CA2935427A1

CA2935427A1 - Manufacture of a security element having color-change properties

Info

Publication number: CA2935427A1
Application number: CA2935427A
Authority: CA
Inventors: Winfried Hoffmuller; Theodor Burchard; Patrick ENGELMANN; Christian Fuhse
Original assignee: Giesecke and Devrient GmbH
Current assignee: Giesecke and Devrient Currency Technology GmbH
Priority date: 2014-02-07
Filing date: 2015-02-06
Publication date: 2015-08-13
Anticipated expiration: 2035-02-06
Also published as: CA2935427C; WO2015117765A1; DE102014001688A1; CN105916697B; EP3102420B1; EP3102420A1; CN105916697A

Abstract

The invention relates to a method for producing a security element, the method comprising the steps: Providing a carrier material (200, 300, 400, 500) having at least one region (106, 202, 302, 402, 502, 606) to be coated; arranging a reflection layer (204, 304, 410) in the region to be coated; arranging a structured spacer layer (206, 306, 412) on the reflection layer, wherein the structured spacer layer is suited to protect the reflection layer from a removal; arranging an absorber layer (212, 312, 416, 512) at least on the structured spacer layer; and removing the reflection layer in those regions, where the removal of the reflection layer is not obstructed by the protection of the structured spacer layer. The invention further relates to a security element produced by using said method, and to a value document having a security element such as this.

Description

Manufacture of a security element having color-change properties [0001] This invention relates to a method for manufacturing a security element and to a security element and a value document containing said security element.

[0002] Value documents as intended by the invention are, inter alia, bank notes, shares, bonds, deeds, vouchers, checks, air tickets, high-value admission tickets, labels for product authentication, credit cards or cash cards, but also other documents at risk of forgery, such as passports, identification cards or other identity documents.

[0003] Value documents, in particular bank notes, are usually produced from paper substrates, polymer substrates or combinations of paper and polymer which have particular security features, such as a security thread at least partly incorporated into the paper or a watermark. As further security features, so-called window foils, security threads, security bands can be bonded/laminated to the value document or incorporated therein. Security elements usually comprise a polymer or polymer compositions as a carrier material or base material.
Typically, security elements have optically variable security features such as holograms or certain color-shift effects to thereby guarantee better anti-forgery security.
The particular advantage of optically variable security elements is that the security features on said security elements cannot be imitated by mere copying using a copying machine, since effects of an optically variable security feature are lost or even only appear black through copying.

[0004] In existing value documents with optically variable security elements having color-shift effects, however, it is disadvantageous that the manufacture of the required thin-film elements is very time-consuming and cost-intensive. For example, when manufacturing a thin-film element by means of physical vapor deposition, in particular the manufacture of the necessary spacer layer is very time-consuming. For a definition and functionality of thin-film elements, reference is made by way of example to the prints WO 2009/149831 A2 and WO
2011/032665 Al.

[0005] Further, the incorporation of additional security features such as so-called negative patterns or negative text in the region of the color-shift effects/thin-film elements is elaborate and can frequently not be done with satisfactory quality. For example, incorporating negative patterns into a region with a color-shift effect requires that the layers of the thin-film element that lead to the color-shift effect must be removed at least partly at the places where the negative patterns are to be incorporated.

[0006] It is hence an object of the present invention to provide a method that enables security elements having optically variable effects to be manufactured in a less time-consuming and cost-intensive manner.

[0007] It is likewise an object of the present invention to provide a method that enables security elements having optically variable effects and additional negative patterns to be manufactured in high quality.

[0008] These objects are achieved by the subject matter of the independent claims. Preferred embodiments are defined in the dependent claims.
100091 A first aspect of the invention relates to a method for manufacturing a security element comprising the steps of:
- supplying a carrier material having at least one region to be coated;
- arranging a reflective layer in the region to be coated;
- arranging a structured spacer layer at the reflective layer, wherein the structured spacer layer is adapted to protect the reflective layer from a removing;
- arranging an absorber layer at least at the structured spacer layer; and - removing the reflective layer in the regions where the removing of the reflective layer is not prevented by the protection of the structured spacer layer.

100101 The carrier material can have one or a plurality of regions to be coated.
A carrier material preferably comprises two principal faces which stand or lie opposite each other. The carrier material is preferably a foil-like material.
The at least one region to be coated is preferably arranged at a principal face of the carrier material. When the carrier material has a plurality of regions to be coated, they can be arranged only at one of the two principal faces or at both principal faces of the carrier material.
[0011] The carrier material's region to be coated can have different areal shapes. For example, the region to be coated can be of rectangular, oval, star-shaped or wiggly configuration. The shape and size of the region to be coated is preferably defined or determined in a method step. The carrier material's region to be coated can have a surface structure and/or surface condition that differs from other regions of the carrier material. The carrier material has, in other words, an area that is defined as a region to be coated.
100121 The step of "arranging a reflective layer in the region to be coated"
preferably comprises that the reflective layer is arranged or applied on or at/above the area of the carrier material that is defined as a region to be coated.
100131 Preferably, the reflective layer is arranged or applied in the region to be coated over the full area. Preferably, the reflective layer can also be arranged in regions other than that to be coated. The reflective layer can for example be applied or vapor-deposited by means of physical vapor deposition. Further preferably, the reflective layer can also be applied by printing technology.
The thickness of the reflective layer preferably lies in the range of 5 nm to 200 nm, preferably 5 nm to 100 nm, particularly preferably 5 nm to 50 nm.
[00141 Preferably, the step of "arranging a structured spacer layer at the reflective layer, wherein the structured spacer layer is adapted to protect the reflective layer from a removing" is to be understood such that the reflective layer is arranged substantially between the carrier material and the structured spacer layer after the arranging of the structured spacer layer.
100151 A structured spacer layer is to be understood in particular to mean that the spacer layer is not arranged at/above the reflective layer uniformly or over the full area. In other words, after an arranging a structured spacer layer does not have the same layer thickness or layer height at every place of the region to be coated.
Rather, due to the structured spacer layer there are places/subregions the region to be coated where the layer thickness of the structured spacer layer is zero.
[0016] After the arranging of the structured spacer layer at the reflective layer there are two different regions or portions in the region to be coated, namely first regions/portions comprising the carrier material, the reflective layer and the structured spacer layer, and second regions/portions comprising the carrier material and the reflective layer but no structured spacer layer or a structured spacer layer with a layer thickness that is too small, so that the reflective layer is not protected by the structured spacer layer in said second regions. In other words, in this case the reflective layer is covered by the structured spacer layer only regionally or they are arranged one over the other only in some subregions of the region to be coated.
[0017] The structured spacer layer is adapted to protect the reflective layer from a removing. In other words, the structuring of the structured spacer layer pre-specifies in which (sub-)regions of the region to be coated the reflective layer can be removed/detached/dissolved/ablated. The structured spacer layer therefore serves as a mask to enable a selective removing of the reflective layer.
[0018] Advantageously, the reflective layer can hence only be detached where the structured spacer layer was not arranged or undershoots a minimum layer thickness or layer height. Therefore, the reflective layer is protected in selected or certain (sub-)regions in the region to be coated from a removing due to the structure of the structured spacer layer.
[0019] Preferably, the structured spacer layer forms a predetermined motif or pattern such as a character, a character string and/or an image. Said motif or pattern determines the structure of the structured spacer layer. The motif can for example be visible or recognizable to a viewer when the viewer looks in the direction of the principal face normal or perpendicularly to the carrier material's principal face having the region to be coated.
[0020] The step of "arranging an absorber layer at least at the structured spacer layer" is to be understood such that the absorber layer is in any case arranged at/above the structured spacer layer.
[0021] In one embodiment example, the absorber layer can additionally be arranged at the regions of the reflective layer and/or of the carrier material that are not protected by the structured spacer layer. In other words, in this case the absorber layer is arranged in the region to be coated over the full area.
[0022] The step of "removing the reflective layer in the regions where the removing of the reflective layer is not prevented by the protection of the structured spacer layer" comprises in particular the cases of:
- removing the reflective layer in the (sub-)regions where the structured spacer layer is not arranged;
- removing the reflective layer in the (sub-)regions of the reflective layer that are not covered by the structured spacer layer;
- removing the reflective layer in the (sub-)regions where the structured spacer layer undershoots a minimum layer thickness, so that in said subregions/regions no protection from a removing is given by the structured spacer layer.
[0023] In other words, the reflective layer is not removed where the structured spacer layer acts as a mask.

[0024] Advantageously, the structure of the structured spacer layer pre-specifies in which (sub-)regions of the area that defines the region to be coated the reflective layer can be removed. Therefore, the reflective layer can be removed selectively, although the means employed for removing is applied over the full area or not selectively in the region to be coated. For example, the means employed for removing can be a laser beam with a planar cross section (e.g. I
cm2), wherein the entire region to be coated is treated with the laser steel but a removing of the reflective layer is possible only in the fields/(sub-)regions not protected by the structure of the structured spacer layer.
[0025] If for example an etching means is employed for removing the reflective layer, the security element can be completely dipped into the etching means or brought in contact with the etching means, wherein due to the structure of the structured spacer layer a removing of the reflective layer can only take place where the (predetermined) structure of the structured spacer layer does not prevent/allows the removing.
[0026] In other words, the structured spacer layer serves as an etching mask or exposure mask.
[0027] Accordingly, after a removing of the reflective layer in the regions where the removing of the reflective layer is not prevented by the protection of the structured spacer layer, the following regions are present:
- regions containing the reflective layer, the structured spacer layer and the absorber layer; said regions can also be designated thin-film-element regions; and - regions containing no reflective layer and no spacer layer; said regions can also be designated negative-pattern regions.
[0028] In particular, the layer sequence of reflective layer, structured spacer layer and absorber layer, wherein the structured spacer layer is arranged between reflective layer and absorber layer, forms a thin-film construction with a color-shift effect or a thin-film element with a color-shift effect. In dependence on the layer thicknesses of the reflective layer, the structured spacer layer and the absorber layer, transmission-view color effects can also be present instead of color-shift effects.
100291 Preferably, the step of "arranging an absorber layer..." is performed (temporally) before the step of "removing the reflective layer...".
[0030] Preferably, in this embodiment the absorber layer is arranged both at the structured spacer layer and at (sub-)regions/partial regions of the reflective layer. In other words, in (sub-)regions of the region to be coated there are so-called second regions/second portions where the absorber layer is arranged directly at the reflective layer. Consequently, in this case the removing of the reflective layer causes the absorber layer to be removed in the (sub-)regions where the structured spacer layer was not arranged. In other words, in said subregions there is no reflective layer, no spacer layer and no absorber layer. Said subregions are negative-pattern regions. Subregions containing a reflective layer, a spacer layer and an absorber layer are thin-film-element regions.
[0031] Advantageously, the reflective layer can be removed where the absorber layer is arranged directly at the reflective layer when the absorber layer is transmissive to the removing means such as irradiation and/or etching means.
Preferably, the absorber layer is porous or holey, so that the absorber layer does not form a barrier for the removing means.
[0032] Simultaneous removing of the absorber layer and the reflective layer in only one method step is especially advantageous, since this enables the manufacturing time and the manufacturing expense of security elements with a color-shift effect or thin-film elements additionally containing negative patterns to be drastically reduced.

[0033] Preferably, the absorber layer has a thickness/height of 2 nm to 15 nm, since the transmissivity of the absorber layer for a removing of the reflective layer is influenced by the thickness of the absorber layer.
[0034] Particularly preferably, the method for manufacturing a security element comprises the steps of:
- supplying a carrier material having at least one region to be coated;
- arranging a reflective layer in the region to be coated over the full area;
- arranging a structured spacer layer at/on the reflective layer, wherein the structured spacer layer is adapted to protect the reflective layer from a removing;
- arranging an absorber layer in the region to be coated over the full area;
- simultaneously removing the reflective layer and the absorber layer in the regions where the removing of the reflective layer is not prevented by the protection of the structured spacer layer.
100351 Arranging an absorber layer in the region to be coated over the full area is effected such that the structured spacer layer is arranged between the absorber layer and the reflective layer, and in the regions where the structured spacer layer is not present the absorber layer is arranged directly at the reflective layer.
[0036] It is especially advantageous that the reflective layer and the absorber layer can be applied/arranged in the region to be coated over the full area and can nevertheless be removed regionally in a targeted manner by a single "removing"

method step. It is also advantageous that the reflective layer and the absorber layer are not removed in the "removing" method step in the regions where the structured spacer layer is present. Advantageously, the absorber layer is porous or transmissive to a corresponding removing means, so that the reflective layer is detached or dissolved in the regions where the reflective layer borders directly on the absorber layer. Due to the detachment or dissolution of the reflective layer, the absorber layer at the same time loses adhesion and is removed together with the reflective layer. In contrast, in the regions where the structured spacer layer lies between the absorber layer and the reflective layer the reflective layer is protected by the structured spacer layer. Although the absorber layer is also transmissive to a corresponding removing means in said regions, the structured absorber layer is not attacked by the corresponding removing means.
10037] According to an example, the absorber layer chosen can be chromium, the structured spacer layer chosen can be a printing ink with good flow, for example based on nitrocellulose, the reflective layer chosen can be aluminum.
As an etching means there can in this case be employed for example caustic sodium or phosphoric acid, which penetrates the chromium and dissolves the aluminum, while the binder or printing ink for the structured spacer layer is not impaired.
[0038] In particular, the absorber layer and/or the reflective layer can be applied by printing technology.
[0039] Alternatively, the step of removing the reflective layer is preferably performed (temporally) before the step of arranging the absorber layer.
[0040] Preferably, the absorber layer is arranged in this alternative only in the (sub-)regions where the structured spacer layer is present. In other words, the absorber layer is preferably arranged exclusively at the structured spacer layer.
[0041] Preferably, there thus arise (sub-)regions where no reflective layer, no structured spacer layer and no absorber layer are present (negative-pattern regions), which are arranged beside other (sub-)regions where the reflective layer, the structured spacer layer and the absorber layer are present (thin-film-element regions).
[0042] Arranging the absorbers layer is preferably effected employing a donor foil. Preferably, the donor foil can be a metal donor foil. The absorber layer can be arranged at the structured spacer layer e.g. with a roll-to-roll method or be transferred to the structured spacer layer by the donor foil.

9 100431 Further preferably, the method comprises the further step of "arranging a relief structure having elevated and recessed regions in the carrier material's region to be coated".
100441 When the relief structure is configured for example as a sine grating or crossed sine grating, the elevated regions lie where the underlying (normalized) sine function assumes the value 1 or has a values range of 1 to greater than 0. The recessed regions then lie for example at the value -1 or in the values range of -1 to smaller than 0.
[0045] Preferably, the relief structure is configured as an emboss structure.
Preferably, the carrier material can have an emboss structure. Alternatively or additionally, there can be arranged at a principal face of the carrier material at least in the region to be coated a relief layer, preferably of emboss lacquer, which is furnished with a relief structure/emboss structure. Preferably, the method can in this regard have the following step sequence:
a) supplying a carrier material having at least one region to be coated/one area defined as a region to be coated;
b) arranging a relief structure in the region to be coated;
c) arranging a reflective layer at the relief structure in the region to be coated.
[0046] Alternatively or additionally, a relief structure can be arranged after the arranging of the reflective layer, so that both the reflective layer and the emboss layer and/or the carrier material are furnished with a relief structure.
[0047] Further alternatively or additionally, a relief structure can be arranged after the arranging of the structured spacer layer, so that the relief structure is incorporated into the structured spacer layer.
[0048] Further alternatively or additionally, a relief structure can be arranged after the arranging of the absorber layer, so that the absorber layer itself and/or a (protective) layer covering the absorber layer have the relief structure.

[0049] Preferably, the method comprises the further step of "flattening out the relief structure by arranging the structured spacer layer at the reflective layer".
[0050] Preferably, the recessed regions of the relief structure are Filled with material of the structured spacer layer, so that the material of the structured spacer layer reaches at least the level of the elevated regions. Preferably, the material of the structured spacer layer is a liquid. Preferably, the relief structure is scraped off or drawn off/wiped off after an arranging/applying of the material of the structured spacer layer, so that the material of the structured spacer layer does not exceed, or only slightly exceeds, the level of the elevated regions. The term "slightly exceed" is to be understood in particular as a layer thickness/height exceeding the layer thickness/height up to the level of the elevated regions by up to 10%, preferably by up to 5%, of the layer thickness.
[0051] Advantageously, the drawing off/scraping off or wiping off of the relief structure after the applying of the material of the structured spacer layer causes excess material of the structured spacer layer to be removed. Consequently, material of the structured spacer layer can thus be saved in the course of the method/in the manufacturing process.
[0052] After the arranging at the relief structure, the structured spacer layer has (sub-)regions with a higher layer thickness/height and therebeside (sub-)regions with a lower layer thickness/height.
[0053] Preferably, the region to be coated has subregions having a layer thickness of the structured spacer layer of zero or slightly thicker than zero. In other words, the structured spacer layer has a structure that corresponds substantially to a negative of the relief structure.
[0054] Further preferably, the method comprises the further step of "removing the reflective layer in the elevated regions of the relief structure".

[0055] The structured spacer layer enables a removing of the reflective layer only in the (sub-)regions where the elevated regions are not, or only slightly, covered by the structured spacer layer or the level of the structured spacer layer does not exceed, or only slightly exceeds, the level of the elevated regions.
[0056] In other words, the reflective layer is removed in the regions where the reflective layer is not protected by the structured spacer layer.
[0057] When the level of the structured spacer layer is higher than that of the elevated regions, the structured spacer layer is first removed and then the reflective layer. Advantageously, the reflective layer is retained in the recessed regions of the relief structure after the end of the step of "removing the reflective structure in the elevated regions of the relief structure", since the structured spacer layer is not, or not completely, removed during the method step, and hence the reflective layer remains protected in the recessed regions.
[0058] Advantageously, the duration of a downstream step of "removing the reflective layer in the elevated regions of the relief structure" will be kept as short as possible by restricting the layer thickness of the structured spacer layer to a maximum measure/maximum, since then the desired or fixed removing of the reflective layer in the elevated regions of the relief structure is not delayed by a previously necessary removing of the structured spacer layer.
[0059] After a removing of the reflective layer in the elevated regions of the relief structure, an uneven surface structure may possibly be present. In other words, a relief structure can at least partly be present again. Hence, the method preferably comprises the further step of "flattening out the surface structure in the region to be coated" by - arranging material of the structured spacer layer; and/or - arranging filler.
[0060] Preferably, the filler or the filling material has a solids content of 100%.

[0061] Preferably, the structured spacer layer is arranged/applied in the form of a motif by printing technology.
100621 Preferably, the structured spacer layer is arranged by means of one or a plurality of rollers and/or cylinders. In particular, the number of rollers can vary.
The rollers/cylinders can transport lacquer and/or ink depending on the mutual speed. The arrangement of the motif, or the motif printing, is preferably effected by a letterpress form.
[0063] Preferably, the structured spacer layer is applied by means of flexographic printing. Alternatively or additionally, the structured spacer layer is applied by means of gravure printing. Alternatively or additionally, the structured spacer layer is applied by means of ink-jet printing. Alternatively or additionally, the structured spacer layer is applied by means of offset printing.
Alternatively or additionally, the structured spacer layer is applied by means of screen printing.
Alternatively or additionally, the structured spacer layer is arranged by means of 3D printing.
[0064] Preferably, the print unit for arranging the structured spacer layer can be encapsulated or atmospherically sealed, so that an atmosphere saturated with solvent is present in the print-unit region. Advantageously, the solvent-saturated atmosphere prevents/avoids a drying up of the printing ink or of the dielectric on rollers and/or cylinders.
[0065] Advantageously, by means of an arrangement/application of the structured spacer layer by printing technology one can achieve the desired layer thickness very fast for example in comparison to an application by means of physical vapor deposition. Further advantageously, upon an application by printing technology one can already achieve the structure or structuring of the structured spacer layer very simply upon the arranging, so that after an arrangement of a spacer layer there is no need for a further/downstream method step for structuring such a spacer layer. In contrast, upon the arranging of a spacer layer by means of physical vapor deposition, for example, there is usually applied a full-area/uniform or unstructured spacer layer which is then removed regionally e.g. by means of an etching operation to thereby obtain a structured spacer layer.
[0066] Preferably, the step of "removing the reflective layer..." comprises etching.
[0067] In other words, the reflective layer is removed by means of an etching operation or etching means as a removing means. Preferably, the etching means employed is caustic sodium or phosphoric acid.
[0068] Advantageously, the etching means penetrates the absorber layer, so as to establish a contact between etching means and reflective layer.
Advantageously, the reflective layer can therefore be dissolved or detached. Advantageously, the detaching of the reflective layer likewise undoes the firm bond/connection between the absorber layer and the carrier layer, so that the removing of the reflective layer at the same time removes the absorber layer. In the (sub-)regions where the structured spacer layer is arranged, the etching means can advantageously not contact the reflective layer after a penetrating of the absorber layer, so that the reflective layer and the absorber layer remain in place in said regions.
[0069] Alternatively or additionally, the step of "removing the reflective layer..." comprises lasering.
[0070] In other words, the reflective layer is removed by means of a laser-beam treatment as a removing means. Further preferably, the absorber layer is not detached or impaired by the laser radiation. Advantageously, the laser radiation can penetrate the absorber layer and remove the reflective layer.
Advantageously, the structured spacer layer protects the reflective layer sufficiently from the laser radiation, so that the reflective layer is not removed in the (sub-)regions where the structured spacer layer is arranged.

[0071] For example, the employed laser can emit infrared laser radiation, and the structured spacer layer have infrared-blocking properties, so that the laser radiation cannot penetrate the structured spacer layer.
100721 Preferably, the method comprises the further step of "arranging an adhesion-promoting layer".
[0073] Preferably, the adhesion-promoting layer is arranged (temporally) before the step of "arranging the reflective layer...". In other words, the adhesion-promoting layer is arranged between the carrier material and the reflective layer.
Advantageously, the bond or connection between the reflective layer and the carrier material is improved by the adhesion-promoting layer. When an emboss lacquer/emboss-lacquer layer is arranged between the carrier material and the reflective layer, the adhesion-promoting layer improves the bond of the carrier material and the reflective layer. The adhesion-promoting layer can comprise metallic and/or non-metallic materials.
[0074] Alternatively or additionally, the method comprises the further step of "applying a protective layer".
[0075] Advantageously, the protective layer is arranged after "arranging the absorber layer..." or "removing the reflective layer..." in order to protect the structures produced by means of the method. Advantageously, the protective layer is arranged in the (entire) region to be coated.
[0076] Preferably, the protective layer comprises a protective lacquer.
Alternatively or additionally, the protective layer comprises a heat-seal lacquer and/or a primer.
[0077] Preferably, the structured spacer layer has at least partly deformation properties which lead to deformation-induced color changes of the security element.

[0078] This makes a color change recognizable to a viewer in the deformed portions of the region to be coated in comparison to a non-deformed state after a deforming of the structured spacer layer.
100791 Advantageously, the deformation of the structured spacer layer leads to a (regional) color change of the security element or of the region to be coated in the deformed portions where the structured spacer layer has the deformation properties which lead to deformation-induced color-change properties of the security element.
[0080] Preferably, such a color change of the security element or the deformation of the structured spacer layer is reversible. Advantageously, the color change persists at least for some time after the deformation, so that the color change is still recognizable to a viewer for a while in a state that is no longer deformed.
[0081] Advantageously, after an arranging of the structured spacer layer the deformation-induced color-change properties can be adjusted or fixed. The deformation-induced color-change properties can be fixed by thermal cross-linking and/or vulcanization and/or radiation curing.
[0082] According to one embodiment, the entire structured spacer layer has deformation properties which lead to deformation-induced color-change properties of the security element. According to a further embodiment, only partial regions/portions of the structured spacer layer have deformation properties which lead to deformation-induced color-change properties of the region to be coated or of the security element. For example, the partial regions/portions of the structured spacer layer that are to have deformation properties for a color change can be defined or fixed by means of selective irradiation.
[0083] Preferably, it is fixable by means of a mask which portions of the security element or of the region to be coated are to have deformation-induced color-change properties. In other words, a mask is employed to furnish a structured spacer layer with portions having defotination properties for deformation-induced color changes of the security element.
[0084] Preferably, the mask protects the portions of the structured spacer layer that are to have or not to have deformation-induced color-change properties from an irradiation/vulcanization or thermal cross-linking.
100851 Preferably, such a mask is configured as a motif or pattern.
Consequently, it is possible that upon or after a deforming of the region to be coated a (further) pattern/motif is/becomes recognizable to a viewer due to the color change in the portions of the region to be coated with deformation-induced color-change properties.
100861 Preferably, a structured spacer layer having deformation properties which lead to deformation-induced color changes of the security element is of gel-like configuration at least in some portions. Preferably, the structured spacer layer is an elastomer. For example, bending or folding a security element having a structured spacer layer that is of gel-like or jelly-like configuration at least in some portions can cause a local change in the layer thickness of the structured spacer layer of gel-like configuration, so that said local layer-thickness change in the thin-film-element region reveals a color change of said thin-film-element region upon viewing of the security element.
[0087] Alternatively or additionally, deformation properties of the structured spacer layer which lead to a recognizable color change can be achieved by a swelling behavior differing at least in some portions. For example, this can cause a color change to become recognizable to a viewer, upon moistening of the security element, in the portions of the structured spacer layer having a stronger swelling behavior in comparison to the portions of the structured spacer layer having a lesser swelling behavior. Advantageously, the color change persists at least for some time after the swelling, so that the color change is still recognizable to a viewer after a moistening, for example after he has breathed on it and thereby caused a swelling.
[0088] According to a further embodiment, the entire structured spacer layer has a strong swelling behavior, so that after a moistening a color change is recognizable upon viewing of the security element due to a layer-thickness increase of the structured spacer layer brought about by swelling.
[0089] Preferably, the structured spacer layer has direction-dependent refractive indices.
[0090] In other words, the structured spacer layer is an anisotropic layer.
Advantageously, a viewer can recognize a different color-shift effect depending on the direction of viewing the region to be coated or the security element due to the direction-dependent refractive indices. For example, a (further) color-shift effect can be recognizable upon viewing the region to be coated from an oblique direction and turning/rotating the region to be coated around the principal-face normal in the centroid of the region to be coated. Preferably, said color-shift effect is different in color from the other color-shift effects in the region to be coated.
[0091] Preferably, the structured spacer layer has one or a plurality of colorants.
[0092] Preferably, the structured spacer layer has pigments. Preferably, the pigment size or pigment dimensions/diameter does not exceed the layer height or layer thickness of the structured spacer layer.
[0093] Preferably, the colorants and/or pigments comprise fluorescence properties.
[0094] Advantageously, the structured spacer layer has a toning or slight coloring, so that the structured spacer layer appears at least not completely transparent to a viewer.

[0095] Advantageously, a fluorescing or a toning or a slight coloring of the structured spacer layer enables the structured spacer layer to be visible or to be made visible to personnel upon manufacture of the security element. This can facilitate for example a check of the manufacturing process or of the method step of "arranging the structured spacer layer".
100961 Preferably, the structured spacer layer has a dry layer thickness of nm to 1100 nm, preferably 300 nm to 600 nm. Preferably, there is recognizable to a viewer of the security element having a structured spacer layer with a dry layer thickness/height of less than 350 nm a motif, in a (single) color, which is formed by the structured spacer layer.
[0097] At a dry layer thickness of the structured spacer layer of 350 nm a color-shift effect is recognizable to the viewer. At a dry layer thickness of the structured spacer layer of 30 nm to 80 nm no color-shift effect is recognizable, but rather a deep black.
[0098] Preferably, the security element has at least one relief structure such as a hologram and/or moth-eyes and/or microlenses and/or micromirrors.
[0099] Preferably, the relief structure can be provided with the step of "arranging a relief structure having elevated and recessed regions in the carrier material's region to be coated". Alternatively or additionally, there can be provided other/further relief structures which are arranged in other layers such as the emboss layer, the structured spacer layer, the absorber layer and/or the protective layer.
[0100] Preferably, the carrier material comprises a carrier foil.
Particularly preferably, the carrier material contains polyethylene terephthalate (PET) and/or polypropylene (PP), the carrier material being particularly preferably made of PET
or PP.

[0101] Preferably, the carrier material can be removed before the applying of the security element to a value-document substrate. Preferably, the security element comprises at least one adhesive layer or at least one release layer which is applied between the carrier material and the reflective layer.
[0102] Preferably, the reflective layer contains aluminum and/or silver. In particular, the reflective layer is an aluminum layer or a silver layer.
[0103] Preferably, the absorber layer contains a material transmissive to an etching means. Preferably, the absorber layer contains a material transparent or semi-transparent to laser radiation. In other words, the absorber layer contains a material at least semi-transparent to laser radiation. Preferably, the absorber layer contains chromium. In particular, the absorber layer is a chromium layer.
[0104] Preferably, the structured spacer layer is a dielectric. Preferably, the dielectric has resist-lacquer properties.
[0105] Preferably, the structured spacer layer is based on vinyl chloride copolymers with acid groups. Vinyl chloride copolymers with acid groups may be for example the product H 15/45 M from Wacker Chemie AG, which is sold under the trademark VINNOL . As specified by the manufacturer, H 15/45 M is a carboxyl group-containing terpolymer of approx. 84 wt.% vinyl chloride (VC) and approx. 15 wt.% vinyl acetate (VAc) as well as approx. 1 wt.% dicarboxylic acid.
According to the manufacturer, it is preferably used as a binder for lacquers and printing inks.
[0106] Preferably, the structured spacer layer is based on nitrocellulose.
This achieves a good flow of the structured spacer layer.
[0107] Preferably, the structured spacer layer is based on acrylate(s).
This enables a high transparency and later deformability through embossing or stamping. Advantageously, the structured spacer layer contains an acrylate flow-control additive such as Byk 361. The latter can advantageously promote an even surface structure of the structured spacer layer, so that the absorber layer can be arranged on such an even surface structure. Preferably, the structured spacer layer is based on acrylic acid ester. Preferably, the structured spacer layer is based on epoxide(s). Preferably, the structured spacer layer is based on polyurethane(s). The advantage of epoxides and polyurethane(s) is a good cross-linkability, so that a good stability is obtained upon overprinting with solvent-containing lacquers.

Preferably, the structured spacer layer can also be based on combinations of the above substances. Further preferably, the structured spacer layer is based on a water-soluble substance. Preferably, the structured spacer layer can be based on vinyl chloride copolymer with acid groups (e.g. VMCH, which is a product name of a vinyl chloride copolymer with acid groups and is manufactured by Dow Chemical Company). A sample formulation could be for example as follows: 20%
vinyl chloride copolymer with acid groups (VMCH), 20% methyl ethyl ketone (MEK), 20% ethyl acetate, 20% toluene, 20% butyl acetate. VMCH has a very good adhesion on metals. The contained solvent mixture is well suited for preventing drying artifacts. Polyvinyl butyral is likewise suitable. UV-reactive coatings can likewise be used.
[0108] According to one embodiment example, when an etchable layer (e.g.
aluminum) is applied as a reflector in the first step, for example, a photoresist can be applied even over the full area in a second step. Through an exposure there can be created washable/etchable and non-washable/non-etchable regions. Said exposure can be effected before or also after the applying of the absorber.
When the regions of the resist that have the corresponding sensitivity are now removed by washing/etching, the reflective layer can be structured either simultaneously, or in a following step with a further etching medium. In this procedure the absorber layer is structured as well, without having to be etched itself.
101091 Alternatively or additionally, the structured spacer layer comprises nematic liquid crystals. Advantageously, there can be supplied by means of nematic liquid crystals a structured spacer layer having direction-dependent refractive indices.
[0110] Preferably, nematic liquid crystals can be printed as a (structured) spacer layer. Preferably, said nematic liquid crystals are aligned by suitable arrangement/alignment methods, such as emboss arrangement, photo arrangement, arrangement by shear upon printing or arrangement based on the choice of substrate to be printed. When a spacer layer having such aligned nematic liquid crystals is supplied, further optically variable effects are obtained in addition to the color-shift effect based on the thin-film element. When the nematic liquid crystals form a uniform, altogether anisotropic structured spacer layer, then said structured spacer layer has a (different) refractive index dependent on the viewing direction. Consequently, the color-shift effect varies in dependence on the viewing direction. An additional color change results for example upon oblique viewing and horizontal rotation of the security element. When the nematic liquid crystals of the structured spacer layer are aligned regionally differently, the regionally differently aligned liquid crystals yield a (separate) motif. It can thereby be achieved that a uniform color is perceived upon nearly perpendicular viewing of the principal face of the security element, while the (separate) motif from the regionally differently aligned liquid crystals is/becomes recognizable upon tilting of the security element/oblique viewing of the principal face of the security element.
[0111] Preferably the structured spacer layer does not consist of Si02.
[0112] A further aspect relates to a security element, wherein the security element has been manufactured by one or a plurality of the previously described method steps and/or from the described aspects.
[0113] A security element according to this invention can contain in particular a foil or a multilayer substrate, wherein the multilayer substrate can also have a combination of fabric substrates and foils. For example, the security element can comprise a window region which serves to fill, or bridge, a hole in a value document or in the paper substrate of the value document. In other words, with the security element there can be incorporated/applied a security window in a value document. Preferably, the region to be coated is arranged in the window region of the security element. Alternatively, the security element can be applied to a value document, for example laminated or bonded thereto. The security element can be a security thread or security band, windowed thread, patch or the like.
101141 A further aspect relates to a value document, in particular a bank note, having a value-document substrate and at least one security element that has been manufactured by means of one or a plurality of the previously described method steps and/or from the described aspects.
[0115] A security element is preferably applied to/incorporated into a value-document substrate. A value-document substrate can have paper, polymer or a paper-polymer combination. In the case of a bank note made of polymer or a paper-polymer combination as a value-document substrate, the carrier material of the security element can be a partial region of the value-document substrate.
For example, the value-document substrate can be a polymer foil and the carrier material of the security element is a partial region of said polymer foil.
[0116] When the security element has been embedded into a value document, the upper side and the underside of the security element preferably extend (substantially) parallel to the upper side and underside of the value-document substrate. The upper side and underside of the value document as well as those of the security element can also be designated principal faces. Said principal faces render relevant information to a viewer. Consequently, the principal faces are visible to a viewer viewing a value document having a security element. For example, a principal face of a bank note can render the value of the bank note as well as its serial number. Accordingly, an upper side and underside of a security element, like those of a value document, can also be regarded as first and second principal faces.

[0117] The invention will be explained hereinafter on the basis of preferred embodiments in connection with the attached figures, whose representation does without a true-to-proportion and true-to-scale rendition in order to increase the illustrative value.
[0118] There are shown:
Figs. I a, lb a schematic representation of a value document having a security element;
Figs. 2a-f a schematic representation for the manufacturing method of a security element according to a first variant;
Figs. 3a-e a schematic representation for the manufacturing method of a security element according to a second variant;
Figs. 4a-g a schematic representation for the manufacturing method of a security element according to a third variant;
Figs. 5a-5c a schematic sectional representation of security elements having a protective layer;
Figs. 6a, 6b a schematic representation of a detail of a value document having a security element;
[0119] Figures la and lb respectively show a schematic plan view of a principal face of a value document 100 having a value-document substrate 102 and a security element 104, wherein the security element 104 is firmly connected to the value-document substrate 102, e.g. embedded into the value-document substrate 102 or applied to the value-document substrate. The security element 104 can also be a partial region of the value-document substrate 102.
[0120] The security element 104 has an area defined as a region 106 to be coated, said area comprising a negative-pattern region 108 and a color-shift or thin-film-element region 110.

[0121] Figure la shows the number 45 as a negative-pattern region 108a.
while Figure lb shows three stripes as a negative-pattern region 108b.
[0122] A negative-pattern region can further have any form or configuration.
For example, a negative-pattern region might have the form of a church or an animal. Preferably, a negative-pattern region enables a viewer to recognize the negative-pattern region in plan view and/or in transmission view. Preferably, the security element is transparent or at least semi-transparent in the negative-pattern region, so that at least a portion of the light impinging on the security element is transmitted in the negative-pattern region. Further preferably, the negative-pattern region can have a different color appearance in plan view compared to transmission view (so-called transmission-view color effects). In other words, the color appearance of the negative-pattern region in plan view (e.g. gold), by which the share of reflected light determines the color appearance, is different from in transmission view (e.g. blue), by which the share of transmitted light determines the color appearance. The security element 104 contains a carrier material which preferably consists of polyethylene terephthalate (PET), and has a region 106 to be coated. The thin-film-element region 110, which is a subregion or partial region of the region 106 to be coated, comprises at least one reflective layer, a structured spacer layer and at least one absorber layer. In comparison to the thin-film-element region 110, the negative-pattern region 108 has at least no reflective layer and no structured spacer layer.
[0123] Accordingly, it is clearly evident that the structured spacer layer is not present over the full area or uniformly in the region 106 to be coated, but only/exclusively in the thin-film-element region 110.
101241 The construction of a region 108 to be coated having thin-film-element region 110 and negative-pattern region 108 will be explained more closely hereinafter with the aid of Figures 2 to 5.

101251 Figs. 2a to 2f show different (method) steps for manufacturing a security element having a thin-film-element region and a negative-pattern region.
101261 Fig. 2a shows the sectional view of a region 202 to be coated of a carrier material 200. The region 202 to be coated is arranged at the principal face I IF of the carrier material. For manufacturing a security element as it is shown in a comparable manner in Figures la and lb, the method step of "supplying a carrier material 200 having at least one region to be coated" is followed by a method step of arranging a reflective layer 204 in the region 202 to be coated. Fig. 2b shows in this connection a reflective layer 204 which was arranged in the region 202 to be coated. As is evident from Fig. 2b, the reflective layer 204 was arranged at the principal face HF of the carrier material. As is evident from Fig. 2b, the reflective layer 204 is arranged in the region 202 to be coated over the full area. In a next step, as shown in Fig. 2c, a structured spacer layer 206 is arranged at the reflective layer 204. Due to the structure of the structured spacer layer 206 there are formed in the region 202 to be coated a thin-film-element region 210 consisting of a plurality of subregions 210a to 210c and a negative-pattern region 208 consisting of the subregions 208a and 208b. For example, the structured spacer layer 210 corresponds to the thin-film-element region 110a or 110b according to Figures 1 a and lb. Consequently, the negative-pattern region 208 can have a motif or a form like the negative-pattern regions 108a or 108b of Figures la and lb. In other words, the structure of the structured spacer layer fixes which regions or subregions of the region 202 to be coated are configured as thin-film-element regions 210 or negative-pattern regions 208.
[0127] Advantageously, the structured spacer layer 206 is a dielectric.
Further advantageously, the structured spacer layer 206 can be arranged at the reflective layer 204 by means of one or a plurality of rollers or printing methods. This is in particular advantageous, since it enables a great variety of structures or motifs that are to have the structured spacer layer 206 to be manufactured in a simple manner.

[0128] In a further method step, an absorber layer 212 is arranged in the region 202 to be coated, as shown in Fig. 2d. As is evident from Fig. 2d, the absorber layer 212 is arranged in the region 202 to be coated over the full area. In a next method step, as shown in Fig. 2e, the reflective layer 204 is removed in the regions where the reflective layer 204 is not protected by the structured spacer layer 210. In other words, the structured spacer layer 206 serves as a mask or protective layer, thereby enabling a selective removing of the reflective layer 204.
For example, the removing of the reflective layer can be achieved, as shown in Fig. 2e, by means of homogeneous irradiation or by employing an etching means 214. Advantageously, the removing of the reflective layer 204 causes the absorber layer 212 to be removed at the same time. This results in a security element having a region 202 to be coated, as represented in Fig. 2f. In particular, only the thin-film-element region 210 or the thin-film-element subregions 210a, 210b, 210c have a reflective layer 204. In other words, the removing of the reflective layer 204 in the regions 208a, 208b where the removing of the reflective layer 204 is not prevented by the protection of the structured spacer layer 206 has given rise to a structured reflective layer and a structured absorber layer. Said structured reflective layer and said structured absorber layer preferably have the same structure/structuring as the structured spacer layer 206.
[0129] In particular, the sectional representation shown in Fig. 2f of a region 202 to be coated can correspond to a section along the line I-I according to Fig. 1 a or the line II-II according to Fig. lb.
[0130] Figures 3a to 3e show the different method steps for manufacturing a security element according to a further variant. Fig. 3a shows the supplying of a carrier material 300 having a principal face HF and a region 302 to be coated in a sectional view. Said sectional view can correspond for example to a sectional view along the line I-I as shown in Fig. la, or along the sectional line II-II
according to Fig. lb. Fig. 3b shows the method step of "arranging a reflective layer 304"
in the region 302 to be coated. As already shown in Fig. 2b, the reflective layer 304 is also arranged at the principal face HF in the region 302 to be coated over the full area or uniformly or in an unstructured manner. In a subsequent method step, the structured spacer layer 306 is arranged at the reflective layer 304. Due to the structure of the structured spacer layer 306 there result in the region 302 to be coated regions or subregions 310a - 310c having a structured spacer layer 306, and regions or subregions 308a, 308b in the region 302 to be coated which have no structured spacer layer 306.
101311 The structured spacer layer 306 is adapted to protect the reflective layer 304 from a removing. In a next method step, the reflective layer 304 is removed in the regions 308a, 308b. In other words, the structured spacer layer 306 serves as a mask or enables a selective removing of the reflective layer 304. Said removing can advantageously be performed by means of homogeneously applied removing means, such as radiation or etching means, due to the function of the structured spacer layer 306 as a mask. A substantially homogeneous action of a removing means or an irradiation or an etching means 314 is represented schematically in Fig. 3d. In a subsequent method step, an absorber layer 312 is arranged in the region 310 or the subregions 310a, 310b, 310c. Consequently, there results a negative-pattern region 308 or negative-pattern regions 308a, 308b where no reflective layer 304 and no absorber layer 312 are arranged. In other words, the absorber layer 312 is applied selectively or in a structured manner in accordance with the structure of the structured spacer layer 306. Thus there arises, in other words, a structured absorber layer 312.
101321 Preferably, the manufacturing methods as set forth with reference to Figures 2 and 3 can comprise further or additional method steps. In particular, such further or additional method steps can also be performed between one or a plurality of the explained method steps. For example, there can be performed as an additional method step the arranging of a relief structure, wherein this method step is performed before an arranging of the reflective layer 204 or 304.

[0133] A further variant for manufacturing a security element will now be explained with reference to Figures 4a to 4f. Fig. 4a shows the sectional view of a carrier material 400 having a principal face HF and a region 402 to be coated.
The carrier material 400 having the region 402 to be coated is supplied within the context of a method step as shown in Fig. 4a. In a further method step, a relief structure 404 having elevated regions 408 and recessed regions 406 is arranged in the carrier material's 400 region 402 to be coated. According to one embodiment, the relief structure can be configured or shaped by embossing the carrier material 400. According to another embodiment example, the relief structure 404 can be arranged or shaped by a relief layer/emboss layer, such as an emboss lacquer, being applied or arranged on the principal face HF of the carrier material and said emboss layer being given a relief structure 404 by an embossing tool. In particular, a relief structure 404 can be arranged or formed by a relief structure 404 being incorporated into a relief layer e.g. by means of etching or lasering. With a further method step, a reflective layer 410 is arranged in the region 402 to be coated. This can be effected for example by vapor deposition methods, so that material of the reflective layer 410 arranges itself or is applied in the elevated regions 408a-d and in the recessed regions 406a-e. In this regard, reference is made to Fig. 4c.
In a further method step, a structured spacer layer 412 can be arranged, as shown in Fig. 4d. In so doing, the structured spacer layer is arranged at least in the recessed regions 406a-e at the reflective layer 410. In other words, the relief structure 404 is flattened out by arranging the structured spacer layer 412 at the reflective layer 410.
101341 Preferably, material of the structured spacer layer 412 is not located, or located only slightly, at the reflective layer 410 in the elevated regions 408a-d.
This can be attained for example by performing a scraping off or detaching/wiping off of excess material of the structured spacer layer 412.
[0135] The structured spacer layer 412 forms a protection or a mask, so that the reflective layer is protected from a removing in the recessed regions 406 during the method step of "removing the reflective layer 410 in the elevated regions 408 of the relief structure 404". When a slight or thin layer of material of the structured spacer layer 412 is also located at the reflective layer 410 in the elevated regions 408, material of the structured spacer layer 412 is first ablated and thereafter the reflective layer 410 in the elevated regions 408 within the context of the method step of "removing the reflective layer in the elevated regions of the relief structure". The reflective layer 410 in the recessed regions 406 still remains protected by the (remaining) structured spacer layer 412, since the method step of "removing the reflective layer in the elevated regions" is ended after the reflective layer 410 was removed in the elevated regions 408. This is shown for example with reference to Fig. 4e, wherein the reflective layer 410 was removed in the elevated regions 408 by means of uniform or homogeneous action of radiation or of an etching means 414. After a removing of the reflective layer 412 in the elevated regions 408a-d one can possibly face the situation that the spacer layer was partly removed in the regions 406, thereby yielding in the region 402 to be coated a surface structure as shown in Figure 4f. In a further method step, said surface structure can be smoothed again by flattening out.
Flattening out can be effected for example by filling with, or arranging, material of the structured spacer layer or another material or filler. This method step can preferably also involve a drawing off or scraping off of superfluous or excess material. In a next method step, an absorber layer 416 is arranged at least at the structured spacer layer 412. As shown in Fig. 4g, the absorber layer 416 can also be arranged in the entire region 402 to be coated.
101361 Figures 5a to 5c respectively show a schematic sectional representation of a security element having a protective layer 514a, 514b or 514c.
The protective layer preferably serves to protect the absorber layer or the region to be coated from external influences. The protective layer 514a, 514b or 514c is preferably transparent. As shown in Fig. 5a, the protective layer or the protective lacquer can flatten out the structures present in the region 502a to be coated.

Advantageously, this also protects the flanks of thin-film-element regions 510a from external influences, such as during the circulation of a bank note. As shown in Fig. 5b, the protective layer 514b can be applied as a thin film, so that no flattening of the structures is present in the region 502b to be coated.
Advantageously, the protective layer 514b can protect the absorber layer 512b from external influences. In Fig. Sc, too, a uniformly distributed or homogeneously applied protective layer 514c covers the absorber layer 512 in the region 502c to be coated.
101371 Fig. 6a shows a detail of a value document 600 having a value-document substrate 602 and a security element 604 which is configured for example as a patch. The security element 604 comprises a region 606 to be coated which comprises a thin-film-element region 610 and a negative-pattern region 608. The thin-film-element region 610 has (regionally) deformation-induced color-change properties. The deformation-induced color-change properties are preferably achieved by deformation properties of the structured spacer layer which is present in the thin-film-element region 610. In particular, the deformation-induced color-change properties are achieved by the structured spacer layer being deformed by external influence, such as moisture input by breathing thereon, irradiation or bending of the security element, so that the thickness of the spacer layer is locally reduced or increased. Fig. 6a shows a thin-film-element region 610 having a structured spacer layer which has deformation properties in partial regions or subregions. In Fig. 6a said subregions having deformation properties are unrecognizable to a viewer, since the structured spacer layer is located in a non-deformed state. When the security element 604 or the thin-film-element region 610 is now deformed, i.e. by deforming the structured spacer layer, the partial region or subregion of the structured spacer layer having deformation properties which lead to a deformation-induced color change becomes recognizable to a viewer. Fig. 6b shows the state in which the deformation-induced color change is recognizable to a viewer, after a deforming of the structured spacer layer. According to Fig. 6b, the subregion 612 having the deformation properties which lead to a deformation-induced color change represents the character or letter "A". Preferably, said deformation-induced color changes are reversible, so that some time after a deformation the subregion grows pale or is no longer recognizable to a viewer, so that a state according to Figure 6a is present again.

List of reference signs 100, 600 Value document 102, 602 Value-document substrate 104, 604 Security element 106, 202, 302, 402, 502, 606 Region to be coated 108, 208, 308, 408, 508, 608 Negative-pattern region 110, 210, 310, 410, 510, 610 Thin-film-element region 200, 300, 400, 500 Carrier material 204, 304, 410 Reflective layer 206, 306, 412 Structured spacer layer 212, 312, 416, 512 Absorber layer 214, 314, 414 Removing means 404 Relief structure 514 Protective layer 612 Subregion having deformation-induced color-change properties HF Principal face

Claims

1. A method for manufacturing a security element (100, 600) comprising the steps of:
- supplying a carrier material (200, 300, 400, 500) having at least one region (106, 202, 302, 402, 502, 606) to be coated;
arranging a reflective layer (204, 304, 410) in the region to be coated;
- arranging a structured spacer layer (206, 306, 412) at the reflective layer, wherein the structured spacer layer is adapted to protect the reflective layer from a removing;
- arranging an absorber layer (212, 312, 416, 512) at least at the structured spacer layer; and - removing the reflective layer in the regions where the removing of the reflective layer is not prevented by the protection of the structured spacer layer.

2. The method according to claim 1, wherein the step of arranging an absorber layer is performed before the step of removing the reflective layer.

3. The method according to claim 1, wherein the step of removing the reflective layer is performed before the step of arranging the absorber layer, and the arranging of the absorber layer is preferably performed employing a donor foil.

4. The method according to any of claims 1 to 3, comprising the further step of:
- arranging a relief structure (404) having elevated and recessed regions (408;
406) in the carrier material's region to be coated.

5. The method according to claim 4, comprising the further steps of:
- flattening out the relief structure (404) by arranging the structured spacer layer at the reflective layer; and - removing the reflective layer in the elevated regions (408) of the relief structure.

6. The method according to any of claims 1 to 5, wherein the structured spacer layer and/or the reflective layer and/or the absorber layer is arranged by printing technology in the form of a motif preferably by means of flexographic printing, gravure printing, ink jet, offset, screen printing or 3D printing.

7. The method according to any of claims 1 to 6, wherein the step of removing the reflective layer comprises etching and/or lasering (214, 314, 414).

8. The method according to any of claims 1 to 7, comprising the further step of:
- arranging an adhesion-promoting layer; and/or - applying a protective layer.

9. The method according to any of claims 1 to 8, wherein the structured spacer layer has at least partly deformation properties which lead to deformation-induced color changes of the security element (612).

10. The method according to any of claims 1 to 9, wherein the structured spacer layer has direction-dependent refractive indices and/or colorants and/or pigments.

11. The method according to any of claims 1 to 10, wherein the structured spacer layer has a dry layer thickness of 30 nm to 1100 nm, preferably 300 nm to 600 nm.

12. The method according to any of claims 1 to 11, wherein the security element has at least one relief structure such as a hologram, moth-eyes, microlenses or micromirrors.

13. The method according to any of claims 1 to 12, wherein the carrier material comprises a carrier foil preferably made of polyethylene terephthalate (PET);
and/or the reflective layer contains aluminum; and/or the absorber layer contains a material transmissive to an etching means, preferably chromium; and/or the absorber layer contains a material at least semi-transparent to laser radiation;
and/or the structured spacer layer is a dielectric and preferably based on vinyl chloride copolymers with acid groups, nitrocellulose, acrylate(s), acrylic acid ester, epoxide(s) or polyurethane(s); and/or the structured spacer layer comprises nematic liquid crystals.

14. A security element, wherein the security element has been manufactured by the method according to any of claims 1 to 13.

15. A value document, in particular bank note, having a value-document substrate and at least one security element according to claim 14.