CA3135878A1 - Equipment degradation monitoring system - Google Patents

Abstract

A degradation monitoring system and a method for monitoring degradation of equipment are provided. The monitoring system includes a plurality of sensors applied to a surface of an internal component of the equipment, the internal component being subjected to a fluid causing degradation to the internal component during use of the equipment, the sensors being provided using a low profile substrate. The system also includes an output cable coupled to the plurality of sensors and being fed from an interior of the equipment to an exterior of the equipment to carry the signals acquired by the plurality of sensors to the exterior of the equipment. The system also includes a data acquisition module positioned in the exterior of the equipment, the data acquisition module being connected to at least one computing device for receiving and processing the signals acquired by the plurality of sensors.

Description

EQUIPMENT DEGRADATION MONITORING SYSTEM
TECHNICAL FIELD
[0001] The following generally relates to degradation monitoring systems for equipment, in particular for monitoring wear, corrosion, erosion, thinning or other damage to internal components of such equipment.
BACKGROUND

[0002] Some equipment used in heavy industrial applications such as hydrocarbon extraction, processing and refinement can be subjected to the handling of abrasive fluids such as slurries. Examples of such equipment can include slurry pumps, piping liners and other pipeline components; and pressure vessels/tanks, valves and pumps, to name a few. The slurries handled by the aforementioned equipment can be extremely abrasive, which leads to the erosion of the internal components of the equipment. While features like weep holes in a pump casing cover can be used to detect when leakage has begun, the cost and disruption of reactively shutting down a pump for maintenance is prohibitive. Because of this, equipment such as slurry pumps are often proactively replaced or serviced during routine downtime rather than waiting for the pumps to fail. That is, it is found that to avoid the disruption of a leakage, internal components of the equipment are often service or prematurely replaced, which can lead to additional cost.
SUMMARY

[0003] While prior monitoring systems have used external sensors to monitor the thickness of the internal wall of the pump casing (or other equipment), it is found that such monitoring can be ineffective since detecting failure of a pump casing is likely already too late and maintenance would be considered overdue. The system described herein utilizes thin, low profile, wafer-like sensors applied to internal components, such as the suction liner on a slurry pump, to perform condition-based monitoring to more accurately detect impending failures and more efficiently plan for preventative maintenance.

[0004] In one aspect, there is provided a degradation monitoring system for equipment, the system comprising: a plurality of sensors applied to a surface of an internal component of the equipment, the internal component being subjected to a fluid causing degradation to the internal component during use of the equipment, the sensors being provided using a low profile substrate; an output cable coupled to the plurality of sensors and being fed through a covering CPST Doc: 384481.1 Date recue/date received 2021-10-26 component of the equipment to carry the signals acquired by the plurality of sensors from an interior of the equipment to an exterior of the equipment; and a data acquisition module positioned in the exterior of the equipment, the data acquisition module being connected to at least one computing device for receiving and processing the signals acquired by the plurality of sensors.

[0005] In another aspect, there is provided a method of monitoring degradation of equipment, the method comprising: receiving sensor data from a plurality of sensors in a degradation monitoring system, the degradation monitoring system comprising:
the plurality of sensors applied to a surface of an internal component of the equipment, the internal component being subjected to a fluid causing degradation to the internal component during use of the equipment, the sensors being provided using a low profile substrate; an output cable coupled to the plurality of sensors and being fed through a covering component of the equipment to carry the signals acquired by the plurality of sensors from an interior of the equipment to an exterior of the equipment; and a data acquisition module positioned in the exterior of the equipment, the data acquisition module being connected to at least one computing device for receiving and processing the signals acquired by the plurality of sensors; storing the sensor data; analyzing the sensor data; and after detecting a degradation condition, initiating a remediation process for the equipment.

[0006] In another aspect, there is provided a computer readable medium storing computer executable instructions that, when executed by a processor of a computing device, perform the above method.

[0007] In an implementation, the system can further include at least one multiplexer for combining signals acquired by the plurality of sensors, the plurality of sensors being connected to one of the at least one multiplexer.

[0008] In an implementation, the low profile substrate can have a thickness that is less that a height of a flange protruding from the surface of the internal component.
The thickness can be in the range from about 0.002 millimeters to about 2 millimeters.

[0009] In an implementation, the plurality of sensors are ultrasonic transducer (UT) sensors.
The UT sensors can include piezoelectric films. The UT sensors can also include an electrode formed on the low profile substrate. The electrode can be formed on the low profile substrate using: electroplating, electroless plating, spray coating, painting, or vacuum deposition. A
CPST Doc: 384481.1 Date recue/date received 2021-10-26 bottom electrode of the UT sensors can be used as the substrate. The UT
sensors can be formed by 3D printing.

[0010] In an implementation, the internal component can be contained within a casing of the equipment. The equipment can include a pump, the pump can include the casing, the casing can contain an impeller and the internal component, and the abrasive or corrosive fluid can be pumped through the internal component and the casing by operating the impeller. The pump can be a slurry pump. The pump can be a pressure pump.

[0011] In an implementation, the equipment can include a pipeline component. The internal component can include a non-metallic liner of the pipeline.

[0012] In an implementation, the equipment can include a vessel or tank.

[0013] In an implementation, the equipment can include a valve.

[0014] In an implementation, the plurality of sensors can be arranged on the surface of the internal component to form an array of sensors.

[0015] In an implementation, the system can include a plurality of multiplexers connected together and providing a common output cable.

[0016] In an implementation, the system can include a computer workstation connected to the data acquisition module.

[0017] In an implementation, the system can include a condition-based monitoring system connected to the data acquisition module. The condition-based monitoring system can be located remotely and connected via a network.

[0018] In an implementation, the system and method can utilize a degradation model. The degradation model can be built from sensor data and be used to plan maintenance for at least one unmonitored equipment based on the degradation model and at least one factor associated with the operation of the unmonitored equipment. The at least one factor can include a runtime.

[0019] In an implementation, the data acquisition module can be connected to the plurality of sensors via an output cable being fed from an interior of the equipment to the exterior of the equipment. The output cable can include a bundle of output cables from a plurality of multiplexers connected to the plurality of sensors.

[0020] In an implementation, the data acquisition module can be connected to the plurality of sensors via wireless connections.
CPST Doc: 384481.1 Date recue/date received 2021-10-26

[0021] Advantages of the system and method described herein include that, by utilizing thin wafer-like sensors applied to internal components, such as the suction liner on a slurry pump, condition-based monitoring can be performed to more accurately detect impending failures and more efficiently plan for preventative maintenance.
BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Embodiments will now be described with reference to the appended drawings wherein:

[0023] FIG. 1 is a schematic perspective view of a slurry pump.

[0024] FIG. 2 is an exploded view of components of a slurry pump.

[0025] FIG. 3 is a schematic partial cross-sectional block diagram of a slurry pump being monitored by a condition-based monitoring system.

[0026] FIG. 4 is a plan view of a configuration for incorporating an array of monitoring sensors with a suction liner of a slurry pump.

[0027] FIG. 5 is a plan view of an image of a suction liner illustrating a surface preparation for the array of monitoring sensors.

[0028] FIG. 6 is an enlarged partial view of the suction liner and sensors shown in FIG. 5.

[0029] FIG. 7 is a plan view of an alternative configuration for incorporating an array of monitoring sensors using strips of sensors applied to a monitoring surface of a suction liner.

[0030] FIG. 8 is a schematic partial cross-sectional block diagram of a steel pipe having a non-metallic liner being monitored by the condition-based monitoring system.

[0031] FIG. 9 is a flow chart illustrating operations performed by a condition-based monitoring system for detecting and acting on degradation conditions detected from sensor data acquired from equipment.
DETAILED DESCRIPTION

[0032] While certain examples provided herein refer to degradation monitoring of slurry pumps, it can be appreciated that the principles discussed herein can be adapted and applied to other types of equipment having at least one internal component that is traditionally difficult to monitor using external sensors, such as pipeline components (e.g., liners), pressure vessels, valves, pressure pumps, etc.
CPST Doc: 384481.1 Date recue/date received 2021-10-26

[0033] Turning now to the figures, FIG. 1 illustrates a slurry pump 10. The slurry pump 10 includes a pump casing 12 that contains certain internal components (see FIG.
2). The pump 10 is driven by a drive shaft 14 that is powered by a motor 16, e.g., an electric drive motor. The motor 16 is mounted to the pump casing 12 and is itself can be mounted to other apparatus such as a frame (not shown) or surface such as a floor. The pump casing 12 has a suction cover 18 that includes or otherwise defines a pump or suction inlet 20. The pump casing 12 also includes a pump or discharge outlet 22.

[0034] Referring also to FIG. 2, the pump casing 12 is attached to the motor 16 via a stuffing box cover 24. The casing 12 contains an impeller 26 that rotates within a chamber 28 defined by the casing 12. The casing 12 also contains a suction cover liner or "suction liner" 30.
The suction liner 30 is thus also an internal component of the pump 10. The suction liner 30, rather than hold pressure, serves as a "front-line" degradation component. The suction liner 30 is typically made of a degradation-resistant material such as hardened tungsten steel. The suction liner 30 is meant to be the first component to fail in the pump 10 and when it begins to degrade (e.g., erode, corrode, wear, thin or be otherwise damaged), and indicate impending failure, permits leakage through weep holes 36 (see FIG. 3) in the suction cover 18. The suction liner 30 is therefore typically changed periodically as a preventative measure, e.g., during a preventative maintenance operation.

[0035] While prior monitoring systems have used external sensors to monitor the thickness of the internal wall of the pump casing 12, it is found that such monitoring can be ineffective since detecting failure of the pump casing 12 is likely already too late and maintenance would be considered overdue. Instead, the system described herein utilizes thin wafer-like sensors applied to internal components, such as the suction liner 30 on a slurry pump 10, to perform condition-based monitoring to more accurately detect impending failures and more efficiently plan for preventative maintenance.

[0036] Referring now to FIG. 3, a condition-based monitoring system 40 is shown, which is coupled to an array of sensors 32 incorporated into a slurry pump 10. As noted above, while the sensor array configuration shown in FIG. 3 is applied to a slurry pump 10, the principles can be applied to monitoring of an internal component of any equipment subjected to wear, corrosion, or other causes of damage, thinning or degradation more generally from normal operation, such as piping (e.g., pipelines, liners), storage (e.g., tanks, vessels), pumping (e.g., pumps and internal pumping components) and control components (e.g., valves, manifolds).
CPST Doc: 384481.1 Date recue/date received 2021-10-26

[0037] In the example shown in FIG. 3, the array of sensors 32 is coupled to an outer facing side of the suction liner 30. It can be seen from the partial cross-sectional schematic that the inlet 20 to the pump 10 passes through the suction liner 30 to the chamber 28 of the casing 12, which contains the impeller 26. The impeller 26 is driven by the drive shaft 14 that passes through the stuffing box cover 24 into the chamber 28 and connects to the impeller 26. Rotation of the impeller 26 pumps a fluid passing through the inlet 20 towards and through the outlet 22 to discharge the fluid and pass it along a piping network or discharge hose (not shown) with which the pump 10 is integrated as is known in the art. The array of sensors 32 is connected internally as discussed further below and feeds sensed data to a sensor data acquisition (DAQ) box 38 that is external to the pump 10. The data is fed via a cable 34 (or cable bundle) coupled to the DAQ box 38. In this example the presence of weep holes 36 is leveraged to provide an outlet port for the cable 34. It can be appreciated that the connections between the sensors 32 and the DAQ box 38 can also be wireless, e.g., using short-range communication protocols such as Bluetooth, NFC, etc., where available.

[0038] The DAQ box 38 can be used to locally monitor the slurry pump 10, e.g., via a computer station 42 and/or can be used to relay, transmit or otherwise provide the sensed data to a remote condition-based monitoring system 40 that can receive, store, analyze and react to the sensed data, e.g., by detecting sufficient degradation to warrant preventative maintenance of the slurry pump 10. The DAQ box 38 and/or the workstation 42 can be connected to the condition-based monitoring system 40 via a network 44, which can include a local area network (LAN), a wide area network (WAN) such as the Internet, or both.

[0039] The network 44 shown in FIG. 1 is an electronic network 44 such as a wired and/or a wireless communication system, for example, an existing enterprise communication infrastructure or purpose built network for the system 40. The electronic network 44 can include a communications network such as a telephone network, cellular, and/or data communication network to connect different types of communication devices. For example, the network 44 may include a private or public switched telephone network (PSTN), mobile network (e.g., code division multiple access (CDMA) network, global system for mobile communications (GSM) network, and/or any 3G, 4G, or 5G wireless carrier network, etc.), WiFi or other similar wireless network, and a private and/or public wide area network (e.g., the Internet).

[0040] The condition-based monitoring system 40 can be implemented using a computing device (e.g., one or more server devices) which include(s) one or more processors other data CPST Doc: 384481.1 Date recue/date received 2021-10-26 storage devices storing device data and application data (not shown), the processor(s) being configured to execute instructions that utilize modules and components (not shown in FIG. 1 for ease of illustration), including a communications module and data collection interface(s) by implementing communication protocols utilized by the particular configuration and/or application.
That is, while not delineated in FIG. 1, the condition-based monitoring system 40 includes at least one memory or memory device that can include a tangible and non-transitory computer-readable medium having stored therein computer programs, sets of instructions, code, or data to be executed by a processor. It can be appreciated that any of the modules and applications shown and/or described herein can also be hosted externally and be available to the computing device(s), e.g., via the communications module or data collection interface(s). Device data stored and utilized by the condition-based monitoring system, can include, without limitation, an IP address or a MAC address that uniquely identifies devices within the system 40. Application data stored and utilized by the condition-based monitoring system 40, can include, without limitation, login credentials, user preferences, cryptographic data (e.g., cryptographic keys), etc.

[0041] Other modules not shown in FIG. 1 that can also be utilized by the system 40 and/or computing workstation 42 and configured to implement same include, without limitation, a display module for rendering GUIs and other visual outputs on a display device such as a display screen, and an input module for processing user or other inputs received at the system 40 and/or workstation 42, e.g., via a touchscreen, input button, transceiver, microphone, keyboard, etc.; standard or customized applications or "apps", and a web browser application for accessing Internet-based content, e.g., via a mobile or traditional website.

[0042] The condition-based monitoring system 40 can also include a degradation model 46, which can be an off-the-shelf model generated using machine learning techniques or can be generated using such techniques by the condition-based monitoring system 40.
The degradation model 46 is built from sensor data to model wear, erosion, corrosion, thinning, or other forms of degradation or damage, and can be used to plan maintenance for at least one unmonitored equipment (not shown) based on the degradation model 46 and at least one factor associated with the operation of the unmonitored equipment. For example, the factor can include a runtime for the equipment such that, based on the model, the suction liner 30 is changed due to expected degradation based on data collected from other monitored equipment such as the slurry pump 10.
CPST Doc: 384481.1 Date recue/date received 2021-10-26

[0043] An example of an application of the array of sensors 32 to the suction liner 30 is shown in FIG. 4. The suction liner 30 in this example is made from a hardened steel. The suction liner 30 includes an inner flange 50 that defines an opening 52, the opening 52 being aligned with and forming a portion of the inlet 20. The suction liner 30 also includes an outer flange 54 that is sized to fit within the sidewall of the chamber 28 of the casing 12 such that it is seated between the impeller 26 and the suction cover 18 as illustrated schematically in FIG. 3.
A first annular surface 56 extends from the inner flange 50 towards the outer flange 54 and transitions to a second annular surface 58 that continues outwardly to the outer flange 54. The first annular surface 56 provides a sensing or monitoring surface on which the array of sensors 32 can be placed. The first annular surface 56 can be manufactured to include a smooth surface or can be machined to provide same when retrofitting an existing suction liner 30. The array of sensors 32 can include any number of sensors that provide sufficient coverage of the suction liner surface, for example, a set of 48 sensors as shown in FIG. 4.
The set of sensors 48 can also be placed according to locations where damage or thinning is more likely to occur.

[0044] In an implementation, the sensors 32 are constructed as thin ultrasonic transducer (UT) piezoelectric sensors, such as those described in WO 2013/026125 filed on August 24, 2011. The UT sensors 32 can be constructed of piezoelectric films having improved high temperature operation, and bandwidth, provided by porosity control. The thickness of such piezoelectric films may range from about 0.002 millimeters (i.e., about 2 microns) to about two (2) millimeters. The porosity of the piezoelectric film may be controlled between about 15% and about 40%. The UT sensors 32 can be designed to operate in a broad ultrasonic bandwidth, at temperature of up to 1000 C, or can be made flexible when such piezoelectric films are directly coated onto thin membranes made of metals or polymer composites. Such flexible UT sensors 32 can conform to curved surfaces such as pipes.

[0045] The porous piezoelectric films are typically made of ceramics such lead-zirconate-titanate (PZT), bismuth titanate, lithium niobate (LiNb03), etc. The average size of the pores is of microns or sub-microns. To fabricate the UT sensor 32, a bottom electrode is deposited onto a substrate. Where desired, the substrate may be flexible. The bottom electrode may be composed of metals or alloys suitable for high temperature operation, having high electrical conductivity, with minimal and non-fragile oxidation at the desired operating temperatures. For temperatures up to 850 C, electrodes such as nickel, platinum, titanium, stainless steel, silver, etc. may be used. Both metals and polymer composites are preferred, provided they can resist CPST Doc: 384481.1 Date recue/date received 2021-10-26 temperatures of the heat treatment (typically above 300 C), and the desired operating temperature range. Fabrication temperature could be lowered down to 50 C with signal strength and chemical stability sacrifice. The metal substrates can be nickel, platinum, titanium, stainless steel, silver, etc., while polymer composites can be glass fiber composites, carbon fiber composites, polyimide based composites, etc. The bottom electrode can be formed on the thin substrate by electroplating or electroless plating, spray coating, painting, vacuum deposition, etc. The bottom electrode can alternatively be the substrate.

[0046] A mixture is prepared with piezoelectric film materials in powder form, having micron or submicron sizes, with oxidizing binders in a liquid or gel form. The composition of the piezoelectric powders is preferably chosen for high piezoelectricity at the desired operating temperature, which may be at a high operating temperature. The mixture may be deposited onto the bottom electrode, by screen printing, stencil printing, spray coating, tape casting, dip coating, and spin coating, for example, to produce a layer of the mixture.
Recently developed 3D printing technology could also be used to deposit the mixture to the electrodes.

[0047] The layer is heat treated, during which treatment the materials are dried and calcined, some portions of the binder evaporate and react with the materials, resulting in a porous piezoelectric film. The deposition of layers and drying may alternate, or may be in series, depending on the duration and desired degree of the drying. The binder residue, after the heat treatment, preferably has a high dielectric constant, preferably higher than that of the piezoelectric powders.

[0048] After the calcining, the film is subjected to a high DC voltage, which provides electrical energy to pole the material, aligning dipoles of the piezoelectric materials, making the material piezoelectrically active. During the electrical poling, an electric field extends across both the piezoelectric powders and the binder material, and so it is important that the binder residue does not conduct electricity, as this would interfere with the poling.

[0049] In the example shown in the figures, an array of forty eight (48) UT
sensors 32 are placed on the surface 56 of the liner 30 in positions according to the plan as illustrated in FIG. 4.
It can be appreciated that to evaluate the operability of a chosen configuration, the sensors 32 can be initially coupled to the liner 30 with grease to first evaluate their performance before being more permanently adhered (e.g., using glue) to the surface 56. The sensors 32 are each connected to a multiplexer 62. The multiplexers 62 are connected together and connected to the external DAQ box 38. Once powered, the sensors 32, multiplexers 62, and DAQ
box 38 being CPST Doc: 384481.1 Date recue/date received 2021-10-26 acquiring sensed data and uploading signals to the cloud, e.g., to the condition-based monitoring system 40.

[0050] The UT sensors 32 can therefore be connected to a scalable multiplexed ultrasonic system. The sensors 32 can have a small magnet on its back that keeps the transducer in place. The sensors 32 can be used with a couplant (and be reused) or permanently installed with glue. In the configuration shown in FIG. 4, a group of sixteen (16) sensors is connected to each multiplexer 62. In the arrangement shown, there are three (3) multiplexers 62 in a cascaded configuration for a total of forty eight (48) sensors 32. The electronic DAQ box 38 includes a power source (e.g., batteries), an ultrasonic pulser-receiver, a low-power microcontroller (to start and manage the measuring process), and a communication box (e.g., 4G or 5G) to upload the ultrasonic signals to the cloud (e.g., to the condition-based monitoring system 40).

[0051] To retrofit the array of sensors 32 as shown in FIG. 4 can require a surface preparation stage. FIGS. 5 and 6 illustrate such surface preparation photographically. The surface preparation is applied to the areas of the liner 30 where the sensors 32 are to be attached, in this case surface 56. The surface preparation can include grinding the surface 56 with a rotating disk tool. For example, the original surface condition can be a rough casting surface. To keep the sensors 32 with couplant (i.e., not glued) in place and to avoid movement of the multiplexers 62, a strong adhesive tape can be applied above the sensors and multiplexers 62. The adhesive tape can also help to protect the coaxial wires 60 connecting each sensor 32 to the multiplexer 62. Afterwards, the suction cover plate 18 can be assembled with the cables 34 (or cable bundle) passing through an enlarged weeping hole 36. Depending on the gauge of the cables/bundle 34, the suction cover weeping hole can require enlargement to pass through the cover plate 18. For example, in an implementation, it was found that enlarging the weeping hole 36 in situ from 3/8" to 3/4" was sufficient and can be done using a drilling rig.

[0052] It can be appreciated that the application of the UT sensors 32 as shown in FIGS. 4-6 is illustrative only. For example, the array of sensors 32 can be applied in strips 80 to the surface as shown in FIG. 7. Such strips can be fabricated by painting the UT
sensors 32 on a substrate, or can be 3D printed to create custom sizes and patterns to suit the particular suction liner 30 being monitored.
CPST Doc: 384481.1 Date recue/date received 2021-10-26

[0053] Similarly, as shown in FIG. 8, the UT sensors 32 can be installed between a steel pipe 90 and a non-metallic liner 92 of that pipe 90 to monitor a pipeline 94.
The cable routing shown in FIG. 8 routes the cable 60 behind the liner to a pipe joint 96 (e.g.
flange, Victaulic or other quick connect system). In this way, the UT sensors 32 can be used to monitor the thickness of the liner 92 on stream, that is, without having to shut down and disassemble or otherwise dismantle the pipeline 94. While not shown in FIG. 8 for ease of illustration, the UT
sensors 32 can be connected to one or more multiplexers 62 as shown in FIG. 4.
Also, the UT
sensors 32 are shown in FIG. 8 being spaced along the bottom portion of the pipeline 94, however, it can be appreciated that the sensors 32 can be arranged in any suitable array, e.g., to be spaced both about the circumference and along the length of the pipeline 94.

[0054] The condition-based monitoring system 40 and/or a suitable application running on the computer workstation 42 can be coupled to the array of sensors 32 as shown in FIG. 3 to acquire, store, analyze, and react to the sensed data. FIG. 9 provides an example of computer executed instructions that can be performed in monitoring the degradation of equipment such as the slurry pump 10 illustrated herein. At step 100, the system 40 receives data from the array of sensors 32 and stores the sensor data at step 102. The stored sensor data can then be analyzed at step 104, e.g., to detect whether any degradation thresholds or other indicators are detectable from the sensed data. This can include updating the degradation model 46, e.g., to improve detection for unmonitored equipment. At step 106 it is assumed that a degradation condition has been detected (either imminently or in the future), and a remediation process is initiated. For example, by detecting that a thinning or erosion threshold has been reached, the system 40 can notify a maintenance team to schedule replacement of the suction liner 30 within a certain period of time. By having real-time sensed data from the array of sensors 32, the replacement of the suction liner 30 can be more finely controlled, preventing both failures and unnecessary replacements.

[0055] For simplicity and clarity of illustration, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements.
In addition, numerous specific details are set forth in order to provide a thorough understanding of the examples described herein. However, it will be understood by those of ordinary skill in the art that the examples described herein may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail CPST Doc: 384481.1 Date recue/date received 2021-10-26 so as not to obscure the examples described herein. Also, the description is not to be considered as limiting the scope of the examples described herein.

[0056] It will be appreciated that the examples and corresponding diagrams used herein are for illustrative purposes only. Different configurations and terminology can be used without departing from the principles expressed herein. For instance, components and modules can be added, deleted, modified, or arranged with differing connections without departing from these principles.

[0057] It will also be appreciated that any module or component exemplified herein that executes instructions may include or otherwise have access to computer readable media such as storage media, computer storage media, or data storage devices (removable and/or non-removable) such as, for example, magnetic disks, optical disks, or tape.
Computer storage media may include volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information, such as computer readable instructions, data structures, program modules, or other data. Examples of computer storage media include RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by an application, module, or both. Any such computer storage media may be part of the box 38, system 40, workstation 42, network 44, or any component of or related thereto, etc., or accessible or connectable thereto.
Any application or module herein described may be implemented using computer readable/executable instructions that may be stored or otherwise held by such computer readable media.

[0058] The steps or operations in the flow charts and diagrams described herein are just for example. There may be many variations to these steps or operations without departing from the principles discussed above. For instance, the steps may be performed in a differing order, or steps may be added, deleted, or modified.

[0059] Although the above principles have been described with reference to certain specific examples, various modifications thereof will be apparent to those skilled in the art as outlined in the appended claims.
CPST Doc: 384481.1 Date recue/date received 2021-10-26

Claims (57)

Claims:

1. A degradation monitoring system for equipment, the system comprising:
a plurality of sensors applied to a surface of an internal component of the equipment, the internal component being subjected to a fluid causing degradation to the internal component during use of the equipment, the sensors being provided using a low profile substrate; and a data acquisition module positioned in the exterior of the equipment, the data acquisition module being connected to the plurality of sensors and at least one computing device for receiving and processing signals acquired by the plurality of sensors.

2. The system of claim 1, further comprising at least one multiplexer for combining signals acquired by the plurality of sensors, the plurality of sensors being connected to one of the at least one multiplexer.

3. The system of claim 1 or claim 2, wherein the low profile substrate has a thickness that is less that a height of a flange protruding from the surface of the internal component.

4. The system of claim 3, wherein the thickness is in the range from about 0.002 millimeters to about 2 millimeters.

5. The system of any one of claims 1 to 4, wherein the plurality of sensors are ultrasonic transducer (UT) sensors.

6. The system of claim 5, wherein the UT sensors comprise piezoelectric films.

7. The system of claim 5 or claim 6, wherein the UT sensors comprise an electrode formed on the low profile substrate.

8. The system of claim 7, wherein the electrode is formed on the low profile substrate using: electroplating, electroless plating, spray coating, painting, or vacuum deposition.

9. The system of any one of claims 5 to 8, wherein a bottom electrode of the UT sensors is used as the substrate.

10. The system of any one of claims 5 to 9, wherein the UT sensors are formed by 3D
printing.

11. The system of any one of claims 1 to 10, wherein the internal component is contained within a casing of the equipment.

12. The system of claim 11, wherein the equipment comprises a pump, the pump comprising the casing, the casing containing an impeller and the internal component, the fluid causing degradation being pumped through the internal component and the casing by operating the impeller.

13. The system of claim 12, wherein the pump is a slurry pump.

14. The system of claim 12, wherein the pump is a pressure pump.

15. The system of any one of claims 1 to 11, wherein the equipment comprises a pipeline component.

16. The system of claim 15, wherein the internal component comprises a non-metallic liner of the pipeline.

17. The system of any one of claims 1 to 11, wherein the equipment comprises a vessel or tank.

18. The system of any one of claims 1 to 11, wherein the equipment comprises a valve.

19. The system of any one of claims 1 to 18, wherein the plurality of sensors are arranged on the surface of the internal component to form an array of sensors.

20. The system of any one of claims 2 to 19, wherein the system comprises a plurality of multiplexers connected together.

21. The system of any one of claims 1 to 20, further comprising a computer workstation connected to the data acquisition module.

22. The system of any one of claims 1 to 21, further comprising a condition-based monitoring system connected to the data acquisition module.

23. The system of claim 22, wherein the condition-based monitoring system is located remotely and connected via a network.

24. The system of any one of claims 1 to 23, further comprising a degradation model, the degradation model being built from sensor data and being used to plan maintenance for at least one unmonitored equipment based on the degradation model and at least one factor associated with the operation of the unmonitored equipment.

25. The system of claim 24, wherein the at least one factor comprises a runtime.

26. The system of any one of claims 1 to 25, wherein the data acquisition module is connected to the plurality of sensors via an output cable being fed from an interior of the equipment to the exterior of the equipment.

27. The system of claim 26 when dependent on any one of claims 1 to 19 or any one of claims 21 to 25, wherein the output cable comprises a bundle of output cables from a plurality of multiplexers connected to the plurality of sensors.

28. The system of any one of claims 1 to 25 wherein the data acquisition module is connected to the plurality of sensors via wireless connections.

29. A method of monitoring degradation of equipment, the method comprising:
receiving sensor data from a plurality of sensors in a degradation monitoring system, the degradation monitoring system comprising:
the plurality of sensors applied to a surface of an internal component of the equipment, the internal component being subjected to a fluid causing degradation to the internal component during use of the equipment, the sensors being provided using a low profile substrate; and a data acquisition module positioned in the exterior of the equipment, the data acquisition module being connected to the plurality of sensors and at least one computing device for receiving and processing the signals acquired by the plurality of sensors;
storing the sensor data;
analyzing the sensor data; and after detecting a degradation condition, initiating a remediation process for the equipment.

30. The method of claim 29, wherein the degradation monitoring system further comprises at least one multiplexer for combining signals acquired by the plurality of sensors, the plurality of sensors being connected to one of the at least one multiplexer.

31. The method of claim 29 or claim 30, further comprising updating a degradation model, the degradation model being built from sensor data and being used to plan maintenance for at least one unmonitored equipment based on the degradation model and at least one factor associated with the operation of the unmonitored equipment.

32. The method of claim 31, wherein the at least one factor comprises a runtime.

33. The method of any one of claims 29 to 32, wherein the low profile substrate has a thickness that is less that a height of a flange protruding from the surface of the internal component.

34. The method of claim 33, wherein the thickness is in the range from about 0.002 millimeters to about 2 millimeters.

35. The method of any one of claims 29 to 34, wherein the plurality of sensors are ultrasonic transducer (UT) sensors.

36. The method of claim 35, wherein the UT sensors comprise piezoelectric films.

37. The method of claim 35 or claim 36, wherein the UT sensors comprise an electrode formed on the low profile substrate.

38. The method of claim 37, wherein the electrode is formed on the low profile substrate using: electroplating, electroless plating, spray coating, painting, or vacuum deposition.

39. The method of any one of claims 35 to 38, wherein a bottom electrode of the UT sensors is used as the substrate.

40. The method of any one of claims 35 to 39, wherein the UT sensors are formed by 3D
printing.

41. The method of any one of claims 29 to 40, wherein the internal component is contained within a casing of the equipment.

42. The method of claim 41, wherein the equipment comprises a pump, the pump comprising the casing, the casing containing an impeller and the internal component, the fluid causing degradation being pumped through the internal component and the casing by operating the impeller.

43. The method of claim 42, wherein the pump is a slurry pump.

44. The method of claim 42, wherein the pump is a pressure pump.

45. The method of any one of claims 29 to 41, wherein the equipment comprises a pipeline component.

46. The method of claim 45, wherein the internal component comprises a non-metallic liner of the pipeline.

47. The method of any one of claims 29 to 41, wherein the equipment comprises a vessel or tank.

48. The method of any one of claims 29 to 41, wherein the equipment comprises a valve.

49. The method of any one of claims 29 to 48, wherein the plurality of sensors are arranged on the surface of the internal component to form an array of sensors.

50. The method of any one of claims 30 to 49, wherein the system comprises a plurality of multiplexers connected together.

51. The method of any one of claims 29 to 50, further comprising a computer workstation connected to the data acquisition module.

52. The method of any one of claims 29 to 51, further comprising a condition-based monitoring system connected to the data acquisition module.

53. The method of claim 52, wherein the condition-based monitoring system is located remotely and connected via a network.

54. The method of any one of claims 29 to 53, wherein the data acquisition module is connected to the plurality of sensors via an output cable being fed from an interior of the equipment to the exterior of the equipment.

55. The method of claim 54 when dependent on any one of claims 29 to 49 or any one of claims 51 to 53, wherein the output cable comprises a bundle of output cables from a plurality of multiplexers connected to the plurality of sensors.

56. The method of any one of claims 29 to 53 wherein the data acquisition module is connected to the plurality of sensors via wireless connections.

57. A computer readable medium storing computer executable instructions that, when executed by a processor of a computing device, perform the method of any one of claims 29 to 56.