrate, and wherein the at least one magnetic rotor is configured to levitate the metal substrate moving in the processing direction [00831 Illustration 32. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein the heating apparatus further comprises:
a plurality of magnetic rotors, wherein, each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate, wherein the plurality of magnetic rotors are configured to levitate and heat the metal substrate moving in the processing direction, and wherein the looper comprises at least one magnetic rotor of the plurality of magnetic rotors.
[00841 Illustration 33. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one magnetic rotor of the looper is vertically' adi u stable.
[00851 illustration 34. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein a height of the at least one magnetic rotor of the looper is vertically offset from another magnetic rotor of the plurality of magnetic rotors, and wherein the height of the at least one magnetic rotor of the looper is fixed.
[00861 illustration 35. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein a magnitude of a force exerted by at least one magnetic rotor of the looper on the metal substrate is adjusted by varying the rotational speed of the rotor.
[00871 Illustration 36. A method of processing a metal substrate moving in a processing direction. with a heating apparatus, the method comprising: receiving the metal substrate at an entrance of the heating apparatus along a passline; heating the metal substrate downstream from the entrance; imparting a deflection in the metal substrate with a looper as the metal substrate is moving in the processing direction, wherein the deflection is in the processing direction; and passing the metal substrate out the exit of the heating apparatus.
[00881 Illustration 37. The method of any preceding or subsequent illustrations or combination of illustrations, wherein: the heating apparatus comprises a plurality of magnetic rotors: each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate;
the plurality of magnetic rotors are configured to levitate and heat the metal substrate moving in the processing direction; the looper comprises at least one magnetic rotor of the plurality of magnetic rotors; heating the metal substrate comprises heating the metal substrate with the at SUBSTITUTE SHEET (RULE 26) least one magnetic rotor of the looper; and imparting the deflection comprises imparting the deflection with the at least one magnetic rotor of the looper.
[00891 Illustration 38. The method of any preceding or subsequent illustrations or combination of illustrations, wherein imparting the deflection in the metal substrate comprises imparting the deflection without contacting the metal substrate.
[00901 Illustration 39. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising controlling tension in the metal substrate by controlling an amplitude of the deflection while maintaining a line speed of the metal substrate at the entrance and at the exit of the heating apparatus.
[00911 Illustration 40. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising controlling an amplitude of the deflection of the metal substrate by actuating one of at least: a gap between the metal substrate and the deflection device; or a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.
[00921 Illustration 41. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising maintaining or controlling a line speed of the metal substrate at the at least one of the entrance or the exit of the contactless looper.
[0093] illustration 42. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising compensating for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate occurring between the entrance and the exit by actuating one of at least: an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, or a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.
[00941 illustration 43. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising maintaining or controlling a line speed of the metal substrate at the at least one of the entrance or the exit of the contactless looper.
[0095] illustration 44. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising controlling tension in the metal substrate by actuating one of at least: an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.

SUBSTITUTE SHEET (RULE 26) 10096i Illustration 45. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising maintaining or controlling a line speed of the metal substrate at the at least one of the entrance or the exit of the contactless looper.
100971 Illustration 46. The method of any preceding or subsequent illustrations or combination of illustrations, wherein imparting the deflection comprises:
providing a magnetic rotor that is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate; positioning the magnetic rotor with the axis at a vertical position such that the height of the passible downstream from the entrance of the looper is offset from a height of the passible at the entrance of the heating apparatus;
and rotating the magnetic rotor about the axis such that the metal substrate is levitated while passing adjacent to the magnetic rotor.
[00981 Illustration 47. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising controlling a heating profile in the metal substrate by controlling an amplitude of the deflection while maintaining the vertical position of the axis of the magnetic rotor, wherein controlling the amplitude comprises at least one of decreasing an amount by which the height of the passline downstream from the entrance of the looper is offset from the height of the passible at the entrance by at least one of decreasing a line speed of the metal substrate at the entrance or increasing a line speed of the metal substrate at the exit; or increasing the amount by which the height of the passible downstream from the entrance of the looper is offset from the height of the passible at the entrance by at least one of increasing the line speed of the metal substrate at the entrance or decreasing the line speed of the metal substrate at the exit.
[00991 Illustration 48. A contactiess looper comprising: an entrance; an exit, wherein the contactless looper is configured to receive a metal substrate moving in a processing direction from the entrance to the exit; and at least one deflection device between the entrance and the exit, wherein the at least one deflection device is configured to impart a force in a metal substrate without contacting the metal substrate resulting in a deflection along the processing direction in the metal substrate such that a position of the metal substrate downstream from the entrance of the looper is vertically offset from a position of the metal substrate at the entrance of the looper.
[01001 Illustration 49. The contactiess looper of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device imparts a vertical force SUBSTITUTE SHEET (RULE 26) in the metal substrate that does not balance the weight of the metal substrate such that a portion of the metal substrate downstream from the entrance of the looper forms a catenary.
[01011 illustration 50, The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device comprises a first deflection device and a second detledi on device, wherein the first deflection device is configured to impart a first force on the metal substrate, and wherein the second deflection device is configured to impart a second force on the metal substrate that is different from the first force.
[01021 illustration 51. The contactlesslooper of any preceding or subsequent illustrations or combination of illustrations, wherein the force from the at least one deflection device is adjustable.
[0103] Illustration 52. The contactiess looper of any preceding or subsequent illustrations or combinati Oil of illustrations. wherein the at least one defieciion device comprises a magnetic rotor, and wherein a magnitude of the force from the at least one deflection device is adjustable by varying the rotational speed of the magnetic rotor.
[01041 Illustration 53. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device is further configured to heat the metal substrate while imparting the deflection.
[01051 illustration 54. The con-tactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the contactless looper is within a heating apparatus.
[01061 Illustration 55. The contacdess looper of any preceding or subsequent illustrations or combination of illustrations, wherein the deflection is a first deflection, and wherein the looper is configured to impart a plurality of deflections in the processing direction in the metal substrate.
[01071 Illustration 56. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein: the at least one deflection device comprises a plurality of magnetic rotors; each magnetic rotor of the plurality of in a.gn.etic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate; and the plurality of magnetic rotors are configured to levitate the metal substrate moving in the processing direction by providing the force to the metal substrate.

SUBSTITUTE SHEET (RULE 26) 101081 Illustration 57. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein a vertical position of at least one magnetic rotor of the plurality of magnetic rotors is offset from a vertical position of another magnetic rotor of the plurality of magnetic rotors.
[01091 Illustration 58. The contactless looper of any preceding or subsequent illustrations or combination of illustrations.: where a first magnetic rotor of the plurality of magnetic rotors imparts a first force on the metal substrate, and wherein a second magnetic rotor of the plurality of magnetic rotors imparts a second force on the metal substrate that is different from the first force.
[01101 Illustration 59. The contactless looper of claim 4, wherein at least one magnetic rotor of the plurality of magnetic rotors is vertically adjustable such that the position of the metal substrate downstream from the entrance of the looper is vertically adjustable.
[01111 Illustration 60. The contacd ess looper of any preceding or subsequent illustrations or combination of illustrations, wherein a first magnetic rotor of the plurality of magnetic rotors imparts a first force on the metal substrate, and wherein the first force is adjustable.
[01121 Illustration 61. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the plurality of magnetic rotors comprises a first magnetic rotor and a second magnetic rotor, and wherein a vertical position of the first magnetic rotor is offset from a vertical position of the second magnetic rotor.
[01131 Illustration 62.. A processing line for a metal substrate, the processing line comprising a contactless looper configured to impart a deflection in the metal substrate moving in a processing direction without contacting the metal substrate; the contactless looper comprising:
an entrance; an exit; and at least one deflection device between the entrance and the exit, wherein the ci-mtactiess looper defines a passlin.e from the entrance to the exit for the metal substrate, wherein the entrance defines a base height of the passline, and wherein the looper vertically offsets the passible such that a position of the passline at the at least one deflection device is offset from the base height.
[01141 Illustration 63. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising: a first piece of processing equipment upstream from the contactless looper, wherein the first piece of processing equipment is configured to contact the metal substrate upstream from the contactless looper: and a second piece of processing equipment downstream from the contactless looper, wherein the second piece of SUBSTITUTE SHEET (RULE 26) processing equipment is configured to contact the metal substrate downstream from the contactless looper.
[01151 illustration 64. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the first piece of processing equipment and the second piece of processing equipment, wherein the controller is configured to selectively: decrease an amount by which the height of the passlin.e downstream from the entrance of the looper is offset from the base height by at least one of decreasing a line speed of the metal substrate at the first piece of processing equipment or increasing a line speed of the metal substrate at the second piece of processing equipment; and increase the amount by which the height of the passline downstream from the entrance of the looper is offset from the base height by at least one of increasing the line speed of the metal substrate at the first piece of processing equipment or decreasing the line speed of the metal substrate at the second piece of processing equipment.
[01161 illustration 65. The processing device of any preceding or subsequent illustrations or combination of illustration.s, wherein the at least one deflection device comprises a magnetic rotor, and wherein a vertical position of an axis of the magnetic rotor and a rotational speed of the magnetic rotor are maintained.
[01171 illustration 66. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the first piece of processing equipment and the second piece of processing equipment, wherein the controller is configured to compensate for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate occurring between the upstream and downstream processing equipment, wherein the controller is configured to control at least one of a line speed of the metal substrate at the first piece of processing equipment or a line speed of the metal substrate at the second piece of processing equipment.
[01181 Illustration 67. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device comprises a magnetic rotor, and wherein a vertical position of an axis of the magnetic rotor and a rotational speed of the magnetic rotor are main tai ned.
[01191 Illustration 68. The processing line of any preceding or subsequent illustrations or combination of illustrations, further comprising a controller communicatively coupled to the SUBSTITUTE SHEET (RULE 26) first piece of processing equipment and the second piece of processing equipment, wherein the controller is configured to selectively: increase the tension in the metal substrate by at least one of decreasing a line speed of the metal substrate at the first piece of processing equipment or increasing a line speed of the metal substrate at the second piece of processing equipment; and decrease the tension in the metal substrate by at least one of increasing a line speed of the metal substrate at the first piece of processing equipment or decreasing a line speed of the metal substrate at the second piece of processing equipment.
[01201 11 ustration 69. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device comprises a magnetic rotor, and wherein a vertical position of an. axis of the magnetic rotor and a rotational speed of the magnetic rotor are maintained.
[01211 Illustration 70. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device of the I ooper comprises at least one magnetic rotor, wherein the at least one magnetic rotor is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate, and wherein the at least one magnetic rotor is configured to levitate the metal substrate moving in the processing direction by providing a force to the metal substrate.
[01221 Illustration 71. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein: the at least one deflection device of the looper comprises a plurality of magnetic rotors; each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate; and the plurality of magnetic rotors are configured to levitate and heat the metal substrate moving in the processing direction.
[01231 Illustration 72. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein at least one magnetic rotor of the looper is vertically adjustable.
[0124] Illustration 73. The processing line of any preceding or subsequent illustrations or combination of illustrations, wherein a height of at least one magnetic rotor of the looper is vertically offset from another magnetic rotor of the plurality of magnetic rotors, and wherein the height of the at least one magnetic rotor of the looper is fixed.
[01251 Illustration 74. A method of processing a metal substrate moving in a processing direction with a contactless looper, the method comprising: receiving the metal substrate at an SUBSTITUTE SHEET (RULE 26) entrance of the contactless looper along a passline; imparting a deflection in the metal substrate with the looper as the metal substrate is moving in the processing direction and without contacting the metal substrate, wherein the deflection is in the processing direction; and passing the metal substrate out an exit of the contactless looper.
[01261 Illustration 75. The method of any preceding or subsequent illustrations or combination of illustrations, wherein: the looper comprises a plurality of magnetic rotors: each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate; the plurality of magnetic rotors are configured to levitate the metal substrate moving along the processing direction by providing a. three to the metal substrate; and imparting the deflection comprises imparting the deflection with at least one magnetic rotor of the looper.
[01271 Illustration 76. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising heating the metal substrate while imparting the deflection.
[01281 Illustration 77. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising control ling tension in the metal substrate by controlling a gap between the metal substrate and the at least one deflection while maintaining a line speed of the metal substrate at the entrance and at the exit of the co/gad ess looper.
[01291 Illustration 78. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising controlling tension in the metal substrate by controlling a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate while maintaining a line speed of the metal substrate at the entrance and at the exit of the contadless looper.
[01301 Illustration 79. The method of any preceding or subsequent illustrations or combination of illustrations, wherein the at least one deflection device comprises a magnetic rotor, and wherein the magnitude of a force exerted by at least one magnetic rotor of the looper on the metal substrate is adjusted by varying the rotational speed of the rotor.
[01311 Illustration 80. The method of any preceding or subsequent illustrations or combination of illustrations, wherein imparting the deflection comprises:
providing a magnetic rotor that is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate, offsetting a vertical position of the pa ssli 11C downstream from the entrance of the looper relative to a vertical position of the passline at the entrance of SUBSTITUTE SHEET (RULE 26) the contactless looper by at least one of: positioning the magnetic rotor such that an axis of the magnetic rotor is at the offset vertical position; or selecting a magnitude of a force exerted by the magnetic rotor on the metal substrate; and rotating the magnetic rotor about the axis such that the metal substrate is levitated while passing adjacent to the magnetic rotor.
[01321 Illustration 81, The method of any preceding or subsequent illustrations or combination of illustrations, wherein the selection of a magnitude of a force exerted by the magnetic rotor on the metal substrate is achieved by varying the rotational speed of the rotor.
[01331 Illustration 82. The method of any preceding or subsequent illustrations or combination of illustrations; further comprising controlling an amp I i nide of the deflection while maintaining the vertical position of the axis of the magnetic rotor and the rotational speed of the magnetic rotor, wherein controlling, the amplitude comprises at least one of: decreasing an amount by which the height of the passline downstream from the entrance of the looper is offset from the height of the passline at the entrance by at least one of decreasing a line speed of the metal substrate at the entrance or increasing a line speed of the metal substrate at the exit; or increasing the amount by which the height of the passline downstream from the entrance of the looper is offset from the height of the passline at the entrance by at least one of increasing the line speed of the metal substrate at the entrance or decreasing the line speed of the metal substrate at the exit.
[01341 Illustration 83. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising controlling an amplitude of the deflection by at least one of: decreasing an amount by which the vertical position of the passline downstream from the en trance of the looper is offset from a base height of the passline at the entrance by at least one of decreasing a line speed of the metal substrate at the entrance or increasing a line speed of the metal substrate at the exit; or increasing the amount by which the veitical position of the passline downstream from the entrance of the looper is offset from the base height of the passline at the entrance by at least one of increasing the line speed of the metal substrate at the entrance or decreasing the line speed of the metal substrate at the exit, [01351 Illustration 84. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising controlling at least one of an amplitude of the deflection or tension in the metal substrate by actuating at least one of a line speed of the metal substrate or the deflection force.

SUBSTITUTE SHEET (RULE 26) [0136] Illustration 85. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising at least one of: decreasing an amount by which the vertical position of the passline downstream from the entrance of the looper is offset from a base height of the passline by at least one of decreasing a line speed of the metal substrate at the entrance of the contactless looper or increasing a line speed of the metal substrate at the exit of the contactless looper; or increasing the amount by which the vertical position of the passline downstream from the entrance of the looper is offset from the base height by at least one of increasing the line speed of the metal substrate at the entrance of the contactiess looper or decreasing the line speed of the metal substrate at the exit of the contactless looper.
[01371 Illustration 4864. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising at least one of maintaining or controlling at least one of a vertical position of the deflection device of the looper or the deflection force exerted by the deflection device on the metal substrate.
[01381 illustration 87. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising compensating for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate courting between the entrance and the exit by actuating at least one of a line speed of the metal substrate at the entrance of the contactless looper or a line speed of the metal substrate at the exit of the contactless looper.
[01391 Illustration 88. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising at least one of controlling or maintaining at least one of a vertical position of a deflection device of the looper or the deflection force exerted by the deflection device on the metal substrate.
[01401 illustration 89. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising at least one of: increasing tension in the metal substrate by at least one of decreasing a line speed of the metal substrate at the entrance of the contactless looper or increasing a line speed of the metal substrate at the exit of the contactless looper, or decrease tension in the metal substrate by at least one of increasing a line speed of the metal substrate at the entrance of the contactless looper or decreasing a line speed of the metal substrate at the exit of the contactless looper.
[01411 Illustration 90. The method of any preceding or subsequent illustrations or combination of illustrations, further comprising at least one of maintaining or controlling at SUBSTITUTE SHEET (RULE 26) least one of a vertical position of a deflection device of the looper or the deflection force exerted by the deflection device on the metal substrate.
[01421 Illustration 91. A contactless looper comprising at least one deflection device, wherein the contactless looper is configured to receive a metal substrate moving in a processing direction, wherein the at least one deflection device is configured to impart a deflection force in a metal substrate without contacting the metal substrate resulting in a vertical deflection along the processing direction in the metal substrate, wherein the force from the at least one deflection device is adjustAle.
[01431 Illustration 92. The contactless looper of any preceding or subsequent illustrations or combination of illustrations, wherein the force for the at least one deflection device is adjustable by actuating at least one of a size of a gap between the deflection device and the metal substrate, [01441 The above-described aspects are merely possible examples of implementations, merely set forth for a clear understanding of the principles of the present disclosure. Many variations and modifications may be made to the above-described embodiment(s) without departing substantially from the spirit and principles of the present disclosure. All such modifications and variations are intended to be included herein within the scope of the present disclosure, and all possible claims to individual aspects or combinations of elements or steps are intended to be supported by the present disclosure. Moreover, although specific terms are employed herein, as well as in the claims that follow, they are used only in a generic and descriptive sense, and not for the purposes of limiting the described embodiments, nor the claims that follow.
SUBSTITUTE SHEET (RULE 26)

Claims

WO 2022/221807 PCT/US2022/071299That which is claimed:

1. A contactless looper comprising:
an entrance;
an exit, wherein the contactless looper is configured to receive a metal substrate moving in a processing direction from the entrance to the exit; and at least one deflection device between the entrance and the exit, wherein the at least one deflection device is configured to impart a deflection force in a metal substrate without contacting the metal substrate resulting in a deflection along the processing direction in the metal substrate such that a position of the metal substrate downstream from the entrance of the looper is vertically offset from a position of the metal substrate at the entrance of the looper.

2. The contactless looper of claim 1, wherein the at least one deflection device imparts a vertical force in the metal substrate that does not balance a weight of the metal substrate such that a portion of the metal substrate downstream from the entrance of the looper forms a catenary.

3. The contactless looper of claim 1, wherein the at least one deflection device comprises a first deflection device and a second deflection device, wherein the first deflection device is configured to impart a first force on the metal substrate, and wherein the second deflection device is configured to impart a second force on the metal substrate that is different from the first force.

4. The contactless looper of claim 1, wherein the force from the at least one deflection device is adjustable.

5. The contactless looper of claim 4, wherein the at least one deflection device comprises a magnetic rotor, and wherein a magnitude of the force from the at least one deflection device is adjustable by varying a rotational speed of the magnetic rotor.

SUBSTITUTE SHEET (RULE 26)

6. The contactless looper of claim 1, wherein the contactless looper is configured to control at least one of an amplitude of the deflection or a tension in the metal substrate.

7. The contactless looper of claim 1, wherein the contactless looper is configured to control the deflection force by actuating at least one of a size of a gap between the deflection device and the metal substrate, a magnitude of the deflection force, a vertical position of the deflection device, or a rotational speed of a magnetic rotor.

8. The contactless looper of claim 1, wherein:
the at least one deflection device comprises a plurality of magnetic rotors;
each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate; and the plurality of magnetic rotors are configured to levitate the metal substrate moving in the processing direction by providing a deflection force to the metal substrate.

9. A processing line for a metal substrate, the processing line comprising a contactless looper configured to impart a deflection in the metal substrate moving in a processing direction without contacting the metal substrate, the contactless looper comprising:
an entrance;
an exit; and at least one deflection device between the entrance and the exit, wherein the contactless looper defines a passline from the entrance to the exit for the metal substrate, wherein the entrance defines a base height of the passline, and wherein the looper vertically offsets the passline such that a position of the passline at the at least one deflection device is offset from the base height.

10. The processing line of claim 9, further comprising a controller communicatively coupled to the at least one deflection device, wherein the controller is configured to control an amplitude of the deflection of the metal substrate by actuating one of at least:
a gap between the metal substrate and the at least one deflection device, a magnitude of the deflection force exerted by at least one deflection device of the looper on the metal substrate.

SUBSTITUTE SHEET (RULE 26)

11. The processing line of claim 9, further comprising a controller communicatively coupled to the at least one deflection device, wherein the controller is configured compensate for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate occurring between the entrance and the exit by actuating one of at least:
an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.

12. The processing line of claim 9, further comprising a controller communicatively coupled to the at least one deflection device, wherein the controller is configured to control the tension in the metal substrate by actuating one of at least:
an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, a magnitude of the deflection force exerted by at least one deflection device of the looper on the metal substrate.

13. The processing line of claim 9, further comprising:
a first piece of processing equipment upstream from the contactless looper, wherein the first piece of processing equipment is configured to contact the metal substrate upstream from the contactless looper;
a second piece of processing equipment downstream from the contactless looper, wherein the second piece of processing equipment is configured to contact the metal substrate downstream from the contactless looper; and a controller communicatively coupled to the first piece of processing equipment and the second piece of processing equipment.

14. The processing line of claim 13, further comprising, wherein the controller is configured to selectively:
decrease an amount by which the height of the passline downstream from the entrance of the looper is offset from the base height by at least one of decreasing a line speed of the metal substrate at the first piece of processing equipment or SUBSTITUTE SHEET (RULE 26) increasing a line speed of the metal substrate at the second piece of processing equipment; and increase the amount by which the height of the passline downstream from the entrance of the looper is offset from the base height by at least one of increasing the line speed of the metal substrate at the first piece of processing equipment or decreasing the line speed of the metal substrate at the second piece of processing equipment.

15. The processing line of claim 13, wherein the controller is configured to compensate for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate occurring between the upstream and downstream processing equipment by actuating at least one of a line speed of the metal substrate at the first piece of processing equipment or a line speed of the metal substrate at the second piece of processing equipment.

16. The processing line of claim 13, wherein the controller is configured to selectively:
increase the tension in the metal substrate by at least one of decreasing a line speed of the metal substrate at the first piece of processing equipment or increasing a line speed of the metal substrate at the second piece of processing equipment; and decrease the tension in the metal substrate by at least one of increasing a line speed of the metal substrate at the first piece of processing equipment or decreasing a line speed of the metal substrate at the second piece of processing equipment.

17. The processing line of claim 9, wherein:
the at least one deflection device of the looper comprises one or a plurality of magnetic rotors;
each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate; and the plurality of magnetic rotors are configured to levitate and heat the metal substrate moving in the processing direction, wherein a magnitude of a force exerted by at least one magnetic rotor of the looper on the metal substrate is adjustable.

SUBSTITUTE SHEET (RULE 26)

18. A method of processing a metal substrate moving in a processing direction with a contactless looper, the method comprising:
receiving the metal substrate at an entrance of the contactless looper along a passline;
imparting a deflection in the metal substrate with the looper as the metal substrate is moving in the processing direction and without contacting the metal substrate, wherein the deflection is in the processing direction; and passing the metal substrate out an exit of the contactless looper.

19. The method of claim 18, wherein:
the looper comprises a plurality of magnetic rotors:
each magnetic rotor of the plurality of magnetic rotors is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate;
the plurality of magnetic rotors are configured to levitate the metal substrate moving along the processing direction by providing a deflection force to the metal substrate; and imparting the deflection comprises imparting the deflection with at least one magnetic rotor of the looper.

20. The method of claim 18, further comprising controlling an amplitude of the deflection of the metal substrate by actuating one of at least:
a gap between the metal substrate and the deflection device; or a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.

21. The method of claim 18, further comprising compensating for at least one of thermal expansion of the metal substrate, thermal contraction of the metal substrate, or creep in the metal substrate occurring between the entrance and the exit by actuating one of at least:
an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, or a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.
SUBSTITUTE SHEET (RULE 26)

22. The method of claim 18, further comprising controlling tension in the metal substrate by actuating one of at least:
an amplitude of the deflection of the metal substrate, a gap between the metal substrate and the at least one deflection device, a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.

23. The method of claim 18, wherein imparting the deflection comprises:
providing a magnetic rotor that is rotatable about an axis that is perpendicular to the processing direction and parallel to a lateral width of the metal substrate;
offsetting a vertical position of the passline downstream from the entrance of the looper relative to a vertical position of the passline at the entrance of the contactless looper by at least one of:
positioning the magnetic rotor such that an axis of the magnetic rotor is at the offset vertical position; or selecting a magnitude of a force exerted by the magnetic rotor on the metal substrate; and rotating the magnetic rotor about the axis such that the metal substrate is levitated while passing adjacent to the magnetic rotor.

24. The method of claim 18, further comprising controlling at least one of an amplitude of the deflection or tension in the metal substrate by actuating one of at least:
a line speed of the metal substrate; or a magnitude of a force exerted by at least one deflection device of the looper on the metal substrate.

25. A contactless looper comprising at least one deflection device, wherein the contactless looper is configured to receive a metal substrate moving in a processing direction, wherein the at least one deflection device is configured to impart a deflection force in a metal substrate without contacting the metal substrate resulting in a vertical deflection along the processing direction in the metal substrate, wherein the force from the at least one deflection device is adjustable.

SUBSTITUTE SHEET (RULE 26)

26. The contactless looper of claim 25, wherein the force for the at least one deflection device is adjustable by actuating at least one of a size of a gap between the deflection device and the metal substrate, SUBSTITUTE SHEET (RULE 26)