CA3212422A1 - Suppression de resonance de cavite a l'aide de socles thermiques discrets dans un reseau actif a balayage electronique - Google Patents

Suppression de resonance de cavite a l'aide de socles thermiques discrets dans un reseau actif a balayage electronique Download PDF

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Publication number
CA3212422A1
CA3212422A1 CA3212422A CA3212422A CA3212422A1 CA 3212422 A1 CA3212422 A1 CA 3212422A1 CA 3212422 A CA3212422 A CA 3212422A CA 3212422 A CA3212422 A CA 3212422A CA 3212422 A1 CA3212422 A1 CA 3212422A1
Authority
CA
Canada
Prior art keywords
aesa
thermal
pedestals
trms
tim
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CA3212422A
Other languages
English (en)
Inventor
Michael Buckley
Tom Walter
Varada Rajan KOMANDURI
Lal Mohan BHOWMIK
Bingqian LU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hughes Network Systems LLC
Original Assignee
Hughes Network Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/657,340 external-priority patent/US12126069B2/en
Application filed by Hughes Network Systems LLC filed Critical Hughes Network Systems LLC
Publication of CA3212422A1 publication Critical patent/CA3212422A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/24—Polarising devices; Polarisation filters 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Un réseau à balayage électronique actif (AESA), comprenant : un substrat à carte de circuit imprimé (PCB) ayant une surface avers ; des TRM (modules d'émission / réception) disposés sur la surface avers ; des socles thermiques, chaque socle thermique comprenant une paroi, ayant une hauteur de paroi, comprenant des surfaces de paroi et l'une des surfaces de paroi étant une surface de contact ; et un matériau d'interface thermique (TIM), ayant une hauteur de TIM, disposée entre une surface de contact respective des socles thermiques et la surface avers. Les socles thermiques sont discrets les uns par rapport aux autres, les surfaces de contact des socles thermiques sont intercalées autour des TRM, les socles thermiques n'entrent pas en contact avec les TRM, le TIM est électroconducteur et thermoconducteur, et la hauteur de paroi plus la hauteur de TIM est suffisante pour supprimer les résonances des TRM au-dessous d'une fréquence supérieure aux bandes de fréquence Tx et Rx des TRM.
CA3212422A 2021-04-01 2022-03-31 Suppression de resonance de cavite a l'aide de socles thermiques discrets dans un reseau actif a balayage electronique Pending CA3212422A1 (fr)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US202163169770P 2021-04-01 2021-04-01
US63/169,770 2021-04-01
US202163266262P 2021-12-30 2021-12-30
US63/266,262 2021-12-30
US17/657,340 2022-03-30
US17/657,340 US12126069B2 (en) 2022-03-30 Cavity resonance suppression using discrete thermal pedestals in active electronically scanned array
PCT/US2022/071452 WO2022213096A1 (fr) 2021-04-01 2022-03-31 Suppression de résonance de cavité à l'aide de socles thermiques discrets dans un réseau actif à balayage électronique

Publications (1)

Publication Number Publication Date
CA3212422A1 true CA3212422A1 (fr) 2022-10-06

Family

ID=81346385

Family Applications (1)

Application Number Title Priority Date Filing Date
CA3212422A Pending CA3212422A1 (fr) 2021-04-01 2022-03-31 Suppression de resonance de cavite a l'aide de socles thermiques discrets dans un reseau actif a balayage electronique

Country Status (4)

Country Link
EP (1) EP4315500A1 (fr)
BR (1) BR112023020110A2 (fr)
CA (1) CA3212422A1 (fr)
WO (1) WO2022213096A1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016031807A1 (fr) * 2014-08-26 2016-03-03 三菱電機株式会社 Module à haute fréquence
US9942975B2 (en) * 2015-10-05 2018-04-10 Raytheon Company Scalable thermal solution for high frequency panel array applications or other applications
CN108352623A (zh) * 2015-10-30 2018-07-31 三菱电机株式会社 高频天线模块及阵列天线装置
US10763226B2 (en) * 2017-10-05 2020-09-01 Anokiwave, Inc. Method and apparatus for heat sinking high frequency IC with absorbing material
US10319700B1 (en) * 2017-12-30 2019-06-11 Intel Corporation Stacked semiconductor architecture including semiconductor dies and thermal spreaders on a base die

Also Published As

Publication number Publication date
EP4315500A1 (fr) 2024-02-07
BR112023020110A2 (pt) 2023-11-14
WO2022213096A1 (fr) 2022-10-06

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