CA2970960A1 - Dual cure polythioether - Google Patents
Dual cure polythioether Download PDFInfo
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- CA2970960A1 CA2970960A1 CA2970960A CA2970960A CA2970960A1 CA 2970960 A1 CA2970960 A1 CA 2970960A1 CA 2970960 A CA2970960 A CA 2970960A CA 2970960 A CA2970960 A CA 2970960A CA 2970960 A1 CA2970960 A1 CA 2970960A1
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- peroxide
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- 229920006295 polythiol Polymers 0.000 title claims abstract description 25
- 230000009977 dual effect Effects 0.000 title description 7
- 239000000203 mixture Substances 0.000 claims abstract description 67
- 150000001412 amines Chemical class 0.000 claims abstract description 17
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000178 monomer Substances 0.000 claims abstract description 14
- 150000002978 peroxides Chemical class 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 13
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004342 Benzoyl peroxide Substances 0.000 claims abstract description 6
- 235000019400 benzoyl peroxide Nutrition 0.000 claims abstract description 6
- VDMLVOIDGSOUTA-UHFFFAOYSA-N 2-(4-methylanilino)ethane-1,1-diol Chemical compound CC1=CC=C(NCC(O)O)C=C1 VDMLVOIDGSOUTA-UHFFFAOYSA-N 0.000 claims abstract description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims abstract description 5
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000001993 dienes Chemical class 0.000 claims abstract description 5
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000012966 redox initiator Substances 0.000 claims abstract description 5
- 150000004662 dithiols Chemical class 0.000 claims abstract description 4
- 150000003512 tertiary amines Chemical class 0.000 claims abstract description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 4
- 239000000565 sealant Substances 0.000 claims description 15
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 14
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 7
- 239000002105 nanoparticle Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- 229920002379 silicone rubber Polymers 0.000 description 8
- 239000004945 silicone rubber Substances 0.000 description 8
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000009472 formulation Methods 0.000 description 6
- 239000008240 homogeneous mixture Substances 0.000 description 6
- FFHWGQQFANVOHV-UHFFFAOYSA-N dimethyldioxirane Chemical compound CC1(C)OO1 FFHWGQQFANVOHV-UHFFFAOYSA-N 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 239000002023 wood Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000446 fuel Substances 0.000 description 4
- 230000000977 initiatory effect Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004927 clay Substances 0.000 description 3
- 239000012973 diazabicyclooctane Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 2
- 102100025848 Acyl-coenzyme A thioesterase 8 Human genes 0.000 description 2
- 101710175468 Acyl-coenzyme A thioesterase 8 Proteins 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000004584 weight gain Effects 0.000 description 2
- 235000019786 weight gain Nutrition 0.000 description 2
- KTRQRAQRHBLCSQ-UHFFFAOYSA-N 1,2,4-tris(ethenyl)cyclohexane Chemical compound C=CC1CCC(C=C)C(C=C)C1 KTRQRAQRHBLCSQ-UHFFFAOYSA-N 0.000 description 1
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- MNZAKDODWSQONA-UHFFFAOYSA-N 1-dibutylphosphorylbutane Chemical compound CCCCP(=O)(CCCC)CCCC MNZAKDODWSQONA-UHFFFAOYSA-N 0.000 description 1
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- HCZMHWVFVZAHCR-UHFFFAOYSA-N 2-[2-(2-sulfanylethoxy)ethoxy]ethanethiol Chemical compound SCCOCCOCCS HCZMHWVFVZAHCR-UHFFFAOYSA-N 0.000 description 1
- OHXAOPZTJOUYKM-UHFFFAOYSA-N 3-Chloro-2-methylpropene Chemical compound CC(=C)CCl OHXAOPZTJOUYKM-UHFFFAOYSA-N 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- -1 CMP diene Chemical class 0.000 description 1
- 241000579895 Chlorostilbon Species 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QYTDEUPAUMOIOP-UHFFFAOYSA-N TEMPO Chemical group CC1(C)CCCC(C)(C)N1[O] QYTDEUPAUMOIOP-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 229910052876 emerald Inorganic materials 0.000 description 1
- 239000010976 emerald Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910002011 hydrophilic fumed silica Inorganic materials 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methyl-cyclopentane Natural products CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- XOTMHFNWERTCLG-UHFFFAOYSA-N tris(4-ethenoxybutyl) benzene-1,2,4-tricarboxylate Chemical compound C=COCCCCOC(=O)C1=CC=C(C(=O)OCCCCOC=C)C(C(=O)OCCCCOC=C)=C1 XOTMHFNWERTCLG-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
- C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
- C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D45/00—Aircraft indicators or protectors not otherwise provided for
- B64D45/02—Lightning protectors; Static dischargers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/34—Introducing sulfur atoms or sulfur-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/04—Polymeric products of isocyanates or isothiocyanates with vinyl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
- C08G8/34—Chemically modified polycondensates by natural resins or resin acids, e.g. rosin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
- C09J181/02—Polythioethers; Polythioether-ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Sealing Material Composition (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Compositions that are curable to polythioether polymers are provided, comprising: a) a dithiol monomer; b) a diene monomer; c) a radical cleaved photoinitiator; d) a peroxide; and e) an amine; where the peroxide and amine together are a peroxide-amine redox initiator. In some embodiments, the amine is a tertiary amine. In some embodiments, the amine is selected from the group consisting of dihydroxyethyl-p-toluidine, N,N-diisopropylethylamine, and N, N, N', N", N"-pentamethyl-diethylenetriamine. In some embodiments, the peroxide is selected from the group consisting of di-tert-butyl peroxide, methyl ethyl ketone peroxide, and benzoyl peroxide. In some embodiments, the composition may additionally comprise a polythiol monomer having three or more thiol groups.
Description
2 DUAL CURE POLYTHIOETHER
Field of the Disclosure This disclosure relates to compositions that cure to form polythioether polymers and that include a dual cure curing mechanism, as well as sealants comprising the same.
Summary of the Disclosure Briefly, the present disclosure provides compositions that are curable to polythioether polymers, comprising: a) a dithiol monomer; b) a diene monomer;
c) a radical cleaved photoinitiator; d) a peroxide; and e) an amine; where the peroxide and amine together are a peroxide-amine redox initiator. In some embodiments, the amine is a tertiary amine. In some embodiments, the amine is selected from the group consisting of dihydroxyethyl-p-toluidine, N,N-diisopropylethylamine, and N, N, N', N", N"-pentamethyl-diethylenetriamine. In some embodiments, the peroxide is selected from the group consisting of di-tert-butyl peroxide, methyl ethyl ketone peroxide, and benzoyl peroxide. In some embodiments, the composition may additionally comprise a polythiol monomer having three or more thiol groups.
In some embodiments, the composition may additionally comprise one or more fillers. In some embodiments, the composition may additionally comprise one or more nanoparticle fillers. In some embodiments, the composition may additionally comprise calcium carbonate. In some embodiments, the composition may additionally comprise nanoparticle calcium carbonate. In some embodiments, the composition may be cured by application of light from an actinic light source. In some embodiments, the composition may be cured by application of light from a blue light source. In some embodiments, the composition may be cured by application of light from a UV
light source.
In another aspect, the present disclosure provides sealants comprising curable compositions according to the present disclosure. In another aspect, the present disclosure provides seals obtained by cure of such sealants.
In another aspect, the present disclosure provides polythioether polymers obtained by cure of any the compositions according to the present disclosure.
In some embodiments, the polythioether polymer has a Tg less than -50 C. In some embodiments, the polythioether polymer exhibits high jet fuel resistance characterized by a volume swell of less than 30% and a weight gain of less than 20% when measured according to Society of Automotive Engineers (SAE) International Standard AS5127/1.
All scientific and technical terms used herein have meanings commonly used in the art unless otherwise specified.
As used in this specification and the appended claims, the singular forms "a", "an", and "the" encompass embodiments having plural referents, unless the content clearly dictates otherwise.
As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
As used herein, "have", "having", "include", "including", "comprise", "comprising" or the like are used in their open ended sense, and generally mean "including, but not limited to." It will be understood that the terms "consisting of' and "consisting essentially of' are subsumed in the term "comprising," and the like.
Brief Description of the Drawing FIG. 1 is a diagram representing the use of a dual cure polythioether according the the present invention as a sealant between two substrates.
Detailed Description The present disclosure provides a dual cure polythioether material such as a sealant. In some embodiments the sealant has both cure on demand properties and dark cure properties. In some embodiments the sealant may be cured by exposure to actinic radiation in 120 seconds or less, in some embodiments 90 seconds or less, in some embodiments 60 seconds or less, in some embodiments 30 seconds or less, and in some embodiments 20 seconds or less. In some embodiments cure on demand can be initiated with UV light, in some with visible light, in some with LED sourced UV light, and in some with LED sourced visible light. Furthermore, in some embodiments the initially photoinitiated cure propagates by a dark cure mechanism into adjacent portions of the polythioether material that are without light access. In some embodiments cure propagates by at least 2.5 cm into the dark zone with 90% or greater conversion in 120 seconds or less, in some embodiments 90 seconds or less, in some embodiments seconds or less, in some embodiments 30 seconds or less, and in some embodiments 20 seconds or less. In some embodiments cure propagates by at least 5.0 cm into the dark zone with 90% or greater conversion in 120 seconds or less, in some embodiments 90 seconds or less, in some embodiments 60 seconds or less, in some embodiments seconds or less, and in some embodiments 20 seconds or less.
With reference to FIG. 1, in one embodiment of a sealant according to the present disclosure, sealant 10 is applied between opaque substrates 20.
Actinic light 40 from actinic light source 30 is used to initiate cure of a portion of sealant 10 exposed to said light, in exposed zone 100. However, sealant 10 in dark zones 110 and 120 is not exposed to actinic light 40. Use of the dual cure initiation system of the present disclosure allows the initially photoinitiated cure to propagate by a dark cure mechanism into adjacent dark zones 110 and 120. In some embodiments, sealant in dark zone 110, representing the 2 inches (5 cm) immediately adjacent to exposed zone 100, is fully cured within 20 seconds, and cure continues further into dark zone 120.
In some embodiments, the initiation system includes a) a radical cleaved photoinitiator and b) a peroxide-amine redox initiator.
In some embodiments, the cured material has low glass transition temperature, in some embodiments less than -20 C, in some embodiments less than -30 C, in some embodiments less than -40 C, and in some embodiments less than -50 C. In some embodiments, the cured material has excellent fuel resistance properties. In some embodiments, the cured material combines low glass transition temperature of less than -50 C with excellent fuel resistance properties. Thus, in certain embodiments this dual cure technology can be applied to aircraft or automobile sealant applications and may result in greater ease and speed of vehicle manufacture.
Selected Embodiments The following numbered embodiments are intended to further illustrate the present disclosure but should not be construed to unduly limit this disclosure.
1. A composition that is curable to a polythioether polymer, comprising:
a) a dithiol monomer;
Field of the Disclosure This disclosure relates to compositions that cure to form polythioether polymers and that include a dual cure curing mechanism, as well as sealants comprising the same.
Summary of the Disclosure Briefly, the present disclosure provides compositions that are curable to polythioether polymers, comprising: a) a dithiol monomer; b) a diene monomer;
c) a radical cleaved photoinitiator; d) a peroxide; and e) an amine; where the peroxide and amine together are a peroxide-amine redox initiator. In some embodiments, the amine is a tertiary amine. In some embodiments, the amine is selected from the group consisting of dihydroxyethyl-p-toluidine, N,N-diisopropylethylamine, and N, N, N', N", N"-pentamethyl-diethylenetriamine. In some embodiments, the peroxide is selected from the group consisting of di-tert-butyl peroxide, methyl ethyl ketone peroxide, and benzoyl peroxide. In some embodiments, the composition may additionally comprise a polythiol monomer having three or more thiol groups.
In some embodiments, the composition may additionally comprise one or more fillers. In some embodiments, the composition may additionally comprise one or more nanoparticle fillers. In some embodiments, the composition may additionally comprise calcium carbonate. In some embodiments, the composition may additionally comprise nanoparticle calcium carbonate. In some embodiments, the composition may be cured by application of light from an actinic light source. In some embodiments, the composition may be cured by application of light from a blue light source. In some embodiments, the composition may be cured by application of light from a UV
light source.
In another aspect, the present disclosure provides sealants comprising curable compositions according to the present disclosure. In another aspect, the present disclosure provides seals obtained by cure of such sealants.
In another aspect, the present disclosure provides polythioether polymers obtained by cure of any the compositions according to the present disclosure.
In some embodiments, the polythioether polymer has a Tg less than -50 C. In some embodiments, the polythioether polymer exhibits high jet fuel resistance characterized by a volume swell of less than 30% and a weight gain of less than 20% when measured according to Society of Automotive Engineers (SAE) International Standard AS5127/1.
All scientific and technical terms used herein have meanings commonly used in the art unless otherwise specified.
As used in this specification and the appended claims, the singular forms "a", "an", and "the" encompass embodiments having plural referents, unless the content clearly dictates otherwise.
As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
As used herein, "have", "having", "include", "including", "comprise", "comprising" or the like are used in their open ended sense, and generally mean "including, but not limited to." It will be understood that the terms "consisting of' and "consisting essentially of' are subsumed in the term "comprising," and the like.
Brief Description of the Drawing FIG. 1 is a diagram representing the use of a dual cure polythioether according the the present invention as a sealant between two substrates.
Detailed Description The present disclosure provides a dual cure polythioether material such as a sealant. In some embodiments the sealant has both cure on demand properties and dark cure properties. In some embodiments the sealant may be cured by exposure to actinic radiation in 120 seconds or less, in some embodiments 90 seconds or less, in some embodiments 60 seconds or less, in some embodiments 30 seconds or less, and in some embodiments 20 seconds or less. In some embodiments cure on demand can be initiated with UV light, in some with visible light, in some with LED sourced UV light, and in some with LED sourced visible light. Furthermore, in some embodiments the initially photoinitiated cure propagates by a dark cure mechanism into adjacent portions of the polythioether material that are without light access. In some embodiments cure propagates by at least 2.5 cm into the dark zone with 90% or greater conversion in 120 seconds or less, in some embodiments 90 seconds or less, in some embodiments seconds or less, in some embodiments 30 seconds or less, and in some embodiments 20 seconds or less. In some embodiments cure propagates by at least 5.0 cm into the dark zone with 90% or greater conversion in 120 seconds or less, in some embodiments 90 seconds or less, in some embodiments 60 seconds or less, in some embodiments seconds or less, and in some embodiments 20 seconds or less.
With reference to FIG. 1, in one embodiment of a sealant according to the present disclosure, sealant 10 is applied between opaque substrates 20.
Actinic light 40 from actinic light source 30 is used to initiate cure of a portion of sealant 10 exposed to said light, in exposed zone 100. However, sealant 10 in dark zones 110 and 120 is not exposed to actinic light 40. Use of the dual cure initiation system of the present disclosure allows the initially photoinitiated cure to propagate by a dark cure mechanism into adjacent dark zones 110 and 120. In some embodiments, sealant in dark zone 110, representing the 2 inches (5 cm) immediately adjacent to exposed zone 100, is fully cured within 20 seconds, and cure continues further into dark zone 120.
In some embodiments, the initiation system includes a) a radical cleaved photoinitiator and b) a peroxide-amine redox initiator.
In some embodiments, the cured material has low glass transition temperature, in some embodiments less than -20 C, in some embodiments less than -30 C, in some embodiments less than -40 C, and in some embodiments less than -50 C. In some embodiments, the cured material has excellent fuel resistance properties. In some embodiments, the cured material combines low glass transition temperature of less than -50 C with excellent fuel resistance properties. Thus, in certain embodiments this dual cure technology can be applied to aircraft or automobile sealant applications and may result in greater ease and speed of vehicle manufacture.
Selected Embodiments The following numbered embodiments are intended to further illustrate the present disclosure but should not be construed to unduly limit this disclosure.
1. A composition that is curable to a polythioether polymer, comprising:
a) a dithiol monomer;
3 b) a diene monomer;
c) a radical cleaved photoinitiator;
d) a peroxide; and e) an amine;
where the peroxide and amine together are a peroxide-amine redox initiator.
2. The composition according to embodiment 1 where the amine is a tertiary amine.
3. The composition according to any of the preceding embodiments where the amine is selected from the group consisting of dihydroxyethyl-p-toluidine, N,N-diisopropylethylamine, and N, N, N', N", N"-pentamethyl-diethylenetriamine.
c) a radical cleaved photoinitiator;
d) a peroxide; and e) an amine;
where the peroxide and amine together are a peroxide-amine redox initiator.
2. The composition according to embodiment 1 where the amine is a tertiary amine.
3. The composition according to any of the preceding embodiments where the amine is selected from the group consisting of dihydroxyethyl-p-toluidine, N,N-diisopropylethylamine, and N, N, N', N", N"-pentamethyl-diethylenetriamine.
4. The composition according to any of the preceding embodiments where the peroxide is selected from the group consisting of di-tert-butyl peroxide, methyl ethyl ketone peroxide, and benzoyl peroxide.
5. The composition according to any of the preceding embodiments additionally comprising:
f) a polythiol monomer having three or more thiol groups.
f) a polythiol monomer having three or more thiol groups.
6. The composition according to any of the preceding embodiments additionally comprising:
g) at least one filler.
g) at least one filler.
7. The composition according to any of the preceding embodiments additionally comprising:
h) at least one nanoparticle filler.
h) at least one nanoparticle filler.
8. The composition according to any of the preceding embodiments additionally comprising:
j) calcium carbonate.
j) calcium carbonate.
9. The composition according to any of the preceding embodiments additionally comprising:
k) nanoparticle calcium carbonate.
k) nanoparticle calcium carbonate.
10. The composition according to any of the preceding embodiments which is curable by actinic light source.
11. The composition according to any of the preceding embodiments which is curable by blue light source.
12. The composition according to any of the preceding embodiments which is curable by UV light source.
13. A sealant comprising the composition according to any of the preceding embodiments.
14. A polythioether polymer obtained by cure of any the composition according to any of embodiments 1-12.
15. The polythioether polymer according to embodiment 14 having a Tg less than -50 C.
16. The polythioether polymer according to embodiment 14 or 15 which exhibits high jet fuel resistence characterized by a volume swell of less than 30% and a weight gain of less than 20% when measured according to Society of Automotive Engineers (SAE) International Standard AS5127/1.
Objects and advantages of this disclosure are further illustrated by the following examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit this disclosure.
Examples Unless otherwise noted, all reagents were obtained or are available from Sigma-Aldrich Company, St. Louis, Missouri, or may be synthesized by known methods.
Unless otherwise reported, all ratios are by weight percent.
The following abbreviations are used to describe the examples:
oc: degrees Centigrade cm: centimeter LED: light emitting diode mL: milliliter Mn: Molecular weight mW: milliWatt nm: nanometer Tg: glass transition temperature UV: ultraviolet Definitions Maximum Processing Time: The time taken for the thiol-ene curable composition to begin gelling.
Photo Cure Time: The cure time of the portion of thiol-ene curable composition exposed to light.
Dark Cure Time: The cure time of the portion of thiol-ene curable composition not exposed to light.
Redox Cure Time: The cure time for the portion of thiol-ene curable composition initiated by redox mechanism.
Dark Cure Distance: The length of thiol-ene composition dark cured, as measured from the leading edge of the opaque silicone rubber sheet.
Materials.
Abbreviations for the materials used in the examples are as follows:
A-200: A hydrophilic fumed silica, obtained under the trade designation "AEROSIL 200" from Evonik Industries AG, Essen, Germany.
BPO: Benzoyl peroxide.
CMP: 3-chloro-2-methyl-1-propene.
DAB CO: 1,4-Diazabicyclo[2.2.2]octane, obtained under the trade designation "DABCO" from Air Products & Chemicals, Inc., Allentown, Pennsylvania.
DHEPT: dihydroxyethyl-p-toluidine.
DIPEA: N,N-diisopropylethylamine, obtained from Alfa Aesar, Ward Hill, Massachusetts.
DMDO: 1,8-Dimercapto-3,6-dioxaoctane, obtained from Arkena, Inc., King of Prussia, Pennsylvania.
DSW: An aluminosilicate clay, obtained under the trade designation "DRAGONITE SELECT WHITE" from Applied Minerals, Inc., New York, New York.
DVE-3: Triethyleneglycol divinylether, obtained under the trade designation "RAPI-CURE DVE-3" from Ashland Specialty Ingredients, Wilmington, Delaware.
E-8220: A diglycidylether of bisphenol F, obtained under the trade designation "EPALLOY 8220" from Emerald Performance Materials, LLC, Cuyahoga Falls, Ohio.
1-819: Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, obtained under the trade designation "IRGACURE 819" from BASF Corp., Florham Park, New Jersey.
MEHQ: Hydroquinone monomethyl ether.
MEKP: Methyl ethyl ketone peroxide, obtained from 3M Company, St.
Paul, Minnesota.
PMETA: N, N, N', N", N"-pentamethyl-diethylenetriamine, obtained from TCI
America, Portland, Oregon..
S-31: Nanoparticle (70 ¨ 100 nm) calcium carbonate, obtained under the trade designation "SOCAL 31" from Solvay Chemicals, Inc., Houston, Texas.
TAC: Triallylcyanurate, obtained from Sartomer, Inc., Exton, Pennsylvania.
TBPO: di-tert-butyl peroxide, obtained from TCI America.
TEMPO: 2,2,6,6-tetramethyl-1-piperidinyloxy, obtained from Oakwood Products, Inc., West Columbia, South Carolina.
TPTMP: Trimethylolpropane tris(3-mercaptopropionate).
TVCH: 1,2,4-Trivinylcyclohexane, obtained from BASF Corp., Florham Park, New Jersey.
TVBT: tris[4-(vinyloxy)butyl] trimellitate, obtained from Allied Signal, Inc., Morristown, New Jersey.
VAZO 52: 2,2'-azobis(2,4-dimethyl-pentanenitrile), obtained under the trade designation "VAZO 52" from E.I. du Dupont de Nemours and Company, Wilmington, Delaware.
VAZO 67: 2,2' azobis-(2-methylbutyronitrile), obtained under the trade designation "VAZO 67" from E.I. du Dupont de Nemours and Company.
Polythioethers were synthesized as follows:
PTE-1. Into a 1000-mL round bottom flask equipped with an air-driven stirrer, thermometer, and a dropping funnel, was added 392.14 grams (2.15 moles) DMDO
and 82.23 grams (0.25 moles) E-8220. To this mixture was added 0.15 grams DABCO.
The system was flushed with nitrogen, then mixed and heated for four hours at 70 C. 12.5 grams (0.05 moles) TAC was added, followed by approximately 0.15 grams VAZO 67. With continuous stirring, the mixture was heated to 60 C, and held at this temperature for approximately 30 -45 minutes. 313.13 grams (1.55 moles) DVE-3 were slowly added drop-wise to the flask over a period of 45 - 60 minutes, keeping the temperature at approximately between 68 - 80 C. Additional VAZO 67 was added in approximately 0.15 gram increments over approximately 6 hours, for a total of approximately 0.6 grams. The temperature was raised to 100 C and the material degassed for approximately 10 minutes. The resultant polythioether was approximately 3200 Mn with a 2.2 functionality.
PTE-2. Into a 500 mL four-neck, round bottom flask fitted with a stirrer, thermometer, chilled water condenser and a pressure equalizing addition funnel was added 206.54 grams of a 20% aqueous solution of sodium hydroxide (1.033 moles). To this was added, drop wise with stirring, 94.08 grams (0.51 moles) DMDO, and the mixture then allowed to cool to approximately 21 C. 96.4 grams (1.065 moles) CMP
was added drop wise with vigorous stirring, and stirring continued for another 2 hours.
The mixture was then held at 21 C for approximately 16 hours, after which 150 grams of a clear layer was decanted. NMR analysis confirmed the decanted layer to be CMP
diene.
Into a 100-mL round bottom flask equipped with an air-driven stirrer, thermometer, and a dropping funnel, was added 39.64 grams (0.22 moles) DMDO and 4.10 grams (0.0125 moles) E-8220. To this mixture was added 0.02 grams DABCO. The system was flushed with nitrogen, then mixed and heated for 1.5 hours at 60 - 70 C.
3.66 grams (.0125 moles) CMP diene was added followed by approximately 0.01 grams VAZO 52. With continuous stirring, the mixture was heated to 60 C, and held at this temperature for approximately 1.5 hrs. 0.83 grams (0.005 mole) TVCH were added and the temperature maintained for another 1.5 hrs. 31.80 grams (0.157 moles) were slowly added drop-wise to the flask over a period of 45 - 60 minutes, keeping the temperature at approximately 70 C. Additional VAZO 52 was added in approximately 0.01 gram increments over approximately 16 hours, for a total amount of about 0.4 grams. The temperature is raised to 100 C and the material degassed for approximately 10 minutes. The resultant polythioether was approximately 3200 Mn with a 2.2 functionality.
Example /
Part A was prepared by dissolving 0.0139 grams BP0 and 0.0300 grams 1-819 in 3.0000 grams DVE-3 in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C. Part B was prepared by dissolving 0.0139 grams DHEPT and 0.0394 grams 1-819 in 3.9407 grams TPTMP in a 20 mL amber vial, also on a roll mill for 8 hours at 21 C.
Part A
was then added to Part B and manually stirred for one minute until homogeneously dispersed.
Examples 2-8 The procedure generally described in Example 1 for preparing homogeneous mixtures of peroxide, photo initiator and vinyl monomer in Part A, and amine, photo initiator and thiol monomer in Part B, was repeated according to the formulations listed in Tables 1A and 1B.
Example 9 Part A was prepared by dissolving 0.0347 grams BP0 and 0.1549 grams 1-819 in 15.0000 grams DVE-3 in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C.
The solution was transferred to a speed mixer jar. 0.1000 grams A-200 and 5.3111 grams clay were added to the solution and homogeneously dispersed by means of a high speed mixer at 2,000 rpm for one minute. Part B was prepared by dissolving 0.0347 grams DIPEA and 0.1974 grams 1-819 in 19.7034 grams TPTNIP in a 40 mL
amber vial, also on a roll mill for 40 minutes at 21 C. The solution was transferred to a speed mixer jar. 0.1000 grams A-200 and 1.8916 grams clay were added to the solution and homogeneously dispersed by means of the high speed mixer at 2,000 rpm for one minute. Part A and Part B were homogeneously dispersed through a static mixer.
Example 10 The procedure generally described in Example 9 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
Example 11 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
Example 12 0.0694 grams 1-819 was dissolved in a mixture of in 3.0000 grams DVE-3 and 3.9407 grams TPTMP in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C
Example /3 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
Example 14 0.0765 grams 1-819 was dissolved in a mixture of in 4.0000 grams DMDO and 3.3467 grams TAC in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C
Example 15 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B, wherein Part B was mixed for 24 hours rather than 8 hours.
Example 16 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
i.) o o o o vi i.) Part A Composition (grams) Example 1 0.0139 0 0.0300 3.0000 0 0 0 2 0.0139 0 0.0300 3.0000 0.0018 0 0 0 0 0 3 0.0278 0 0.0300 3.0000 0 0.0009 0 0 0 0 0 0 0 0 0 4 0.0139 0 0.0300 3.0000 0 0 0 0.0070 0 0.0300 3.0000 0 0 0 0 0 0 0 0 6 0 0 0.0300 3.0000 0 0 0.0139 g 7 0.0171 0 0.0554 0 0 0 0 5.5359 0 0 0 0 0 0 0 o r., 8 0.0171 0 0.0554 0 0 0 0 5.5359 0 0 .., 9 0.0347 0 0.1549 15.0000 0 0 0 0 0.1000 5.3111 0 0 0 0 0 , .2 , 0.0532 0 0.1116 11.5000 0 0 0 0 0.3000 0 2.9669 0 0 0 0 11 0.0139 0 0.0600 6.0000 0 0 0 0 0 0 12 0 0 0.0694 3.0000 0 0 0 0 0 0 0 0 0 0 3.9407 13 0 0 0.0400 0 0 0 0 0 0 0 0 0.0153 4.0000 0 0 14 0 0 0.0765 0 0 0 0 0 0 0 0 0 4.0000 3.6467 0 0.0134 0 0.0035 0 0 0 0 0.3468 0 0 0 16 0 0.0230 0.0300 0.0624 0 0 0 0 0 0 0 0 0 0.1197 0 1-d n ,-i cp t.., =
u, -c-:--, c, .6.
u, =
C
i..) o o o Part B Composition (grams) o Example vi i..) 1 0.0139 0 0.0394 3.9407 0 0 0 0 2 0.0139 0 0.0394 3.9407 0 0 0 0 3 0.0278 0 0.0394 3.9407 0 0 0 0 4 0 0 0.0394 3.9407 0/0139 0 0 0 0 0 0.0394 3.9407 0.0070 0 0 0 0 0 0 6 0 0 0.0394 3.9407 0.0139 0 0 0 7 0.0171 0 0.0300 0 0 3.0000 0 0 8 0 0 0.0300 0 0.0171 3.0000 0 0 0 0 0 0 0 "
_.]
, 9 0 0 0.1974 19.7034 0.0347 0 0.1000 1.8916 0 0 0 0 0 .
(.,..) 10 0 0 0.1516 15.1059 0.0532 0 0.3000 0 1.0631 0 0 0 0 11 0 0 0.0788 7.8814 0 0 0 0 0 0 0 0 0 , _.]
, 0 0 0 0 0 .
, , 13 0 0 0.0365 0 0 0 0 0 0 0.0153 3.6467 0 0 .
0.0134 0 0.0300 0 0 0 0 0 0 0 0 3.0000 0 16 0 0.0160 0.0300 0 0 0 0 0 0 0 0 0 3.0000 1-d n ,-i cp t.., =
u, -a-, c., .6.
u, =
Evaluations The following molds were used for curing evaluations:
Glass mold. An elongate 25 cm by 1.27 cm by 0.1 cm deep silicone rubber mold over a glass base, with an opaque silicone rubber sheet covering all but 1.27 cm of one end of the mold.
Aluminum, frit glass and black coated wood molds. An elongate 10 cm by 1.27 cm by 0.1 cm deep silicone rubber mold over an aluminum, frit glass or black coated wood base, with an opaque silicone rubber sheet covering all but 1.27 cm of one end of the mold.
TeflonTm mold. A 8.4 cm by 3.2 cm by 0.2 cm deep silicone rubber mold over a TeflonTm base, with an opaque silicone rubber sheet covering all but 2 cm of one end of the mold.
The curable composition was applied to the mold, an opaque silicone rubber sheet was then laid over the curable composition according to the dimensions described above.
The remaining exposed area of the composition was then exposed to a 88 mW 455 nm LED light source, at a distance of 1.27 cm, for between 10 ¨ 60 seconds. The following thiol-ene curing evaluations are listed in Tables 2 and 3.
Cure Length (cm) After 60 Example Mold second Exposure Fully Cured Partially Cured Glass 4 cm 14 cm 11 Glass 3 cm 8 cm Teflon 7.6 cm N/A
Aluminum 2.2 cm N/A
Black frit 1.3 cm N/A
12 primed glass Glass 8 cm 13 cm Black coated 4 cm 4 cm wood surface Glass 4 cm 4.5 cm 13 Black coated 1 cm 3 cm wood surface Black coated 14 < 1 cm 1 cm wood surface Approximate Maximum Approximate Photo Approximate Redox Example Processing Time Cure Time (seconds) Cure Time (minutes) (minutes) 1 0 N/A* 0.25 2 0 N/A* 0.25 7 0 N/A* 0.25 0 N/A* 5 * N/A: The thiol-ene composition cured during the mixing step and could not be 5 applied to the mold.
The Tg of photo-initiated and redox-initiated Examples 1, 7, and 15 were measured using a model "DSC Q2000" differential scanning calorimeter, obtained from TA
Instruments, New Castle, Delaware. Results are listed in Table 4.
Tg ( C) Redox Example Photo initiation initiation 1 -44 C -46 C to -41 C
7 -44 C -51 C to -50 C
Various modifications and alterations of this disclosure will become apparent to those skilled in the art without departing from the scope and principles of this disclosure, and it should be understood that this disclosure is not to be unduly limited to the illustrative embodiments set forth hereinabove.
Objects and advantages of this disclosure are further illustrated by the following examples, but the particular materials and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit this disclosure.
Examples Unless otherwise noted, all reagents were obtained or are available from Sigma-Aldrich Company, St. Louis, Missouri, or may be synthesized by known methods.
Unless otherwise reported, all ratios are by weight percent.
The following abbreviations are used to describe the examples:
oc: degrees Centigrade cm: centimeter LED: light emitting diode mL: milliliter Mn: Molecular weight mW: milliWatt nm: nanometer Tg: glass transition temperature UV: ultraviolet Definitions Maximum Processing Time: The time taken for the thiol-ene curable composition to begin gelling.
Photo Cure Time: The cure time of the portion of thiol-ene curable composition exposed to light.
Dark Cure Time: The cure time of the portion of thiol-ene curable composition not exposed to light.
Redox Cure Time: The cure time for the portion of thiol-ene curable composition initiated by redox mechanism.
Dark Cure Distance: The length of thiol-ene composition dark cured, as measured from the leading edge of the opaque silicone rubber sheet.
Materials.
Abbreviations for the materials used in the examples are as follows:
A-200: A hydrophilic fumed silica, obtained under the trade designation "AEROSIL 200" from Evonik Industries AG, Essen, Germany.
BPO: Benzoyl peroxide.
CMP: 3-chloro-2-methyl-1-propene.
DAB CO: 1,4-Diazabicyclo[2.2.2]octane, obtained under the trade designation "DABCO" from Air Products & Chemicals, Inc., Allentown, Pennsylvania.
DHEPT: dihydroxyethyl-p-toluidine.
DIPEA: N,N-diisopropylethylamine, obtained from Alfa Aesar, Ward Hill, Massachusetts.
DMDO: 1,8-Dimercapto-3,6-dioxaoctane, obtained from Arkena, Inc., King of Prussia, Pennsylvania.
DSW: An aluminosilicate clay, obtained under the trade designation "DRAGONITE SELECT WHITE" from Applied Minerals, Inc., New York, New York.
DVE-3: Triethyleneglycol divinylether, obtained under the trade designation "RAPI-CURE DVE-3" from Ashland Specialty Ingredients, Wilmington, Delaware.
E-8220: A diglycidylether of bisphenol F, obtained under the trade designation "EPALLOY 8220" from Emerald Performance Materials, LLC, Cuyahoga Falls, Ohio.
1-819: Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide, obtained under the trade designation "IRGACURE 819" from BASF Corp., Florham Park, New Jersey.
MEHQ: Hydroquinone monomethyl ether.
MEKP: Methyl ethyl ketone peroxide, obtained from 3M Company, St.
Paul, Minnesota.
PMETA: N, N, N', N", N"-pentamethyl-diethylenetriamine, obtained from TCI
America, Portland, Oregon..
S-31: Nanoparticle (70 ¨ 100 nm) calcium carbonate, obtained under the trade designation "SOCAL 31" from Solvay Chemicals, Inc., Houston, Texas.
TAC: Triallylcyanurate, obtained from Sartomer, Inc., Exton, Pennsylvania.
TBPO: di-tert-butyl peroxide, obtained from TCI America.
TEMPO: 2,2,6,6-tetramethyl-1-piperidinyloxy, obtained from Oakwood Products, Inc., West Columbia, South Carolina.
TPTMP: Trimethylolpropane tris(3-mercaptopropionate).
TVCH: 1,2,4-Trivinylcyclohexane, obtained from BASF Corp., Florham Park, New Jersey.
TVBT: tris[4-(vinyloxy)butyl] trimellitate, obtained from Allied Signal, Inc., Morristown, New Jersey.
VAZO 52: 2,2'-azobis(2,4-dimethyl-pentanenitrile), obtained under the trade designation "VAZO 52" from E.I. du Dupont de Nemours and Company, Wilmington, Delaware.
VAZO 67: 2,2' azobis-(2-methylbutyronitrile), obtained under the trade designation "VAZO 67" from E.I. du Dupont de Nemours and Company.
Polythioethers were synthesized as follows:
PTE-1. Into a 1000-mL round bottom flask equipped with an air-driven stirrer, thermometer, and a dropping funnel, was added 392.14 grams (2.15 moles) DMDO
and 82.23 grams (0.25 moles) E-8220. To this mixture was added 0.15 grams DABCO.
The system was flushed with nitrogen, then mixed and heated for four hours at 70 C. 12.5 grams (0.05 moles) TAC was added, followed by approximately 0.15 grams VAZO 67. With continuous stirring, the mixture was heated to 60 C, and held at this temperature for approximately 30 -45 minutes. 313.13 grams (1.55 moles) DVE-3 were slowly added drop-wise to the flask over a period of 45 - 60 minutes, keeping the temperature at approximately between 68 - 80 C. Additional VAZO 67 was added in approximately 0.15 gram increments over approximately 6 hours, for a total of approximately 0.6 grams. The temperature was raised to 100 C and the material degassed for approximately 10 minutes. The resultant polythioether was approximately 3200 Mn with a 2.2 functionality.
PTE-2. Into a 500 mL four-neck, round bottom flask fitted with a stirrer, thermometer, chilled water condenser and a pressure equalizing addition funnel was added 206.54 grams of a 20% aqueous solution of sodium hydroxide (1.033 moles). To this was added, drop wise with stirring, 94.08 grams (0.51 moles) DMDO, and the mixture then allowed to cool to approximately 21 C. 96.4 grams (1.065 moles) CMP
was added drop wise with vigorous stirring, and stirring continued for another 2 hours.
The mixture was then held at 21 C for approximately 16 hours, after which 150 grams of a clear layer was decanted. NMR analysis confirmed the decanted layer to be CMP
diene.
Into a 100-mL round bottom flask equipped with an air-driven stirrer, thermometer, and a dropping funnel, was added 39.64 grams (0.22 moles) DMDO and 4.10 grams (0.0125 moles) E-8220. To this mixture was added 0.02 grams DABCO. The system was flushed with nitrogen, then mixed and heated for 1.5 hours at 60 - 70 C.
3.66 grams (.0125 moles) CMP diene was added followed by approximately 0.01 grams VAZO 52. With continuous stirring, the mixture was heated to 60 C, and held at this temperature for approximately 1.5 hrs. 0.83 grams (0.005 mole) TVCH were added and the temperature maintained for another 1.5 hrs. 31.80 grams (0.157 moles) were slowly added drop-wise to the flask over a period of 45 - 60 minutes, keeping the temperature at approximately 70 C. Additional VAZO 52 was added in approximately 0.01 gram increments over approximately 16 hours, for a total amount of about 0.4 grams. The temperature is raised to 100 C and the material degassed for approximately 10 minutes. The resultant polythioether was approximately 3200 Mn with a 2.2 functionality.
Example /
Part A was prepared by dissolving 0.0139 grams BP0 and 0.0300 grams 1-819 in 3.0000 grams DVE-3 in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C. Part B was prepared by dissolving 0.0139 grams DHEPT and 0.0394 grams 1-819 in 3.9407 grams TPTMP in a 20 mL amber vial, also on a roll mill for 8 hours at 21 C.
Part A
was then added to Part B and manually stirred for one minute until homogeneously dispersed.
Examples 2-8 The procedure generally described in Example 1 for preparing homogeneous mixtures of peroxide, photo initiator and vinyl monomer in Part A, and amine, photo initiator and thiol monomer in Part B, was repeated according to the formulations listed in Tables 1A and 1B.
Example 9 Part A was prepared by dissolving 0.0347 grams BP0 and 0.1549 grams 1-819 in 15.0000 grams DVE-3 in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C.
The solution was transferred to a speed mixer jar. 0.1000 grams A-200 and 5.3111 grams clay were added to the solution and homogeneously dispersed by means of a high speed mixer at 2,000 rpm for one minute. Part B was prepared by dissolving 0.0347 grams DIPEA and 0.1974 grams 1-819 in 19.7034 grams TPTNIP in a 40 mL
amber vial, also on a roll mill for 40 minutes at 21 C. The solution was transferred to a speed mixer jar. 0.1000 grams A-200 and 1.8916 grams clay were added to the solution and homogeneously dispersed by means of the high speed mixer at 2,000 rpm for one minute. Part A and Part B were homogeneously dispersed through a static mixer.
Example 10 The procedure generally described in Example 9 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
Example 11 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
Example 12 0.0694 grams 1-819 was dissolved in a mixture of in 3.0000 grams DVE-3 and 3.9407 grams TPTMP in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C
Example /3 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
Example 14 0.0765 grams 1-819 was dissolved in a mixture of in 4.0000 grams DMDO and 3.3467 grams TAC in a 20 mL amber vial, on a roll mill for 40 minutes at 21 C
Example 15 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B, wherein Part B was mixed for 24 hours rather than 8 hours.
Example 16 The procedure generally described in Example 1 for preparing homogeneous mixtures of Part A and Part B was repeated according to the formulations listed in Tables 1A and 1B.
i.) o o o o vi i.) Part A Composition (grams) Example 1 0.0139 0 0.0300 3.0000 0 0 0 2 0.0139 0 0.0300 3.0000 0.0018 0 0 0 0 0 3 0.0278 0 0.0300 3.0000 0 0.0009 0 0 0 0 0 0 0 0 0 4 0.0139 0 0.0300 3.0000 0 0 0 0.0070 0 0.0300 3.0000 0 0 0 0 0 0 0 0 6 0 0 0.0300 3.0000 0 0 0.0139 g 7 0.0171 0 0.0554 0 0 0 0 5.5359 0 0 0 0 0 0 0 o r., 8 0.0171 0 0.0554 0 0 0 0 5.5359 0 0 .., 9 0.0347 0 0.1549 15.0000 0 0 0 0 0.1000 5.3111 0 0 0 0 0 , .2 , 0.0532 0 0.1116 11.5000 0 0 0 0 0.3000 0 2.9669 0 0 0 0 11 0.0139 0 0.0600 6.0000 0 0 0 0 0 0 12 0 0 0.0694 3.0000 0 0 0 0 0 0 0 0 0 0 3.9407 13 0 0 0.0400 0 0 0 0 0 0 0 0 0.0153 4.0000 0 0 14 0 0 0.0765 0 0 0 0 0 0 0 0 0 4.0000 3.6467 0 0.0134 0 0.0035 0 0 0 0 0.3468 0 0 0 16 0 0.0230 0.0300 0.0624 0 0 0 0 0 0 0 0 0 0.1197 0 1-d n ,-i cp t.., =
u, -c-:--, c, .6.
u, =
C
i..) o o o Part B Composition (grams) o Example vi i..) 1 0.0139 0 0.0394 3.9407 0 0 0 0 2 0.0139 0 0.0394 3.9407 0 0 0 0 3 0.0278 0 0.0394 3.9407 0 0 0 0 4 0 0 0.0394 3.9407 0/0139 0 0 0 0 0 0.0394 3.9407 0.0070 0 0 0 0 0 0 6 0 0 0.0394 3.9407 0.0139 0 0 0 7 0.0171 0 0.0300 0 0 3.0000 0 0 8 0 0 0.0300 0 0.0171 3.0000 0 0 0 0 0 0 0 "
_.]
, 9 0 0 0.1974 19.7034 0.0347 0 0.1000 1.8916 0 0 0 0 0 .
(.,..) 10 0 0 0.1516 15.1059 0.0532 0 0.3000 0 1.0631 0 0 0 0 11 0 0 0.0788 7.8814 0 0 0 0 0 0 0 0 0 , _.]
, 0 0 0 0 0 .
, , 13 0 0 0.0365 0 0 0 0 0 0 0.0153 3.6467 0 0 .
0.0134 0 0.0300 0 0 0 0 0 0 0 0 3.0000 0 16 0 0.0160 0.0300 0 0 0 0 0 0 0 0 0 3.0000 1-d n ,-i cp t.., =
u, -a-, c., .6.
u, =
Evaluations The following molds were used for curing evaluations:
Glass mold. An elongate 25 cm by 1.27 cm by 0.1 cm deep silicone rubber mold over a glass base, with an opaque silicone rubber sheet covering all but 1.27 cm of one end of the mold.
Aluminum, frit glass and black coated wood molds. An elongate 10 cm by 1.27 cm by 0.1 cm deep silicone rubber mold over an aluminum, frit glass or black coated wood base, with an opaque silicone rubber sheet covering all but 1.27 cm of one end of the mold.
TeflonTm mold. A 8.4 cm by 3.2 cm by 0.2 cm deep silicone rubber mold over a TeflonTm base, with an opaque silicone rubber sheet covering all but 2 cm of one end of the mold.
The curable composition was applied to the mold, an opaque silicone rubber sheet was then laid over the curable composition according to the dimensions described above.
The remaining exposed area of the composition was then exposed to a 88 mW 455 nm LED light source, at a distance of 1.27 cm, for between 10 ¨ 60 seconds. The following thiol-ene curing evaluations are listed in Tables 2 and 3.
Cure Length (cm) After 60 Example Mold second Exposure Fully Cured Partially Cured Glass 4 cm 14 cm 11 Glass 3 cm 8 cm Teflon 7.6 cm N/A
Aluminum 2.2 cm N/A
Black frit 1.3 cm N/A
12 primed glass Glass 8 cm 13 cm Black coated 4 cm 4 cm wood surface Glass 4 cm 4.5 cm 13 Black coated 1 cm 3 cm wood surface Black coated 14 < 1 cm 1 cm wood surface Approximate Maximum Approximate Photo Approximate Redox Example Processing Time Cure Time (seconds) Cure Time (minutes) (minutes) 1 0 N/A* 0.25 2 0 N/A* 0.25 7 0 N/A* 0.25 0 N/A* 5 * N/A: The thiol-ene composition cured during the mixing step and could not be 5 applied to the mold.
The Tg of photo-initiated and redox-initiated Examples 1, 7, and 15 were measured using a model "DSC Q2000" differential scanning calorimeter, obtained from TA
Instruments, New Castle, Delaware. Results are listed in Table 4.
Tg ( C) Redox Example Photo initiation initiation 1 -44 C -46 C to -41 C
7 -44 C -51 C to -50 C
Various modifications and alterations of this disclosure will become apparent to those skilled in the art without departing from the scope and principles of this disclosure, and it should be understood that this disclosure is not to be unduly limited to the illustrative embodiments set forth hereinabove.
- 17-
Claims (15)
1. A composition that is curable to a polythioether polymer, comprising:
a) a dithiol monomer;
b) a diene monomer;
c) a radical cleaved photoinitiator;
d) a peroxide; and e) an amine;
where the peroxide and amine together are a peroxide-amine redox initiator.
a) a dithiol monomer;
b) a diene monomer;
c) a radical cleaved photoinitiator;
d) a peroxide; and e) an amine;
where the peroxide and amine together are a peroxide-amine redox initiator.
2. The composition according to claim 1 where the amine is a tertiary amine.
3. The composition according to any of the preceding claims where the amine is selected from the group consisting of dihydroxyethyl-p-toluidine, N,N-diisopropylethylamine, and N, N, N', N", N"-pentamethyl-diethylenetriamine.
4. The composition according to any of the preceding claims where the peroxide is selected from the group consisting of di-tert-butyl peroxide, methyl ethyl ketone peroxide, and benzoyl peroxide.
5. The composition according to any of the preceding claims additionally comprising:
f) a polythiol monomer having three or more thiol groups.
f) a polythiol monomer having three or more thiol groups.
6. The composition according to any of the preceding claims additionally comprising:
g) at least one filler.
g) at least one filler.
7. The composition according to any of the preceding claims additionally comprising:
h) at least one nanoparticle filler.
h) at least one nanoparticle filler.
8. The composition according to any of the preceding claims additionally comprising:
j) calcium carbonate.
j) calcium carbonate.
9. The composition according to any of the preceding claims additionally comprising:
k) nanoparticle calcium carbonate.
k) nanoparticle calcium carbonate.
10. The composition according to any of the preceding claims which is curable by actinic light source.
11. The composition according to any of the preceding claims which is curable by blue light source.
12. The composition according to any of the preceding claims which is curable by UV light source.
13. A sealant comprising the composition according to any of the preceding claims.
14. A polythioether polymer obtained by cure of any the composition according to any of claims 1-12.
15. The polythioether polymer according to claim 14 having a Tg less than -50°C.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462095952P | 2014-12-23 | 2014-12-23 | |
US62/095,952 | 2014-12-23 | ||
PCT/US2015/067450 WO2016106352A1 (en) | 2014-12-23 | 2015-12-22 | Dual cure polythioether |
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CA2970960A1 true CA2970960A1 (en) | 2016-06-30 |
Family
ID=55221521
Family Applications (1)
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---|---|---|---|
CA2970960A Abandoned CA2970960A1 (en) | 2014-12-23 | 2015-12-22 | Dual cure polythioether |
Country Status (8)
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US (2) | US10703906B2 (en) |
EP (1) | EP3237494B1 (en) |
JP (1) | JP7016698B2 (en) |
KR (1) | KR20170097754A (en) |
CN (1) | CN107108894B (en) |
BR (1) | BR112017013742A2 (en) |
CA (1) | CA2970960A1 (en) |
WO (1) | WO2016106352A1 (en) |
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WO2021094887A1 (en) * | 2019-11-15 | 2021-05-20 | 3M Innovative Properties Company | Curable compositions and methods of making and using the same |
CN113929908B (en) * | 2021-09-28 | 2023-08-04 | 武汉纺织大学 | Bio-based antibacterial adhesive and preparation method thereof |
WO2023167014A1 (en) * | 2022-03-01 | 2023-09-07 | ナミックス株式会社 | Resin composition, adhesive, sealing material, cured product, semiconductor device, and electronic parts |
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-
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- 2015-12-22 US US15/533,758 patent/US10703906B2/en active Active
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- 2015-12-22 WO PCT/US2015/067450 patent/WO2016106352A1/en active Application Filing
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- 2015-12-22 JP JP2017531873A patent/JP7016698B2/en active Active
- 2015-12-22 KR KR1020177020355A patent/KR20170097754A/en unknown
- 2015-12-22 EP EP15828442.2A patent/EP3237494B1/en active Active
- 2015-12-22 CN CN201580070296.7A patent/CN107108894B/en active Active
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Also Published As
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CN107108894A (en) | 2017-08-29 |
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JP7016698B2 (en) | 2022-02-07 |
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CN107108894B (en) | 2021-04-06 |
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